CN219286421U - Packaging structure of optical sensor and sensor - Google Patents
Packaging structure of optical sensor and sensor Download PDFInfo
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- CN219286421U CN219286421U CN202320134907.1U CN202320134907U CN219286421U CN 219286421 U CN219286421 U CN 219286421U CN 202320134907 U CN202320134907 U CN 202320134907U CN 219286421 U CN219286421 U CN 219286421U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model relates to the technical field of packaging, and discloses a packaging structure of an optical sensor and the sensor, comprising: the transparent packaging cover is provided with a transparent lens integrally formed with the transparent packaging cover, an aperture is arranged right below the transparent lens, and a shading grid is arranged in the transparent packaging cover; when the transparent packaging cover is buckled on the photosensitive chip and the light-emitting chip of the optical sensor for packaging, the aperture is positioned right above the photosensitive chip, and the photosensitive chip and the light-emitting chip are separated by the light-shielding grid; the package structure of the optical sensor may further include a filter layer and a second lens; the sensor comprises a packaging structure of the optical sensor, a light emitting chip, a substrate and a photosensitive chip. The utility model can improve the photosensitivity of the photosensitive chip on the basis of protecting the components in the sensor.
Description
Technical Field
The utility model relates to the technical field of packaging, in particular to a packaging structure of an optical sensor and the sensor.
Background
The optical sensor is a sensor for realizing measurement according to an optical principle, the light sensing module receives the intensity of reflected light, and the corresponding processing command is executed through the light intensity change processing chip. The integrated light sensing module and the processing chip are light sensing chips, the light sensing chips are packaged by adopting a transparent molding packaging scheme in the prior art, and the packaging structure is formed at one time.
The optical sensor is provided with a light emitting chip, light emitted by the light emitting chip is incident to a detection object, and light reflected by the detection object is received by the photosensitive chip, so that the photosensitive detection effect is realized. The transparent packaging structure packaged on the upper surface of the photosensitive chip is completely transparent without an integrated aperture, which can cause stray light to easily enter the photosensitive chip and interfere with the photosensitive effect of the photosensitive chip.
Disclosure of Invention
Therefore, the utility model aims to overcome the defects in the prior art, and provides a packaging structure of an optical sensor and the sensor, which can improve the photosensitivity of a photosensitive chip on the basis of protecting components in the sensor.
In order to solve the above technical problems, the present utility model provides a packaging structure of an optical sensor, including:
the transparent packaging cover is provided with a transparent lens integrally formed with the transparent packaging cover, an aperture is arranged right below the transparent lens, and a shading grid is arranged in the transparent packaging cover;
when the transparent packaging cover is buckled on the photosensitive chip and the light-emitting chip of the optical sensor for packaging, the aperture is positioned right above the photosensitive chip, and the light shielding grid keeps apart the photosensitive chip and the light-emitting chip.
In one embodiment of the utility model, the aperture is integrated in a transparent plate.
In one embodiment of the utility model, when the transparent packaging cover is buckled on the photosensitive chip and the light emitting chip of the optical sensor for packaging, the transparent plate is fixed on the photosensitive chip.
In one embodiment of the present utility model, one end of the light shielding barrier is fixed on the transparent encapsulation cover.
In one embodiment of the present utility model, the optical filter further comprises a filter layer, wherein the filter layer is disposed between the transparent lens and the aperture.
In one embodiment of the present utility model, the lens further comprises a second lens, and the second lens is disposed between the transparent lens and the aperture.
In one embodiment of the utility model, the refractive index of the second lens and the refractive index of the transparent lens are different.
In one embodiment of the present utility model, the optical filter further comprises a second lens disposed between the transparent lens and the optical filter layer.
The utility model also provides an optical sensor, which comprises the packaging structure of the optical sensor, a light-emitting chip, a substrate and a photosensitive chip,
the light emitting chip and the photosensitive chip are fixed on the substrate and are electrically connected with the substrate, and the transparent packaging cover is matched with the substrate to realize packaging of the photosensitive chip and the light emitting chip; when the transparent packaging cover is buckled on the substrate, the light emitting chip and the light sensing chip are positioned between the transparent packaging cover and the substrate, and two ends of the light shielding grid are respectively fixed on the transparent packaging cover and the substrate.
In one embodiment of the utility model, the optical sensor comprises at least one of the light emitting chips, the light emitting chips being uniformly distributed around the photosensitive chip.
Compared with the prior art, the technical scheme of the utility model has the following advantages:
according to the utility model, the aperture and the shading grid are arranged in the transparent packaging cover, stray light is prevented from entering the photosensitive chip through the aperture, light emitted by the light emitting chip is prevented from affecting the photosensitive chip through the shading grid, and the photosensitivity of the photosensitive chip is improved on the basis that the transparent packaging cover protects components in the sensor.
Drawings
In order that the utility model may be more readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, in which:
figure 1 is a front view of a first embodiment of the utility model,
figure 2 is a front view of a second embodiment of the utility model,
figure 3 is a front view of a third embodiment of the utility model,
figure 4 is a front view of a fourth embodiment of the utility model,
figure 5 is a front view of a sensor using the present utility model,
fig. 6 is a top view of a sensor using the present utility model.
Description of the specification reference numerals: 1. a transparent encapsulation cover; 2. a transparent lens; 3. an aperture; 4. a shading grid; 5. a photosensitive chip; 6. a light emitting chip; 7. a transparent plate; 8. a filter layer; 9. a second lens; 10. a substrate; 11. gold wire.
Detailed Description
The present utility model will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the utility model and practice it.
Example 1
As shown in fig. 1, the utility model discloses a packaging structure of an optical sensor, which comprises a transparent packaging cover 1, wherein a transparent lens 2 integrally formed with the transparent packaging cover 1 is arranged on the transparent packaging cover 1, an aperture 3 is arranged right below the transparent lens 2, and a shading grid 4 is arranged in the transparent packaging cover 1; when the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light-emitting chip 6 of the optical sensor for packaging, the aperture 3 is positioned right above the photosensitive chip 5, and the light-shielding grid 4 separates the photosensitive chip 5 from the light-emitting chip 6. One end of the light shielding screen 4 is fixed on the transparent packaging cover 1.
In this embodiment, a transparent plate 7 is further included, and the diaphragm 3 is integrated on the transparent plate 7. The surface of the photosensitive chip 5 is provided with a transparent plate 7, and the aperture 3 is integrated on the transparent plate 7, so that stray light can be prevented from entering the photosensitive chip 5, and the photosensitivity of the photosensitive chip 5 is effectively improved. When the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light emitting chip 6 of the optical sensor to package, the transparent plate 7 is fixed on the photosensitive chip 5, and in this embodiment, the transparent plate 7 can be fixed on the photosensitive chip 5 through an adhesive. The transparent plate 7 and the transparent package cover 1 may be made of a transparent material such as glass, and the transparent plate 7 and the transparent package cover 1 may be made of the same material or different materials.
Example two
As shown in fig. 2, the utility model discloses a packaging structure of an optical sensor, which comprises a transparent packaging cover 1, wherein a transparent lens 2 integrally formed with the transparent packaging cover 1 is arranged on the transparent packaging cover 1, an aperture 3 is arranged right below the transparent lens 2, and a shading grid 4 is arranged in the transparent packaging cover 1; when the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light-emitting chip 6 of the optical sensor for packaging, the aperture 3 is positioned right above the photosensitive chip 5, and the light-shielding grid 4 separates the photosensitive chip 5 from the light-emitting chip 6. One end of the light shielding screen 4 is fixed on the transparent packaging cover 1.
In this embodiment, a transparent plate 7 is further included, and the diaphragm 3 is integrated on the transparent plate 7. The surface of the photosensitive chip 5 is provided with a transparent plate 7, and the aperture 3 is integrated on the transparent plate 7, so that stray light can be prevented from entering the photosensitive chip 5, and the photosensitivity of the photosensitive chip 5 is effectively improved. When the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light emitting chip 6 of the optical sensor to package, the transparent plate 7 is fixed on the photosensitive chip 5, and in this embodiment, the transparent plate 7 can be fixed on the photosensitive chip 5 through an adhesive. The transparent plate 7 and the transparent package cover 1 may be made of a transparent material such as glass, and the transparent plate 7 and the transparent package cover 1 may be made of the same material or different materials.
In this embodiment, the optical filter layer 8 is further included, and the optical filter layer 8 is disposed between the transparent lens 2 and the aperture 3. The filter layer 8 can realize selective passing of different light rays and improve the photosensitivity of the photosensitive chip 5. The filter layer 8 may also be integrated on the transparent plate 7.
Example III
As shown in fig. 3, the utility model discloses a packaging structure of an optical sensor, which comprises a transparent packaging cover 1, wherein a transparent lens 2 integrally formed with the transparent packaging cover 1 is arranged on the transparent packaging cover 1, an aperture 3 is arranged right below the transparent lens 2, and a shading grid 4 is arranged in the transparent packaging cover 1; when the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light-emitting chip 6 of the optical sensor for packaging, the aperture 3 is positioned right above the photosensitive chip 5, and the light-shielding grid 4 separates the photosensitive chip 5 from the light-emitting chip 6. One end of the light shielding screen 4 is fixed on the transparent packaging cover 1.
In this embodiment, a transparent plate 7 is further included, and the diaphragm 3 is integrated on the transparent plate 7. The surface of the photosensitive chip 5 is provided with a transparent plate 7, and the aperture 3 is integrated on the transparent plate 7, so that stray light can be prevented from entering the photosensitive chip 5, and the photosensitivity of the photosensitive chip 5 is effectively improved. When the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light emitting chip 6 of the optical sensor to package, the transparent plate 7 is fixed on the photosensitive chip 5, and in this embodiment, the transparent plate 7 can be fixed on the photosensitive chip 5 through an adhesive. The transparent plate 7 and the transparent package cover 1 may be made of a transparent material such as glass, and the transparent plate 7 and the transparent package cover 1 may be made of the same material or different materials.
In this embodiment, the lens further includes a second lens 9, and the second lens 9 is disposed between the transparent lens 2 and the aperture 3. The refractive index of the second lens 9 is different from the refractive index of the transparent lens 2. The combination of the two lenses can improve the optical performance of the photosensitive chip 5.
Example IV
As shown in fig. 4, the utility model discloses a packaging structure of an optical sensor, which comprises a transparent packaging cover 1, wherein a transparent lens 2 integrally formed with the transparent packaging cover 1 is arranged on the transparent packaging cover 1, an aperture 3 is arranged right below the transparent lens 2, and a shading grid 4 is arranged in the transparent packaging cover 1; when the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light-emitting chip 6 of the optical sensor for packaging, the aperture 3 is positioned right above the photosensitive chip 5, and the light-shielding grid 4 separates the photosensitive chip 5 from the light-emitting chip 6. One end of the light shielding screen 4 is fixed on the transparent packaging cover 1.
In this embodiment, a transparent plate 7 is further included, and the diaphragm 3 is integrated on the transparent plate 7. The surface of the photosensitive chip 5 is provided with a transparent plate 7, and the aperture 3 is integrated on the transparent plate 7, so that stray light can be prevented from entering the photosensitive chip 5, and the photosensitivity of the photosensitive chip 5 is effectively improved. When the transparent packaging cover 1 is buckled on the photosensitive chip 5 and the light emitting chip 6 of the optical sensor to package, the transparent plate 7 is fixed on the photosensitive chip 5, and in this embodiment, the transparent plate 7 can be fixed on the photosensitive chip 5 through an adhesive. The transparent plate 7 and the transparent package cover 1 may be made of a transparent material such as glass, and the transparent plate 7 and the transparent package cover 1 may be made of the same material or different materials.
In this embodiment, the optical filter layer 8 is further included, and the optical filter layer 8 is disposed between the transparent lens 2 and the aperture 3. The filter layer 8 can realize selective passing of different light rays and improve the photosensitivity of the photosensitive chip 5. The filter layer 8 may also be integrated on the transparent plate 7.
In this embodiment, the optical filter further includes a second lens 9, where the second lens 9 is disposed between the transparent lens 2 and the optical filter layer 8. The refractive index of the second lens 9 is different from the refractive index of the transparent lens 2. The second lens 9 is added on the basis of the filter layer 8, so that the optical performance of the photosensitive chip 5 can be further improved.
Example five
As shown in fig. 5 to 6, the present utility model discloses a further optical sensor including the package structure of any one of the optical sensors in the foregoing embodiments, the light emitting chip 6, the substrate 10, and the light sensing chip 5. The light emitting chip 6 and the photosensitive chip 5 are fixed on the substrate 10 and electrically connected with the substrate 10, the light emitting chip 6 and the photosensitive chip 5 are fixed on the substrate 10 by an adhesive and electrically connected with the substrate 10 by gold wires 11, and the adhesive can be silver paste or SMT patch. After the transparent plate 7 is fixed on the photosensitive chip 5 through an adhesive, the transparent packaging cover 1 is matched with the substrate 10 through a plastic packaging process to realize packaging of the photosensitive chip 5 and the light-emitting chip 6.
When the transparent packaging cover 1 is buckled on the substrate 10, the light emitting chip 6 and the photosensitive chip 5 are positioned between the transparent packaging cover 1 and the substrate 10, and two ends of the light shielding grid 4 are respectively adhered and fixed on the transparent packaging cover 1 and the substrate 10. The transparent packaging cover 1 is used for protecting the light emitting chip 6 and the photosensitive chip 5, and the shading screen 4 is used for shading light and preventing light emitted by the light emitting chip 6 from affecting the photosensitive chip 5.
The optical sensor comprises at least one light emitting chip 6, the light emitting chip 6 is an LED or VCSEL, and the light emitting chip 6 is uniformly distributed around the photosensitive chip 5. In this embodiment, the number of the light emitting chips 6 is two, the number of the light emitting chips 6 may be one, three, four, etc., and the number of the light emitting chips 6 is set according to actual requirements, and the light shielding barrier 4 and the photosensitive chip 5 are spaced apart.
The utility model has the following advantages:
(1) The aperture and the shading grid are arranged in the transparent packaging cover, stray light is prevented from entering the photosensitive chip through the aperture, light emitted by the light emitting chip is prevented from affecting the photosensitive chip through the shading grid, and the photosensitivity of the photosensitive chip is improved on the basis that components in the sensor are protected by the transparent packaging cover. The utility model has simple structure and strong protection reliability of the sensor, and can be widely applied to the fields of rotating shaft sensing structures for heart rate blood oxygen detection, rotating shaft sensing structures of intelligent watches, roller sensing structures of mice and the like.
(2) On the basis of setting the aperture and the shading grid, the filter layer is further arranged, so that the selective passing of different light rays can be realized, and the photosensitivity of the photosensitive chip is improved.
(3) On the basis of setting the aperture and the shading screen, a lens is further additionally arranged, and the optical performance of the photosensitive chip can be improved by combining two lenses with different refractive indexes.
(4) On the basis of the filter layer with the aperture, the shading grid and the shielding grid, a lens is further additionally arranged, so that the photosensitivity of the photosensitive chip can be improved through the filter layer, and the optical performance of the photosensitive chip can be improved through the lens.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present utility model will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present utility model.
Claims (10)
1. An optical sensor's packaging structure, characterized by: comprising the following steps:
the transparent packaging cover is provided with a transparent lens integrally formed with the transparent packaging cover, an aperture is arranged right below the transparent lens, and a shading grid is arranged in the transparent packaging cover;
when the transparent packaging cover is buckled on the photosensitive chip and the light-emitting chip of the optical sensor for packaging, the aperture is positioned right above the photosensitive chip, and the light shielding grid keeps apart the photosensitive chip and the light-emitting chip.
2. The package structure of an optical sensor according to claim 1, wherein: the aperture is integrated on the transparent plate.
3. The package structure of an optical sensor according to claim 2, wherein: when the transparent packaging cover is buckled on the photosensitive chip and the light-emitting chip of the optical sensor for packaging, the transparent plate is fixed on the photosensitive chip.
4. The package structure of an optical sensor according to claim 1, wherein: one end of the shading screen is fixed on the transparent packaging cover.
5. The package structure of an optical sensor according to any one of claims 1 to 4, wherein: the optical filter layer is arranged between the transparent lens and the aperture.
6. The package structure of an optical sensor according to any one of claims 1 to 4, wherein: the lens system further comprises a second lens, wherein the second lens is arranged between the transparent lens and the aperture.
7. The package structure of an optical sensor according to claim 6, wherein: the refractive index of the second lens is different from the refractive index of the transparent lens.
8. The package structure of an optical sensor according to claim 5, wherein: the optical filter further comprises a second lens, wherein the second lens is arranged between the transparent lens and the optical filter layer.
9. An optical sensor, characterized in that: packaging structure comprising the optical sensor according to any one of claims 1 to 8, a light emitting chip, a substrate and a light sensing chip,
the light emitting chip and the photosensitive chip are fixed on the substrate and are electrically connected with the substrate, and the transparent packaging cover is matched with the substrate to realize packaging of the photosensitive chip and the light emitting chip;
when the transparent packaging cover is buckled on the substrate, the light emitting chip and the light sensing chip are positioned between the transparent packaging cover and the substrate, and two ends of the light shielding grid are respectively fixed on the transparent packaging cover and the substrate.
10. The optical sensor of claim 9, wherein: the optical sensor comprises at least one light emitting chip, and the light emitting chips are uniformly distributed around the photosensitive chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320134907.1U CN219286421U (en) | 2023-01-17 | 2023-01-17 | Packaging structure of optical sensor and sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320134907.1U CN219286421U (en) | 2023-01-17 | 2023-01-17 | Packaging structure of optical sensor and sensor |
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| CN219286421U true CN219286421U (en) | 2023-06-30 |
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| CN202320134907.1U Active CN219286421U (en) | 2023-01-17 | 2023-01-17 | Packaging structure of optical sensor and sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117673062A (en) * | 2023-12-01 | 2024-03-08 | 讯芯电子科技（中山）有限公司 | Light shielding packaging structure and packaging method of light sensor |
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2023
- 2023-01-17 CN CN202320134907.1U patent/CN219286421U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117673062A (en) * | 2023-12-01 | 2024-03-08 | 讯芯电子科技（中山）有限公司 | Light shielding packaging structure and packaging method of light sensor |
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