CN109405856A - Optical sensor and forming method thereof - Google Patents
Optical sensor and forming method thereof Download PDFInfo
- Publication number
- CN109405856A CN109405856A CN201811508735.XA CN201811508735A CN109405856A CN 109405856 A CN109405856 A CN 109405856A CN 201811508735 A CN201811508735 A CN 201811508735A CN 109405856 A CN109405856 A CN 109405856A
- Authority
- CN
- China
- Prior art keywords
- binding
- pin
- binding pin
- several
- pseudo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000027455 binding Effects 0.000 claims abstract description 426
- 238000009739 binding Methods 0.000 claims abstract description 426
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000005130 electrotropism Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of optical sensor and forming method thereof, optical sensor includes: substrate；Fingerprint sensing circuit layer on substrate, fingerprint sensing circuit layer include pixel region and the first binding area；Pixel region includes: several columns sensitive pixel elements；One or more columns per page non-photo-sensing pixel unit, non-photo-sensing pixel unit are located at the side of the several columns sensitive pixel elements；The first data line being separately connected with each column sensitive pixel elements；The second data line being separately connected with each column non-photo-sensing pixel unit；First binding area includes: several first binding pins, and the first binding pin is connected with the first data line respectively；The second binding pin positioned at several first bindings pin side, the second binding pin are connect with the second data line；The first pseudo- binding pin between several first binding pins and the second binding pin；Anisotropic conductive layer in the first binding area.The performance of the optical sensor is improved.
Description
Technical field
The present invention relates to sensor fields more particularly to a kind of optical sensor and forming method thereof.
Background technique
Optical sensor is a kind of planar imaging equipment of large area, by pixel unit array, driving line, signal sense line
Deng composition.Optical signal with image information is projected directly at each pixel unit of sensor imaging surface, by sensor
Pixel unit is absorbed and is imaged.It is same size, the imaging without scaling due to focusing light without lens or optical fiber, thus
Have better image quality；Imaging device is also more frivolous simultaneously, so being widely used in every field.
For example it is applied to the optical sensor in the fields such as fingerprint imaging, file scan.Each pixel unit by switching device and
Photoelectric device is constituted.Visible light is converted into electronic signal by the photoelectric device in each pixel unit of optical sensor and stores
Come.System controller controls the driving chip on driving unit, to control the driving line on optical sensor, and then controls pixel
The unlatching line by line of cell array；Signal on simultaneity factor controller control signal acquisition unit reads chip, is passed by optics
Signal wire on sensor reads the electronic signal of that a line being turned in pixel unit array, then amplifies, modulus
Conversion, storage.Finally realize a digital grey scale image directly related with irradiated object surface characteristics.
However, the performance of existing optical sensor is to be improved.
Summary of the invention
Problems solved by the invention is to provide a kind of optical sensor and forming method thereof, to improve the property of optical sensor
Energy.
To solve the above problems, the present invention provides a kind of optical sensor, comprising: substrate；Fingerprint sense on substrate
Slowdown monitoring circuit layer, fingerprint sensing circuit layer include pixel region and bind area positioned at the first of pixel region side；The fingerprint sensing electricity
The pixel region of road floor includes: several columns sensitive pixel elements；One or more columns per page non-photo-sensing pixel unit, non-photo-sensing pixel unit position
In the side of the several columns sensitive pixel elements；The first data line being separately connected with each column sensitive pixel elements；With each column
The second data line that non-photo-sensing pixel unit is separately connected；First binding area of the fingerprint sensing circuit layer includes: several the
One binding pin, the first binding pin are connected with the first data line respectively；Positioned at the of several first bindings pin side
Two binding pins, the second binding pin are connect with the second data line；Draw positioned at several first binding pins and the second binding
The first pseudo- binding pin between foot；Anisotropic conductive layer in the first binding area of fingerprint sensing circuit layer.
Optionally, the anisotropic conductive layer is greater than in the conductivity perpendicular to the first binding area surface is being parallel to the
The conductivity on one binding area surface.
Optionally, the first binding pin and the second binding pin are parallel and parallel with the first pseudo- binding pin.
Optionally, the line width of the first binding pin is equal to the line width of the second binding pin and is equal to the first pseudo- binding pin
Line width.
Optionally, the spacing between the first adjacent binding pin and the first pseudo- binding pin, the second adjacent binding are drawn
Spacing between foot and the first pseudo- binding pin and the spacing between the first binding pin of arbitrary neighborhood are equal.
Optionally, for the second binding pin of several first bindings pin side, the quantity of the second binding pin
To be multiple, the second binding pin is connect with the second data line respectively；Spacing between first binding pin of arbitrary neighborhood is equal to
Spacing between second binding pin of arbitrary neighborhood.
Optionally, for the first pseudo- binding pin of several first bindings pin side, the first puppet binds pin
Quantity is multiple.
Optionally, the spacing between the first adjacent binding pin and the first pseudo- binding pin is equal to the first of arbitrary neighborhood
Spacing between puppet binding pin.
Optionally, the first pseudo- binding pin equidistant arrangement；The distance between the pseudo- binding pin of arbitrary neighborhood first is micro- for 10
Rice~400 microns.
Optionally, for the first pseudo- binding pin of several first bindings pin side, the first puppet binds pin
Quantity is more than or equal to 5.
Optionally, for the first pseudo- binding pin of several first bindings pin side, the first puppet binds pin
Quantity is one.
Optionally, the non-photo-sensing pixel unit is located at the two sides of the several columns sensitive pixel elements；Described
Two binding pins are located at the two sides of several first binding pins；The second of several first bindings pin side is tied up
Determine that there is the first pseudo- binding pin between pin and several first binding pins, several first bindings pin other side
The second binding pin and several first bindings pins between have first pseudo- to bind pin.
Optionally, further includes: signal reads flexible circuit, and it includes the second binding area that the signal, which reads flexible circuit, the
Two binding areas with it is described first binding area it is opposite, and the anisotropic conductive layer be located at first binding area and second bind area it
Between；Second binding area includes: several third binding pins, and third binding pin is opposite with the first binding pin, each third
It binds pin and each first binding pin is corresponded by anisotropic conductive layer and is electrically connected；It is tied up positioned at several thirds
Determine pin side the 4th binding pin, the 4th binding pin with second binding pin it is opposite, the 4th binding pin pass through it is each to
Anisotropic conductive layer and the second binding pin are electrically connected；Positioned at several thirds binding pins and the 4th binding pin it
Between the second pseudo- binding pin, the second pseudo- binding pin and the first pseudo- binding pin are opposite.
The present invention also provides a kind of forming methods for forming optical sensor described in above-mentioned any one, comprising: provides base
Plate；Fingerprint sensing circuit layer is formed on substrate, fingerprint sensing circuit layer includes pixel region and positioned at the first of pixel region side
Bind area；The pixel region of the fingerprint sensing circuit layer includes: several columns sensitive pixel elements；One or more columns per page non-photo-sensing pixel
Unit, non-photo-sensing pixel unit are located at the side of the several columns sensitive pixel elements；Connect respectively with each column sensitive pixel elements
The first data line connect；The second data line being separately connected with each column non-photo-sensing pixel unit；The fingerprint sensing circuit layer
First binding area includes: several first binding pins, and the first binding pin is connected with the first data line respectively；Positioned at described several
Second binding pin of the first binding pin side, the second binding pin are connect with the second data line；Positioned at described several first
Bind the first pseudo- binding pin between pin and the second binding pin；It is formed in the first binding area of fingerprint sensing circuit layer
Anisotropic conductive layer.
Optionally, further includes: signal is provided and reads flexible circuit, it includes the second binding that the signal, which reads flexible circuit,
Area, second binding area include: several third binding pins, the 4th binding positioned at several third bindings pin side
Pin；The second pseudo- binding pin between several third binding pins and the 4th binding pin；Signal is read
Flexible circuit fits together with the anisotropic conductive layer out, and the anisotropic conductive layer is located at the first binding Qu He
Between two binding areas, the second binding area is opposite with the first binding area, and third binding pin is opposite with the first binding pin, the
Four binding pins are opposite with the second binding pin, and the second pseudo- binding pin and the first pseudo- binding pin are opposite, and each third binding is drawn
Foot and each first binding pin are corresponded by anisotropic conductive layer and are electrically connected, and the 4th binding pin passes through anisotropy
Conductive layer and the second binding pin are electrically connected.
Compared with prior art, technical solution of the present invention has the advantage that
In the optical sensor that technical solution of the present invention provides, in several first binding pins and the second binding pin
Between be provided with first it is pseudo- bind pin so that the distance between the first binding pin and second binding pin increase.First is pseudo-
Pin is bound without being electrically connected.Even if exposing to sensitive pixel elements, the letter of the first data line output in stronger light
In number biggish situation of value, since the distance between the first binding pin and second binding pin increase, adjacent first
Electric field between data line and the second data line is also unlikely to very big.It thus is avoided that the signal of the first data line passes through anisotropy
Conductive layer drains to the second data line, then the signal of the second data line reality output is background signal value, the letter of the second data line
It number can be used in cutting down electronic noise.To sum up, the performance of optical sensor is improved.
Secondly, being increased between the first binding pin and the second binding pin by the placement of the pseudo- binding pin of setting first
Distance, so that the density for binding pin is consistent, make anisotropic conductive layer and first bind area pressing when everywhere
Uniform force is conducive to the pressing effect of anisotropic conductive layer and the first binding area, improves anisotropic conductive layer and the
The adhesive property and conductive effect in one binding area.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of optical sensor；
Fig. 2 is the top view of Fig. 1；
Fig. 3 to Fig. 7 is the structural schematic diagram of optical sensor forming process in one embodiment of the invention.
Specific embodiment
As described in background, the performance of existing optical sensor is to be improved.
A kind of optical sensor, in conjunction with reference Fig. 1 and Fig. 2, comprising: substrate 100；100 fingerprint sensing on substrate
Circuit layer 110, fingerprint sensing circuit layer 110 include pixel region Z1 and binding area Z2；Pixel region Z1 includes: several columns photosensitive pixel
Unit 110a；One or more columns per page non-photo-sensing pixel unit 110b, non-photo-sensing pixel unit 110b are located at the several columns light-sensitive image
The side of plain unit 110a；The first data line 1101 being connect with each column sensitive pixel elements 110a；With each column non-photo-sensing pixel
Second data line 1102 of unit 110b connection；Binding area Z2 includes: several first bindings pin (not shown), and the first binding is drawn
Foot is connected with the first data line 1101 respectively；The second binding pin (not shown) positioned at several first bindings pin side, the
Two binding pins are connect with the second data line 1102；Anisotropic conductive layer 120 on the first binding area Z2；Positioned at it is each to
Signal on anisotropic conductive layer 120 reads flexible circuit 130.
Non-photo-sensing pixel unit 110b and the sole difference of sensitive pixel elements 110a are: non-photo-sensing pixel unit 110b does not have
There is photonasty, sensitive pixel elements 110a has photonasty.
Second data line 1102 is connect with non-photo-sensing pixel unit 110b, since non-photo-sensing pixel unit 110b is not photosensitive
Property, therefore the output valve of the second data line 1102 is held at a background signal value at any time.In Image Acquisition, electricity
The interference of source fluctuation or external electromagnetic wave to optical sensor, and the electronic noise generated will be comprised in this background signal
In value, and non-photo-sensing pixel unit 110b be disturbed with sensitive pixel elements 110a be it is synchronous, size is also basic one
It causes.Therefore when optical sensor does not have light incidence, the signal value and the second data line 1102 of the output of the first data line 1101
The signal value of output is almost the same.When light exposes to sensitive pixel elements 110a, the second data line 1102 is for collecting light
The real-time electronic noise of sensor is learned, part or all of second data are individually subtracted in the signal value that each first data line 1101 exports
Line 1102 exports the average value of background signal value, can thus eliminate the Most electronic noise of image, improves image effect
Fruit.
Area Z2 is bound first, signal reading flexible circuit 130 is bonded in fingerprint sensing electricity by anisotropic conductive layer 120
On the binding area Z2 of road floor 110.Anisotropic conductive layer 120 is also used to carrying out conduction perpendicular to 100 surface direction of substrate, and
100 surface direction of substrate is being parallel to for electrical insulation.
Anisotropic conductive layer 120 is < 30 ohm/binding pin area in the conductivity perpendicular to the binding surface area Z2,
Longitudinal conducting resistance < 30 ohm of anisotropic conductive layer 120 on i.e. each binding pin；Anisotropic conductive layer 120
It is > 10 being parallel to the conductivity on the binding surface area Z28The distance between ohm/adjacent binding pin, i.e., arbitrary neighborhood is bound
Lateral conducting resistance > 10 of anisotropic conductive layer 120 between pin8Ohm.
However, anisotropic conductive layer 120 is not absolute insulator being parallel to 100 surface direction of substrate, respectively to
Anisotropic conductive layer 120 has certain electric conductivity (generally 10 being parallel to 100 surface direction of substrate8More than the magnitude of ohm).
Secondly, spacing, the line width of the first binding pin, Yi Ji between the first binding pin of binding area Z2 and the second binding pin
The line width of two binding pins is respectively smaller (generally less than 100um), so that the area of binding area Z2 is smaller, improves optics
The integrated level of sensor.
On this basis, when stronger light exposes to sensitive pixel elements 110a, the output of the second data line 1102
Signal value is larger, and the current potential of the current potential of the second data line 1102 and the first data line 1101 has significant difference, adjacent first data
Electric field between line 1101 and the second data line 1102 is stronger.Therefore, the signal of adjacent first data line 1101 can by it is each to
Anisotropic conductive layer 120 drains to the second data line 1102, and the signal of 1102 reality output of the second data line is caused to become larger, and at this time second
The signal of 1102 reality output of data line will be comprising the signal except background signal value, then can not just utilize the second data line
1102 signal goes to cut down electronic noise in real time.
On this basis, the present invention provides a kind of optical sensor, comprising: substrate；Fingerprint sensing electricity on substrate
Road floor, fingerprint sensing circuit layer include pixel region and the first binding area；Pixel region includes: several columns sensitive pixel elements；One column
Or multiple row non-photo-sensing pixel unit, non-photo-sensing pixel unit are located at the side of the several columns sensitive pixel elements；Feel with each column
The first data line that light pixel unit is separately connected；The second data line being separately connected with each column non-photo-sensing pixel unit；First
Binding area includes: several first binding pins, and the first binding pin is connected with the first data line respectively；Positioned at several first bindings
Second binding pin of pin side, the second binding pin are connect with the second data line；Positioned at several first binding pins and the
The first pseudo- binding pin between two binding pins；Anisotropic conductive layer in the first binding area.The optical sensing
The performance of device is improved.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Fig. 3 to Fig. 6 is the structural schematic diagram of semiconductor devices forming process in one embodiment of the invention.
In conjunction with reference Fig. 3 and Fig. 4, Fig. 4 is the top view of Fig. 3, provides substrate 200.
The substrate 200 is transparent substrates, and the transparent substrates include glass substrate or plastic base, and plastic base includes
PI or pet substrate.
Continuing with reference Fig. 3 and Fig. 4, fingerprint sensing circuit layer 210, fingerprint sensing circuit layer are formed on substrate 200
210 include pixel region A and bind area B positioned at the first of the side pixel region A；The pixel region A packet of the fingerprint sensing circuit layer 210
It includes: several columns sensitive pixel elements a1；One or more columns per page non-photo-sensing pixel unit a2, if non-photo-sensing pixel unit a2 is positioned at described
The side of dry column sensitive pixel elements a1；The first data line 2101 being separately connected with each column sensitive pixel elements a1；With each column
The second data line 2102 that non-photo-sensing pixel unit a2 is separately connected；First binding area B packet of the fingerprint sensing circuit layer 210
Include: several first binding pins 2201, the first binding pin 2201 are connected with the first data line 2101 respectively；Positioned at described several
Second binding pin 2202 of the first binding 2201 side of pin, the second binding pin 2202 are connect with the second data line 2102；
The first pseudo- binding pin 2203 between several first binding pins 2201 and the second binding pin 2202.
The sensitive pixel elements a1 includes: sensor devices and first switch device.The first switch device includes extremely
A few transistor.The sensor devices include photodiode.
The non-photo-sensing pixel unit a2 and sensitive pixel elements a1 are formed in a set of manufacturing process.The non-photo-sensing picture
Plain unit a2 includes: non-photo-sensing device and second switch device.The second switch device includes at least one transistor.
In one embodiment, the non-photo-sensing device includes the photodiode for being covered with light blocking layer, the light blocking layer
For stopping light to expose to non-photo-sensing device, the material of the light blocking layer includes metal, black organic matter.
In the present embodiment, the column direction of the column direction of each column sensitive pixel elements a1 and each column non-photo-sensing pixel unit a2 are flat
Row.
Several sensitive pixel elements a1 constitute the sensitive pixel elements array of N row * M column, and N is whole more than or equal to 1
Number, M are the integer more than or equal to 1.
The pixel region A of the fingerprint sensing circuit layer 210 further include: the driving line of several rows, driving line respectively with each row
Sensitive pixel elements a1 connection, specifically, the driving line of the i-th row is connect with the sensitive pixel elements a1 of the i-th row respectively.It is several
Capable driving line is the integer more than or equal to 1 and less than or equal to N for opening sensitive pixel elements a1, i line by line.
The pixel region A of the fingerprint sensing circuit layer 210 includes the first data line of M column 2101, the first data line of jth column
2101 connect with the sensitive pixel elements a1 of jth column respectively.First data line 2101 of jth column is for reading jth column light-sensitive image
The output signal of plain unit a1.
In the present embodiment, the non-photo-sensing pixel unit a2 is located at the two of the several columns sensitive pixel elements a1
Side.Specifically, the side of the several columns sensitive pixel elements a1 has the non-photo-sensing pixel unit a2 of N row * Q column, if described
The other side of dry column sensitive pixel elements a1 has the non-photo-sensing pixel unit a2 of N row * W column.In other embodiments, described non-
Sensitive pixel elements a2 is only located at the side of the several columns sensitive pixel elements a1.
The driving line is also connect with the non-photo-sensing pixel unit a2 respectively with each row, specifically, the driving line of the i-th row point
It is not connect with the non-photo-sensing pixel unit a2 of the i-th row.The driving line is also used to open non-photo-sensing pixel unit a2.
The pixel region A of the fingerprint sensing circuit layer 210 includes the second data line 2102 of one or more columns per page.Described second
The columns of data line 2102 and the columns of non-photo-sensing pixel unit a2 are equal.One the second data line of column 2102 is non-with a column respectively
Sensitive pixel elements a2 connection.Second data line 2102 is used to read the output signal of non-photo-sensing pixel unit a2.
In the present embodiment, the second binding pin 2202 is located at the two of several first binding pins 2201
Side.It is described it is several first binding 2201 side of pin second binding pin 2202 and it is described it is several first binding pin 2201 it
Between have first pseudo- to bind pin 2203, the second binding pin 2202 of several first bindings 2201 other side of pin and institute
Stating has the first pseudo- binding pin 2203 between several first binding pins 2201.
For the second binding pin 2202 of any side in several first bindings 2201 two sides of pin, the second binding
The quantity of pin 2202 is multiple or one.
First pseudo- binding pin 2203 and the first data line 2101 are not connected to, the first pseudo- binding pin 2203 and the first data
Line 2101 electrically disconnects, and the first pseudo- binding pin 2203 and the second data line 2102 are not connected to, the first pseudo- binding 2203 He of pin
Second data line 2102 electrically disconnects.
In the present embodiment, the first pseudo- binding pin 2203 for binding 2201 side of pin for described several first, first
The quantity of puppet binding pin 2203 is multiple.For the first pseudo- binding pin of several first bindings 2201 other side of pin
2203, the quantity of the first pseudo- binding pin 2203 is multiple.
In other embodiments, pin 2203 is bound for the first puppet of several first bindings 2201 side of pin,
The quantity of first pseudo- binding pin 2203 is one, and the first puppet of several first bindings 2201 other side of pin is bound
The quantity of pin 2203, the first pseudo- binding pin 2203 is one.
First binding pin 2201 is parallel with the second binding pin 2202 and parallel with the first pseudo- binding pin 2203.
The line width of first binding pin 2201, which is equal to the line width of the second binding pin 2202 and is equal to the first puppet, binds pin
2203 line width.
It is spacing between adjacent first binding pin 2201 and the first pseudo- binding pin 2203, any in the present embodiment
It is spacing between second binding pin 2202 of spacing, arbitrary neighborhood between adjacent first binding pin 2201, adjacent
Spacing, the second adjacent binding pin 2202 and first between first binding pin 2201 and the first pseudo- binding pin 2203 is pseudo-
The spacing bound between the first pseudo- binding pin 2203 of the spacing and arbitrary neighborhood between pin 2203 is equal.
In a specific embodiment, between the first adjacent binding pin 2201 and the first pseudo- binding pin 2203
Distance is 10 microns~400 microns；The distance between the second adjacent binding pin 2202 and the first pseudo- binding pin 2203 are
10 microns~400 microns.
Described first pseudo- binding 2203 equidistant arrangement of pin, the distance between pseudo- binding pin 2203 of arbitrary neighborhood first are
10 microns~400 microns.
In a specific embodiment, for the first pseudo- binding pin of several first bindings 2201 side of pin
2203, the quantity of the first pseudo- binding pin 2203 is more than or equal to 5.It is advantageous in that: when the adjacent first pseudo- binding pin 2203
Spacing (being less than 50um) and the adjacent first pseudo- binding pin 2203 and the second binding between the first binding pin 2201
The spacing (being less than 50um) point between spacing (being less than 50um) and adjacent first pseudo- binding pin 2203 between pin 2202
When not smaller, by the way that the pseudo- binding pin 2203 of at least five first is arranged, Lai Zeng great first binds pin 2201 and the second binding
Effective insulation distance between pin 2202, so that the electric leakage of the first binding pin 2201 and the second binding pin 2202 is effective
It reduces.
In the present embodiment, the first binding pin 2201 and second is increased by the placement of the pseudo- binding pin 2203 of setting first
Bind the distance between pin 2202, so that the density for binding pin is consistent, and makes anisotropic conductive layer and first
Uniform force everywhere when binding the pressing in area avoids between anisotropic conductive layer and the first binding pin 2201, respectively to different
Property conductive layer and the second binding pin 2202 between there is bubble, bind area with first to be conducive to anisotropic conductive layer
Effect is pressed, the adhesive property and conductive effect of anisotropic conductive layer and the first binding area are improved.
It is the top view of Fig. 5 in conjunction with reference Fig. 5 and Fig. 6, Fig. 6, Fig. 5 is schematic diagram on the basis of Fig. 3, and Fig. 6 is in Fig. 4
On the basis of schematic diagram, fingerprint sensing circuit layer 210 first binding area B on formed anisotropic conductive layer 300.
Anisotropic conductive layer 300 is greater than in the conductivity perpendicular to the first binding 2201 surface of area to be tied up being parallel to first
Determine the conductivity on 2201 surface of area.
With continued reference to Fig. 5 and Fig. 6, signal is provided and reads flexible circuit 400, the signal reads flexible circuit 400 and includes
Second binding area C, the second binding area C includes: several third binding pins 4011, is located at several thirds and binds pin
4th binding pin 4012 of 4011 sides；Positioned at several third binding pins 4011 and the 4th binding pin 4012
Between the second pseudo- binding pin 4013；Signal is read into flexible circuit 400 and the anisotropic conductive layer 300 is fitted in one
It rises, the anisotropic conductive layer 300 is located between the first binding area B and the second binding area C, the second binding area C and described the
One binding area B is opposite, and third binds pin 4011 and the first binding pin 2201 is opposite, and the 4th binding pin 4012 is tied up with second
It is opposite to determine pin 2202, the second pseudo- binding pin 4013 and the first pseudo- binding pin 2203 are opposite, and each third binds pin 4011
It is corresponded and is electrically connected by anisotropic conductive layer 300 with each first binding pin 2201, the 4th binding pin 4012 is logical
It crosses anisotropic conductive layer 300 and the second binding pin 2202 is electrically connected.
The signal reads binding signal on flexible circuit 400 and reads chip, i.e., signal reads chip and signal reading is soft
Property circuit 400 is bound together.In the present embodiment, each second pseudo- binding pin 4013 reads chip with signal and electrically disconnects.
In another embodiment, with reference to Fig. 7, each second pseudo- binding pin 4013 reads chip electrical property with signal respectively
Connection can make the current potential of the second pseudo- binding pin 4013 be always maintained at stabilization in this way, reduce the interference to image.
If the second pseudo- binding pin 4013 all floatings, then external interference factor can pass through the second pseudo- binding 4013 coupling of pin
It is bonded to the second pseudo- binding pin 4013 or the first pseudo- binding pin, and then interference is generated to image.
Correspondingly, the present embodiment also provides a kind of optical sensor, incorporated by reference to reference Fig. 5 and Fig. 6, comprising: substrate 200；
Fingerprint sensing circuit layer 210 on substrate 200, fingerprint sensing circuit layer 210 are adjacent including pixel region A and with pixel region A
First binding area B；The pixel region A of the fingerprint sensing circuit layer 210 includes: several columns sensitive pixel elements a1；One column or
Multiple row non-photo-sensing pixel unit a2, non-photo-sensing pixel unit a2 are located at the side of the several columns sensitive pixel elements a1；With it is each
First data line 2101 of column sensitive pixel elements a1 connection；The second data line being connect with each column non-photo-sensing pixel unit a2
2102；First binding area B of the fingerprint sensing circuit layer 210 includes: several first binding pins 2201, the first binding pin
2201 connect with the first data line 2101 respectively；The second binding pin positioned at several first bindings 2201 side of pin
2202, the second binding pin 2202 is connect with the second data line 2102；Positioned at several first binding pins 2201 and second
Bind the first pseudo- binding pin 2203 between pin 2202；It is each on the first binding area B of fingerprint sensing circuit layer 210
Anisotropy conductive layer 300.
Anisotropic conductive layer 300 is greater than in the conductivity perpendicular to first binding area's B surface is being parallel to the first binding
The conductivity of area's B surface.
In the present embodiment, the second binding pin 2202 is located at the two of several first binding pins 2201
Side.It is described it is several first binding 2201 side of pin second binding pin 2202 and it is described it is several first binding pin 2201 it
Between have first pseudo- to bind pin 2203, the second binding pin 2202 of several first bindings 2201 other side of pin and institute
Stating has the first pseudo- binding pin 2203 between several first binding pins 2201.
In the present embodiment, the first pseudo- binding pin 2203 for binding 2201 side of pin for described several first, first
The quantity of puppet binding pin 2203 is multiple.For the first pseudo- binding pin of several first bindings 2201 other side of pin
2203, the quantity of the first pseudo- binding pin 2203 is multiple.
In other embodiments, pin 2203 is bound for the first puppet of several first bindings 2201 side of pin,
The quantity of first pseudo- binding pin 2203 is one, and the first puppet of several first bindings 2201 other side of pin is bound
The quantity of pin 2203, the first pseudo- binding pin 2203 is one.
First binding pin 2201 is parallel with the second binding pin 2202 and parallel with the first pseudo- binding pin 2203.
The line width of first binding pin 2201, which is equal to the line width of the second binding pin 2202 and is equal to the first puppet, binds pin
2203 line width.
It is spacing between adjacent first binding pin 2201 and the first pseudo- binding pin 2203, any in the present embodiment
Spacing between adjacent first binding pin 2201, the first adjacent binding pin 2201 and the first pseudo- binding pin 2203 it
Between spacing, the spacing between adjacent second binding pin 2202 and the first pseudo- binding pin 2203 and arbitrary neighborhood
Spacing between first pseudo- binding pin 2203 is equal.
In a specific embodiment, between the first adjacent binding pin 2201 and the first pseudo- binding pin 2203
Distance is 10 microns~400 microns；The distance between the second adjacent binding pin 2202 and the first pseudo- binding pin 2203 are
10 microns~400 microns.
Described first pseudo- binding 2203 equidistant arrangement of pin, the distance between pseudo- binding pin 2203 of arbitrary neighborhood first are
10 microns~400 microns.
In a specific embodiment, for the first pseudo- binding pin of several first bindings 2201 side of pin
2203, the quantity of the first pseudo- binding pin 2203 is more than or equal to 5.
The optical sensor further include: signal reads flexible circuit 400, and the signal reads flexible circuit 400 and includes
Second binding area C, the second binding area C is opposite with the first binding area B, and the anisotropic conductive layer 300 is located at first
It binds between the binding of area B and second area C.
The second binding area C includes: several third binding pins 4011, and third is bound pin 4011 and drawn with the first binding
Foot 2201 is opposite, and each third binding pin 4011 and each first binding pin 2201 are a pair of by anisotropic conductive layer 300 1
Electrotropism connection；The 4th binding pin 4012 positioned at several third bindings 4011 side of pin, the 4th binding pin
4012 and second bind pin 2202 relatively, and the 4th binding pin 4012 is drawn by anisotropic conductive layer 300 and the second binding
Foot 2202 is electrically connected；Second between several third binding pins 4011 and the 4th binding pin 4012 is pseudo-
Pin 4013 is bound, the second pseudo- binding pin 4013 and the first pseudo- binding pin 2203 are opposite.
In the present embodiment, the second data line 2102 is connect with non-photo-sensing pixel unit a2, due to non-photo-sensing pixel unit a2
There is no photonasty, therefore the second data line 2102 is used to export background signal value at any time.In Image Acquisition, power supply wave
Interference of the dynamic or external electromagnetic wave to optical sensor, and the electronic noise generated will be comprised in this background signal value
In, and non-photo-sensing pixel unit a2 be disturbed with sensitive pixel elements a1 be it is synchronous, size is also almost the same.?
When optical sensor does not have light incidence, the signal value of the first data line 2101 output and the signal value of the second data line 2102 output
It is almost the same.
Due to avoiding the signal of the first data line 2101 from passing through anisotropy when light exposes to sensitive pixel elements a1
Conductive layer 300 drains to the second data line 2102, then the signal of 2102 line reality output of the second data is background signal value, therefore
Second data line 2102 can accurately collect the real-time electronic noise of optical sensor, the letter that each first data line 2101 exports
The average value that part or all of second data line 2102 exports background signal value is individually subtracted in number value, can thus eliminate image
Most electronic noise, improves image effect.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (15)
1. a kind of optical sensor characterized by comprising
Substrate；
Fingerprint sensing circuit layer on substrate, fingerprint sensing circuit layer include pixel region and positioned at the first of pixel region side
Bind area；
The pixel region of the fingerprint sensing circuit layer includes: several columns sensitive pixel elements；One or more columns per page non-photo-sensing pixel list
Member, non-photo-sensing pixel unit are located at the side of the several columns sensitive pixel elements；It is separately connected with each column sensitive pixel elements
The first data line；The second data line being separately connected with each column non-photo-sensing pixel unit；
First binding area of the fingerprint sensing circuit layer includes: several first bindings pins, and the first binding pin is respectively with the
The connection of one data line；The second binding pin positioned at several first bindings pin side, the second binding pin and the second number
It is connected according to line；The first pseudo- binding pin between several first binding pins and the second binding pin；
Anisotropic conductive layer in the first binding area of fingerprint sensing circuit layer.
2. optical sensor according to claim 1, which is characterized in that the anisotropic conductive layer is perpendicular to first
The conductivity for binding area surface is greater than in the conductivity for being parallel to the first binding area surface.
3. optical sensor according to claim 1, which is characterized in that the first binding pin and the second binding pin are parallel
And it is parallel with the first pseudo- binding pin.
4. optical sensor according to claim 1, which is characterized in that the line width of the first binding pin is equal to the second binding
The line width of pin and the line width for being equal to the first pseudo- binding pin.
5. optical sensor according to claim 1, which is characterized in that the first adjacent binding pin and the first pseudo- binding
The of spacing and arbitrary neighborhood between spacing between pin, the second adjacent binding pin and the first pseudo- binding pin
Spacing between one binding pin is equal.
6. optical sensor according to claim 5, which is characterized in that for several first bindings pin side
Second binding pin, second binding pin quantity be it is multiple, second binding pin is connect respectively with the second data line；
Spacing between first binding pin of arbitrary neighborhood is equal to the spacing between the second binding pin of arbitrary neighborhood.
7. optical sensor according to claim 1, which is characterized in that for several first bindings pin side
The quantity of first pseudo- binding pin, the first pseudo- binding pin is multiple.
8. optical sensor according to claim 7, which is characterized in that the first adjacent binding pin and the first pseudo- binding
Spacing between pin is equal to the spacing between the first pseudo- binding pin of arbitrary neighborhood.
9. optical sensor according to claim 7, which is characterized in that the first pseudo- binding pin equidistant arrangement；Any phase
The distance between pseudo- binding pin of neighbour first is 10 microns~400 microns.
10. optical sensor according to claim 7, which is characterized in that for several first bindings pin side
The first pseudo- binding pin, the quantity of the first pseudo- binding pin is more than or equal to 5.
11. optical sensor according to claim 1, which is characterized in that for several first bindings pin side
The first pseudo- binding pin, the quantity of the first pseudo- binding pin is one.
12. optical sensor according to claim 1, which is characterized in that the non-photo-sensing pixel unit is located at institute
State the two sides of several columns sensitive pixel elements；The second binding pin is located at the two of several first binding pins
Side；There is the first puppet between second binding pin of several first bindings pin side and several first binding pins
Pin is bound, is had between the second binding pin of several first bindings pin other side and several first binding pins
There is the first pseudo- binding pin.
13. optical sensor according to claim 1, which is characterized in that further include: signal reads flexible circuit, described
It includes the second binding area that signal, which reads flexible circuit, and the second binding area is opposite with the first binding area, and the anisotropy
Conductive layer is located between the first binding area and the second binding area；
Second binding area includes: several third binding pins, and third binding pin is opposite with the first binding pin, each third
It binds pin and each first binding pin is corresponded by anisotropic conductive layer and is electrically connected；It is tied up positioned at several thirds
Determine pin side the 4th binding pin, the 4th binding pin with second binding pin it is opposite, the 4th binding pin pass through it is each to
Anisotropic conductive layer and the second binding pin are electrically connected；Positioned at several thirds binding pins and the 4th binding pin it
Between the second pseudo- binding pin, the second pseudo- binding pin and the first pseudo- binding pin are opposite.
14. a kind of forming method for forming optical sensor described in claim 1 to 13 any one characterized by comprising
Substrate is provided；
Fingerprint sensing circuit layer is formed on substrate, fingerprint sensing circuit layer includes pixel region and positioned at the first of pixel region side
Bind area；The pixel region of the fingerprint sensing circuit layer includes: several columns sensitive pixel elements；One or more columns per page non-photo-sensing pixel
Unit, non-photo-sensing pixel unit are located at the side of the several columns sensitive pixel elements；Connect respectively with each column sensitive pixel elements
The first data line connect；The second data line being separately connected with each column non-photo-sensing pixel unit；The fingerprint sensing circuit layer
First binding area includes: several first binding pins, and the first binding pin is connected with the first data line respectively；Positioned at described several
Second binding pin of the first binding pin side, the second binding pin are connect with the second data line；Positioned at described several first
Bind the first pseudo- binding pin between pin and the second binding pin；
Anisotropic conductive layer is formed in the first binding area of fingerprint sensing circuit layer.
15. the forming method of optical sensor according to claim 14, which is characterized in that further include: signal is provided and is read
Flexible circuit out, it includes the second binding area that the signal, which reads flexible circuit, and second binding area includes: several third bindings
Pin, the 4th binding pin positioned at several third bindings pin side；Positioned at several third binding pins and institute
State the second pseudo- binding pin between the 4th binding pin；Signal is read flexible circuit to be bonded with the anisotropic conductive layer
Together, the anisotropic conductive layer is located between the first binding area and the second binding area, the second binding area and described first
It is opposite to bind area, third binding pin is opposite with the first binding pin, and the 4th binding pin is opposite with the second binding pin, and second
Puppet binding pin and the first pseudo- binding pin are opposite, and each third binding pin and each first binding pin pass through anisotropic conductive
Layer, which corresponds, to be electrically connected, and the 4th binding pin is electrically connected by anisotropic conductive layer and the second binding pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811508735.XA CN109405856A (en) | 2018-12-11 | 2018-12-11 | Optical sensor and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811508735.XA CN109405856A (en) | 2018-12-11 | 2018-12-11 | Optical sensor and forming method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109405856A true CN109405856A (en) | 2019-03-01 |
Family
ID=65458284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811508735.XA Pending CN109405856A (en) | 2018-12-11 | 2018-12-11 | Optical sensor and forming method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109405856A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111027498A (en) * | 2019-12-17 | 2020-04-17 | 上海思立微电子科技有限公司 | Fingerprint identification sensor and fingerprint identification method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000413A (en) * | 2006-01-13 | 2007-07-18 | 三星电子株式会社 | Liquid crystal display and forming method thereof and thin film transistor substrate |
| CN101510396A (en) * | 2008-02-15 | 2009-08-19 | 奇美电子股份有限公司 | Control circuit, backlight module and flat display device |
| CN103378108A (en) * | 2012-04-27 | 2013-10-30 | 台湾积体电路制造股份有限公司 | Method and apparatus for packaging image sensor |
| CN104835416A (en) * | 2014-02-10 | 2015-08-12 | 三星显示有限公司 | Display device |
| CN204759454U (en) * | 2015-07-16 | 2015-11-11 | 上海箩箕技术有限公司 | Optics fingerprint sensor |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN105608445A (en) * | 2016-01-29 | 2016-05-25 | 上海箩箕技术有限公司 | Optical fingerprint sensor, and manufacturing method and fingerprint acquisition method thereof |
| CN209043336U (en) * | 2018-12-11 | 2019-06-28 | 上海箩箕技术有限公司 | Optical sensor |
-
2018
- 2018-12-11 CN CN201811508735.XA patent/CN109405856A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000413A (en) * | 2006-01-13 | 2007-07-18 | 三星电子株式会社 | Liquid crystal display and forming method thereof and thin film transistor substrate |
| CN101510396A (en) * | 2008-02-15 | 2009-08-19 | 奇美电子股份有限公司 | Control circuit, backlight module and flat display device |
| CN103378108A (en) * | 2012-04-27 | 2013-10-30 | 台湾积体电路制造股份有限公司 | Method and apparatus for packaging image sensor |
| CN104835416A (en) * | 2014-02-10 | 2015-08-12 | 三星显示有限公司 | Display device |
| CN204759454U (en) * | 2015-07-16 | 2015-11-11 | 上海箩箕技术有限公司 | Optics fingerprint sensor |
| CN105512645A (en) * | 2016-01-19 | 2016-04-20 | 上海箩箕技术有限公司 | Optical fingerprint sensor module |
| CN105608445A (en) * | 2016-01-29 | 2016-05-25 | 上海箩箕技术有限公司 | Optical fingerprint sensor, and manufacturing method and fingerprint acquisition method thereof |
| CN209043336U (en) * | 2018-12-11 | 2019-06-28 | 上海箩箕技术有限公司 | Optical sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111027498A (en) * | 2019-12-17 | 2020-04-17 | 上海思立微电子科技有限公司 | Fingerprint identification sensor and fingerprint identification method |
| CN111027498B (en) * | 2019-12-17 | 2023-04-25 | 上海思立微电子科技有限公司 | Fingerprint identification sensor and fingerprint identification method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107564416B (en) | A kind of display panel and display device | |
| CN205318406U (en) | Terminal with fingerprint identification function | |
| CN102096089B (en) | Detect photodiode and the manufacture method thereof of X ray | |
| EP0117957A2 (en) | Solid-state device having a plurality of optical functions | |
| CN107393895A (en) | Display device | |
| CN105514029B (en) | Dot structure of X-ray flat panel detector and preparation method thereof, camera system | |
| CN101057249A (en) | Apparatus for fingerprint sensing and other measurements | |
| CN107248518A (en) | Photoelectric sensor and preparation method thereof, display device | |
| TWI227562B (en) | Photoelectric conversion device, image scanning apparatus, and manufacturing method of the photoelectric conversion device | |
| CN209043336U (en) | Optical sensor | |
| CN108873438A (en) | A kind of array substrate, display panel and display device | |
| CN107452283A (en) | Display module and its manufacture method, display device | |
| CN108363993A (en) | Fingerprint recognition module, display device and preparation method thereof | |
| CN109405856A (en) | Optical sensor and forming method thereof | |
| CN101359054A (en) | Image detection device | |
| CN107153483B (en) | A kind of touch-control display module, display device and its driving method | |
| CN110245610A (en) | Show backboard and preparation method thereof and comprehensively screen fingerprint recognition display device | |
| CN105977268A (en) | Photosensitive device, display panel and display device | |
| CN207053646U (en) | A kind of multi-cam module and its substrate | |
| CN106331535A (en) | Image collection system | |
| CN105047674A (en) | Array substrate and fabrication method thereof, and display device | |
| TW201115740A (en) | Display device and thin film transistor array substrate and thin film transistor thereof | |
| WO2020118499A1 (en) | Optical sensor and forming method therefor | |
| CN105528598B (en) | Optical fingerprint sensor | |
| CN109782329B (en) | Flexible X-ray detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |