CN105512645A - Optical fingerprint sensor module - Google Patents
Optical fingerprint sensor module Download PDFInfo
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- CN105512645A CN105512645A CN201610033959.4A CN201610033959A CN105512645A CN 105512645 A CN105512645 A CN 105512645A CN 201610033959 A CN201610033959 A CN 201610033959A CN 105512645 A CN105512645 A CN 105512645A
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- fingerprint sensor
- optical fingerprint
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- protective seam
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- 230000003287 optical effect Effects 0.000 title claims abstract description 161
- 230000001681 protective effect Effects 0.000 claims description 80
- 230000005540 biological transmission Effects 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 25
- 239000003292 glue Substances 0.000 claims description 22
- 238000003384 imaging method Methods 0.000 claims description 11
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 128
- 238000000034 method Methods 0.000 description 14
- 230000000694 effects Effects 0.000 description 13
- 238000005538 encapsulation Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 7
- 238000001914 filtration Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000392 somatic effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses an optical fingerprint sensor module, comprising an optical fingerprint sensor, a protection layer located above the optical fingerprint sensor, and a heightening layer located between the protection layer and the optical fingerprint sensor, wherein the optical fingerprint sensor is provided with a light transmitting base plate and a device layer located on the surface of the light transmitting base plate, the device layer is provided with a pixel zone, the pixel zone is provided with multiple pixels, each pixel is provided with a light transmitting area and a lightproof area, each lightproof area is provided with a photosensitive element, each light transmitting area enables light rays to penetrate through the pixel zone, and the optical fingerprint sensor is provided with a binding zone; the heightening layer at least covers the pixel zone. The optical fingerprint sensor module is simplified in structure and improved in reliability.
Description
Technical field
The present invention relates to optical finger print identification field, particularly relate to a kind of optical fingerprint sensor module.
Background technology
Fingerprint imaging recognition technology is the fingerprint image being collected human body by optical fingerprint sensor, then compares with the existing fingerprint imaging information in system, whether carrys out correct judgment, and then realize the technology of identification.Due to the convenience that it uses, and the uniqueness of somatic fingerprint, fingerprint imaging recognition technology is widely used in every field.The gate control system and the consumer product area such as PC and mobile phone etc. of the such as field of safety check such as public security bureau and customs, building.The implementation of fingerprint imaging recognition technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Wherein, optical finger print imaging recognition technology imaging effect is relatively better, and equipment cost is relatively low.
The content of more associated optical fingerprint sensors can be the Chinese utility model patent of CN203405831U with reference to publication number.
The structure of the module of existing optical fingerprint sensor haves much room for improvement, and performance has much room for improvement.
Summary of the invention
The problem that the present invention solves is to provide a kind of optical fingerprint sensor module, with the structure of optimizing optical fingerprint sensor module, improves the performance of optical fingerprint sensor module.
For solving the problem, the invention provides a kind of optical fingerprint sensor module, described optical fingerprint sensor module comprises:
Optical fingerprint sensor, described optical fingerprint sensor has transparent substrates and is positioned at the device layer on described transparent substrates surface, described device layer has pixel region, described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region, and described optical fingerprint sensor has binding district;
Protective seam, described protective seam is positioned at above described optical fingerprint sensor;
Described optical fingerprint sensor module also comprises:
Padded layer, described padded layer is between described protective seam and described optical fingerprint sensor, and described padded layer at least covers described pixel region.
Optionally; described optical fingerprint sensor module also comprises backlight; described backlight provides the light needed for fingerprint imaging; the emergent light light of described backlight enters described optical fingerprint sensor from described transparency carrier; again through the described transmission region of described pixel region; then through described padded layer, described protective seam is finally entered.
Optionally, the thickness of described padded floor is more than or equal to the maximum height of device in described binding district.
Optionally, described binding district reads at least one of chip and flexible printed circuit board for binding signal.
Optionally, described padded layer comprises light transmission medium layer, has the first printing opacity glue-line between described light transmission medium layer and described optical fingerprint sensor, has the second printing opacity glue-line between described light transmission medium layer and described protective seam.
Optionally, the material of described light transmission medium layer is transparent glass or light-passing plastic.
Optionally, at least one surface in described light transmission medium layer lower surface, described light transmission medium layer upper surface, described protective seam lower surface and described optical fingerprint sensor upper surface has filter layer.
Optionally, described padded layer is light-transmissive photosensitive glue, printing opacity heat-sensitive glue, clear pressure senstivie glue or transparent double-side adhesive tape.
Optionally, at least one surface of described optical fingerprint sensor upper surface and described protective seam lower surface has filter layer.
Optionally, the lower surface of described optical fingerprint sensor has light antireflection layer.
Compared with prior art, technical scheme of the present invention has the following advantages:
In technical scheme of the present invention, provide a kind of new optical fingerprint sensor module, described optical fingerprint sensor module comprises optical fingerprint sensor and protective seam, and described protective seam is positioned at above described optical fingerprint sensor.Described optical fingerprint sensor has transparent substrates and is positioned at the device layer on described transparent substrates surface, described device layer has pixel region, described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, described transmission region enables light through described pixel region, and described optical fingerprint sensor also has binding district.By arranging padded layer between protective seam and described optical fingerprint sensor, thus make the encapsulation of protective seam can not affect the device bound in district, and then blind hole need not be made at protective layer, and flat plate body structure directly can be used as protective seam, simplify the structure of protective seam, simplify manufacturing process and the encapsulation process of protective seam, also manufacturing process and the encapsulation process of whole optical fingerprint sensor module is just simplified, improve reliability and the yield of protective seam, also just improve reliability and the yield of whole optical fingerprint sensor module, and also improve process efficiency simultaneously, reduce cost.
Further; described padded layer comprises light transmission medium layer; at the upper surface of described light transmission medium layer and lower surface, filter layer is set; described optical fingerprint sensor arranges filter layer; at the lower surface of protective seam, filter layer is set; each filter layer both can play the effect of filtering surround lighting, can play again the effect changing whole optical fingerprint sensor module appearance color, thus the performance of optical fingerprint sensor module is improved further.
Further, at the lower surface of described optical fingerprint sensor, light antireflection layer is set, the light that light antireflection layer can increase backlight enters the ratio of optical fingerprint sensor, therefore, when carrying out fingerprint image acquisition, more light can be utilized to carry out the collection of fingerprint image, thus obtain sharpness and the higher fingerprint image of accuracy, improve the performance of optical fingerprint sensor module further.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of existing a kind of optical fingerprint sensor module;
Fig. 2 is the cross-sectional view of the optical fingerprint sensor module that first embodiment of the invention provides;
Fig. 3 is the cross-sectional view of the optical fingerprint sensor module that second embodiment of the invention provides;
Fig. 4 is the cross-sectional view of the optical fingerprint sensor module that third embodiment of the invention provides;
Fig. 5 is the cross-sectional view of the optical fingerprint sensor module that fourth embodiment of the invention provides.
Embodiment
As shown in Figure 1, it comprises the structures such as protective seam 110, optical fingerprint sensor (mark), light guide plate 122 and light source 124 to existing a kind of optical fingerprint sensor module.Described optical fingerprint sensor comprises pixel substrate 121 and flexible printed circuit board (mark).Described pixel substrate has pel array (not shown in figure 1).Described flexible printed circuit board comprises three parts, Part I 1251 is bundled in described pixel substrate upper surface (Part I 1251 of described flexible printed circuit board refers to the part of described flexible printed circuit board higher than pixel substrate 121), Part III 1253 is positioned at bottom optical fingerprint sensor, and Part II 1252 connects Part I 1251 and Part III 1253.
Protective seam 110 has outside surface and inside surface.Wherein, outside surface is one side upward in Fig. 1, and inside surface is one side relative with described optical fingerprint sensor in Fig. 1.Outside surface has the first blind hole 111, inside surface has the second blind hole 112.There is between the inside surface of pixel substrate 121 upper surface and outer cover plate 110 glue-line 130, fit together by glue-line 130 between pixel substrate 121 and outer cover plate 110.The Part I 1251 of described flexible printed circuit board binds together for structure electric connection structures such as the respective pins (not shown) with pixel substrate 121.Described Part I 1251 higher than part (in other words higher than the part of protective seam inside surface) the i.e. top of Part I 1251 of glue-line 130 upper surface, the top of described Part I hold by the second blind hole 112.If the top of described Part I 1251 not hold by the second blind hole 112, then the inside surface of protective seam 110 and pixel substrate 121 upper surface are difficult to closely be pasted together.Meanwhile, the signal that also has being bundled in pixel substrate 121 surface reads chip 123.Signal reads chip 123 reads chip 123 top higher than the part of protective seam 110 inside surface and signal, the top that signal reads chip 123 also hold by the second blind hole 112.If the top that signal reads chip 123 not hold by the second blind hole 112, then the inside surface of protective seam 110 and pixel substrate 121 upper surface are difficult to closely be pasted together equally.
In other cases, in existing optical fingerprint sensor module, also may make two blind holes at inside surface, two blind holes are respectively used to hold chip top and flexible printed circuit board Part I 1251 top.
As shown in the above, existing optical fingerprint sensor module, in order to realize the laminating of its protective seam and other structure, needs to dig blind hole at the inside surface of protective seam, to hold each top device in binding district.And set up these blind holes, make the complex structure of optical fingerprint sensor module, the reliability decrease of protective seam, yield reduces, and the manufacture craft difficulty of optical fingerprint sensor module is increased, and cost improves.
For this reason; the invention provides a kind of new optical fingerprint sensor module; by arranging padded layer between protective seam and described optical fingerprint sensor; thus ensure that the lower surface of protective seam can not touch the device in corresponding binding district, or under ensureing protective seam, can not there be any influence and effect (comprising pressure effect etc.) on (interior) surface to the device in corresponding binding district.Now; the surface of protective seam need not make blind hole; simplify the structure of protective seam; simplify manufacturing process and the encapsulation process of protective seam; correspondingly simplify manufacturing process and the encapsulation process of whole optical fingerprint sensor module; improve reliability and the yield of optical fingerprint sensor module, and also improve process efficiency simultaneously, reduce cost.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail specific embodiments of the invention below in conjunction with accompanying drawing.
First embodiment of the invention provides a kind of optical fingerprint sensor module, please refer to Fig. 2, and described optical fingerprint sensor module comprises optical fingerprint sensor (mark) and protective seam 240, and protective seam 240 is positioned at above described optical fingerprint sensor.Described optical fingerprint sensor has transparent substrates 201 and is positioned at the device layer 202 on transparent substrates 201 surface.Though do not show in figure, but device layer 202 has pixel region (not showing separately), described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region.
In the present embodiment, described optical fingerprint sensor also has binding district (not showing separately), and described binding district is the binding position region of corresponding device on described optical fingerprint sensor.Described corresponding device refers to that signal reads the device such as chip and outer even flexible printed circuit board, such as, it is that signal reads chip bonding district that signal reads region, chip bonding position, and flexible printed circuit board binding region, position is flexible printed circuit board binding district.Concrete, the described binding district in the present embodiment reads chip 220 for binding signal and connects flexible printed circuit board (flexible printed circuit board) 230 outward.Concrete, as shown in Figure 2, be bundled in described binding district by anisotropy conductiving glue (ACF) 231 between flexible printed circuit board 230, and signal reading chip 220 is also bundled in described binding district with corresponding anisotropy conductiving glue (mark).
It should be noted that, in other embodiment, signal reads chip 220 and flexible printed circuit board 230 also can adopt alternate manner to be bundled in described binding district.
It should be noted that, in other embodiment, described binding district also only can read chip and outer one of them of flexible printed circuit board of connecting for binding signal.
Please continue to refer to Fig. 2, described optical fingerprint sensor module also comprises padded layer (mark).
In the present embodiment, described padded layer comprises light transmission medium layer 212.Further, there is between light transmission medium layer 212 and optical fingerprint sensor the first printing opacity glue-line 211, there is between light transmission medium layer 212 and protective seam 240 second printing opacity glue-line 213.Whole described padded layer between protective seam 240 and described optical fingerprint sensor, simultaneously also between the first printing opacity glue-line 211 and the second printing opacity glue-line 213.
In the present embodiment, the material of light transmission medium layer 212 can be transparent glass or light-passing plastic.First printing opacity glue-line 211 and the second printing opacity glue-line 213 can be light-transmissive photosensitive glue, printing opacity heat-sensitive glue, clear pressure senstivie glue or transparent double-side adhesive tape.
In the present embodiment, the THICKNESS CONTROL of light transmission medium layer 212 is more than 50 μm.The THICKNESS CONTROL of the first printing opacity glue-line 211 and the second printing opacity glue-line 213 is below 100 μm.And the gross thickness of light transmission medium layer 212, first printing opacity glue-line 211 and the second printing opacity glue-line 213 controls more than 150 μm.
In the present embodiment, though do not show in figure, described padded layer (i.e. light transmission medium layer 212) at least covers described pixel region.Described padded layer covers described pixel region and can play a protective role to described pixel region.Further, described padded floor does not cover (covering) above-mentioned binding district.
From aforementioned, above-mentioned binding district comprises signal and reads the region such as chip bonding district and flexible printed circuit board binding district.Meanwhile, the thickness of described padded floor is more than or equal to the maximum height of device in described binding district.Above-mentioned binding district is not covered at described padded floor; and the thickness of described padded floor is when being more than or equal to the maximum height of device in described binding district; after protective seam 240 and described optical fingerprint sensor are packaged together, protective seam 240 can not affect the device in described binding district.Such as shown in Fig. 2; due to the padded effect of light transmission medium layer 212; the lower surface of protective seam 240 and signal read between chip and outer flexible printed circuit board and are all in contactless state; protective seam 240 lower surface and signal read between chip top has interval, also has interval between protective seam 240 lower surface and outer flexible printed circuit board top.Therefore, protective seam 240 can not affect signal reading chip 220 and outer even flexible printed circuit board 230.
It should be noted that, in other embodiment, described padded floor also can cover above the device in above-mentioned binding district, but the segment thickness that described padded floor is positioned in described binding district is less, thus ensures that whole described padded layer upper surface remains smooth.That is, now, described padded layer can have inverted ledge structure, and in ledge structure, the part of thickness less (or minimum) is upside down in the top of corresponding device in described binding district just.
In the present embodiment, the thickness of described padded layer refers to the thickness of described padded layer main body part.In fig. 2, described padded layer each several part thickness is identical, and therefore the thickness of described padded layer each position is equal to the thickness of main part.In other embodiment, when the variable thickness of described padded layer, take the thickness of main part as the thickness of described padded layer, and the thickness of main part is also the maximum gauge of described padded layer usually.
It should be noted that; though do not show in Fig. 2; but in the present embodiment; described optical fingerprint sensor module can also comprise backlight; described backlight provides the light needed for fingerprint imaging, and the emergent light light of described backlight enters described optical fingerprint sensor from described transparency carrier, then through the described transmission region of described pixel region; then through described padded layer, described protective seam 240 is finally entered.
In the optical fingerprint sensor module that the present embodiment provides; by arranging light transmission medium layer 212 as padded layer between protective seam 240 and described optical fingerprint sensor; thus make the encapsulation of protective seam 240 can not affect the device bound in district; and then blind hole need not be made on protective seam 240 surface; and flat plate body structure directly can be used as protective seam 240; simplify the structure of protective seam 240; simplify manufacturing process and the encapsulation process of protective seam 240, also just simplify manufacturing process and the encapsulation process of whole optical fingerprint sensor module.Meanwhile, improve reliability and the yield of protective seam 240, also just improve reliability and the yield of whole optical fingerprint sensor module.Further, also improve process efficiency, reduce cost.
Second embodiment of the invention provides another kind of optical fingerprint sensor module; please refer to Fig. 3; described optical fingerprint sensor module comprises optical fingerprint sensor (mark) and protective seam 340, and protective seam 340 is positioned at above described optical fingerprint sensor.Described optical fingerprint sensor has transparent substrates 301 and is positioned at the device layer 302 on transparent substrates 301 surface.Though do not show in figure, but device layer 302 has pixel region (not showing separately), described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region.
Described optical fingerprint sensor also has binding district (not showing separately), and described binding district is the binding position region of corresponding device on described optical fingerprint sensor.In the present embodiment, described binding district reads chip 320 for binding signal and connects flexible printed circuit board 330 outward.Concrete, as shown in Figure 3, between flexible printed circuit board 330, be bundled in described binding district by anisotropy conductiving glue 331, and signal reading chip 320 is also bundled in described binding district with corresponding anisotropy conductiving glue (mark).It should be noted that, in other embodiment, signal reads chip 320 and flexible printed circuit board 330 also can adopt alternate manner to be bundled in described binding district.
Please continue to refer to Fig. 3, described optical fingerprint sensor module also comprises padded layer (mark).In the present embodiment, described padded layer comprises light transmission medium layer 314.Further, there is between light transmission medium layer 314 and optical fingerprint sensor the first printing opacity glue-line 312, there is between light transmission medium layer 314 and protective seam 340 second printing opacity glue-line 316.Whole described padded layer is between protective seam 340 and described optical fingerprint sensor, and described padded layer is also between the first printing opacity glue-line 312 and the second printing opacity glue-line 316 simultaneously.
In the present embodiment, the material of light transmission medium layer 314 can be transparent glass or light-passing plastic.First printing opacity glue-line 312 and the second printing opacity glue-line 316 can be light-transmissive photosensitive glue, printing opacity heat-sensitive glue, clear pressure senstivie glue or transparent double-side adhesive tape.
In the present embodiment, described padded layer also comprises the filter layer 313 being positioned at light transmission medium layer 314 lower surface and the filter layer 315 being positioned at light transmission medium layer 314 lower surface.
In the present embodiment, described device layer 302 upper surface also has filter layer 311, and the lower surface of protective seam 340 also has filter layer 317.
In the present embodiment, filter layer 311, filter layer 313, filter layer 315 and filter layer 317 can be the light absorbing zones such as ink, also can be the interference reflection horizon of multi-layer film structure.
In other embodiment; filter layer 311, filter layer 313, filter layer 315 and filter layer 317 can not simultaneously exist; wherein any one deck, two-layer or three layers can be only had; namely in other embodiment; at least one surface in described light transmission medium layer lower surface, described light transmission medium layer upper surface, described protective seam lower surface and described optical fingerprint sensor upper surface has filter layer, and the present invention is not construed as limiting this.
Identical with previous embodiment, described padded layer at least covers described pixel region, but described padded floor does not cover (covering) above-mentioned binding district, and the thickness of described padded floor is more than or equal to the maximum height of device in described binding district.Therefore, protective seam 340 can not affect signal reading chip 320 and outer even flexible printed circuit board 330.
It should be noted that, though do not show in Fig. 3, in the present embodiment, described optical fingerprint sensor module can also comprise backlight.
Other NM structure of the present embodiment optical fingerprint sensor module and content can with reference to previous embodiment corresponding contents.
In the optical fingerprint sensor module that the present embodiment provides; by arranging light transmission medium layer 314 as padded layer between protective seam 340 and described optical fingerprint sensor; thus blind hole need not be made on protective seam 340 surface; simplify manufacturing process and the encapsulation process of optical fingerprint sensor module; improve reliability and the yield of optical fingerprint sensor module; and also improve process efficiency simultaneously, reduce cost.And; at the upper surface of light transmission medium layer 314 and lower surface, filter layer 313 and filter layer 315 are set; described optical fingerprint sensor arranges filter layer 311; at the lower surface of protective seam 340, filter layer 317 is set; each filter layer both can play the effect of filtering surround lighting; the effect (outward appearance when namely observing from protective seam 340) changing whole optical fingerprint sensor module appearance color can be played again downwards, thus the performance of optical fingerprint sensor module is improved further.
Third embodiment of the invention provides another kind of optical fingerprint sensor module; please refer to Fig. 4; described optical fingerprint sensor module comprises optical fingerprint sensor (mark) and protective seam 440, and protective seam 440 is positioned at above described optical fingerprint sensor.Described optical fingerprint sensor has transparent substrates 401 and is positioned at the device layer 402 on transparent substrates 401 surface.Though do not show in figure, but device layer 402 has pixel region (not showing separately), described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region.
Described optical fingerprint sensor also has binding district (not showing separately), and described binding district is the binding position region of corresponding device on described optical fingerprint sensor.In the present embodiment, described binding district reads chip 420 for binding signal and connects flexible printed circuit board 430 outward.Concrete, as shown in Figure 4, between flexible printed circuit board 430, be bundled in described binding district by anisotropy conductiving glue 431, and signal reading chip 420 is also bundled in described binding district with corresponding anisotropy conductiving glue (mark).It should be noted that, in other embodiment, signal reads chip 420 and flexible printed circuit board 430 also can adopt alternate manner to be bundled in described binding district.
Please continue to refer to Fig. 4, described optical fingerprint sensor module also comprises padded layer (mark).In the present embodiment, described padded layer comprises glue-line 412, and glue-line 412 can be light-transmissive photosensitive glue, printing opacity heat-sensitive glue, clear pressure senstivie glue or transparent double-side adhesive tape, as shown in Figure 4.
In the present embodiment, described device layer 402 upper surface has filter layer 411, and the lower surface of protective seam 440 has filter layer 413.Filter layer 411 and filter layer 413 can be the light absorbing zones such as ink, also can be the interference reflection horizon of multi-layer film structure.
In other embodiment; filter layer 411 and filter layer 413 can not simultaneously exist, and can only have wherein one deck arbitrarily, that is; at least one surface of described optical fingerprint sensor upper surface and described protective seam lower surface has filter layer, and the present invention is not construed as limiting this.
Identical with previous embodiment, described padded layer at least covers described pixel region, but described padded floor does not cover (covering) above-mentioned binding district, and the thickness of described padded floor is more than or equal to the maximum height of device in described binding district.Therefore, protective seam 440 can not affect signal reading chip 420 and outer even flexible printed circuit board 430.
It should be noted that, though do not show in Fig. 4, in the present embodiment, described optical fingerprint sensor module can also comprise backlight.
Other NM structure of the present embodiment optical fingerprint sensor module and content can with reference to previous embodiment corresponding contents.
In the optical fingerprint sensor module that the present embodiment provides; by arranging glue-line 412 as padded layer between protective seam 440 and described optical fingerprint sensor; glue-line 412 both can play stickup effect; padded effect can be played again; simplify manufacturing process and the encapsulation process of optical fingerprint sensor module; improve reliability and the yield of optical fingerprint sensor module, and also improve process efficiency simultaneously, reduce cost.And; by arranging filter layer 411 on described optical fingerprint sensor; arrange filter layer 413 at the lower surface of protective seam 440, each filter layer both can play the effect of filtering surround lighting, can play again the effect changing whole optical fingerprint sensor module appearance color.
Fourth embodiment of the invention provides another kind of optical fingerprint sensor module; please refer to Fig. 5; described optical fingerprint sensor module comprises optical fingerprint sensor (mark) and protective seam 550, and protective seam 550 is positioned at above described optical fingerprint sensor.Described optical fingerprint sensor has transparent substrates 501 and is positioned at the device layer 502 on transparent substrates 501 surface.Though do not show in figure, but device layer 502 has pixel region (not showing separately), described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region.
Described optical fingerprint sensor also has binding district (not showing separately), and described binding district is the binding position region of corresponding device on described optical fingerprint sensor.In the present embodiment, described binding district connects flexible printed circuit board 530 outside binding.Concrete, as shown in Figure 5, between flexible printed circuit board 530, be bundled in described binding district by anisotropy conductiving glue 531.
Please continue to refer to Fig. 5, described optical fingerprint sensor module also comprises padded layer 510, as shown in Figure 5.
In the present embodiment, owing to not having signal to read chip in the binding district of described optical fingerprint sensor, therefore, the thickness of padded layer 510 can be smaller, specifically can control more than 50 μm.
In the present embodiment, described signal reads chip and is not bundled in the binding district of described optical fingerprint sensor, and described signal reads chip and can be bundled on flexible printed circuit board or on corresponding (outside) system circuit board.
Identical with previous embodiment, padded layer 510 at least covers described pixel region, but padded floor 510 does not cover (covering) above-mentioned binding district, and the thickness of padded floor 510 is more than or equal to the maximum height of device in described binding district.Therefore, protective seam 550 connects flexible printed circuit board 530 outside can not affecting.
It should be noted that, though do not show in Fig. 5, in the present embodiment, described optical fingerprint sensor module can also comprise backlight.
Other NM structure of the present embodiment optical fingerprint sensor module and content can with reference to previous embodiment corresponding contents.
Different from previous embodiment, in the present embodiment, the lower surface of described optical fingerprint sensor also has light antireflection layer 520 (in Fig. 5, light antireflection layer 520 is specifically arranged on transparent substrates 501 lower surface), and described backlight can be arranged on below light antireflection layer 520 (immediately below comprising and side-lower).The light that light antireflection layer 520 can increase described backlight enters the ratio of optical fingerprint sensor, therefore, when carrying out fingerprint image acquisition, more light can be utilized to carry out the collection of fingerprint image, thus obtain sharpness and the higher fingerprint image of accuracy, improve the performance of optical fingerprint sensor module further.
In the optical fingerprint sensor module that the present embodiment provides; by arranging padded layer 510 between protective seam 550 and described optical fingerprint sensor; padded layer 510 plays padded effect; thus prevent protective seam and flexible printed circuit board 530 from influencing each other; improve reliability and the yield of optical fingerprint sensor module; and also improve process efficiency simultaneously, reduce cost.Meanwhile, the lower surface of described optical fingerprint sensor also has light antireflection layer 520, thus improve described optical fingerprint sensor module gather sharpness and the accuracy of fingerprint image.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (10)
1. an optical fingerprint sensor module, comprising:
Optical fingerprint sensor, described optical fingerprint sensor has transparent substrates and is positioned at the device layer on described transparent substrates surface, described device layer has pixel region, described pixel region has multiple pixel, each described pixel has transmission region and alternatively non-transparent region, described alternatively non-transparent region has photo-sensitive cell, and described transmission region enables light through described pixel region, and described optical fingerprint sensor has binding district; Protective seam, described protective seam is positioned at above described optical fingerprint sensor;
It is characterized in that, also comprise:
Padded layer, described padded layer is between described protective seam and described optical fingerprint sensor, and described padded layer at least covers described pixel region.
2. optical fingerprint sensor module as claimed in claim 1; it is characterized in that; described optical fingerprint sensor module also comprises backlight; described backlight provides the light needed for fingerprint imaging; the emergent light light of described backlight enters described optical fingerprint sensor from described transparency carrier; again through the described transmission region of described pixel region, then through described padded layer, finally enter described protective seam.
3. optical fingerprint sensor module as claimed in claim 1, it is characterized in that, the thickness of described padded floor is more than or equal to the maximum height of device in described binding district.
4. optical fingerprint sensor module as claimed in claim 1, is characterized in that, described binding district reads at least one of chip and flexible printed circuit board for binding signal.
5. optical fingerprint sensor module as claimed in claim 1; it is characterized in that; described padded layer comprises light transmission medium layer, has the first printing opacity glue-line between described light transmission medium layer and described optical fingerprint sensor, has the second printing opacity glue-line between described light transmission medium layer and described protective seam.
6. optical fingerprint sensor module as claimed in claim 5, it is characterized in that, the material of described light transmission medium layer is transparent glass or light-passing plastic.
7. optical fingerprint sensor module as claimed in claim 6; it is characterized in that, at least one surface in described light transmission medium layer lower surface, described light transmission medium layer upper surface, described protective seam lower surface and described optical fingerprint sensor upper surface has filter layer.
8. optical fingerprint sensor module as claimed in claim 1, it is characterized in that, described padded layer is light-transmissive photosensitive glue, printing opacity heat-sensitive glue, clear pressure senstivie glue or transparent double-side adhesive tape.
9. optical fingerprint sensor module as claimed in claim 8, it is characterized in that, at least one surface of described optical fingerprint sensor upper surface and described protective seam lower surface has filter layer.
10. the optical fingerprint sensor module as described in any one of claim 1-9, is characterized in that, the lower surface of described optical fingerprint sensor has light antireflection layer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610033959.4A CN105512645A (en) | 2016-01-19 | 2016-01-19 | Optical fingerprint sensor module |
| PCT/CN2016/095821 WO2017124737A1 (en) | 2016-01-19 | 2016-08-18 | Optical fingerprint sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610033959.4A CN105512645A (en) | 2016-01-19 | 2016-01-19 | Optical fingerprint sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105512645A true CN105512645A (en) | 2016-04-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610033959.4A Pending CN105512645A (en) | 2016-01-19 | 2016-01-19 | Optical fingerprint sensor module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105512645A (en) |
| WO (1) | WO2017124737A1 (en) |
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| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
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| CN107358139A (en) * | 2016-05-09 | 2017-11-17 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and preparation method thereof |
| CN106022253A (en) * | 2016-05-17 | 2016-10-12 | 深圳天珑无线科技有限公司 | Mobile terminal and fingerprint module group thereof |
| WO2018006478A1 (en) * | 2016-07-08 | 2018-01-11 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN107590423A (en) * | 2016-07-08 | 2018-01-16 | 上海箩箕技术有限公司 | Optical fingerprint sensor and forming method thereof |
| WO2018010250A1 (en) * | 2016-07-12 | 2018-01-18 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
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| CN106203408A (en) * | 2016-08-31 | 2016-12-07 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
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| CN110023955A (en) * | 2016-12-07 | 2019-07-16 | 辛纳普蒂克斯公司 | Optical sensor with substrate optical filter |
| CN107273821A (en) * | 2017-05-26 | 2017-10-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
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| CN107820618B (en) * | 2017-09-30 | 2022-05-17 | 深圳市汇顶科技股份有限公司 | Sensing pixel unit and optical fingerprint sensor |
| CN107820618A (en) * | 2017-09-30 | 2018-03-20 | 深圳市汇顶科技股份有限公司 | Sensing pixels unit and optical fingerprint sensor |
| CN111209785A (en) * | 2018-11-22 | 2020-05-29 | 上海耕岩智能科技有限公司 | Fingerprint acquisition device and manufacturing method thereof |
| CN109405856A (en) * | 2018-12-11 | 2019-03-01 | 上海箩箕技术有限公司 | Optical sensor and forming method thereof |
| WO2020118499A1 (en) * | 2018-12-11 | 2020-06-18 | 上海箩箕技术有限公司 | Optical sensor and forming method therefor |
| CN111052143A (en) * | 2019-04-10 | 2020-04-21 | 深圳市汇顶科技股份有限公司 | Optical fingerprint device and electronic equipment |
| WO2020206983A1 (en) * | 2019-04-10 | 2020-10-15 | 深圳市汇顶科技股份有限公司 | Optical fingerprint device and electronic device |
| CN111052143B (en) * | 2019-04-10 | 2023-09-08 | 深圳市汇顶科技股份有限公司 | Optical fingerprint device and electronic equipment |
| CN110929600A (en) * | 2019-11-08 | 2020-03-27 | 敦泰电子（深圳）有限公司 | Sliding type fingerprint identification method and optical fingerprint identification assembly under screen |
| CN110929600B (en) * | 2019-11-08 | 2023-03-24 | 敦泰电子（深圳）有限公司 | Sliding type fingerprint identification method and optical fingerprint identification assembly under screen |
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