CN108021845A - Optical fingerprint sensor module - Google Patents
Optical fingerprint sensor module Download PDFInfo
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- CN108021845A CN108021845A CN201610931111.3A CN201610931111A CN108021845A CN 108021845 A CN108021845 A CN 108021845A CN 201610931111 A CN201610931111 A CN 201610931111A CN 108021845 A CN108021845 A CN 108021845A
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- substrate
- backlight
- light
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
Abstract
A kind of optical fingerprint sensor module, including：Including：First substrate, the first substrate are transparent substrates；Backlight below the first substrate；Device layer below the first substrate；Second substrate below the device layer；The backlight is located at beyond the device layer side, and at least one of which side of the device layer is opposite with the backlight；The light that the backlight is sent first enters the first substrate from the first substrate lower surface, reach the first substrate upper surface and refraction and reflection occurs with the interface that finger is formed, at least part reflection light returns to the first substrate, then enters the device layer from the first substrate.The optical fingerprint sensor module performance improves, and the fingerprint image quality obtained using the optical fingerprint sensor module is improved.
Description
Technical field
The present invention relates to optical finger print to identify field, more particularly to a kind of optical fingerprint sensor module.
Background technology
Fingerprint imaging identification technology, is the fingerprint image that human body is collected by fingerprint sensor, then with system
Existing fingerprint imaging information is compared, and whether carrying out correct judgment, and then realizes the technology of identification.The side used due to it
Just property, and the uniqueness of somatic fingerprint, fingerprint identification technology have been widely used in every field.Such as public security bureau, customs
Etc. field of safety check, consumer product area such as the access control system of building, and PC and mobile phone etc..
The implementation of fingerprint imaging identification technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Relatively
For, optical finger print imaging technique, its imaging effect is relatively preferable, and equipment cost is relatively low.
The structure of existing optical fingerprint sensor module has much room for improvement, and performance has much room for improvement.
The content of the invention
The present invention solves the problems, such as to be to provide a kind of optical fingerprint sensor module, to improve the optical fingerprint sensor
The performance of module, so as to improve the fingerprint image quality obtained using the optical fingerprint sensor module.
To solve the above problems, the present invention provides a kind of optical fingerprint sensor module, including：First substrate, described
One substrate is transparent substrates；Backlight below the first substrate；Device layer below the first substrate；Position
Second substrate below the device layer；The backlight is located at beyond the device layer side, and the device layer is at least
One of side is opposite with the backlight；The light that the backlight is sent first enters institute from the first substrate lower surface
First substrate is stated, the first substrate upper surface is reached and refraction and reflection occurs with the interface that finger is formed, it is at least partly anti-
Penetrate light and return to the first substrate, then enter the device layer from the first substrate.
Optionally, there is light shield layer between the device layer side opposite with the backlight, the light shield layer is at the same time
Between the side opposite with the backlight positioned at the second substrate.
Optionally, it is bonded between the backlight and the first substrate using blob of viscose, the blob of viscose is by the backlight
It is bonded in below the first substrate.
Optionally, the device layer has pixel region, and the plan view shape of the pixel region is rectangle；During vertical view, institute
State backlight to be located at beyond the long side of the rectangle, the pixel region has the n row pixels parallel to the long side；N row institute
State pixel and be divided into m groups, every group includes at least one row pixel, and m is 5 to 200 integer, and n is the integer of more than m；It is same
Effective photosensitive area of pixel described in group is equal；In different groups, the group more remote from the long back gauge, the corresponding pixel
Effective photosensitive area is bigger.
Optionally, in pixel described in two adjacent groups, larger effectively photosensitive area is the 1.~2.5 of smaller effectively photosensitive area
Times.
Optionally, during vertical view, the distance of the backlight to the long side is 0.2mm~2mm, the height of the backlight
For 0.2mm~0.8mm.
Optionally, the device layer is produced on the first substrate lower surface；Alternatively, the device layer is produced on described
Two upper surface of base plate.
Optionally, when the device layer is produced on the second substrate upper surface, the device layer and the first substrate
Between have printing opacity pad thick-layer.
Optionally, the first substrate lower surface, printing opacity pad thick-layer upper surface and printing opacity pad thick-layer lower surface
At least one of which surface there is color coating.
Optionally, the thickness of the printing opacity pad thick-layer is 0.1mm~2mm.
Optionally, the light shield layer is located immediately at the side of the second substrate and the device layer；Alternatively, the shading
Layer is directly adjacent with the backlight.
Optionally, there is collector lens, the collector lens energy between the backlight and the first substrate lower surface
The light of the backlight is enough set to be converted to directional light or nearly directional light.
Optionally, the part for being used to receive the backlight light in the first substrate lower surface has light antireflection layer,
The smooth antireflection layer can increase the light of the backlight into the ratio of the first substrate.
Compared with prior art, technical scheme has the following advantages：
In technical scheme, by setting backlight to be located at first substrate lower surface, and backlight is located at device
The side of part layer and second substrate, device layer form a kind of small and fingerprint and know between first substrate and second substrate
The structure that other performance improves.This structure causes the light that backlight is sent to be sent out by first substrate upper surface and finger print
After raw reflection and refraction effect, part returns to the light come and reaches device layer through first substrate again.At this time, the optics
Fingerprint sensor module is in the case where that need not increase light guide plate, it becomes possible to gather finger print image, reduce module
Overall volume, and the fingerprint image quality of optical fingerprint sensor module collection is improved, improve fingerprint recognition performance.Also, because
It is all devices all under first substrate, therefore the performance such as waterproof and dustproof, electrostatic discharge and Anti-scratching of overall module all obtains
Sufficient guarantee.
Brief description of the drawings
Fig. 1 is the optical fingerprint sensor module diagrammatic cross-section that first embodiment of the invention is provided；
Fig. 2 is the optical fingerprint sensor module diagrammatic cross-section that second embodiment of the invention is provided；
Fig. 3 is the optical fingerprint sensor module diagrammatic cross-section that third embodiment of the invention is provided；
Fig. 4 is the optical fingerprint sensor module diagrammatic cross-section that fourth embodiment of the invention is provided；
Fig. 5 is the optical fingerprint sensor module schematic top plan view that fifth embodiment of the invention is provided.
Embodiment
Existing optical fingerprint sensor module generally includes protective layer, optical fingerprint sensor, light guide plate and backlight etc.
Structure.Backlight is located at below protective layer, optical fingerprint sensor and light guide plate, and optical fingerprint sensor includes device layer and base
Plate.Therefore, whole optical fingerprint sensor modular lamination is more, and volume is larger.
In addition, in order to gather higher-quality fingerprint image, it is desirable to reach protective layer in the incident ray that backlight is sent
During upper surface, following two different situations can occur：The interface of fingerprint ridge position and protective layer upper surface normally into
Row refraction and reflection（It is not totally reflected）；It is totally reflected in fingerprint valley position and the interface of protective layer upper surface.From
And improve fingerprint diverse location（Paddy position and ridge position）Contrast, improve fingerprint image quality.However, existing optical finger print
Sensor module can not realize this possibility.
For this reason, the present invention provides a kind of optical fingerprint sensor module, by setting backlight to be located at first substrate following table
Face, and backlight is located at the side of device layer and second substrate, device layer between first substrate and second substrate, and
Light shield layer is set between backlight and device layer side and second substrate side, a kind of small and fingerprint recognition performance is formed and carries
High structure.This structure cause the light that backlight is sent by first substrate upper surface and finger print occur reflection and
After refraction effect, return to the light come and reach device layer through first substrate again.At this time, the optical fingerprint sensor mould is not
In the case of needing light guide plate, it becomes possible to gather finger print image, reduce volume, and improve optical fingerprint sensor module and adopt
The fingerprint image quality of collection, improves fingerprint recognition performance.
Meanwhile in the optical fingerprint sensor module, using blob of viscose（The blob of viscose is by the glue solidifies）Backlight is glued
It is attached to below first substrate lower surface.At this time, by using appropriate blob of viscose, can adjust as far as possible light that backlight sends with
Larger angle enters first substrate.So as to when light reaches first substrate upper surface, can on the first substrate surface with it is empty
The first interface that gas is formed（Air is had between fingerprint valley position and first substrate upper surface）It is totally reflected, and
One upper surface of base plate and corresponding fingerprint tough position（Fingerprint ridge position can be contacted with first substrate upper surface）Formed
Second interface is normally carried out reflecting and reflects（It is not totally reflected）, so as to improve fingerprint diverse location（Paddy position and ridge position）
Contrast, improve fingerprint image quality.
It is understandable to enable the above objects, features and advantages of the present invention to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
In each profile of this specification, the upper and lower relation of each structure of optical fingerprint sensor module is to be located at light with finger
Learn what fingerprint sensor module the top was defined.
First embodiment of the invention provides a kind of optical fingerprint sensor module, please refers to Fig.1.
The optical fingerprint sensor module includes first substrate 101, the device layer 100 positioned at the lower section of first substrate 101,
Second substrate 102 positioned at the lower section of device layer 100.Backlight 103 positioned at the lower section of first substrate 101.Fig. 1 also show first
Also there is finger 105, but finger 105 is not belonging to optical fingerprint sensor module on 101 upper surface of substrate.
Backlight 103 is located at beyond 100 side of device layer.Between device layer 100 and the opposite side of the backlight 103
With light shield layer 104, light shield layer 104 also be located at the same time the second substrate 102 side opposite with the backlight 103 it
Between.That is, backlight 103 is located at beyond 100 side of device layer, both device layer 100 and second substrate 102 and backlight
There is light shield layer 104 between 103 opposite sides.That is, light shield layer 104 is both opposite with backlight 103 positioned at device layer 100
Side, also is located at the side opposite with backlight 103 of second substrate 102.
In the present embodiment, though not shown in figure, device layer 100 is produced on 102 upper surface of second substrate.At this time, second
Substrate 102 and device layer 100 belong to same optical fingerprint sensor.I.e. optical fingerprint sensor includes 102 He of second substrate
Device layer 100.
Multiple photo-sensitive cells of array arrangement are generally included in device layer 100（It is not shown, photo-sensitive cell is usually light-sensitive image
Element, photosensitive pixel also abbreviation pixel）, these photo-sensitive cells are used to receive the light that fingerprint reflects, for fingerprint image
Collection, so as to fulfill fingerprint identification function.
In other embodiments, the device layer can also be produced on first substrate lower surface.When device layer is produced on
During one base lower surface, then first substrate and the device layer belong to same optical fingerprint sensor, i.e. optical finger print senses
Device includes first substrate and the device layer.
In the present embodiment, light shield layer 104 is located immediately at the side opposite with backlight 103 of second substrate 102.Light shield layer
104 can be itself non-transparent solid structure, be, for example, metal layer.At this time the height of light shield layer 104 can be more than or
Person is equal to the sum of thickness of both device layer 100 and second substrate 102, i.e., device layer 100 and second is completely covered in light shield layer 104
The respective side of substrate 102.
In other embodiments, light shield layer can be formed using ink coating（Such as directly in device layer and second substrate
Respective side coating printing ink coating is as light shield layer）, other suitable materials and mode can also be used to be formed.
In the present embodiment, 104 purpose of light shield layer is set to be：In order to enable the light that backlight 103 is sent is first from the first base
101 lower surface of plate enters first substrate 101, reach 101 upper surface of first substrate and the interface that finger is formed occur refraction and
After the optical phenomenas such as reflection, at least part reflection light returns to first substrate 101, then enters device layer from first substrate 101
100.In other words, light shield layer 104 is used to prevent the light that backlight 103 is sent before first substrate 101 is introduced into, to be put into
Device layer 100.
To further illustrate the setting purpose of light shield layer 104, it is necessary to relate to second substrate 102.In the present embodiment, second
Substrate 102 can be transparent substrates either non-transparent substrate.When second substrate 102 is transparent substrates, positioned at second substrate
The photo-sensitive cell generally use TFT of device layer 100 on 102（Thin Film Transistor, thin film transistor (TFT)）Technique system
Make, these photo-sensitive cells are easily influenced be subject to the light from second substrate 102.If being not provided with light shield layer 104, it be easy to cause
The problem of light that backlight 103 is sent is irradiated to these photo-sensitive cells from 102 side of second substrate.And if light directly shines
It is mapped to these photo-sensitive cells, it will produce noise signal, influence fingerprint recognition.Therefore, the light that backlight 103 is sent in order to prevent
Line enters device layer 100, it is necessary to set light shield layer 104 from 102 side of second substrate.
When second substrate is non-transparent substrates, if the performance that is in the light of device layer side is bad, also need in device
Layer side sets light shield layer.At this time, although light shield layer can not be set in second substrate side, in order to preferably in device
Layer side sets light shield layer, generally also sets light shield layer in second substrate side in the lump.It is of course also possible to only in device layer side
Light shield layer is set.Meanwhile when the performance that is in the light of device layer side is preferable, light shield layer can not also must be set.
The present embodiment is used to ensure that the light that backlight 103 is sent is first from 101 lower surface of first substrate using light shield layer 104
Into first substrate 101, then return again to and carry out device layer 100.These light for backing into device layer 100 are and corresponding hand
Refer to the light after the optical phenomenas such as fingerprint generation reflected refraction, this some light carries the information of fingerprint image, can be used for
Fingerprint recognition, therefore it is properly termed as " required light ".And enter device layer from 102 side of second substrate or 100 side of device layer
100 light, is properly termed as " unfavorable light ", and light shield layer 104 is precisely in order to eliminate this " unfavorable light ".
It should be noted that in other embodiments, in order to ensure that the light that backlight is sent is first from first substrate lower surface
Into first substrate（Specifically enter first substrate from a part of lower surface of first substrate）, the device layer is then entered back into,
Can also be by controlling the light direction and light-emitting angle scope of backlight so that light only can first from first substrate lower surface into
Enter first substrate（Such as the light for sending backlight only irradiates first substrate lower surface）, then enter back into the device layer.
But even if this when, increase light shield layer is still favourable.This is because the light that common backlight is sent is being propagated through
Certain scattering always occurs in journey, even if light direction and light-emitting angle scope by controlling backlight, can not ensure
Light be not irradiated to completely with first substrate lower surface similar in the device layer respective side and second substrate respective side.Increase
The scattering light that backlight can be avoided by adding light shield layer enters device layer from the side of device layer and second substrate.Meanwhile shading
Other light that layer can also be eliminated in environment are adversely affected caused by device layer.
In the present embodiment, when second substrate 102 is transparent substrates, it can be specially glass substrate, at this time, if device
Part layer 100 is directly made on 102 surface of second substrate, and the photo-sensitive cell of device layer 100 can use TFT techniques to make；When
When second substrate 102 is non-transparent substrate, it can be specially Semiconductor substrate（Such as silicon substrate）, at this time, if device layer
100 when being directly made on 102 surface of second substrate, and the photo-sensitive cell of device layer 100 can use CMOS
（Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor）Technique makes.When second
Substrate 102 is glass when transparent substrates, and light is easily directly irradiated to the corresponding sense in device layer 100 from second substrate 102
Optical element；Even if second substrate 102 is Semiconductor substrate when substrate, it is also possible to can leak through light, cause light directly to shine
The corresponding photo-sensitive cell being mapped in device layer 100.Therefore, as previously described, the present embodiment sets light shield layer 104 to be used for more preferable
Protect device layer 100 in ground.
In the present embodiment, first substrate 101 is single layer structure.At this time under 101 upper surface of first substrate, first substrate 101
At least one of which surface of 100 upper surface of surface and device layer can have color coating.The color coating can be used for
Filter ambient light or change the appearance color of optical fingerprint sensor module.
In other embodiments, first substrate can also be sandwich construction.When first substrate is sandwich construction, first substrate
Multiple submount, at this time, 100 upper surface of the submount upper surface, the submount lower surface and device layer can be included
At least one of which surface has color coating.
In the present embodiment, backlight 103 is located at the left side of device layer 100 and second substrate 102.
In other embodiments, backlight can also be located at other sides of device layer and second substrate.When backlight is more
During a point light source, backlight can be located at multiple sides of device layer and second substrate.
In the present embodiment, backlight 103 is in direct contact with 101 lower surface of first substrate, can set backlight 103 and first
The surface that substrate 101 contacts is light-emitting surface, so that light is directly entered first substrate 101 as far as possible.
In the present embodiment, the height of backlight 103 can be 0.2mm~0.8mm.The height of backlight 103 is typically smaller than
The gross thickness of device layer 100 and second substrate 102.
In other embodiments, backlight can also be set to be located at the lower section of first substrate lower surface, and have between the two
Gap, while ensure that backlight source position is higher than or waits higher than second substrate lower surface, so that the light for preventing backlight from sending
Enter second substrate from second substrate lower surface, and then prevent the light of backlight from directly entering institute from second substrate lower surface
State device layer.
When backlight 103 is located at below first substrate, and backlight 103 is located at the side of device layer 100（That is backlight
103 need be not necessarily positioned at the lower section of device layer 100）When, the light that backlight 103 is sent can just reach the first base by shorter light path
101 lower surface of plate, is conducive to reduce the optical fingerprint sensor modular volume, is conducive to send more backlights 103
Light applies to fingerprint image acquisition, is conducive to obtain more preferable fingerprint image.
In the present embodiment, backlight 103 is point light source, such as can be a LED light.The light of the LED light can be
Black light, purple light, blue light, green light, sodium yellow, red light, near infrared light or white light.
In other embodiments, backlight can be multiple point light sources, such as multiple LED light.At this time correspondingly, device layer with
The opposite each side of point light source is respectively provided with light shield layer, and the second substrate each side opposite with point light source is respectively provided with light shield layer.
In the present embodiment, it can be bonded between first substrate 101 and device layer 100 by glue-line.Glue-line can be optics
Glue-line, the material of optical cement layer can be specifically temperature-sensitive optical cement layer, Photosensitive optical glue-line or optical double-sided adhesive tape band.
In the optical fingerprint sensor module that the present embodiment is provided, by setting backlight 103 located immediately at the first base
101 lower surface of plate, and backlight 103 is located at the side of device layer 100 and second substrate 102（Beyond side）, device layer 100
Between first substrate 101 and second substrate 102, and in backlight 103 and 102 side of 100 side of device layer and second substrate
Light shield layer 104 is set between face, forms the structure that a kind of small and fingerprint recognition performance improves.This structure causes backlight
103 light sent return to the light come after reflection and refraction effect occurs by 101 upper surface of first substrate and finger print
Line reaches device layer 100 through first substrate 101 again.At this time, the optical fingerprint sensor mould need not increase extra saturating
Photopolymer substrate（Also without light guide plate）In the case of, it becomes possible to finger print image is gathered, and improves optical fingerprint sensor mould
The fingerprint image quality of group collection, improves fingerprint recognition performance.Also, because all devices（Backlight 103 and device layer 100
Deng）All under first substrate 101, therefore the performance such as waterproof and dustproof, electrostatic discharge and Anti-scratching of overall module is obtained for and fills
The guarantee divided.
Second embodiment of the invention provides another optical fingerprint sensor module, please refers to Fig.2.
The optical fingerprint sensor module includes first substrate 201, the device layer 200 positioned at the lower section of first substrate 201,
Second substrate 202 positioned at the lower section of device layer 200.Backlight 203 positioned at the lower section of first substrate 201.Backlight 203 is located at device
Beyond 200 side of part layer.There is light shield layer 204, the shading between device layer 200 and the opposite side of the backlight 203
Layer 204 also is located between the opposite side of the second substrate 202 and the backlight 203 at the same time.That is, backlight
203 are located at beyond 200 side of device layer, between the opposite side of both and backlight 203 of device layer 200 and second substrate 202
With light shield layer 204.That is, light shield layer 204 also is located at the second base both positioned at the side opposite with backlight 203 of device layer 200
The side opposite with backlight 203 of plate 202.
Fig. 2, which also show, also has finger 207 on 201 upper surface of first substrate, but finger 207 is not belonging to optical finger print biography
Sensor module.
In the present embodiment, though not shown in figure, device layer 200 is produced on 202 upper surface of second substrate.At this time, second
Substrate 202 and device layer 200 belong to same optical fingerprint sensor.
It is different from previous embodiment, there is printing opacity pad thick-layer in the present embodiment between device layer 200 and first substrate 201
205.Increase printing opacity pad thick-layer 205 can improve what backlight 203 emitted beam between device layer 200 and first substrate 201
Incident width and incident angle, reach more preferable radiation response.
In the present embodiment, the thickness of printing opacity pad thick-layer can be 0.1mm~2mm, so as to both prevent optical fingerprint sensor
The volume of module substantially increases, and achievees the purpose that the incident width and incident angle of light regulating well.
In the present embodiment, first substrate 201 is single layer structure.The first substrate lower surface, printing opacity pad thick-layer 205 at this time
At least one of which surface of 205 lower surface of upper surface and printing opacity pad thick-layer has color coating.
It is different from previous embodiment, in the present embodiment, using blob of viscose 206（The blob of viscose is by the glue solidifies）By backlight
203 are pasted onto below 201 lower surface of first substrate.At this time, light shield layer 204 and backlight 203 are bonded in by blob of viscose 206 at the same time
Together.
It should be noted that in other embodiments, the light shield layer 204 shown in Fig. 2 can also omit, and at this time, blob of viscose 206 is straight
Connect and the side of device layer 200 and the side of second substrate 202 bond together with backlight 203.
In the present embodiment, at least partly filled between 201 lower surface of backlight 203 and first substrate by blob of viscose 206（In figure
It is not shown）.At this time, by using suitable 206 material of blob of viscose（It is larger for example with refractive index and light transmission rate can be increased
Glue, it is larger and the blob of viscose of light transmission rate can be increased for forming respective indices of refraction）, backlight 203 can be adjusted as far as possible send out
The light gone out enters first substrate 201 with larger angle., can when light reaches 201 upper surface of first substrate so as to ensure
At the first interface that 201 upper surface of first substrate and air are formed（Fingerprint valley position and first substrate have between 201 upper surface
Air, therefore, the interface of fingerprint valley position and 201 upper surface of first substrate belong to the part at the first interface）It is totally reflected,
And it is normally carried out reflecting and reflects in the second contact surface that 201 upper surface of first substrate is formed with corresponding fingerprint ridge position（I.e.
It is not totally reflected, the reason is that fingerprint ridge position is directly contacted with 201 upper surface of first substrate, and the refraction of fingerprint ridge position
Rate is more than the refractive index of air）, so as to improve fingerprint diverse location（Paddy position and ridge position）Contrast, improve fingerprint image
Quality.
Structure, property and the advantage of more optical fingerprint sensor modules provided in relation to the present embodiment refer to foregoing
Embodiment corresponding contents.
Third embodiment of the invention provides another optical fingerprint sensor module, please refers to Fig.3.
The optical fingerprint sensor module includes first substrate 301, the device layer 300 positioned at the lower section of first substrate 301,
Second substrate 302 positioned at the lower section of device layer 300.Backlight 303 positioned at the lower section of first substrate 301.Backlight 303 is located at device
Beyond 300 side of part layer.There is light shield layer 304, the shading between device layer 300 and the opposite side of the backlight 303
Layer 304 also is located between the opposite side of the second substrate 302 and the backlight 303 at the same time.That is, backlight
303 are located at beyond 300 side of device layer, between the opposite side of both and backlight 303 of device layer 300 and second substrate 302
With light shield layer 304.That is, light shield layer 304 also is located at the second base both positioned at the side opposite with backlight 303 of device layer 300
The side opposite with backlight 303 of plate 302.
In the present embodiment, though not shown in figure, device layer 300 is produced on 302 upper surface of second substrate.At this time, second
Substrate 302 and device layer 300 belong to same optical fingerprint sensor.
It is different from previous embodiment, in the present embodiment, before the light-emitting surface of backlight 303 with first substrate 301
There is collector lens 305, collector lens 305 can make the light of backlight 303 be converted to directional light or near parallel between surface
Light（The angle difference that the nearly directional light refers between light is less than 10 degree）.The light of backlight 303 is introduced into collector lens
305, enter back into first substrate 301.Increase collector lens 305, make incident light for parallel or near directional light, so as to improve fingerprint image
The problem of image distortion, improve the fingerprint image quality that optical fingerprint sensor module is gathered.
Structure, property and the advantage of more optical fingerprint sensor modules provided in relation to the present embodiment refer to foregoing
Embodiment corresponding contents.
Fourth embodiment of the invention provides another optical fingerprint sensor module, please refers to Fig.4.
The optical fingerprint sensor module includes first substrate 401, the device layer 400 positioned at the lower section of first substrate 401,
Second substrate 402 positioned at the lower section of device layer 400.Backlight 403 positioned at the lower section of first substrate 401.Backlight 403 is located at device
Beyond 400 side of part layer.There is light shield layer 404, light shield layer 404 between device layer 400 and the opposite side of the backlight 403
It also is located at the same time between the opposite side of the second substrate 402 and the backlight 403.That is, backlight 403 is located at
Beyond 400 side of device layer, both and backlight 403 of device layer 400 and second substrate 402 have shading between opposite side
Layer 404.That is, light shield layer 404 is both positioned at the side opposite with backlight 403 of device layer 400, also be located at second substrate 402 and
The opposite side of backlight 403.
In the present embodiment, though not shown in figure, device layer 400 is produced on 402 upper surface of second substrate.At this time, second
Substrate 402 and device layer 400 belong to same optical fingerprint sensor.
In the present embodiment, there is collector lens between the lower surface of first substrate 401 before the light-emitting surface of backlight 403
405, collector lens 405 can make the light of backlight 403 be converted to directional light or nearly directional light.
Different from previous embodiment, in the present embodiment, first substrate 401 is used to receive what backlight 403 emitted beam
Lower surface has light antireflection layer 406, and light antireflection layer 406 can increase the light of backlight into the ratio of first substrate, so that
Be conducive to the fingerprint image become apparent from, improve the performance of the optical fingerprint sensor module.
Structure, property and the advantage of more optical fingerprint sensor modules provided in relation to the present embodiment refer to foregoing
Embodiment corresponding contents.
Fifth embodiment of the invention provides another optical fingerprint sensor module, refer to Fig. 5.With previous embodiment not
With, Fig. 5 is the schematic top plan view of optical fingerprint sensor module, and is omitted in Fig. 5 and show optical fingerprint sensor module
First substrate and second substrate.
Fig. 5 is refer to, the optical fingerprint sensor module includes first substrate（As it was previously stated, it is not shown）, positioned at institute
The device layer 500 below first substrate is stated, the second substrate positioned at the lower section of device layer 500（As it was previously stated, it is not shown）.Positioned at institute
State the backlight 501 below first substrate.Backlight 501 is located at beyond 500 side of device layer.Device layer 500 and the backlight
There is light shield layer 502 between the opposite side in source 501.Light shield layer 502 also is located at the second substrate 500 and the backlight at the same time
Between the opposite side in source 501.That is, backlight 501 is located at beyond 500 side of device layer, 500 and second base of device layer
Both and backlight 501 of plate 500 have light shield layer 502 between opposite side.That is, light shield layer 502 is both located at device layer 500
The side opposite with backlight 501, also is located at the side opposite with backlight 501 of second substrate 500.
Although the cross-section structure of optical fingerprint sensor module is not shown in the present embodiment, previous embodiment may be referred to
Corresponding contents.
In the present embodiment, though not shown in figure, device layer 500 is produced on the second substrate upper surface.At this time, it is described
Second substrate and device layer 500 belong to same optical fingerprint sensor.
In the present embodiment, as shown in the schematic top plan view of Fig. 5, light shield layer 502 is adjacent with backlight 501.This adjacent bonds
Structure causes the respective side of respective side and the second substrate of the light that backlight 501 is sent without normal direction device layer 500（Phase
Side is answered to refer to the side opposite with backlight）Propagate, so that reaching prevents light to be introduced into device before without first substrate
The situation of part layer.In other words, prevent the light that backlight is sent from entering device from the side of second substrate or the side of device layer
Layer.
In other embodiments, backlight can not also be close to light shield layer（It is adjacent）.
Please continue to refer to Fig. 5, device layer 500 has pixel region（Do not mark）, the plan view shape of the pixel region is
Rectangle.Usually there are multiple pixels of array arrangement in the pixel region（I.e. foregoing photo-sensitive cell）.
In the present embodiment, during vertical view, backlight 501 is located at rectangle（The rectangle is the plan view shape of pixel region）Length
Side（I.e. long side has long side for rectangle）In addition.
In the present embodiment, during vertical view, backlight 501 arrives（The rectangle）The distance of the long side is in more than 0.2mm.I.e.
Distance D in Fig. 5 is in more than 0.2mm.
Since backlight 501 is far and near different apart from 500 pixel region of device layer, pixel region diverse location is reached
Light luminance is also different, and apart from the region of backlight 501 farther out, the intensity of reflected light that can be obtained is smaller.Therefore, at this
In embodiment, backlight 501 is arranged on beyond the long side of rectangle first.So that pixel region is as far as possible apart from backlight
501 nearer distances.Meanwhile make the short side of 500 pixel region of device layer（Short side be the rectangle short side, short side be less than or
Person is equal to long side, i.e. short side and long side can be equal in the case of the most limit）Length is limited in below 8mm, so that further
Ensure pixel region in whole pixels can be nearer apart from backlight 501 distance, to ensure the collection of fingerprint image.
In the present embodiment, pixel region has the 5 row pixels parallel to long side.5 row pixels are divided into 5 groups, i.e. every group of bag
Include a row pixel.Effective photosensitive area of pixel is equal in same group.In different groups, the group more remote from long back gauge, pixel has
It is bigger to imitate photosensitive area.
It specifically show in Fig. 5 from closely to 5 groups of remote pixels, first group of pixel being 5001, second groups of pixel from backlight
Pixel is pixel 5002, the 3rd group of pixel is pixel 5003, the 4th group of pixel is pixel 5004 and the 5th group of pixel is pixel
5005.Wherein, set in two adjacent groups, larger effectively photosensitive area is 2 times of smaller effectively photosensitive area.That is pixel 5005
Effective photosensitive area is 2 times of 5004 effective photosensitive area of pixel, and effective photosensitive area of pixel 5004 is effective for pixel 5003
2 times of photosensitive area, effective photosensitive area of pixel 5003 are 2 times of 5002 effective photosensitive area of pixel, and pixel 5002 has
Imitate 2 times that photosensitive area is 5001 effective photosensitive area of pixel.
When making the pixel of above-mentioned different groups, whole pixels of photosensitive area all same can be first produced.But make
Use light blocking layer（Light blocking layer can use metal material to make, such as annular metallic layer is produced on Pixel surface, be formed as schemed
The 5 oblique line shape light shield layer structures shown, do not mark）Block the different photosensitive areas of respective pixel.Block what rear pixel remained
Photosensitive area is effective photosensitive area.Having for every group of pixel is determined with specific reference to the corresponding incident intensity section of every group of pixel
Photosensitive area is imitated, so as to reach adjusting pixel dynamic range（Dynamic range represents the signal that can respond of pixel from " most dark " extremely
The scope of " most bright ", wherein optics dynamic range are generally equal to saturation exposure/noise light exposure）Purpose.
Can be the pixel that minimum area is blocked by light blocking layer in the present embodiment（That is, the picture of effective photosensitive area maximum
Element）The group farthest from backlight is placed on, as shown in Figure 5（Can be the picture not blocked completely by light blocking layer in other embodiments
Element is placed on the group farthest from backlight）.Then, it is stepped up the area of light blocking layer（As it was previously stated, in overlook direction, gear
Photosphere can be on the photosensitive area of covering pixel annular in shape, the center section of exposure photosensitive area as effective photosensitive area,
As shown in Figure 5）, i.e. effective photosensitive area of pixel progressively reduces.Effective photosensitive area is bigger, then photoresponse is sensitiveer, has
Effect photosensitive area is smaller, then dynamic range is bigger.
Other to apply in example, whole pixels, can be divided into 5~200 groups by complexity and luminous intensity balance error in order to balance,
Effective photosensitive area per two adjacent groups（Effective photosensitive area is proportional to sensitivity）Ratio, specifically can be with 1.05~2.5 times
Determined according to the different distance backlight reflection light difference in brightness of test.
The present embodiment sets the pixel of different effectively photosensitive areas, is the pixel for setting different sensitivity.And use not
The pixel of same feeling luminosity, can offset the influence of different reflection light strength differences with a distance from backlight.It is that is, above-mentioned
Pixel is arranged to different groups, is to tackle the non-uniform problem of intensity of reflected light that different lines pixel obtains.Pass through this
Different groups of kind has the settings of different effectively photosensitive areas, can be different pixels in device layer 500 according to apart from backlight
It is one of axial（The present embodiment is the horizontal axis shown in Fig. 5）Distance, different sensitivity sizes is set, it is specific to set
For：Apart from backlight farther out, it is higher to be arranged to sensitivity, it is nearer apart from backlight, it is arranged to sensitivity relatively low.
In the present embodiment, set by above-mentioned packet and the difference of effective photosensitive area so that be subject to compared with strong reflection
The region of irradiation, the light responsing sensitivity of pixel is relatively low, is being subject to the weaker region of weaker reflected light, the photoresponse of pixel is sensitive
Degree is higher, in this way, in the pixel of regional, the intensity of reflected light being even connected to is different, but as caused by reflected light
Photoelectric effect and the photoelectron number that produces is relatively average, so as to ensure that each group of pixel can be in essentially identical light
Fingerprint image is gathered under response condition.
It should be noted that in other embodiments, set pixel region that there is the n row pixels parallel to long side.N row pixels
M groups are divided into, every group includes an at least row pixel, and m is 5 to 200 integer, and n is the integer of more than m.Pixel in same group
Effective photosensitive area is equal.In different groups, the group more remote from long back gauge, the effective photosensitive area of pixel is bigger.
Structure, property and the advantage of more optical fingerprint sensor modules provided in relation to the present embodiment refer to foregoing
Embodiment corresponding contents.
Although present disclosure is as above, the present invention is not limited to this.Any those skilled in the art, are not departing from this
In the spirit and scope of invention, it can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the scope of restriction.
Claims (13)
1. a kind of optical fingerprint sensor module, including：
First substrate, the first substrate are transparent substrates；
Backlight below the first substrate；
Device layer below the first substrate；
Second substrate below the device layer；
It is characterized in that,
The backlight is located at beyond the device layer side, at least one of which side and the backlight of the device layer
Relatively；
The light that the backlight is sent first enters the first substrate from the first substrate lower surface, reaches first base
With the interface that finger is formed refraction and reflection occur for plate upper surface, and at least part reflection light returns to the first substrate, then
Enter the device layer from the first substrate.
2. optical fingerprint sensor module as claimed in claim 1, it is characterised in that the device layer and the backlight phase
To side between there is light shield layer, the light shield layer at the same time positioned at the second substrate side opposite with the backlight it
Between.
3. optical fingerprint sensor module as claimed in claim 2, it is characterised in that the backlight and the first substrate
Between be bonded using blob of viscose, the backlight is bonded in below the first substrate by the blob of viscose.
4. optical fingerprint sensor module as claimed in claim 3, it is characterised in that the device layer has pixel region,
The plan view shape of the pixel region is rectangle；During vertical view, the backlight is located at beyond the long side of the rectangle, the pixel
Region has the n row pixels parallel to the long side；N arranges the pixel and is divided into m groups, and every group includes at least one row picture
Element, m are 5 to 200 integer, and n is the integer of more than m；Effective photosensitive area of pixel described in same group is equal；Different groups
In, the group more remote from the long back gauge, accordingly effective photosensitive area of the pixel is bigger.
5. optical fingerprint sensor module as claimed in claim 4, it is characterised in that larger in pixel described in two adjacent groups
Effective photosensitive area is 1.05~2.5 times of smaller effectively photosensitive area.
6. optical fingerprint sensor module as claimed in claim 4, it is characterised in that during vertical view, the backlight is described in
The distance of long side is 0.2mm~2mm, and the height of the backlight is 0.2mm~0.8mm.
7. optical fingerprint sensor module as claimed in claim 4, it is characterised in that the device layer is produced on described first
Base lower surface；Alternatively, the device layer is produced on the second substrate upper surface.
8. optical fingerprint sensor module as claimed in claim 7, it is characterised in that the device layer is produced on described second
There is printing opacity pad thick-layer during upper surface of base plate, between the device layer and the first substrate.
9. optical fingerprint sensor module as claimed in claim 8, it is characterised in that the first substrate lower surface, described
Printing opacity, which pads thick-layer upper surface and at least one of which surface of printing opacity pad thick-layer lower surface, has color coating.
10. optical fingerprint sensor module as claimed in claim 8, it is characterised in that the thickness of printing opacity pad thick-layer is
0.1mm~2mm.
11. the optical fingerprint sensor module as described in claims 1 to 10 any one, it is characterised in that the light shield layer
Located immediately at the side of the second substrate and the device layer；Alternatively, the light shield layer is directly adjacent with the backlight.
12. the optical fingerprint sensor module as described in claims 1 to 10 any one, it is characterised in that the backlight
There is collector lens between the first substrate lower surface, the collector lens can be converted to the light of the backlight
Directional light or nearly directional light.
13. the optical fingerprint sensor module as described in claims 1 to 10 any one, it is characterised in that first base
The part for being used to receive the backlight light in plate lower surface has light antireflection layer, and the smooth antireflection layer can increase the back of the body
The light of light source enters the ratio of the first substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610931111.3A CN108021845A (en) | 2016-10-31 | 2016-10-31 | Optical fingerprint sensor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610931111.3A CN108021845A (en) | 2016-10-31 | 2016-10-31 | Optical fingerprint sensor module |
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| CN108021845A true CN108021845A (en) | 2018-05-11 |
Family
ID=62069749
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| CN201610931111.3A Pending CN108021845A (en) | 2016-10-31 | 2016-10-31 | Optical fingerprint sensor module |
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| CN109034039A (en) * | 2018-07-19 | 2018-12-18 | 维沃移动通信有限公司 | A kind of display screen module and terminal device |
| CN109445160A (en) * | 2018-12-27 | 2019-03-08 | 厦门天马微电子有限公司 | Display module and display device |
| EP3460455A3 (en) * | 2017-08-31 | 2019-07-03 | JENETRIC GmbH | Device for simultaneous contact-based taking of impressions of autopodium |
| CN110427910A (en) * | 2019-08-09 | 2019-11-08 | Oppo广东移动通信有限公司 | The control method of electronic equipment and electronic equipment |
| CN110569798A (en) * | 2019-09-10 | 2019-12-13 | 京东方科技集团股份有限公司 | Line identification module, line identification device and display device |
| WO2020010732A1 (en) * | 2018-07-13 | 2020-01-16 | 中兴通讯股份有限公司 | Glass cover plate, terminal, fingerprint recognition method and apparatus, and storage medium |
| CN110781848A (en) * | 2019-10-30 | 2020-02-11 | Oppo广东移动通信有限公司 | Fingerprint recognition device under screen and electronic equipment |
| WO2020211779A1 (en) * | 2019-04-16 | 2020-10-22 | 华为技术有限公司 | Fingerprint identification module, screen assembly and electronic device |
| CN113376886A (en) * | 2021-06-30 | 2021-09-10 | 武汉华星光电技术有限公司 | Display panel, biological detection method and display device |
| WO2023085404A1 (en) * | 2021-11-12 | 2023-05-19 | 株式会社ジャパンディスプレイ | Detection device |
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| CN110569798A (en) * | 2019-09-10 | 2019-12-13 | 京东方科技集团股份有限公司 | Line identification module, line identification device and display device |
| CN110781848B (en) * | 2019-10-30 | 2022-05-20 | Oppo广东移动通信有限公司 | Screen fingerprint identification device and electronic equipment |
| CN110781848A (en) * | 2019-10-30 | 2020-02-11 | Oppo广东移动通信有限公司 | Fingerprint recognition device under screen and electronic equipment |
| CN113376886A (en) * | 2021-06-30 | 2021-09-10 | 武汉华星光电技术有限公司 | Display panel, biological detection method and display device |
| WO2023085404A1 (en) * | 2021-11-12 | 2023-05-19 | 株式会社ジャパンディスプレイ | Detection device |
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Application publication date: 20180511 |