TWI562011B - Optical fingerprint sensor package structure - Google Patents

Optical fingerprint sensor package structure

Info

Publication number
TWI562011B
TWI562011B TW105107149A TW105107149A TWI562011B TW I562011 B TWI562011 B TW I562011B TW 105107149 A TW105107149 A TW 105107149A TW 105107149 A TW105107149 A TW 105107149A TW I562011 B TWI562011 B TW I562011B
Authority
TW
Taiwan
Prior art keywords
fingerprint sensor
package structure
sensor package
optical fingerprint
optical
Prior art date
Application number
TW105107149A
Other languages
Chinese (zh)
Other versions
TW201732668A (en
Inventor
Yu-Tang Pan
Shih-Wen Chou
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW105107149A priority Critical patent/TWI562011B/en
Priority to CN201610398910.9A priority patent/CN107180217A/en
Application granted granted Critical
Publication of TWI562011B publication Critical patent/TWI562011B/en
Publication of TW201732668A publication Critical patent/TW201732668A/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
TW105107149A 2016-03-09 2016-03-09 Optical fingerprint sensor package structure TWI562011B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW105107149A TWI562011B (en) 2016-03-09 2016-03-09 Optical fingerprint sensor package structure
CN201610398910.9A CN107180217A (en) 2016-03-09 2016-06-07 Optical fingerprint sensing package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105107149A TWI562011B (en) 2016-03-09 2016-03-09 Optical fingerprint sensor package structure

Publications (2)

Publication Number Publication Date
TWI562011B true TWI562011B (en) 2016-12-11
TW201732668A TW201732668A (en) 2017-09-16

Family

ID=58227316

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105107149A TWI562011B (en) 2016-03-09 2016-03-09 Optical fingerprint sensor package structure

Country Status (2)

Country Link
CN (1) CN107180217A (en)
TW (1) TWI562011B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664766B (en) * 2017-04-18 2019-07-01 Gingy Technology Inc. Image capturing module and manufacturing method thereof
US10734435B2 (en) 2017-04-18 2020-08-04 Gingy Technology Inc. Image capturing module and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108039355B (en) * 2018-01-12 2024-03-12 苏州晶方半导体科技股份有限公司 Packaging structure and packaging method of optical fingerprint chip

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI227549B (en) * 2003-06-30 2005-02-01 Pixart Imaging Inc Optical sensor packaging method and its packaging structure
US7084473B2 (en) * 2003-04-29 2006-08-01 Stmicroelectronics S.A. Semiconductor package with an optical sensor which may be fit inside an object
US7405456B2 (en) * 2005-09-14 2008-07-29 Sigurd Microelectronics Corp. Optical sensor chip package
US7480006B1 (en) * 2004-04-13 2009-01-20 Pixim, Inc. Optical package for image sensor with integrated heater
TWI344218B (en) * 2004-01-06 2011-06-21 Tang Sung Capital Llc Method of packaging an optical sensor
TWI508275B (en) * 2013-08-20 2015-11-11
TWI523242B (en) * 2013-01-03 2016-02-21 昇佳電子股份有限公司 Optical sensor, optoelectronics devices and packaging method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2412460C2 (en) * 2006-04-10 2011-02-20 Электролюкс Хоум Продактс Корпорейшн Н.В. Household electric appliance incorporating fingerprint identification sensor
TWI466282B (en) * 2011-11-23 2014-12-21 Tong Hsing Electronic Ind Ltd A structure of image sensor package and manufacturing method thereof
CN204028936U (en) * 2014-05-16 2014-12-17 深圳印象认知技术有限公司 Ultrathin fingerprint acquisition device, the display device of fingerprint can be gathered
CN104836867B (en) * 2015-04-24 2018-05-18 上海箩箕技术有限公司 Phone cover module and mobile phone
CN104850839A (en) * 2015-05-19 2015-08-19 深圳市恒睿智达科技有限公司 Optical acquisition module group light control assembly and formation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7084473B2 (en) * 2003-04-29 2006-08-01 Stmicroelectronics S.A. Semiconductor package with an optical sensor which may be fit inside an object
TWI227549B (en) * 2003-06-30 2005-02-01 Pixart Imaging Inc Optical sensor packaging method and its packaging structure
TWI344218B (en) * 2004-01-06 2011-06-21 Tang Sung Capital Llc Method of packaging an optical sensor
US7480006B1 (en) * 2004-04-13 2009-01-20 Pixim, Inc. Optical package for image sensor with integrated heater
US7405456B2 (en) * 2005-09-14 2008-07-29 Sigurd Microelectronics Corp. Optical sensor chip package
TWI523242B (en) * 2013-01-03 2016-02-21 昇佳電子股份有限公司 Optical sensor, optoelectronics devices and packaging method thereof
TWI508275B (en) * 2013-08-20 2015-11-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI664766B (en) * 2017-04-18 2019-07-01 Gingy Technology Inc. Image capturing module and manufacturing method thereof
US10734435B2 (en) 2017-04-18 2020-08-04 Gingy Technology Inc. Image capturing module and manufacturing method thereof

Also Published As

Publication number Publication date
CN107180217A (en) 2017-09-19
TW201732668A (en) 2017-09-16

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