CN105116968A - Electronic equipment with fingerprint identification function - Google Patents
Electronic equipment with fingerprint identification function Download PDFInfo
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- CN105116968A CN105116968A CN201510590601.7A CN201510590601A CN105116968A CN 105116968 A CN105116968 A CN 105116968A CN 201510590601 A CN201510590601 A CN 201510590601A CN 105116968 A CN105116968 A CN 105116968A
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Abstract
Electronic equipment with a fingerprint identification function comprises a fingerprint identification module and a shell. The fingerprint identification module is used for conducting fingerprint identification, the shell is used for protecting electronic equipment hardware, the shell comprises a protective covering plate which covers the fingerprint identification module, the area of the protective covering plate is larger than that of the fingerprint identification module, and the protective covering plate completely covers the fingerprint identification module. According to the electronic equipment with the fingerprint identification function, by means of the protective covering plate which covers the fingerprint identification module, the shell which protects the electronic equipment hardware is formed, the area of the protective covering plate is not less than that of the fingerprint identification module, the shell covers the finger identification module, therefore, assembly tolerance of the protective covering plate and other parts of the shell can be beyond the touch range of fingerprint identification, gaps of the protective covering plate and the other parts of the shell are not touched in the fingerprint identification process, and the comfort degree of use is improved.
Description
Technical field
The present invention relates to electronic equipment assembling field, particularly a kind of electronic equipment with fingerprint identification function.
Background technology
Fingerprint identification technology collects the fingerprint image of human body by fingerprint imaging module, then with fingerprint recognition system in existing fingerprint imaging information compare, to realize identification.Due to the convenience used, and the uniqueness of somatic fingerprint, fingerprint identification technology is widely used in every field, such as: the field of safety check such as public security bureau, customs, and the gate control system of building, and the consumer product area such as PC and mobile phone etc.
Referring to figs. 1 to Fig. 3, wherein figure 1 illustrate a kind of structural representation with the electronic equipment of fingerprint identification function in prior art, wherein Fig. 2 is the cut-open view along a-a ' line in Fig. 1, and Fig. 3 is the enlarged drawing of Fig. 2 centre circle b.Herein, be described for the mobile phone with fingerprint identification function.
Fingerprint recognition module 11 is arranged on the front of mobile phone 10.Particularly, the shell of mobile phone 10 is made up of front shroud 12, mesochite 13 and back cover 14, and the various hardware devices comprising fingerprint recognition module 11 are surrounded by described phone housing, to provide protection.
But prior art has in the electronic equipment of fingerprint recognition, there is gap between the cover plate of fingerprint imaging module and electronic equipment, affect comfort.
Summary of the invention
The problem that the present invention solves is to provide a kind of electronic equipment with fingerprint identification function, to improve comfort.
For solving the problem, the invention provides a kind of electronic equipment with fingerprint identification function, comprising:
Fingerprint recognition module, for carrying out fingerprint recognition;
For the protection of the shell of described electronic equipment hardware, described shell comprises the cover sheet covering described fingerprint recognition module, and the area of described cover sheet is greater than the area of described fingerprint recognition module, and described cover sheet covers described fingerprint recognition module completely.
Optionally, described cover sheet is transparent material, comprises glass, sapphire or fibre optic plate.
Optionally, described glass comprises organic glass.
Optionally, described fingerprint recognition module comprises optical fingerprint identification module, comprising: substrate; For providing the light source of incident light; Be positioned at the light guide plate of described substrate surface, for making described incident light homogenising; Be positioned at the sensor of described light guide plate surface and be positioned at the chip of described sensor surface; The area of described cover sheet is greater than the area of described light guide plate, and covers described sensor and be positioned at the chip of described sensor surface.
Optionally, the articulamentum between described cover sheet and described sensor, links together for making described cover sheet and described sensor; Described articulamentum is positioned at the position that described sensor is not provided with described chip.
Optionally, the material of described articulamentum is optical cement or UV glue.
Optionally, described cover sheet is provided with a bulge-structure in the one side of described fingerprint recognition module; Described articulamentum covers described bulge-structure surface, is connected with described sensor for making the bulge-structure of described cover sheet; The thickness of described articulamentum and the thickness sum of described bulge-structure are greater than the thickness of described chip, for forming a slit between the position of chip described in sensor setting and described cover sheet, to hold described chip.
Optionally, described cover sheet is plane towards the face of described fingerprint recognition module; The thickness of described articulamentum is greater than the thickness of described chip, for forming a slit between the position of chip described in sensor setting and described cover sheet, to hold described chip.
Optionally, described cover sheet is provided with a groove on the face of described fingerprint recognition module, for holding described chip.
Optionally, described light guide plate is provided with an accepting groove away from the one side of substrate, for holding described sensor; Described cover sheet covers described accepting groove opening.
Optionally, described electronic equipment is provided with the face of described fingerprint recognition module is first surface; Described shell also comprises the first panel, for forming with described cover sheet the first housing covering described first surface.
Optionally, the joint gap between described cover sheet and described first panel is not more than 0.2 millimeter.
Optionally, described electronic equipment also comprises second relative with described first surface, and described shell comprises covering second housing of described second and the 3rd housing between described first housing and described second housing; Described 3rd housing is provided with the groove for holding described fingerprint recognition module in the one side of the first housing; Described cover sheet is cover part the 3rd housing also
Optionally, described cover sheet is connected with described 3rd housing by hot-setting adhesive or double faced adhesive tape.
Optionally, described first surface is rectangle; Described cover sheet extends the described first surface of covering along the broadside of described rectangle first surface.
Optionally, described electronic equipment is mobile phone or panel computer.
Compared with prior art, technical scheme of the present invention has the following advantages:
The shell of the present invention by making the cover sheet of the described fingerprint recognition module of covering form protection electronic equipment hardware; and the area of cover sheet is not less than the area of described fingerprint recognition module; and cover described fingerprint recognition module; therefore, it is possible to make the build-up tolerance of described cover sheet and described other parts of shell be positioned at beyond the touch scope of fingerprint recognition; thus in fingerprint identification process, do not touch described cover sheet and the gap with described other parts of shell, improve comfort.
In possibility of the present invention; the area of described cover sheet is greater than the area of described fingerprint recognition module; the one side of light guide plate away from substrate arranges accepting groove to hold sensor; therefore compared with fingerprint recognition module of the prior art; fingerprint recognition module of the present invention can save containment vessel; the thickness of described fingerprint recognition module can be reduced, improve the integrated level of described fingerprint recognition module.
In possibility of the present invention; the first surface of described cover sheet towards described fingerprint recognition module arranges the chip holding fingerprint recognition module; or bulge-structure is set on described first surface to connect described cover sheet and described fingerprint recognition module; to avoid described cover sheet to interfere described chip operation, improve the stability of described fingerprint recognition module.
In possibility of the present invention; the optical cement of connection described fingerprint recognition module and cover sheet or the thickness of UV glue can also be made to be greater than the thickness of described chip; thus described cover sheet can be made to be set to plane towards the first surface of described fingerprint recognition module; thus reduce the difficulty of processing of described cover sheet, reduce manufacturing cost.
Accompanying drawing explanation
Fig. 1 to Fig. 3 is a kind of structural representation with the electronic equipment of fingerprint identification function in prior art;
Fig. 4 to Fig. 7 is the structural representation that the present invention has electronic equipment one embodiment of fingerprint identification function;
Fig. 8 and Fig. 9 is the structural representation that the present invention has another embodiment of electronic equipment of fingerprint identification function;
Figure 10 and Figure 11 is the structural representation of the electronic equipment embodiment again that the present invention has a fingerprint identification function.
Embodiment
From background technology, there is the not good enough problem of comfort in the electronic equipment in prior art with fingerprint identification function.Now combine the reason with the not good enough problem of its comfort of structure analysis of the electronic equipment of fingerprint identification function:
With reference to figure 3; in prior art; groove is provided with in the mesochite 13 of described mobile phone 10; to hold described fingerprint recognition module 11; front shroud 12 sticks on described mesochite 13 surface; and described front shroud 12 is provided with a through hole 15, carry out fingerprint sensing for the cover sheet 16 exposing described fingerprint recognition module 11 for finger touch.But due to build-up tolerance, there is certain interval (as shown in Fig. 3 centre circle c) between the cover sheet 16 of described fingerprint imaging module 11 and the front shroud 12 of mobile phone 10, thus comfort when affecting fingerprint recognition.
For solveing the technical problem, the invention provides a kind of electronic equipment with fingerprint identification function, comprising:
Fingerprint recognition module, for carrying out fingerprint recognition; For the protection of the shell of described electronic equipment hardware, described shell comprises the cover sheet covering described fingerprint recognition module, and the area of described cover sheet is greater than the area of described fingerprint recognition module, and described cover sheet covers described fingerprint recognition module completely.
The cover sheet that the present invention covers described fingerprint recognition module forms the shell protecting electronic equipment hardware; and the area of cover sheet is not less than the area of described fingerprint recognition module; and cover described fingerprint recognition module; therefore, it is possible to make the build-up tolerance of described cover sheet and described other parts of shell be positioned at beyond the touch scope of fingerprint recognition; thus in fingerprint identification process, do not touch described cover sheet and the gap with described other parts of shell, improve comfort.
For enabling above-mentioned purpose of the present invention, feature and advantage more become apparent, and are described in detail specific embodiments of the invention below in conjunction with accompanying drawing.
Fig. 4 to Fig. 7 is the structural representation that the present invention has electronic equipment one embodiment of fingerprint identification function.
With reference to figure 4, in conjunction with reference to figure 5, wherein Fig. 4 is the vertical view of the electronic equipment 100 in the present embodiment with fingerprint identification function, and Fig. 5 is the cut-open view along A-A ' line in Fig. 4.
It should be noted that, electronic equipment described in the present embodiment is the mobile phone with fingerprint identification function, but should not limit the present invention with this.In other embodiments of the present invention, described electronic equipment can also be other electronic equipments such as the panel computer with fingerprint identification function.
Described electronic equipment 100 comprises:
Fingerprint recognition module 110, for carrying out fingerprint recognition.
In conjunction with reference to figure 6, show the structural representation of fingerprint recognition module 110 in Fig. 5.
In the present embodiment, described fingerprint recognition module 110 is optical fingerprint identification module, comprise: substrate 111, be positioned at the light guide plate 112 on described substrate 111 surface, be positioned at the light source 113 of described light guide plate 112 one end, be positioned at the sensor 114 on described light guide plate 112 surface, and be positioned at the chip 115 on described sensor 114 surface.
In the present embodiment, described substrate 111 can comprise printed circuit board (PCB) or flexible PCB etc.In the present embodiment, described substrate 111 is flexible PCB, to realize the connection of described fingerprint recognition module 110 and described other hardware of electronic equipment.
The light source 113 being positioned at the described light guide plate 112 in described substrate 111 and being positioned at described light guide plate 112 one end act as and provides uniform incident light.Wherein, the material of described light guide plate 112 comprises the acryl plates of optical grade, and described light source 113 is that light emitting diode is to reduce volume and the energy consumption of described fingerprint recognition module.
It should be noted that, the light-emitting area of described light source 113 aims at the side of described light guide plate 112.Therefore the incident light produced by described light source 113, is imported by light guide plate 112 one end and is diffused in whole plate, to form uniform incident light.
In the present embodiment, described light guide plate 113 is provided with an accepting groove 116 away from the one side of described substrate 111, for holding described sensor 114.The benefit be arranged at by described sensor 114 in the accepting groove 116 of described light guide plate 113 is; described light guide plate 112 can protect described sensor 114 from damage; therefore the metal coating shell of fingerprint imaging modules in prior art can be removed from; reduce the volume of described fingerprint imaging module 110, improve its integrated level.
In addition, in the present embodiment, described sensor 114 is positioned at the accepting groove 116 of described light guide plate 113, chip 115 and flexible PCB utilize anisotropic conductive film (AnisotropicConductiveFilm, ACF) attach in the one side do not contacted with described light guide plate 113 at described sensor 114, flexible PCB is bent to below described light guide plate 113 again, is connected with described light guide plate 113.
Continue with reference to figure 4 and Fig. 5; described electronic equipment 100 also comprises the shell 120 for the protection of described electronic equipment hardware; described shell 120 comprises the cover sheet 121 covering described fingerprint recognition module 110; the area of described cover sheet 121 is greater than the area of described fingerprint recognition module 110, and described cover sheet 121 covers described fingerprint recognition module 110 completely.
The cover sheet 121 covering described fingerprint recognition module 110 is transparent material, and finger presses is on described cover sheet 121, and the incident light produced by fingerprint recognition module 110 is projected to finger and occurs to reflect and reflect with the surface of contact of described cover sheet 121.Reflected light is received by the sensor in fingerprint recognition module 110 to obtain fingerprint image.Concrete, the material of described cover sheet 121 comprises glass, sapphire or fibre optic plate, and wherein glass comprises organic glass.
In the present embodiment, the material of described cover sheet 121 is fibre optic plate.Because fibre optic plate has the high feature of light conduction efficiency, therefore fibre optic plate is adopted to cover the intensity that described fingerprint recognition module 110 can improve and project the upper incident light of finger, and improve the intensity that described sensor receives reflected light, be conducive to the quality improving the fingerprint image that sensor obtains, improve the performance of described fingerprint recognition module 110.
In conjunction with reference to figure 7, show the enlarged drawing in Fig. 5 centre circle B.
Because described cover sheet 121 area is greater than described fingerprint recognition module 110; that is whole fingerprint recognition module 110 is hidden in below cover sheet 121 completely; therefore the build-up tolerance of described cover sheet 121 and described other parts of shell is positioned at beyond the touch scope of fingerprint recognition; thus the gap of described cover sheet 121 and described other parts of shell can not be touched in fingerprint identification process, thus improve the comfort of described electronic equipment.
In the present embodiment; the area of described cover sheet 121 is greater than the area of described fingerprint recognition module 110; that is; the area of described cover sheet 121 is greater than the area of described light guide plate 112, and covers the described sensor 114 be positioned in described light guide plate 112 and the chip 115 being positioned at described sensor 114 surface.
It should be noted that, be not provided with the part of chip 115, be also provided with articulamentum 132 between described cover sheet 121 and described sensor 114, described cover sheet 121 is connected with described sensor 114 by described articulamentum 132.Concrete, the material of described articulamentum 132 is UV glue or optical cement.In the present embodiment, described cover sheet 121 realizes the connection with described sensor 114 by UV glue.
In the present embodiment, described cover sheet 121 is provided with a groove 125 in the one side of described fingerprint recognition module 110, for holding described chip 115.Described groove 125 can make to leave space between described cover sheet 121 and described chip 115, in order to avoid chip 115 affects the installation of described cover sheet 121.
Continue with reference to figure 4, in the present embodiment, described electronic equipment 100 comprises the first surface being provided with fingerprint recognition module 110; Described shell 120 also comprises the first panel 122, and described cover sheet 121 and described first panel 122 form the first housing to cover the first surface of described electronic equipment.
In the present embodiment, described fingerprint recognition module 110 is arranged at the front of described electronic equipment 100, and the first housing that therefore described first panel 122 and described cover sheet 121 are formed covers the whole front of described electronic equipment 100.
In addition, in the present embodiment, the first surface of described electronic equipment 100 also includes screen, and described first panel 122 also covers described screen, and therefore the material of described first panel 122 comprises glass (comprising organic glass) or sapphire transparent material.The described material of the first panel 122 and the material of described cover sheet 121 can be the same or different, and the present invention does not limit this.Concrete, in the present embodiment, the material of described first panel 122 is glass.
But it should be noted that, in the present embodiment, described fingerprint recognition module 110 is arranged at the one side that electronic equipment 100 is provided with screen, thus the way that described first panel 122 is set to transparent material is only an example.In other embodiments of the invention, when the one side that described electronic equipment 100 arranges fingerprint recognition module 110 is not provided with screen, the material of described first panel 122 can also be the opaque materials such as metal, and the present invention does not limit this.
It should be noted that, in the present embodiment, the joint gap between described cover sheet 121 and described first panel 122 is not more than 0.2 millimeter, to improve the aesthetics in described mobile phone front, and improves comfort further.
Further, in the present embodiment, along on the direction of parallel described cover sheet 121 and described first panel 122 connecting line, described cover sheet 121 extends to described first panel 122 wide.Concrete; in the present embodiment; described electronic equipment first surface is rectangle, and described cover sheet 121 and described first panel 122 line are parallel to described rectangular broadside, and therefore described cover sheet 121 extends the described first surface of covering along described rectangle first surface broadside.Therefore the bottom being provided with described electronic equipment 110 first surface of fingerprint recognition module 110 is all set to cover sheet 121, thus reduces the position that there is fit-up gap, reduces assembly difficulty, improves comfort.But this way is only an example, the area of described cover sheet 121 also can be greater than fingerprint recognition module 110, and only covers described fingerprint recognition module 110.The present invention does not limit this.
It should be noted that; in the present embodiment; the material of described cover sheet 121 is fibre optic plate; the material of described first panel 121 is glass; form the first housing to cover the way of described electronic equipment 100 by described cover sheet 121 and described first panel 122, be conducive to the manufacturing cost reducing described electronic equipment 100.But in other embodiments of the present invention, described cover sheet 121 also can be made to extend the first surface covering whole electronic equipment 100, and that is form separately the first housing by cover sheet 121, the present invention does not limit this.
In conjunction with reference to figure 5, described electronic equipment 100 also comprises second relative with described first surface, and described shell 120 also comprises the second housing 124 covering described second and the 3rd housing 123 connecting described first housing and the second housing 124.Described cover sheet is cover part the 3rd housing 123 also.
In the present embodiment, the 3rd housing 123 connecting described first housing and the second housing 124 is provided with groove, to hold described fingerprint recognition module 110.Described cover sheet 121 covers described groove and part the 3rd housing 123, to protect described fingerprint recognition module 110.
In addition, described cover sheet 121 is connected with described 3rd housing 123 by hot-setting adhesive or double faced adhesive tape.Concrete, in the present embodiment, described cover sheet 121 realizes the connection with described 3rd housing 123 by hot-setting adhesive 131.
So in the present embodiment, the shell 120 that described first housing, the second housing 123 and the 3rd housing 124 are formed comprises the hardware of the described electronic equipment 100 of fingerprint recognition module 110, to protect the hardware of described electronic equipment 100.
With reference to figure 8 and Fig. 9, show the structural representation that the present invention has another embodiment of electronic equipment of fingerprint identification function.Wherein Fig. 9 is the enlarged drawing in Fig. 8 centre circle C.
The something in common of the present embodiment and previous embodiment repeats no more, and the difference of the present embodiment and previous embodiment is, cover sheet 221 described in the present embodiment also comprises the bulge-structure 225 for being connected with described sensor 214.
Concrete, in the present embodiment, described cover sheet 221 is provided with a bulge-structure 225 on the first surface of described fingerprint recognition module; Described articulamentum 232 covers described bulge-structure 225 surface, is connected with described sensor 214 for making the raised structures of described cover sheet 221; The thickness of described articulamentum 232 and the thickness sum of described bulge-structure 225 are greater than the thickness of described chip 215; a slit is formed for arranging between the position of described chip 215 and described cover sheet 221 at described sensor 214; to hold described chip 215, thus described cover sheet 221 is avoided too closely to affect the installation of described cover sheet 221 with the spacing of described chip 215.
With reference to Figure 10 and Figure 11, show the structural representation of electronic equipment that the present invention has a fingerprint identification function embodiment again.Wherein Figure 11 is the enlarged drawing in Figure 10 centre circle D.
The something in common of the present embodiment and previous embodiment repeats no more, and the difference of the present embodiment and previous embodiment is, in the present embodiment, described cover sheet 321 is plane towards the first surface of described fingerprint recognition module.
Concrete; in the present embodiment; the thickness of described articulamentum 332 is greater than the thickness of described chip 315; a slit is formed for arranging between the position of described chip 315 and described cover sheet 321 at described sensor 314; to hold described chip 315, avoid described chip 315 and the spacing of described cover sheet 321 too near and cause interference.Therefore described cover sheet 321 can be set to plane towards the first surface of described fingerprint recognition module, to reduce the difficulty of processing of described cover sheet 321, reduces manufacturing cost.
To sum up; the shell of the present invention by making the cover sheet of the described fingerprint recognition module of covering form protection electronic equipment hardware; and the area of cover sheet is not less than the area of described fingerprint recognition module; and cover described fingerprint recognition module; therefore, it is possible to make the build-up tolerance of described cover sheet and described other parts of shell be positioned at beyond the touch scope of fingerprint recognition; thus in fingerprint identification process, do not touch described cover sheet and the gap with described other parts of shell, improve comfort.And in possibility of the present invention; the area of described cover sheet is greater than the area of described fingerprint recognition module; the one side of light guide plate away from substrate arranges accepting groove to hold sensor; therefore compared with fingerprint recognition module of the prior art; fingerprint recognition module of the present invention can save containment vessel; the thickness of described fingerprint recognition module can be reduced, improve the integrated level of described fingerprint recognition module.In addition in possibility of the present invention; the first surface of described cover sheet towards described fingerprint recognition module arranges the chip holding fingerprint recognition module; or bulge-structure is set on described first surface to connect described cover sheet and described fingerprint recognition module; to avoid described cover sheet to interfere described chip operation, improve the stability of described fingerprint recognition module.Further; in possibility of the present invention; the optical cement of connection described fingerprint recognition module and cover sheet or the thickness of UV glue can also be made to be greater than the thickness of described chip; thus described cover sheet can be made to be set to plane towards the first surface of described fingerprint recognition module; thus reduce the difficulty of processing of described cover sheet, reduce manufacturing cost.
Although the present invention discloses as above, the present invention is not defined in this.Any those skilled in the art, without departing from the spirit and scope of the present invention, all can make various changes or modifications, and therefore protection scope of the present invention should be as the criterion with claim limited range.
Claims (16)
1. there is an electronic equipment for fingerprint identification function, it is characterized in that, comprising:
Fingerprint recognition module, for carrying out fingerprint recognition;
For the protection of the shell of described electronic equipment hardware, described shell comprises the cover sheet covering described fingerprint recognition module, and the area of described cover sheet is greater than the area of described fingerprint recognition module, and described cover sheet covers described fingerprint recognition module completely.
2. electronic equipment as claimed in claim 1, it is characterized in that, described cover sheet is transparent material, comprises glass, sapphire or fibre optic plate.
3. electronic equipment as claimed in claim 2, it is characterized in that, described glass comprises organic glass.
4. electronic equipment as claimed in claim 1, it is characterized in that, described fingerprint recognition module comprises optical fingerprint identification module, comprising: substrate; For providing the light source of incident light; Be positioned at the light guide plate of described substrate surface, for making described incident light homogenising; Be positioned at the sensor of described light guide plate surface and be positioned at the chip of described sensor surface;
The area of described cover sheet is greater than the area of described light guide plate, and covers described sensor and be positioned at the chip of described sensor surface.
5. electronic equipment as claimed in claim 4, is characterized in that, the articulamentum between described cover sheet and described sensor, linking together for making described cover sheet and described sensor; Described articulamentum is positioned at the position that described sensor is not provided with described chip.
6. electronic equipment as claimed in claim 5, it is characterized in that, the material of described articulamentum is optical cement or UV glue.
7. electronic equipment as claimed in claim 5, it is characterized in that, described cover sheet is provided with a bulge-structure in the one side of described fingerprint recognition module;
Described articulamentum covers described bulge-structure surface, is connected with described sensor for making the bulge-structure of described cover sheet;
The thickness of described articulamentum and the thickness sum of described bulge-structure are greater than the thickness of described chip, for forming a slit between the position of chip described in sensor setting and described cover sheet, to hold described chip.
8. electronic equipment as claimed in claim 5, it is characterized in that, described cover sheet is plane towards the face of described fingerprint recognition module;
The thickness of described articulamentum is greater than the thickness of described chip, for forming a slit between the position of chip described in sensor setting and described cover sheet, to hold described chip.
9. electronic equipment as claimed in claim 4, it is characterized in that, described cover sheet is provided with a groove on the face of described fingerprint recognition module, for holding described chip.
10. electronic equipment as claimed in claim 4, it is characterized in that, described light guide plate is provided with an accepting groove away from the one side of substrate, for holding described sensor; Described cover sheet covers described accepting groove opening.
11. electronic equipments as claimed in claim 1, is characterized in that, the face that described electronic equipment is provided with described fingerprint recognition module is first surface;
Described shell also comprises the first panel, for forming with described cover sheet the first housing covering described first surface.
12. electronic equipments as claimed in claim 11, it is characterized in that, the joint gap between described cover sheet and described first panel is not more than 0.2 millimeter.
13. electronic equipments as claimed in claim 11, it is characterized in that, described electronic equipment also comprises second relative with described first surface, and described shell comprises covering second housing of described second and the 3rd housing between described first housing and described second housing; Described 3rd housing is provided with the groove for holding described fingerprint recognition module in the one side of the first housing;
Described cover sheet is cover part the 3rd housing also.
14. electronic equipments as claimed in claim 13, is characterized in that, described cover sheet is connected with described 3rd housing by hot-setting adhesive or double faced adhesive tape.
15. electronic equipments as claimed in claim 11, it is characterized in that, described first surface is rectangle;
Described cover sheet extends the described first surface of covering along the broadside of described rectangle first surface.
16. electronic equipments as claimed in claim 1, it is characterized in that, described electronic equipment is mobile phone or panel computer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590601.7A CN105116968A (en) | 2015-09-16 | 2015-09-16 | Electronic equipment with fingerprint identification function |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510590601.7A CN105116968A (en) | 2015-09-16 | 2015-09-16 | Electronic equipment with fingerprint identification function |
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| CN105116968A true CN105116968A (en) | 2015-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510590601.7A Pending CN105116968A (en) | 2015-09-16 | 2015-09-16 | Electronic equipment with fingerprint identification function |
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Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN106529487A (en) * | 2016-11-18 | 2017-03-22 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN106650607A (en) * | 2016-10-31 | 2017-05-10 | 维沃移动通信有限公司 | Backlight structure of fingerprint module and electronic device |
| CN106657480A (en) * | 2017-02-20 | 2017-05-10 | 维沃移动通信有限公司 | Mobile terminal |
| CN107016340A (en) * | 2017-03-01 | 2017-08-04 | 广东欧珀移动通信有限公司 | Input module and electronic installation |
| CN107239724A (en) * | 2016-03-28 | 2017-10-10 | 上海箩箕技术有限公司 | Fingerprint imaging module |
| CN107979669A (en) * | 2017-12-12 | 2018-05-01 | 江苏凯尔生物识别科技有限公司 | Touch-control fingerprint component for smart mobile phone |
| WO2018099231A1 (en) * | 2016-11-29 | 2018-06-07 | 惠州Tcl移动通信有限公司 | Embedded fingerprint recognition device utilized in mobile terminal |
| CN108388826A (en) * | 2017-02-03 | 2018-08-10 | 上海箩箕技术有限公司 | Electronic equipment |
| WO2018157687A1 (en) * | 2017-03-01 | 2018-09-07 | 广东欧珀移动通信有限公司 | Input component and electronic device |
| CN108629258A (en) * | 2017-03-24 | 2018-10-09 | 上海箩箕技术有限公司 | Fingerprint imaging module and electronic equipment |
| CN108803783A (en) * | 2018-05-29 | 2018-11-13 | 珠海市魅族科技有限公司 | Terminal device |
| CN109426784A (en) * | 2017-08-31 | 2019-03-05 | 上海箩箕技术有限公司 | Display module |
| CN109585596A (en) * | 2017-09-29 | 2019-04-05 | 致伸科技股份有限公司 | Optical finger print sensing unit and its manufacturing method, Touch Screen |
| CN110197539A (en) * | 2018-02-27 | 2019-09-03 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition mould group and fingerprint identification door lock |
| CN110737306A (en) * | 2019-09-26 | 2020-01-31 | 维沃移动通信有限公司 | display module and electronic equipment |
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