CN209963083U

CN209963083U - Optical retaining wall structure

Info

Publication number: CN209963083U
Application number: CN201920950126.3U
Authority: CN
Inventors: 李蕙如
Original assignee: Peiying Semiconductor Co Ltd
Current assignee: Peiying Semiconductor Co Ltd
Priority date: 2019-06-24
Filing date: 2019-06-24
Publication date: 2020-01-17
Anticipated expiration: 2029-06-24

Abstract

The utility model provides an optical retaining wall structure, which comprises a substrate, a first retaining wall layer, a laser shielding copper layer and a second retaining wall layer, wherein the substrate is provided with a working surface, the first retaining wall layer is formed on the working surface, and the first retaining wall layer encloses a first window with an exposed working surface; the laser shielding copper layer is formed on the upper surface of the first blocking wall layer but not formed on the side wall of the first window; the second wall layer is formed on the laser shielding copper layer, the second wall layer encloses a second window, the cross-sectional area of the second wall layer is smaller than that of the first wall layer, the outline of the second window is larger than that of the first window, and the second window exposes a part of the laser shielding copper layer.

Description

Optical retaining wall structure

Technical Field

The present invention relates to a structure of an optoelectronic mechanism, and more particularly, to a structure of a barrier wall formed on an optoelectronic mechanism.

Background

The existing optical sensor comprises a light-emitting unit and a photosensitive unit, and light emitted by the light-emitting unit can be received and output a sensing signal by the photosensitive unit after being reflected by a detected object. In order to prevent the light emitted from the light-emitting unit from being directly transmitted to the light-sensing unit, the conventional light sensor has a retaining wall disposed between the light-emitting unit and the light-sensing unit, so that the light-emitting unit only emits light in a predetermined direction and the light-sensing unit only senses light from the predetermined direction, thereby increasing the reliability of the light sensor.

Most of the retaining walls of the conventional optical sensor are formed by injection molding (injection molding), but the process has the following disadvantages: (1) the problem of glue overflow is easy to occur, thereby reducing the yield; (2) precision is easily affected by mold shift (mold shift) and miniaturization is disadvantageous; (3) the molds need to be made for different retaining wall models, thereby increasing the cost.

SUMMERY OF THE UTILITY MODEL

In view of the above, the main objective of the present invention is to provide an optoelectronic mechanism manufacturing process that can improve the precision and reduce the cost.

In order to achieve the above and other objects, the present invention provides an optical retaining wall structure, which includes a substrate, a first retaining wall layer, a laser shielding copper layer and a second retaining wall layer, wherein the substrate has a working surface, the first retaining wall layer is formed on the working surface, and the first retaining wall layer encloses a first opening window exposing the working surface; the laser shielding copper layer is formed on the upper surface of the first blocking wall layer but not formed on the side wall of the first window; the second wall layer is formed on the laser shielding copper layer, the second wall layer encloses a second window, the cross-sectional area of the second wall layer is smaller than that of the first wall layer, the outline of the second window is larger than that of the first window, and the second window exposes a part of the laser shielding copper layer.

The retaining wall formed by the method has high precision, the processing cost is reduced, the degree of freedom of circuit design of the photoelectric mechanism is improved, and even if the windowing position or the shape is modified, the mould is not required to be remade or modified as the prior art. In addition, by forming the laser shielding copper layer between the barrier layers, the multiple barrier layers can have different profiles in one laser engraving operation, thereby greatly improving the degree of freedom of design.

Other functions and embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 to 12 are schematic views illustrating a manufacturing method according to a first embodiment of the present invention;

fig. 13 is a schematic diagram illustrating another embodiment of the optical retaining wall structure of the present invention.

Description of the symbols

10 substrate 11 working surface

20 first retaining wall film 20A first retaining wall layer

201 upper surface 21 first retaining wall area

22 first

non-bank regions

30, 35 laser-masked copper layers

31 photoresist layer 40 second barrier film

40A second wall layer 41 second wall area

42 second non-retaining wall area 50A third retaining wall layer

60-fenestration 601 first fenestration

602 second window 603 third window

70 photoelectric unit 80 colloid

Detailed Description

The utility model relates to a method for forming optics barricade with laser windowing and optics barricade structure thereof, optics barricade structure can be applied to light emitting equipment, photosensitive equipment or have equipment of luminous and photosensitive function simultaneously, for example prior art light sensor, light sensor can be applied to but not limited to remote controller, side apart from the appearance.

One embodiment of a method for forming an optical wall by laser windowing is described below with reference to fig. 1 to 12.

Referring to fig. 1, a substrate 10 is first provided, which has a working surface 11, and the substrate 10 may be a circuit board or a lead frame for an LED, for example, the substrate 10 has an insulating base material, such as epoxy resin, glass cloth (woven glass), polyester or other materials commonly used for manufacturing a substrate of a circuit board, and a circuit structure and electrical contacts formed on the insulating base material.

Next, referring to fig. 2, a photo-curable or thermal-curable first retaining wall film 20 is laminated on the working surface 11 by using a laminator, wherein a dotted line shows a boundary between a first retaining wall region 21 and a first non-retaining wall region 22 of the first retaining wall film 20, the first retaining wall region 21 is, for example, annular, and at least a portion of the first non-retaining wall region 22 is enclosed between the first retaining wall regions 21. In the state shown in fig. 1, the first retaining wall film 20 is not completely cured, and there is no substantial difference in the chemical structure between the first retaining wall region 21 and the first non-retaining wall region 22; after the first barrier film 20 is formed on the working surface 11, it may be further photo-cured or thermally cured. The first barrier film 20 is, for example, preformed on a carrier film before being laminated on the working surface 11, and the carrier film is removed after the first barrier film 20 is laminated on the working surface 11, and the carrier film may be a polyethylene terephthalate (PET) or other polyester film, a polyimide film, a polyamide-imide film, a polypropylene film, or a polystyrene film. In a possible embodiment, the first barrier film 20 is black and absorbs most of the light. In other possible embodiments, the first retaining wall film may also be formed by coating uncured retaining wall slurry on the work surface by screen printing or other coating means, followed by curing.

As shown in fig. 3, a laser shielding copper layer 30 is formed on the upper surface 201 of the first barrier film 20 by electroless plating, sputtering or other methods.

Then, as shown in fig. 4, a photoresist layer 31 is formed on the laser-shielding copper layer 30, and the photoresist layer 31 is selectively irradiated and exposed.

Then, as shown in fig. 5, the photoresist layer 31 is selectively removed from the first non-blocking region 22 by a developer to expose the underlying laser-shielding copper layer 30.

Then, as shown in fig. 6, the etching solution is used to selectively remove the portion of the laser-shielding copper layer 30 opposite to the first non-retaining wall region 22, exposing the underlying first retaining wall layer 20, especially exposing the underlying first non-retaining wall region 22.

As shown in fig. 7, the photoresist layer is removed.

As shown in fig. 8, before the first barrier film 20 is laser-engraved and after it has been previously cured, a photo-curable or thermally curable second barrier film 40 is formed on the first barrier film 20, wherein a portion of the second barrier film 40 is also covered with the laser shielding copper layer 30. Similar to the first retaining wall film 20, the second retaining wall film 40 also has a second retaining wall region 41 and a second non-retaining wall region 42, the second retaining wall region 41 is located above the first retaining wall region 21, and the cross-sectional area of the second retaining wall region 41 is not greater than that of the first retaining wall region 21, i.e., the profile of the second retaining wall region 41 is equal to or smaller than that of the first retaining wall region 21. Similarly, the second barrier film 40 that is not completely cured is also formed on a carrier film in advance before laminating on the second barrier film 20, for example, the second barrier film 40 is formed on the first barrier film 20 and then may be further photo-cured or heat-cured, and the carrier film may be removed after the second barrier film 40 is laminated on the first barrier film 20, and the carrier film may be a polyethylene terephthalate (PET) or other polyester film, a polyimide film, a polyamideimide film, a polypropylene film, a polystyrene film. In a possible embodiment, the second barrier film 40 is also black and absorbs most of the light. In other possible embodiments, the second retaining wall film may also be formed by applying uncured retaining wall slurry onto the first retaining wall film by screen printing or other coating methods, followed by curing.

As shown in fig. 9, the laser beam is emitted by the laser engraving machine to selectively remove the first and

second non-bank areas

22 and 42, wherein a portion of the laser beam penetrates the second non-bank area 42 but cannot go deep any more because it is shielded by the laser shielding copper layer 30, so that the first bank area 21 under the laser shielding copper layer 30 is retained to form the state shown in fig. 10, the retained first and

second bank areas

21 and 41 are respectively used as the first and

second bank layers

20A and 40A, the first bank layer 20A encloses a first open window 601, the second bank layer 40A encloses a second open window 602, and the combination of the first and second

open windows

601 and 602 is an open window 60 that can expose the working surface 11. In this embodiment, the cross-sectional area of the second retaining wall layer 40A is smaller than that of the first retaining wall layer 20A, and the profile of the second opening window 602 is larger than that of the first opening window 601, so that the divergent opening window is helpful for the operation of a robot arm or other mechanisms.

Next, as shown in fig. 11, the optoelectronic units 70 are formed on the working surface 11 in the window 60, the number of the optoelectronic units 70 can be determined according to the requirement, the optoelectronic unit 70 is one of a light emitting unit and a light sensing unit, and the retaining wall formed by the combination of the first and second

retaining wall layers

20A and 40A and the laser shielding copper layer 30 is higher than the optoelectronic unit 70 for blocking light. The optoelectronic element 70 may be electrically connected to circuit structures or electrical contacts on the substrate 10, for example, by wire bonding; in the case where the optoelectronic unit is a flip-chip LED or other suitable cases, the wire bonding step can be omitted. The light emitting unit is, for example, an LED, the light sensing unit is, for example, a CCD or a CMOS, the light emitting unit is configured to emit light, and the light sensing unit is configured to sense light, which may be visible light or invisible light, such as infrared light.

Next, as shown in fig. 12, a glue is dispensed in the window 60, and the dispensed glue 80 is a light-permeable glue, such as a transparent glue or a fluorescent glue, for protecting the photoelectric unit 70 and/or for emitting light with a preselected wavelength, that is, the manufactured optical retaining wall structure includes a substrate 10, a first retaining wall layer 20A having a first window 601, a laser shielding copper layer 30 formed on the upper surface of the first retaining wall layer 20A but not formed on the sidewall enclosing the first window 601, a second retaining wall layer 40A having a second window 602, a photoelectric unit 70 formed on the working surface 11 and located in the window 60, and a glue 80 formed in the window 60.

It should be noted that the foregoing embodiments have been described only with reference to two retaining wall layers, and in other possible embodiments of the present invention, more retaining wall layers can be formed by a similar multilayer stacking method, for example, in the embodiment shown in fig. 13, the manufactured optical retaining wall structure includes a substrate 10, a first retaining wall layer 20A having a first opening 601, a laser shielding copper layer 30 formed on the upper surface of the first retaining wall layer 20A but not formed on the sidewall enclosing the first opening 601, a second retaining wall layer 40A having a second opening 602, a laser shielding copper layer 35 formed on the upper surface of the second retaining wall layer 40A but not formed on the sidewall enclosing the second opening 602, a third retaining wall layer 50A having a third opening 603, an optoelectronic unit 70 formed on the working surface 11 and located in the opening 60, and a sealant 80 formed in the opening 60.

In summary, by forming the laser shielding copper layer between the barrier layers, the multiple barrier layers can have different profiles in one laser engraving operation, thereby greatly improving the degree of freedom in design.

In other possible embodiments, the laser intensity of the central region and the peripheral region of the laser beam can be adjusted to make the central region of the laser beam have a stronger penetration capability, so that a stepped or divergent window can be formed without providing a laser shielding copper layer.

The above-described embodiments and/or implementations are merely illustrative of preferred embodiments and implementations for implementing the technology of the present invention, and are not intended to limit the implementations of the technology of the present invention in any way, and those skilled in the art can make modifications or changes without departing from the scope of the technology disclosed in the present invention.

Claims

1. An optical retaining wall structure, comprising:

a substrate having a working surface;

the first retaining wall layer is formed on the working surface, the first retaining wall layer encloses a first window, and the working surface is exposed in the first window;

a laser shielding copper layer formed on an upper surface of the first barrier layer but not formed on the sidewall surrounding the first window; and

and the second wall layer is formed on the laser shielding copper layer, the second wall layer encloses a second window, the cross sectional area of the second wall layer is smaller than that of the first wall layer, the outline of the second window is larger than that of the first window, and the second window exposes one part of the laser shielding copper layer.

2. The optical retaining wall structure of claim 1, further comprising at least one photoelectric unit formed on the working surface of the first and second windows.