WO2018157687A1

WO2018157687A1 - Input component and electronic device

Info

Publication number: WO2018157687A1
Application number: PCT/CN2018/074475
Authority: WO
Inventors: 张文真
Original assignee: 广东欧珀移动通信有限公司
Priority date: 2017-03-01
Filing date: 2018-01-29
Publication date: 2018-09-07

Abstract

Disclosed are an input component (100) and an electronic device (200). The input component (100) comprises a cover plate (10), a display screen (20), and a fingerprint recognition module (30). A first accommodation recess (23) is formed on the display screen (200). At least a part of the fingerprint recognition module (30) is placed within the first accommodation recess (23). The cover plate (10) covers the display screen (20) and the fingerprint recognition module (30).

Description

Input component and electronic device

Priority information

The present application claims priority to and the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit of the benefit.

Technical field

The present invention relates to the field of electronic devices, and in particular, to an input component and an electronic device.

Background technique

Electronic products such as mobile phones have become an indispensable tool in most people's lives, and people's requirements for mobile phones are also increasing. Therefore, how to reduce the thickness of mobile phones has become a technical problem to be solved.

Summary of the invention

The invention provides an input component and an electronic device.

The input component of an embodiment of the present invention includes a display screen, a fingerprint recognition module, and a cover. The display screen is formed with a first receiving slot. The fingerprint identification module is at least partially received in the first receiving slot. The cover covers the display screen and the fingerprint identification module.

The electronic device of the embodiment of the present invention includes the input component of the above embodiment.

In the input component and the electronic device of the embodiment of the invention, since the fingerprint recognition module is at least partially housed in the first receiving slot, the overall thickness of the input component can be reduced, thereby reducing the thickness of the electronic device to which the input component is applied.

The additional aspects and advantages of the invention will be set forth in part in the description which follows.

DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic cross-sectional view of an input assembly in accordance with an embodiment of the present invention;

2 is a partial plan view showing an input assembly of an embodiment of the present invention;

3 is another schematic cross-sectional view of an input assembly in accordance with an embodiment of the present invention;

4 is another schematic cross-sectional view of the input assembly of the embodiment of the present invention;

Figure 5 is a further schematic cross-sectional view of the input assembly of the embodiment of the present invention;

6 is a schematic cross-sectional view of a fingerprint identification module according to an embodiment of the present invention;

Figure 7 is a cross-sectional view of the fingerprint identification module of Figure 6 taken along line VI-VI;

8 is a schematic plan view of an electronic device according to an embodiment of the present invention.

The main component symbol description:

Input component 100;

Cover plate 10, upper surface 11, lower surface 12, first region 13, second region 14, second receiving groove 15;

The display screen 20, the display area 21, the short side 211 of the display area 21, the non-display area 22, the first receiving slot 23, the top surface 24 of the display screen 20, and the side surface 25 of the display screen 20;

The fingerprint recognition module 30, the proximity edge 31, the package body 32, the bottom surface 321 of the package body 32, the fingerprint identification chip 33, the identification area 331, the non-recognition area 332, and the printed circuit board 34;

Electronic device 200.

detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals indicate the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientations of "post", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description of the present invention and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. Therefore, it should not be construed as limiting the invention. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" or "second" may include one or more of the described features either explicitly or implicitly. In the description of the present invention, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be fixed or detachable, for example, unless otherwise explicitly defined and defined. Connected, or integrally connected; may be mechanically connected, may be electrically connected or may communicate with each other; may be directly connected, or may be indirectly connected through an intermediate medium, may be internal communication of two elements or interaction of two elements relationship. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

In the present invention, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and below the second feature, or merely the first feature level being less than the second feature.

The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and arrangements of the specific examples are described below. Of course, they are merely examples and are not intended to limit the invention. In addition, the present invention may be repeated with reference to the numerals and/or reference numerals in the various examples, which are for the purpose of simplicity and clarity, and do not indicate the relationship between the various embodiments and/or arrangements discussed. Moreover, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the use of other processes and/or the use of other materials.

Referring to FIG. 1 , an input assembly 100 of an embodiment of the present invention includes a cover 10 , a display screen 20 , and a fingerprint recognition module 30 . The cover 10 covers the display screen 20 and the fingerprint recognition module 30, and the fingerprint recognition module 30 is disposed on the display screen 20.

The input component 100 of the embodiment of the present invention can be applied to an electronic device 200, such as an electronic device such as a mobile phone, a tablet computer, or a smart wearable device.

Specifically, the cover 10 includes an upper surface 11 and a lower surface 12. It will be appreciated that the upper surface 11 of the cover 10 is the design side of the input assembly 100, facing the user. The user can perform a gesture operation on the upper surface 11, such as clicking or sliding to control the electronic device 200 to implement the corresponding function.

The material of the cover 10 may be made of a light transmissive material such as glass, ceramic or sapphire. Since the cover 10 is an input component of the electronic device 200, the cover 10 is often subjected to contact such as collision or scratching. For example, when the user puts the electronic device 200 into the pocket, the cover 10 may be scratched by the key in the user's pocket and damaged.

Therefore, the material of the cover 10 can be made of a relatively hard material such as the above sapphire material. Of course, it is also possible to attach an upper protective sheet to the upper surface 11 of the cover 10 to prevent the cover 10 from being scratched.

Further, in conjunction with FIG. 2, the cover 10 includes a first region 13 and a second region 14. The first area 13 corresponds to the display area 21 of the display screen 20, and the second area 14 corresponds to the non-display area 22 of the display screen 20. Generally, the intermediate portion of the cover 10 serves as the first region 13, and the second region 14 is disposed around the first region 13. For example, the second region 14 is disposed on the top side and/or the bottom side of the first region 13.

Since the cover 10 is made of a light transmissive material, the user can view the content displayed on the display screen 20 through the first area 13.

In order to make the electronic device 200 more aesthetically pleasing, the ink may be sprayed on the lower surface 12 of the second region 14. The color of the ink is, for example, white, black or blue, and the like may be set according to actual needs. The ink can not only meet the user's requirements for the electronic device 200 of different colors, but also cover the structure inside the electronic device 200 to achieve the effect of beautifying the electronic device 200. It can be understood that the shape of the cover 10 can be specifically designed according to the shape of the electronic device 200, for example, a rounded rectangle.

In some embodiments, display screen 20 includes display area 21. The fingerprint recognition module 30 is located on one side of the edge of the display area 21, and the distance D between the fingerprint recognition module 30 and the display area 21 is 0-3 mm.

It should be noted that the distance D between the fingerprint recognition module 30 and the display area 21 refers to the shortest distance dimension between the fingerprint fingerprint recognition module 30 and the display area 21.

As such, since the distance between the fingerprint recognition module 30 and the display area 21 is 0-3 mm, the distance between the fingerprint recognition module 30 and the display area 21 is small, and the size of the area where the input component 100 does not have the display function is reduced. Thereby, the size of the display area 21 can be increased to increase the screen ratio of the electronic device 200 such as a mobile phone, thereby improving the user experience.

It can be understood that the display screen 20 also includes a non-display area 22 that is located at the periphery of the display area 21. In some embodiments, the fingerprint recognition module 30 is disposed on the non-display area 22.

As such, the fingerprint recognition module 30 does not affect the display effect of the display screen 20 when performing fingerprint recognition.

In addition, since the first area 13 of the cover 10 corresponds to the display area 21 of the display screen 20, the second area 14 corresponds to the non-display area 22 of the display screen 20 such that the area ratio of the first area 13 to the second area 14 is larger. Large, can improve the user experience.

In some embodiments, the display area 21 is rectangular and the fingerprint recognition module 30 is located on one side of the short side 211 of the display area 21.

As such, the location of the fingerprint recognition module 30 conforms to the user's operating habits, and the user's operating experience can be improved.

In some embodiments, the fingerprint recognition module 30 includes an approaching edge 31 that is adjacent the edge of the short side 211 of the display region 21. The distance between the approaching edge 31 and the short side 211 of the display area 21 is 0-3 mm.

As such, the fingerprint recognition module 30 is closer to the display area 21, and the display area 21 of the display screen 20 can be increased in area of the display screen 20.

In some embodiments, the display screen 20 is formed with a first receiving slot 23, and the fingerprint recognition module 30 is at least partially received in the first receiving slot 23.

As such, since the fingerprint recognition module 30 is at least partially housed in the first receiving slot 23, the overall thickness of the input assembly 100 can be reduced, thereby reducing the thickness of the electronic device 200 to which the input assembly 100 is applied.

It can be understood that the fingerprint identification module 30 can be completely accommodated in the first receiving slot 23 or partially in the first receiving slot 23 according to the actual situation.

Preferably, when the fingerprint recognition module 30 is partially received in the first receiving slot 23, the fingerprint recognition module 30 protrudes from the top surface 24 of the display screen 20 and abuts against the lower surface 12 of the cover 10, as shown in FIG. Shown. In this way, the fingerprint recognition module 30 is closer to the upper surface 11 of the cover 10, which facilitates fingerprint recognition by the fingerprint recognition module 30.

In some embodiments, the first receiving slot 23 extends to the edge of the display screen 20. Since the display area 21 of the display screen 20 is generally disposed at an intermediate position of the display screen 20, the first receiving groove 23 extends to the edge of the display screen 20 to prevent the first receiving groove 23 from interfering with the display area 21.

Since the edge area of the display screen 20 is the non-display area 22, in some embodiments, the first receiving groove 23 can be formed in the non-display area 22. It should be noted that the first receiving slot 23 is located outside the lead area of the display screen 20 to prevent the first receiving slot 23 from interfering with the lead area of the display screen 20. The lead area of the display screen 20 is used to connect the flexible circuit board to achieve corresponding The function.

Further, the first receiving groove 23 is formed on the top surface 24 and the side surface 25 of the display screen 20, as shown in FIG. It should be noted that the fingerprint recognition module 30 is received in the first receiving slot 23 , and the fingerprint recognition module 30 is not protruded from the side surface 25 of the display screen 20 . The first receiving slot 23 can be aligned with the side surface 25 of the display screen 20. As shown in FIG. 4, the first receiving slot 23 can also be located inside the side surface 25, as shown in FIG.

In some embodiments, the shape and size of the first receiving slot 23 match the shape and size of the fingerprint recognition module 30.

As such, the mating structure between the first receiving slot 23 and the fingerprint recognition module 30 is more compact. For example, the shape of the first receiving groove 23 is an oblong shape, and the fingerprint recognition module 30 is also an oblong shape. Of course, the first receiving groove 23 may have other shapes such as a rectangular parallelepiped shape and a cylindrical shape.

In addition, the size of the first receiving slot 23 is slightly larger than the size of the fingerprint recognition module 30, so that the fingerprint recognition module 30 is easily installed in the first receiving slot 23.

In some embodiments, the lower surface 12 of the cover 10 is formed with a second receiving slot 15. The second receiving groove 15 faces the first receiving groove 23 . The lower portion of the fingerprint recognition module 30 is received in the first receiving slot 23 , and the upper portion of the fingerprint recognition module 30 is received in the second receiving slot 15 .

As such, the distance between the fingerprint recognition module 30 and the upper surface 11 of the cover 10 is relatively close to improve the accuracy of the fingerprint recognition of the fingerprint recognition module 30.

In order to make the first receiving slot 23 and the second receiving slot 15 more compact, the shape of the first receiving slot 23 is the same as that of the second receiving slot 15 in some embodiments.

Referring again to FIG. 2, in some embodiments, the length L of the fingerprint recognition module 30 is 3-5 mm in the longitudinal direction of the display area 21. For example, the length L is 3.5 mm, 4 mm or 4.5 mm.

As such, the length of the fingerprint recognition module 30 in the longitudinal direction of the display area 21 is small, and the size of the non-display area 22 of the display screen 20 can be reduced to increase the screen ratio of the electronic device 200.

Referring to FIGS. 6 and 7 , in some embodiments, the fingerprint recognition module 30 includes a package 32 and a fingerprint recognition chip 33 .

As such, the fingerprint recognition module 30 can implement the function of fingerprint recognition through the fingerprint recognition chip 33. Specifically, the fingerprint identification chip 33 is provided with a sensing pixel array facing the surface of the user's finger. When the user performs the fingerprint recognition operation, the finger can be placed at a position corresponding to the fingerprint identification chip 33, and the sensing pixel array can collect the user's fingerprint. The pattern is followed by matching the fingerprint pattern of the user with the pre-stored fingerprint pattern. If the matching is successful, the fingerprint recognition is successful.

In addition, the package body 32 can reduce the influence of the interference pixel by the sensing pixel array when acquiring the fingerprint pattern, so as to improve the accuracy of the fingerprint recognition module 30 to recognize the fingerprint.

In order to ensure that the leads of the fingerprint recognition chip 33 can be led out of the package 32 to ensure the fingerprint recognition function of the fingerprint recognition module 30, in some embodiments, the distance between the side of the fingerprint recognition chip 33 and the outer side of the package 32 is H. Greater than or equal to 0.2 mm, that is, H ≥ 0.2 mm.

It should be noted that the distance between the side surface of the fingerprint identification chip 33 and the outer side surface of the package body 32 refers to the shortest distance dimension between the side surface of the fingerprint identification chip 33 and the outer side surface of the package body 32.

Specifically, the fingerprint identification chip 33 has a rectangular parallelepiped shape, and the distance H between the long side surface of the fingerprint recognition chip 33 and the outer side surface of the package body 32 is greater than or equal to 0.2 mm, that is, H ≥ 0.2 mm.

In some embodiments, the fingerprint recognition chip 33 includes an identification area 331 and a non-recognition area 332 surrounding the identification area 331. The distance H between the side of the non-recognition area 332 and the outer side of the package 32 is greater than or equal to 0.2 mm, ie, H. ≥0.2mm.

It can be understood that the non-recognition area 332 is formed with a connection line, such as a gold wire, the connection line is connected to the identification area 331 and extends outside the package body 32, and an external component (for example, a flexible circuit board) is connected to the connection line of the non-identification area 332, thereby Data transfer is possible for fingerprint recognition.

In some embodiments, the distance P of the side of the identification zone 331 from the outer side of the package 32 is greater than or equal to 0.35 mm. For example, the distance P is 0.4 mm.

In this way, the distance between the fingerprint recognition chip 33 and the outer side of the package body 32 can be ensured so that the fingerprint recognition module 30 can perform the fingerprint recognition operation normally.

In some embodiments, the identification area 331 has a rectangular parallelepiped shape, and the distance P between the long side of the identification area 331 and the outer side of the package 32 is greater than or equal to 0.35 mm.

As such, the size of the connection lead of the identification area 331 is large, which facilitates the identification area 331 to lead the lead to the outside of the package 32.

In some embodiments, fingerprint identification module 30 further includes a printed circuit board 34 disposed in package 32, and fingerprint identification chip 33 is disposed on printed circuit board 34.

As such, the printed circuit board 34 can support the fingerprint recognition chip 33, so that the fingerprint recognition chip 33 is not easily deformed, and the package 32 is advantageously packaged by the package 32.

In some embodiments, the bottom surface 321 of the package body 32 is opposite to the printed circuit board 34. The bottom surface 321 of the package body 32 is formed with a pad (not shown), and the pad is electrically connected to the printed circuit board 34. For example, the printed circuit board 34 is connected to the pads by gold wires. The pads facilitate the connection of the fingerprint recognition module 30 to the flexible circuit board such that the fingerprint recognition module 30 can be quickly coupled to external components through the flexible circuit board for fingerprinting operations.

Referring to FIG. 8, an electronic device 200 according to an embodiment of the present invention includes the input component 100 of the above embodiment.

In the electronic device 200 of the embodiment of the present invention, since the fingerprint recognition module 30 is at least partially housed in the first receiving slot 23, the overall thickness of the input component 100 can be reduced, thereby reducing the electronic device 200 to which the input component 100 is applied. thickness of.

In the description of the present specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples", etc. The specific features, structures, materials or characteristics described in the embodiments or examples are included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims

An input component, comprising:

a display screen, the display screen is formed with a first receiving slot;

a fingerprint identification module, the fingerprint recognition module being at least partially received in the first receiving slot; and

a cover plate covering the display screen and the fingerprint recognition module.
The input component of claim 1 , wherein the fingerprint identification modules are all housed in the first receiving slot.
The input assembly of claim 1 wherein said fingerprint recognition module protrudes from a top surface of said display screen and abuts a lower surface of said cover.
The input assembly of claim 1 wherein said first receiving slot extends to an edge of said display screen.
The input assembly of claim 4 wherein said first receiving slot is formed in a top surface and a side surface of said display screen.
The input assembly of claim 1 wherein said first receiving slot has a shape and size that matches the shape and size of said fingerprint recognition module.
The input component of claim 1 , wherein the fingerprint identification module comprises a package and a fingerprint identification chip disposed in the package.
The input assembly according to any one of claims 1 to 7, wherein a lower surface of the cover plate is formed with a second receiving groove opposite to the first receiving slot, and a lower portion of the fingerprint recognition module is received. The upper portion of the fingerprint recognition module is received in the second receiving slot in the first receiving slot.
The input assembly according to claim 8, wherein the shape of the second receiving groove is the same as the shape of the first receiving groove.
An electronic device characterized by comprising an input component, the input component comprising:

a display screen, the display screen is formed with a first receiving slot;

a fingerprint identification module, the fingerprint identification module being at least partially received in the first receiving slot;

a cover plate covering the display screen and the fingerprint recognition module.
The electronic device according to claim 10, wherein the fingerprint recognition modules are all housed in the first receiving slot.
The electronic device according to claim 10, wherein the fingerprint recognition module protrudes from a top surface of the display screen and abuts against a lower surface of the cover plate.
The electronic device of claim 10 wherein said first receiving slot extends to an edge of said display screen.
The electronic device according to claim 13, wherein the first receiving groove is formed on a top surface and a side surface of the display screen.
The electronic device according to claim 10, wherein the shape and size of the first receiving slot match the shape and size of the fingerprint recognition module.
The electronic device according to claim 10, wherein the fingerprint identification module comprises a package body and a fingerprint identification chip disposed in the package body.
The electronic device according to any one of claims 10-16, wherein a lower surface of the cover plate is formed with a second receiving slot opposite to the first receiving slot, and a lower portion of the fingerprint recognition module is received. The upper portion of the fingerprint recognition module is received in the second receiving slot in the first receiving slot.
The electronic device according to claim 17, wherein the shape of the second receiving groove is the same as the shape of the first receiving groove.