CN104836867B - Phone cover module and mobile phone - Google Patents
Phone cover module and mobile phone Download PDFInfo
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- CN104836867B CN104836867B CN201510203657.2A CN201510203657A CN104836867B CN 104836867 B CN104836867 B CN 104836867B CN 201510203657 A CN201510203657 A CN 201510203657A CN 104836867 B CN104836867 B CN 104836867B
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- protecgulum
- finger print
- optical finger
- protective shell
- imaging modules
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Abstract
A kind of phone cover module and mobile phone.Wherein, the phone cover module includes：Protecgulum, the protecgulum have first surface and second surface；Lining lid, the second surface of the lining lid and the protecgulum are oppositely arranged；The lining lid has through hole；Optical finger print imaging modules, the first structure of the optical finger print imaging modules are located in the through hole.The phone cover module can improve the Experience Degree of user, and improve the assembling yield of phone cover module.
Description
Technical field
The present invention relates to mobile terminal and fingerprint recognition field more particularly to a kind of phone cover modules and mobile phone.
Background technology
Fingerprint imaging identification technology is the fingerprint image that human body is collected by fingerprint sensor, then in system
Have fingerprint imaging information to be compared, whether carrying out correct judgment, and then realize the technology of identification.The side used due to it
Just property and the uniqueness of somatic fingerprint, fingerprint identification technology have been widely used in every field.Such as public security bureau, customs
Etc. field of safety check, consumer product areas such as the access control system and PC of building and mobile phone etc..
It is currently largely all designed with the mobile phone of fingerprint identification function its fingerprint imaging module in the front of mobile phone, in hand
Design through hole on the protecgulum of machine, the shell and cover sheet of fingerprint imaging module are through leaking out outside after protecgulum through hole.
Fig. 1 shows the partial schematic diagram of the unassembled optical finger print imaging modules of existing mobile phone.The mobile phone includes protecgulum 110
With rear cover 120, through hole 111 is provided on protecgulum.
Fig. 2 shows the partial schematic diagram after existing mobile phone assembling optical finger print imaging modules (not marking), and Fig. 2 is figure
Dotted line frame 102 surrounds the enlarged diagram of part after the assembling optical finger print imaging modules of mobile phone shown in 1.The fingerprint imaging module
With upper protective shell 132 and cover sheet 131, upper protective shell 132 and cover sheet 131 through after through hole 111 shown in FIG. 1,
Leakage is outside.
It is (open that more assembling contents in relation to mobile phone and fingerprint imaging module can refer to Publication No. CN102611774A
Day：On July 25th, 2012) Chinese invention patent application.
The content of the invention
The present invention solves the problems, such as to be to provide a kind of new phone cover module and mobile phone, so as to improve body of the user to mobile phone
Degree of testing, and improve the assembling yield of phone cover module and mobile phone.
To solve the above problems, the present invention provides a kind of phone cover module, including：
Protecgulum, the protecgulum have first surface and second surface；
Lining lid, the second surface of the lining lid and the protecgulum are oppositely arranged；
The lining lid has through hole；
Optical finger print imaging modules, the first structure of the optical finger print imaging modules are located in the through hole.
Optionally, there is the first optical cement, the lining lid passes through first optics between the protecgulum and the lining lid
Glue is in the second surface.
Optionally, the first structure includes upper protective shell and cover sheet, between the protecgulum and the upper protective shell
With the second optical cement, the upper protective shell is pasted onto the second surface by second optical cement.
Optionally, the first structure includes cover sheet, has the second light between the protecgulum and the cover sheet
Glue is learned, the cover sheet is pasted onto the second surface by second optical cement.
Optionally, the second surface whole face passes through the solid state optics gluing covered with solid state optics glue, the lining lid
The second surface is attached to, the first structure is by the solid state optics glue in the second surface.
Optionally, the optical finger print imaging modules include at least one of upper protective shell and lower protective shell, described
Upper protective shell belongs to the first structure, and the lower protective shell is not belonging to the first structure.
Optionally, the thickness range of the protecgulum is 0.15mm~0.5mm.
Optionally, the lining lid has touch function layer.
Optionally, further include rear cover, the lining lid and the optical finger print imaging modules be located at the protecgulum and it is described after
Between lid.
To solve the above problems, the present invention also provides a kind of mobile phone, the mobile phone includes mobile phone cover mold as described above
Group.
Compared with prior art, technical scheme has the following advantages：
In technical scheme, the phone cover module with protecgulum, lining lid and optical finger print imaging modules, institute are provided
Protecgulum is stated with first surface and second surface, the second surface of the lining lid and the protecgulum is oppositely arranged, the lining
Lid has through hole, optical finger print imaging modules, and the first structure of the optical finger print imaging modules is located in the through hole.It is described
In phone cover module, lining lid is provided with through hole, and protecgulum is not provided with through hole.Protecgulum has first surface and second surface, is
A kind of covering plate structure of unitary solid.The first structure of the optical finger print imaging modules is located in the through hole, and serve as a contrast lid with
The second surface of protecgulum is oppositely arranged, and therefore, the first structure of the optical finger print imaging modules is oppositely arranged with protecgulum, so as to
Ensure that the optical finger print imaging modules can realize corresponding fingerprint identification function.At this point, the technical solution is avoided preceding
Lid sets through hole, and protecgulum is not provided with through hole can improve Experience Degree of the user to mobile phone.As it can be seen that in the phone cover module,
On the premise of it need not through hole be set on mobile phone protecgulum, it can realize the demand of fingerprint function and improve user opponent
The Experience Degree of machine.
Further, since the through hole is arranged in lining lid, and the first structure of the optical finger print imaging modules is located at institute
It states in through hole, that is to say, that the optical finger print imaging modules are assemblied in the lower section of protecgulum.At this point, the through hole and the light
The build-up tolerance learned between fingerprint imaging module can suitably amplify, and reduce the assembling of the optical finger print imaging modules
Difficulty also just reduces the assembly difficulty of phone cover module, improves the assembling yield of phone cover module and corresponding mobile phone.
Further, there is solid state optics glue, the lining lid passes through the solid state optics between the protecgulum and the lining lid
Glue is in the second surface.The first structure of the follow-up optical finger print imaging modules exists also by solid state optics glue
The second surface.Solid state optics glue can ensure that the lining lid and the protecgulum are combined closely, while make the first structure
It combines closely with the protecgulum.Also, the solid state optics glue can reduce in terms of two described in corresponding fingerprint light entrance
Loss during optical finger print imaging modules：In a first aspect, the refractive index of the solid state optics glue can be with the refraction of protecgulum
Rate is identical, it is possible to reduce the loss of corresponding fingerprint light；On the other hand, since the stickup of solid state optics glue acts on, described first
There is no air between structure and the protecgulum, it can significantly reduce the loss of corresponding fingerprint light, two aspects are conducive to
The fingerprint imaging of the optical finger print imaging modules.
Description of the drawings
Fig. 1 is the partial schematic diagram of the unassembled optical finger print imaging modules of existing mobile phone；
Fig. 2 shows the partial schematic diagram after the assembling optical finger print imaging modules of mobile phone shown in Fig. 1；
Fig. 3 is the front view for the phone cover module that one embodiment of the invention is provided；
Fig. 4 is the part-structure schematic diagram that phone cover module shown in Fig. 3 is obtained along after AA chain-dotted line cuttings；
Fig. 5 is the schematic diagram after Standard other structures shown in Fig. 4；
Fig. 6 is the structure diagram of optical finger print imaging modules；
Fig. 7 is the enlarged diagram that dotted line frame surrounds the one of example in part in structure shown in Fig. 5；
Fig. 8 is the enlarged diagram that dotted line frame surrounds another example of part in structure shown in Fig. 5；
Fig. 9 is the enlarged diagram that dotted line frame surrounds another example of part in structure shown in Fig. 5；
Figure 10 is the front view for the phone cover module that another embodiment of the present invention is provided；
Figure 11 is the part-structure schematic diagram that phone cover module shown in Figure 10 is obtained along after BB chain-dotted line cuttings；
Figure 12 is the schematic diagram after Standard other structures shown in Figure 11；
Figure 13 is the enlarged diagram that dotted line frame surrounds the one of example in part in structure shown in Figure 12；
Figure 14 is the enlarged diagram that dotted line frame surrounds another example of part in structure shown in Figure 12.
Specific embodiment
As described in background, in existing phone cover module, protecgulum sets through hole with by optical finger print imaging modules
Upper protective shell and cover sheet are spilt, and it is public to there will necessarily be certain assembling between through hole and optical finger print imaging modules
Difference causes to reduce user experience in the out-of-flatness in finger touch area on mobile phone protecgulum.Meanwhile in existing phone cover module
Due to needing strictly to control above-mentioned build-up tolerance, the assembly difficulty for also causing existing phone cover module is larger, and assembling yield is relatively low.
The present invention provides a kind of phone cover module, including：Protecgulum, the protecgulum have first surface and second surface；
Lining lid, the second surface of the lining lid and the protecgulum are oppositely arranged；The lining lid has through hole；Optical finger print is imaged mould
Group, the first structure of the optical finger print imaging modules are located in the through hole.In the phone cover module, it is provided in lining lid
Through hole, and protecgulum is not provided with through hole.Protecgulum has first surface and second surface, is a kind of covering plate structure of unitary solid.Institute
The first structure for stating optical finger print imaging modules is located in the through hole, and the second surface for serving as a contrast lid and protecgulum is oppositely arranged, because
This, the first structure of the optical finger print imaging modules is oppositely arranged with protecgulum, so as to ensure the optical finger print imaging modules
It can realize corresponding fingerprint identification function.At this point, the technical solution avoids setting through hole in protecgulum, and protecgulum is not provided with leading to
Hole can improve Experience Degree of the user to mobile phone.As it can be seen that in the phone cover module, it is logical that need not be set on mobile phone protecgulum
On the premise of hole, it can realize the demand of fingerprint function and improve Experience Degree of the user to mobile phone.
It is understandable for the above objects, features and advantages of the present invention is enable to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
The embodiment of the present invention provides a kind of phone cover module, incorporated by reference to reference to figure 3 to Fig. 9.
It please refers to Fig.3, the phone cover module includes protecgulum 201, and protecgulum 201 has first surface (before being shown in Fig. 3
The first surface of lid 201 is not marked in Fig. 3) and second surface (not showing second surface in Fig. 3).
In the present embodiment, Fig. 3 shows the front view of the first surface, and 201 rounded square of protecgulum is can see in Fig. 3
Shape.In other embodiments, the first surface front view of protecgulum 201 can also be in other shapes, such as orthogonal rectangle etc..
Also, the first surface that Fig. 3 is shown has centrally located rectangular area and frame region, wherein, rectangular area
It can correspond to the screen region of mobile phone.In other embodiments, as needed, protecgulum 201 can also be divided into other shapes
Two regions of shape and ratio are divided into the region of three or more, naturally it is also possible to not subregion.
It please refers to Fig.4, shows the part-structure signal that phone cover module shown in Fig. 3 is obtained along after AA chain-dotted line cuttings
Figure.Show that phone cover module includes protecgulum 201 and lining lid 203 in Fig. 4.From Fig. 4 it can furthermore be seen that protecgulum 201 has the
One surface 201A and second surface 201B.First surface 201A can be the upper surface of protecgulum 201, and second surface 201B can be
The lower surface of protecgulum 201, i.e. first surface 201A and second surface 201B can be two corresponding surfaces of protecgulum 201.Lining
Lid 203 and the second surface 201B of protecgulum 201 are oppositely arranged.There is the first optical cement 202 between protecgulum 201 and lining lid 203.Lining
Lid 203 is pasted onto second surface 201B by the first optical cement 202.Serving as a contrast lid 203 has through hole 2031.Serve as a contrast the through hole of lid 203
2031 cooperatively form to store the fitting groove of subsequent optical fingerprint imaging module first structure with second surface 201B.
In the present embodiment, 201 face through hole 2031 of protecgulum it is partially transparent, this is to ensure subsequently to be arranged on protecgulum
The optical finger print imaging modules of 201 lower sections can obtain corresponding fingerprint reflection light as far as possible.The material of protecgulum 201 and lining lid 203
Material can be glass, plastics or other suitable material, wherein, protecgulum can be whole clearing, can also be only in Mobile phone screen
Curtain 2031 face location transparency of correspondence position and through hole, other places may be employed opaque light screening material and are coated, shape
Into frame or pattern etc..
It should be noted that in other embodiments, the partially transparent of 201 face through hole 2031 of protecgulum can also be in semi-transparent
Bright or 201 face through hole 2031 of protecgulum part is coated with the coating of white.But no matter 201 face through hole 2031 of protecgulum
Partial status how, when being required for ensureing that finger is pressed against corresponding position, the reflection light of finger print can be from protecgulum 201
The photosensitive structure for being partially transmitted to subsequent optical fingerprint imaging module of face through hole 2031.On the contrary, it is only necessary to before guarantee
The part of 201 face through hole 2031 of lid can ensure the normal identification of fingerprint, specifically before this part face through hole 2031
Lid 201 can be transparent, translucent or be coated with the states such as white paint.
In the present embodiment, it can be a slab construction (pure flat structure) that protecgulum 201 is whole.In other embodiments, protecgulum
201 can also be the part of face through hole 2031 with being designed as slab construction in this part of its periphery a certain range, and other parts
Non-flat structure can be designed to as needed.
In the present embodiment, the thickness range of protecgulum 201 can be controlled in 0.15mm~0.5mm.The thickness range of protecgulum 201
It is to make the fingerprint image that can preferably sense of corresponding mobile phone less than 0.5mm, therefore its thickness gets over Bao Yuehao, but needs simultaneously
Ensure that protecgulum has corresponding mechanical strength, therefore, the thickness of control protecgulum 201 is more than 0.15mm.The thickness of specific protecgulum 201
Degree can need to determine according to different mobile phones.
In the present embodiment, lining lid 203 can have touch function layer, and the phone cover module is to be touched with external hanging type at this time
Control the phone cover module of structure.When serving as a contrast lid 203 with touch function layer, the material of protecgulum 201 can be glass, serve as a contrast lid 203
It can include layer protecting film, the material of the protective film can be polyethylene terephthalate (PET).Other embodiments
In, lining lid 203 can not also have touch function layer, and only play a protective role as protection structure.
In the present embodiment, the first optical cement 202 can be the optical cement of solid or the optical cement of liquid.It can be with
The optical cement of liquid is first used, then by ultraviolet light curing and heat cure, protecgulum 201 and lining lid 203 are pasted together.By
It is usually smaller in the thickness of optical cement, thus by the first optical cement 202 by protecgulum 201 with lining lid 203 fit to together with, can
Reduce protecgulum 201 and serve as a contrast the overall thickness after lid 203 is bonded, so as to ensure that subsequent optical finger print imaging modules can be close proximity to
The second surface 201B (please referring to Fig.4) of protecgulum 201, to improve the fingerprint imaging quality of optical finger print imaging modules.
Fig. 5 is refer to, Fig. 5 further illustrates the other structures of mobile phone cover mold shown in Fig. 4, that is to say, that Fig. 5 is shown
Schematic diagram after Standard other structures shown in Fig. 4.Show that phone cover module further includes optical finger print imaging modules in Fig. 5
(not marking), (the included part of first structure is with reference to subsequent figure 7 to Fig. 9 phases for the first structure of the optical finger print imaging modules
Answer content) it is located in through hole 2031.The phone cover module further includes middle cover 204 and rear cover 208, serves as a contrast lid 203 and optical finger print
Imaging modules are between protecgulum 201 and middle cover 204, and middle cover 204 is between protecgulum 201 and rear cover 208.The mobile phone cover mold
Group further includes flexible printed circuit board 207 (Flexible Printed Circuit board, FPC) and printed circuit board 206
(Printed Circuit Board, PCB).Flexible printed circuit board 207 is electrically connected to printed circuit board 206.It is also aobvious in Fig. 5
Show that phone cover module has display module 205, display module 205 can be liquid crystal display panel or organic light emitting display face
Plate.
It also shows the optical finger print imaging modules in Fig. 5 at least partly to be surrounded by dotted line frame 209, by dotted line frame
209 structures surrounded may be referred to subsequent Fig. 7 to Fig. 9, but understand for convenience, and this specification first passes through Fig. 6 to wherein
A kind of structure of the optical finger print imaging modules is described.
Fig. 6 is refer to, in one of specific example of the present embodiment, the optical finger print imaging modules include upper guarantor
Protective case 2091, cover sheet 2092, chip 2093, optical finger print sensing element 2094 (such as cmos sensor or CCD sensing
Device), light source 2095, light guide plate 2096, flexible printed circuit board 2097 (flexible printed circuit board 2097 in Fig. 6 in Fig. 5
Flexible printed circuit board 207 is same structure, simply shows different piece in different figures), side protective shell 2098 and lower protective shell
2099。
In the present embodiment, upper protective shell 2091 is at least partially disposed at 2092 top of cover sheet, and upper protective shell 2091
There can also be part to be located at 2092 side of cover sheet.Optical finger print sensing element 2094 is located at 2092 lower section of cover sheet, uses
In the reflection light for receiving fingerprint.Chip 2093 is used to handle the fingerprint image letter received by optical finger print sensing element 2094
Breath, chip 2093 can be arranged at the wherein one side of cover sheet 2092, and be similarly disposed at optical finger print sensing element
Above in the of 2094 (correspondence position, which is not used in, receives light), in other embodiments, chip 2093 can also be arranged on other positions.Light
Source 2095 can be LED light or other devices.Light source 2095 can be arranged on the wherein one side of light guide plate 2096.Light guide plate
2096 are located at the lower section of optical finger print sensing element 2094, and the light for light source 2095 to be sent upwardly propagates after disperseing, with
In the corresponding finger print of irradiation.At least subregion of optical finger print sensing element 2094 can light transmission cross line, so as to ensure
Allowing in light guide plate 2096 light spread out of, the light continues to propagate to cover sheet through optical finger print sensing element 2094
2092nd, upper protective shell 2091 and protecgulum 201, until the light is irradiated to and is pressed against on the fingerprint of 201 corresponding position of protecgulum.Institute
The reflection light for stating light sequentially passes through protecgulum 201, upper protective shell 2091 and cover sheet 2092 again, until by optical finger print
Sensing element 2094 receives.After the reflection light that optical finger print sensing element 2094 receives, information in fingerprint is formed, it is described
Information in fingerprint can obtain the fingerprint image of respective finger after the processing of chip 2093 and corresponding software.
In the present embodiment, 2097 one end of flexible printed circuit board is connected to the chip of the optical finger print imaging modules
2093, the other end is connected to printed circuit board 206 (refer to Fig. 5).Lower protective shell 2099 be located at the entire optical finger print into
As the bottom of module, and side protective shell 2098 is located at the side of optical finger print imaging modules.
In the present embodiment, welding can be passed through between upper protective shell 2091, side protective shell 2098 and lower protective shell 2099
Mode connects together, and by cover sheet 2092, chip 2093, optical finger print sensing element 2094, light source 2095, light guide plate
2096 and in 207 grade critical pieces of flexible printed circuit board are wrapped in.
Fig. 7 is refer to, Fig. 7 is shown in structure shown in Fig. 5, and dotted line frame 209 surrounds the enlarged diagram of part.This implementation
In one specific example of example, as shown in fig. 7, the first structure includes upper protective shell 2091 and cover sheet 2092.That is Fig. 7
In, the optical finger print imaging modules assembling shown in Fig. 6 (is needed what is illustrated in the combination of protecgulum 201 and lining lid 203
It is that the part that protective shell 2091 is located at 2092 both sides of cover sheet is only shown in Fig. 7, still, upper protective shell 2091 can be with
There is part to directly overlay 2092 top of cover sheet, as shown in Figure 6).Also, have between protecgulum 201 and upper protective shell 2091
Having the second optical cement 210, (the second optical cement 210 can first use the optical cement of liquid, then pass through ultraviolet light curing and thermosetting
Change, protecgulum 201 and upper protective shell 2091 be pasted together), upper protective shell 2091 is pasted onto second by the second optical cement 210
Surface 201B.
In the phone cover module that the above-mentioned specific example of the present embodiment is provided, the second optical cement 210 can make described first
Structure upper surface is directly fitted with protecgulum 201, i.e., can be with there is no air between described first structure upper surface and protecgulum 201
Significantly reduce the loss of corresponding fingerprint light.
In the phone cover module that the above-mentioned specific example of the present embodiment is provided, including with first surface 201A and the second table
The protecgulum 201 of face 201B and the lining lid 203 being oppositely arranged with the second surface 201B of protecgulum 201.
In the above-mentioned specific example of the present embodiment, the first structure is located at the first knot with also having after the assembling of through hole 2031
Structure with side gap (not marking), due to assembling always there are certain location tolerance, the gap can usually deposit always
.And in the present embodiment, since entire optical finger print imaging modules are assemblied in the lower section of protecgulum 201, therefore, it is not necessary to consider first
The tight assembling of structure and through hole 2031, therefore, the gap can also suitably be adjusted so as to it is larger, with convenient for assembly.
It has been mentioned hereinbefore that the lining lining lid of lid 203 has through hole 2031.And the phone cover module further includes the optics and refers to
Line imaging modules, the first structure of the optical finger print imaging modules are located in the through hole 2031, the first structure
Including upper protective shell 2091 and cover sheet 2092.Since in the phone cover module, through hole 2031 is provided in lining lid 203,
Thus, protecgulum 201 need not set to install the through hole of optical finger print imaging modules, that is to say, that protecgulum 201 can be a kind of
The covering plate structure of unitary solid.And the first structure of the optical finger print imaging modules is located in through hole 2031, lining lid 203 again with
The second surface 201B of protecgulum 201 is oppositely arranged, therefore, first structure and 201 phase of protecgulum of the optical finger print imaging modules
To setting.201 face through hole 2031 of protecgulum it is partially transparent, ensure that the optical finger print imaging modules can realize corresponding finger
Line identification function.At this point, the technical solution avoids setting through hole in protecgulum 201, and protecgulum 201 is not provided with through hole and can improve
User is to the Experience Degree of mobile phone.As it can be seen that in the phone cover module, through hole 201 need not be set on mobile phone protecgulum 201
Under the premise of, it can realize the demand of fingerprint function and improve Experience Degree of the user to mobile phone.
Further, since through hole 2031 is arranged in lining lid 203, and the first structure of the optical finger print imaging modules is located at
In the through hole, that is to say, that the optical finger print imaging modules are assemblied in the lower section of protecgulum.At this point, through hole 2031 with it is described
Build-up tolerance between optical finger print imaging modules can suitably amplify (i.e. in Fig. 7, through hole 2031 and the first structure
Between the gap can be larger), reduce the assembly difficulty of the optical finger print imaging modules, also just reduce phone cover
The assembly difficulty of module improves the assembling yield of phone cover module and corresponding mobile phone.
Further, there is the first optical cement 202, lining lid 203 passes through the first optical cement 202 between protecgulum 201 and lining lid 203
It is pasted onto the second surface.First optical cement 202 can ensure that serving as a contrast lid 203 and protecgulum 201 combines closely, and make after combining
Thinner thickness, so as to be conducive to second surface 201B of the optical finger print imaging modules close proximity to protecgulum 201.
It should be noted that in other specific examples of the present embodiment, structure shown in Fig. 7 can also be simplified,
The upper protective shell 2091 of optical finger print imaging modules shown in Fig. 6 is omitted as shown in figure 8, in Fig. 8 in structure after specifically simplifying,
That is, the first structure being now placed in through hole 2031 includes cover sheet 2092 without including upper protective shell
2091, and cover sheet 2092 is Nian Jie with second surface 201B by the second optical cement 210.By omitting upper protective shell
2091, structure, cost-effective, reduce thickness can not only be simplified, and cover sheet 2092 can be made closer to the second table
Face 201B, so that light can preferably be reflected back optics fingerprint sensing element 2094.
It should be noted that in other specific examples of the present embodiment, other manner can also be used to knot shown in Fig. 7
Structure is simplified, and the upper of optical finger print imaging modules shown in Fig. 7 is omitted as shown in figure 9, in Fig. 9 in the structure after specifically simplifying
Protective shell 2091, and it is omitted to be bonded with the second optical cement 210 of protective shell 2091, it is now placed in through hole 2031
The first structure includes cover sheet 2092 without including upper protective shell 2091, and cover sheet 2092 is without using optics
Glue is Nian Jie with second surface 201B.By omitting 2091 and second optical cement 210 of upper protective shell, structure can be simplified, saved into
This.
The embodiment of the present invention provides a kind of phone cover module, incorporated by reference to reference to figures 10 to Figure 14.
0 is please referred to Fig.1, the phone cover module includes protecgulum 301, and there is protecgulum 301 first surface (to be shown in Figure 10
The first surface of protecgulum 301 is not marked in Figure 10) and second surface (not showing second surface in Figure 10).
In the present embodiment, Figure 10 shows the front view of the first surface, and it is rounded to can see protecgulum 301 in Figure 10
Rectangle.In other embodiments, the first surface front view of protecgulum 301 can also be in other shapes, such as orthogonal rectangle
Deng.Also, the first surface that Figure 10 is shown has centrally located rectangular area and frame region, wherein, rectangle
Region can correspond to the screen region of mobile phone.In other embodiments, as needed, protecgulum 301 can also be divided into it
Two regions of its shape and ratio are divided into the region of three or more, naturally it is also possible to not subregion.
1 is please referred to Fig.1, shows the part-structure signal that phone cover module shown in Figure 10 is obtained along after BB chain-dotted line cuttings
Figure.Show that phone cover module includes protecgulum 301 and lining lid 303 in Figure 11.From Figure 11 it can furthermore be seen that protecgulum 301 has
First surface 301A and second surface 301B.First surface 301A can be the upper surface of protecgulum 301, and second surface 301B can be with
For the lower surface of protecgulum 301, i.e. first surface 301A and second surface 301B can be two corresponding surfaces of protecgulum 301.
Lining lid 303 and the second surface 301B of protecgulum 301 are oppositely arranged.There is solid state optics glue 302 between protecgulum 301 and lining lid 303.
Second surface 301B whole faces are pasted onto second surface covered with solid state optics glue 302, lining lid 303 by solid state optics glue 302
301B.Serving as a contrast lid 303 has through hole 3031.Also, through hole 3031 exposes the solid state optics glue 302 do not pasted with lining lid 303.Lining lid
303 through hole 3031 cooperatively forms to store the assembling of subsequent optical fingerprint imaging module first structure with second surface 301B
Slot.
In the present embodiment, 301 face through hole 3031 of protecgulum it is partially transparent, it is accordingly interior that reason can refer to previous embodiment
Hold.
It should be noted that in other embodiments, the partially transparent of 301 face through hole 3031 of protecgulum can also be in semi-transparent
Bright or 301 face through hole 3031 of protecgulum part is coated with the coating of white.But no matter 301 face through hole 3031 of protecgulum
Partial status how, when being required for ensureing that finger is pressed against corresponding position, the reflection light of finger print can be from protecgulum 301
The photosensitive structure for being partially transmitted to subsequent optical fingerprint imaging module of face through hole 3031.On the contrary, it is only necessary to before guarantee
The part of 301 face through hole 3031 of lid can ensure the normal identification of fingerprint, specifically before this part face through hole 3031
Lid 301 can be transparent, translucent or be coated with the states such as white paint.
In the present embodiment, the material and structure of protecgulum 301 and lining lid 303 can refer to previous embodiment corresponding contents.
In the present embodiment, the thickness range of protecgulum 301 can be controlled in 0.15mm~0.5mm, and reason can refer to foregoing
Embodiment corresponding contents.
In the present embodiment, lining lid 303 can have touch function layer, and the phone cover module is to be touched with external hanging type at this time
Control the phone cover module of structure.In other embodiments, lining lid 303 can not also have touch function layer, and only as protection knot
Structure plays a protective role.
In the present embodiment, solid state optics glue 302.Since the thickness of optical cement is usually smaller, pass through solid state optics glue
302 by protecgulum 301 with lining lid 303 fit to together with, can reduce protecgulum 301 and serve as a contrast lid 303 be bonded after overall thickness, so as to protect
Demonstrate,proving subsequent optical finger print imaging modules can be close proximity to the second surface 301B (please referring to Fig.1 1) of protecgulum 301, to improve
The fingerprint imaging quality of optical finger print imaging modules.
Please refer to Fig.1 the other structures that 2, Figure 12 further illustrates mobile phone cover mold shown in Figure 11, that is to say, that Tu12Xian
The schematic diagram after Standard other structures shown in Figure 11 is shown.Show that phone cover module further includes optical finger print imaging in Figure 12
Module (does not mark), and the first structure of the optical finger print imaging modules is located in through hole 3031.The phone cover module also wraps
Middle cover 304 and rear cover 308 are included, serves as a contrast lid 303 and optical finger print imaging modules between protecgulum 301 and middle cover 304, middle cover 304
Between protecgulum 301 and rear cover 308.The phone cover module further includes flexible printed circuit board 307 and printed circuit board
306.Flexible printed circuit board 307 is electrically connected to printed circuit board 306.Also show that phone cover module has display module in Figure 12
305, display module 305 can be liquid crystal display panel or organic electroluminescence display panel.
It also shows the optical finger print imaging modules in Figure 12 at least partly to be surrounded by dotted line frame 309, by dotted line frame
309 structures surrounded may be referred to subsequent Figure 13.
Please refer to Fig.1 3, it is shown that in structure shown in Figure 12, the amplification that dotted line frame 309 surrounds the one of example in part is shown
It is intended to.I.e. in one of specific example of the present embodiment, the optical finger print imaging modules include upper protective shell 3091, protect
Protecting cover plate 3092, chip 3093, optical finger print sensing element 3094 (such as cmos sensor or ccd sensor),
In the present embodiment, upper protective shell 3091 is located at 3092 side of cover sheet.Optical finger print sensing element 3094 is located at
3092 lower section of cover sheet, for receiving the reflection light of fingerprint.Chip 3093 is used to handle optical finger print sensing element 3094
Received information in fingerprint, chip 3093 can be arranged at the wherein one side of cover sheet 3092, and equally set
Above optical finger print sensing element 3094 (correspondence position, which is not used in, receives light).In other embodiments, chip 3093 also may be used
To be arranged on other positions.
Please refer to Fig.1 4, it is shown that in structure shown in Figure 12, dotted line frame 309 surrounds the amplification signal of another example of part
Figure.I.e. in another specific example of the present embodiment, the optical finger print imaging modules further include light source 3095, light guide plate
3096th, (the flexible printed circuit board 307 in flexible printed circuit board 3097 and Figure 12 in Figure 14 of flexible printed circuit board 3097
For same structure, simply different piece is shown in different figures) and side protective shell 3098.
In the present embodiment, light source 3095 can be LED light or other devices.Light source 3095 can be arranged on light guide plate
3096 wherein one side.Light guide plate 3096 is located at 3094 lower section of optical finger print sensing element, for the light for sending light source 3095
Line upwardly propagates after disperseing, for irradiating corresponding finger print.At least subregion of optical finger print sensing element 3094
Can light transmission cross line, so as to ensure to allow the light spread out of in light guide plate 3096 through optical finger print sensing element 3094, the light
Line continues to propagate to cover sheet 3092 and protecgulum 301, until the light is irradiated to the finger for being pressed against 301 corresponding position of protecgulum
On line.The reflection light of the light sequentially passes through protecgulum 301 and cover sheet 3092 again, until by optical finger print sensing element
Part 3094 receives.After the reflection light that optical finger print sensing element 3094 receives, information in fingerprint, the fingerprint image are formed
As information is after the processing of chip 3093 and corresponding software, the fingerprint image of respective finger can be obtained.
In the present embodiment, 3097 one end of flexible printed circuit board is connected to the chip of the optical finger print imaging modules
3093, the other end is connected to printed circuit board 306 (please referring to Fig.1 2).Lower protective shell 3099 be located at the entire optical finger print into
As the bottom of module, and side protective shell 3098 is located at the side of optical finger print imaging modules.
In the present embodiment, welding can be passed through between upper protective shell 3091, side protective shell 3098 and lower protective shell 3099
Mode connects together, and by cover sheet 3092, chip 3093, optical finger print sensing element 3094, light source 3095, light guide plate
3096 and in 307 grade critical pieces of flexible printed circuit board are wrapped in.
The first structure includes upper protective shell 3091 and cover sheet 3092.That is in Figure 13, by the optical finger print into
As the upper protective shell 3091 and cover sheet 3092 of module are assemblied in through hole 3031.Also, upper protective shell 3091 and protection cap
Plate 3092 is pasted onto second surface 301B by solid state optics glue 302.
In the phone cover module that the above-mentioned specific example of the present embodiment is provided, including with first surface 301A and the second table
The protecgulum 301 of face 301B and the lining lid 303 being oppositely arranged with the second surface 301B of protecgulum 301.The present embodiment is above-mentioned specific
In example, the first structure also has gap (not marking) after being assembled with through hole 3031, exists centainly due to assembling always
Location tolerance, therefore, the gap can usually exist always.And in the present embodiment, due to entire optical finger print imaging modules
The lower section of protecgulum is assemblied in, therefore, it is not necessary to consider the tight assembling of first structure and through hole 3031, therefore, the gap may be used also
It is larger to be suitably adjusted so as to, with convenient for assembly.
In the present embodiment, since the lining lining lid of lid 303 has through hole 3031.The phone cover module further includes the optics and refers to
Line imaging modules, the first structure of the optical finger print imaging modules are located in the through hole, and the first structure includes upper guarantor
Protective case 3091 and cover sheet 3092.Since in the phone cover module, through hole 3031 is provided in lining lid 303, thus, protecgulum
301 need not set to install the through hole of optical finger print imaging modules, that is to say, that protecgulum 301 can be a kind of unitary solid
Covering plate structure.And the first structure of the optical finger print imaging modules is located in through hole 3031, lining lid 303 again with protecgulum 301
Second surface 301B is oppositely arranged, and therefore, first structure and the protecgulum 301 of the optical finger print imaging modules are oppositely arranged, and is protected
Corresponding fingerprint identification function can be realized by demonstrate,proving the optical finger print imaging modules.At this point, the technical solution is avoided in protecgulum
301 set through holes, and protecgulum 301 is not provided with through hole can improve Experience Degree of the user to mobile phone.As it can be seen that the phone cover module
In, on the premise of it need not through hole 301 be set on mobile phone protecgulum 301, it can realize the demand of fingerprint function and improve
User is to the Experience Degree of mobile phone.
Further, since through hole 3031 is arranged in lining lid 303, and the first structure of the optical finger print imaging modules is located at
In the through hole, that is to say, that the optical finger print imaging modules are assemblied in the lower section of protecgulum.At this point, through hole 3031 with it is described
Build-up tolerance between optical finger print imaging modules can suitably amplify, and reduce the dress of the optical finger print imaging modules
With difficulty, the assembly difficulty of phone cover module is also just reduced, improves the assembling yield of phone cover module and corresponding mobile phone.
Further, there is solid state optics glue 302, lining lid 303 passes through solid state optics glue 302 between protecgulum 301 and lining lid 303
It is pasted onto the second surface.
There is solid state optics glue 302, lining lid 303 is pasted onto by solid state optics glue 302 between protecgulum 301 and lining lid 303
The second surface.The first structure of the follow-up optical finger print imaging modules is pasted onto described also by solid state optics glue 302
Second surface 301B.Solid state optics glue 302 can ensure that serving as a contrast lid 303 and protecgulum 301 combines closely, while make the first structure
It combines closely with protecgulum 301.Also, solid state optics glue 302 can reduce corresponding fingerprint light into the light in terms of two
Learn the loss during fingerprint imaging module：In a first aspect, the refractive index of solid state optics glue 302 can be with the protecgulum of glass material
301 refractive index is identical, so as to reduce the loss of corresponding fingerprint light；On the other hand, gluing due to solid state optics glue 302
Patch acts on, and there is no air between the first structure and protecgulum 301, can significantly reduce the loss of corresponding fingerprint light.Two
A aspect is conducive to the fingerprint imaging of the optical finger print imaging modules.
It should be noted that in other specific examples of the present embodiment, can be gone with the optical finger print imaging modules
Upper and lower protective shell is fallen, and side protective shell is set in light guide plate surrounding, optical finger print sensing element is accommodated so as to form a slot
Part, cover sheet, light source and chip, and as reflecting layer after can flexible printed circuit board being folded into light guide plate.
It should be noted that in other embodiments, when phone cover module only serves defencive function, during without touch function,
Its protecgulum and lining lid can all be the structure of one layer of glass.Such as when touch function is integrated in inside display module, phone cover
Module need not have touch function again, and protecgulum and lining lid all can be single-glasses at this time.
It should be noted that in other embodiments, the optical finger print imaging modules include upper protective shell and lower protective shell
At least one, the upper protective shell belongs to the first structure, and the lower protective shell is not belonging to the first structure.
That is upper protective shell can be contained in the through hole of lining lid, and lower protective shell is not contained in the through hole of lining lid and (serves as a contrast the logical of lid
Hole cooperatively forms the fitting groove of the optical finger print imaging modules with second surface).
The embodiment of the present invention additionally provides a kind of mobile phone, and the mobile phone includes times that this specification previous embodiment is provided
It anticipates a kind of phone cover module.Since the mobile phone that the present embodiment is provided has phone cover module provided by the present invention, institute
The user experience for stating mobile phone improves, and the assembly difficulty of the mobile phone reduces.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the scope of restriction.
Claims (10)
1. a kind of phone cover module, which is characterized in that including：
Protecgulum, the protecgulum have first surface and second surface；
Lining lid, the second surface of the lining lid and the protecgulum are oppositely arranged；
The lining lid has through hole；
Optical finger print imaging modules, the optical finger print imaging modules include first structure, optical finger print sensing element and chip,
The width of optical finger print sensing element is more than the width of first structure, and first structure is located above optical finger print sensing element, core
Piece is located above the optical finger print sensing element of first structure one side, and the first structure is located in the through hole, the chip
It is located at lining lid lower section with optical finger print sensing element.
2. phone cover module as described in claim 1, which is characterized in that there is the first light between the protecgulum and the lining lid
Glue is learned, the lining lid is pasted onto the second surface by first optical cement.
3. phone cover module as claimed in claim 2, which is characterized in that the first structure includes upper protective shell and protection cap
Plate, has the second optical cement between the protecgulum and the upper protective shell, the upper protective shell passes through the second optics gluing
It is attached to the second surface.
4. phone cover module as claimed in claim 2, which is characterized in that the first structure includes cover sheet, before described
There is the second optical cement, the cover sheet is pasted onto described the by second optical cement between lid and the cover sheet
Two surfaces.
5. phone cover module as described in claim 1, which is characterized in that the second surface whole face is covered with solid state optics
Glue, for the lining lid by the solid state optics glue in the second surface, the first structure passes through the solid state optics
Glue is in the second surface.
6. phone cover module as claimed in claim 5, which is characterized in that the optical finger print imaging modules include upper protective shell
With lower protective shell at least one, the upper protective shell belongs to the first structure, and the lower protective shell is not belonging to described
First structure.
7. phone cover module as described in claim 1, which is characterized in that the thickness range of the protecgulum for 0.15mm~
0.5mm。
8. phone cover module as described in claim 1, which is characterized in that the lining lid has touch function layer.
9. the phone cover module as described in claim 1 to 8 any one, which is characterized in that middle cover and rear cover are further included, it is described
Between the protecgulum and the middle cover, the middle cover is located at the protecgulum and institute for lining lid and the optical finger print imaging modules
It states between rear cover.
10. a kind of mobile phone, which is characterized in that the mobile phone includes the phone cover module described in claim 1 to 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510203657.2A CN104836867B (en) | 2015-04-24 | 2015-04-24 | Phone cover module and mobile phone |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510203657.2A CN104836867B (en) | 2015-04-24 | 2015-04-24 | Phone cover module and mobile phone |
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| Publication Number | Publication Date |
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| CN104836867A CN104836867A (en) | 2015-08-12 |
| CN104836867B true CN104836867B (en) | 2018-05-18 |
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| CN201510203657.2A Active CN104836867B (en) | 2015-04-24 | 2015-04-24 | Phone cover module and mobile phone |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105262860B (en) * | 2015-09-02 | 2018-06-29 | 广东欧珀移动通信有限公司 | The manufacturing method and mobile phone of a kind of glass assembly |
| CN105116968A (en) * | 2015-09-16 | 2015-12-02 | 上海箩箕技术有限公司 | Electronic equipment with fingerprint identification function |
| WO2017084003A1 (en) * | 2015-11-16 | 2017-05-26 | Shanghai Oxi Technology Co., Ltd | Fingerprint system and mobile phone |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| TWI562011B (en) * | 2016-03-09 | 2016-12-11 | Chipmos Technologies Inc | Optical fingerprint sensor package structure |
| CN105631444A (en) * | 2016-03-17 | 2016-06-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and fingerprint identification module assembling method |
| CN105979042B (en) * | 2016-07-29 | 2019-06-18 | 上海摩软通讯技术有限公司 | Mobile terminal and its installation method |
| CN106598160A (en) * | 2016-12-30 | 2017-04-26 | 深圳天珑无线科技有限公司 | Mobile terminal |
| CN107395825A (en) * | 2017-09-16 | 2017-11-24 | 南京中高知识产权股份有限公司 | Full frame smart mobile phone |
| CN110998480B (en) | 2017-10-27 | 2021-12-28 | 华为技术有限公司 | Structural assembly, electronic device and fingerprint module assembly method |
| CN108038477B (en) * | 2018-01-05 | 2022-03-22 | 敦泰电子有限公司 | Protective housing for optical sensing |
| CN109101080B (en) * | 2018-06-25 | 2022-02-08 | 珠海市魅族科技有限公司 | Terminal device |
| CN110188702B (en) * | 2019-05-31 | 2021-03-30 | 上海天马微电子有限公司 | Display panel and display device |
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| JP4141997B2 (en) * | 2004-06-09 | 2008-08-27 | シャープ株式会社 | Sensor protective cover and pointing device |
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| CN204143463U (en) * | 2014-10-27 | 2015-02-04 | 广东欧珀移动通信有限公司 | There is the mobile electronic terminal of preposition fingerprint sensor |
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| CN104836867A (en) | 2015-08-12 |
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