CN209963020U

CN209963020U - Optical retaining wall structure

Info

Publication number: CN209963020U
Application number: CN201920950088.1U
Authority: CN
Inventors: 李蕙如
Original assignee: Peiying Semiconductor Co Ltd
Current assignee: Peiying Semiconductor Co Ltd
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2020-01-17
Anticipated expiration: 2029-06-24

Abstract

The utility model provides an optical retaining wall structure, which comprises a substrate, a first retaining wall layer and a second retaining wall layer, wherein the substrate is provided with a working surface, the first retaining wall layer is formed on the working surface, and the first retaining wall layer encloses a first window with an exposed working surface; the second retaining wall layer is formed on the first retaining wall layer, the second retaining wall layer encloses a second window, the cross-sectional area of the second retaining wall layer is smaller than that of the first retaining wall layer, and the outline of the second window is larger than that of the first window.

Description

Optical retaining wall structure

Technical Field

The present invention relates to a structure of an optoelectronic mechanism, and more particularly, to a structure of a barrier wall formed on an optoelectronic mechanism.

Background

The existing optical sensor comprises a light-emitting unit and a photosensitive unit, and light emitted by the light-emitting unit can be received and output a sensing signal by the photosensitive unit after being reflected by a detected object. In order to prevent the light emitted from the light-emitting unit from being directly transmitted to the light-sensing unit, the conventional light sensor has a retaining wall disposed between the light-emitting unit and the light-sensing unit, so that the light-emitting unit only emits light in a predetermined direction and the light-sensing unit only senses light from the predetermined direction, thereby increasing the reliability of the light sensor.

Most of the retaining walls of the conventional optical sensor are formed by injection molding (injection molding), but the process has the following disadvantages: (1) the problem of glue overflow is easy to occur, thereby reducing the yield; (2) precision is easily affected by mold shift (mold shift) and miniaturization is disadvantageous; (3) the molds need to be made for different retaining wall models, thereby increasing the cost.

SUMMERY OF THE UTILITY MODEL

In view of the above, the main objective of the present invention is to provide an optoelectronic mechanism manufacturing process that can improve the precision and reduce the cost.

In order to achieve the above and other objects, the present invention provides an optical retaining wall structure, which includes a substrate, a first retaining wall layer and a second retaining wall layer, wherein the substrate has a working surface, the first retaining wall layer is formed on the working surface, and the first retaining wall layer encloses a first opening of the exposed working surface; the second retaining wall layer is formed on the first retaining wall layer, the second retaining wall layer encloses a second window, the cross-sectional area of the second retaining wall layer is smaller than that of the first retaining wall layer, and the outline of the second window is larger than that of the first window.

The retaining wall formed by the method has high precision, the processing cost is reduced, the degree of freedom of circuit design of the photoelectric mechanism is improved, and even if the windowing position or the shape is modified, the mould is not required to be remade or modified as the prior art. Moreover, the multi-layer baffle wall layer can have different profiles by a method of multiple photocuring and one-time etching, and the thickness of the whole baffle wall layer can be improved, so that the design freedom degree is greatly improved.

Other functions and embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 to 12 are schematic views illustrating a manufacturing method according to a first embodiment of the present invention;

fig. 13 is a schematic diagram illustrating another embodiment of the optical retaining wall structure of the present invention.

Description of the symbols

10 substrate 11 working surface

20 first retaining wall film 20A first retaining wall layer

21 first retaining wall region 22 first non-retaining wall region

30 first light shade 40 second wall blocking film

40A second wall layer 41 second wall area

42 second non-retaining wall region 50 second light shield

60-fenestration 601 first fenestration

602 second window 603 third window

70 photoelectric unit 80 colloid

90A third retaining wall layer

Detailed Description

The utility model relates to a method for once etch and form optics barricade with photocuring many times and optics barricade structure thereof, optics barricade structure can be applied to light emitting equipment, photosensitive equipment or have equipment of luminous and photosensitive function simultaneously, for example prior art light sensor, light sensor can be applied to but not limited to remote controller, side apart from the appearance.

One embodiment of a method for forming an optical barrier by multiple photocuring and one etching is described below with reference to fig. 1 to 12.

Referring to fig. 1, a substrate 10 is first provided, which has a working surface 11, and the substrate 10 may be a circuit board or a lead frame for an LED, for example, the substrate 10 has an insulating base material, such as epoxy resin, glass cloth (woven glass), polyester or other materials commonly used for manufacturing a substrate of a circuit board, and a circuit structure and electrical contacts formed on the insulating base material.

Next, referring to fig. 2, a photo-curable first retaining wall film 20 is laminated on the working surface 11 by using a laminator, wherein a dotted line shown in the drawing represents a boundary between a first retaining wall region 21 and a first non-retaining wall region 22 of the first retaining wall film 20, the first retaining wall region 21 is, for example, annular, and at least a portion of the first non-retaining wall region 22 is enclosed between the first retaining wall regions 21. In the state shown in fig. 1, the first retaining wall film 20 is not completely cured, and there is no substantial difference in the chemical structure between the first retaining wall region 21 and the first non-retaining wall region 22. The first barrier film 20 is, for example, preformed on a carrier film before being laminated on the working surface 11, and the carrier film is removed after the first barrier film 20 is laminated on the working surface 11, and the carrier film may be a polyethylene terephthalate (PET) or other polyester film, a polyimide film, a polyamide-imide film, a polypropylene film, or a polystyrene film. In a possible embodiment, the first barrier film 20 is black and absorbs most of the light.

As shown in fig. 3, a first mask 30 is formed on the first blocking wall film 20, and the first mask 30 covers the first non-blocking wall region 22 but exposes the first blocking wall region 21.

As shown in fig. 4, the first retaining wall film 20 is irradiated to crosslink and solidify the polymer in the first retaining wall region 21; the first non-retaining wall region 22 is not photo-cured because it is covered by the first photo-mask 30.

After curing is complete, first mask 30 is removed, as shown in FIG. 5.

Next, as shown in fig. 6, before the first barrier film 20 is etched, a photo-curable second barrier film 40 is laminated on the first barrier film 20 by using a laminator. Similar to the first retaining wall film 20, the second retaining wall film 40 also has a second retaining wall region 41 and a second non-retaining wall region 42, the second retaining wall region 41 is located on the first retaining wall region 21, and the cross-sectional area of the second retaining wall region 41 is not larger than that of the first retaining wall region 21, i.e., the profile of the second retaining wall region 41 is equal to or smaller than that of the first retaining wall region 21. Similarly, the second barrier film 40 is also formed in advance on a carrier film, which is removed after the second barrier film 40 is laminated on the first barrier film 20, for example, before the lamination on the second barrier film 20, and the carrier film may be polyethylene terephthalate (PET) or other polyester film, polyimide film, polyamideimide film, polypropylene film, polystyrene film. In a possible embodiment, the second barrier film 40 is also black and absorbs most of the light.

As shown in fig. 7, a second mask 50 is formed on the second barrier film 40, and the second mask 50 covers the second non-retaining wall region 42 but exposes the second retaining wall region 41.

As shown in fig. 8, the second barrier film 40 is irradiated to crosslink and cure the polymer in the second barrier region 41; the second non-retaining wall region 42 is covered by the second mask 50, and therefore, the photo-curing reaction is not performed.

After curing is complete, the second mask 50 is removed, as shown in FIG. 9.

Next, as shown in fig. 10, the uncured first and second non-retaining wall regions are removed by using the etching solution, the cured first and second

retaining wall regions

21 and 41 are remained, the remained first and second

retaining wall regions

21 and 41 are respectively used as the first and second

retaining wall layers

20A and 40A, the first retaining wall layer 20A encloses a first open window 601, the second retaining wall layer 40A encloses a second open window 602, and the combination of the first and second open windows 601 and 602 is an open window 60 that can expose the working surface 11. In this embodiment, the cross-sectional area of the second retaining wall layer 40A is smaller than that of the first retaining wall layer 20A, and the profile of the second opening window 602 is larger than that of the first opening window 601, so that the divergent opening window is helpful for the operation of the robot arm.

Next, as shown in fig. 11, the photoelectric units 70 are formed on the working surface 11 in the window 60, the number of the photoelectric units 70 can be determined according to the requirement, the photoelectric unit 70 is one of a light emitting unit and a light sensing unit, and the retaining wall formed by the combination of the first and second

retaining wall layers

20A, 40A is higher than the photoelectric unit 70 for blocking light. The optoelectronic element 70 may be electrically connected to circuit structures or electrical contacts on the substrate 10, for example, by wire bonding; in the case where the optoelectronic unit is a flip-chip LED or other suitable cases, the wire bonding step can be omitted. The light emitting unit is, for example, an LED, the light sensing unit is, for example, a CCD or a CMOS, the light emitting unit is configured to emit light, and the light sensing unit is configured to sense light, which may be visible light or invisible light, such as infrared light.

Next, as shown in fig. 12, a glue is dispensed in the window 60, and the dispensed glue 80 is a light-permeable glue, such as a transparent glue or a fluorescent glue, for protecting the photoelectric unit 70 and/or for emitting light with a preselected wavelength, that is, the manufactured optical retaining wall structure includes a substrate 10, a first retaining wall layer 20A having a first window 601, a second retaining wall layer 40A having a second window 602, a photoelectric unit 70 formed on the working surface 11 and located in the window 60, and a glue 80 formed in the window 60.

It should be noted that, the foregoing embodiment only exemplifies two blocking wall layers, and in other possible embodiments of the present invention, more blocking wall layers may be formed by a similar multi-photo-curing one-time etching method, for example, in the embodiment shown in fig. 13, the optical blocking wall structure manufactured has a substrate 10, a first blocking wall layer 20A having a first opening 601, a second blocking wall layer 40A having a second opening 602, a third blocking wall layer 90A having a third opening 603, a photoelectric unit 70 formed on the working surface 11 and located in the opening 60, and a colloid 80 formed in the opening 60.

In conclusion, the utility model discloses a method of etching once of many times photocuring can make multilayer retaining wall layer have different profile and thickness, also can promote the whole thickness on retaining wall layer, avoids because retaining wall layer too thick and the unable problem of photocuring once to can improve the design degree of freedom by a wide margin.

The above-described embodiments and/or implementations are merely illustrative of preferred embodiments and implementations for implementing the technology of the present invention, and are not intended to limit the implementations of the technology of the present invention in any way, and those skilled in the art can make modifications or changes without departing from the scope of the technology disclosed in the present invention.

Claims

1. An optical retaining wall structure, comprising:

a substrate having a working surface;

the first retaining wall layer is formed on the working surface, the first retaining wall layer encloses a first window, and the working surface is exposed in the first window; and

and the second retaining wall layer is formed on the first retaining wall layer, the second retaining wall layer encloses a second window, the cross sectional area of the second retaining wall layer is smaller than that of the first retaining wall layer, and the outline of the second window is larger than that of the first window.

2. The optical retaining wall structure of claim 1, further comprising at least one photoelectric unit formed on the working surface of the first and second windows.