CN219476685U - Semiconductor package - Google Patents
Semiconductor package Download PDFInfo
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- CN219476685U CN219476685U CN202222685341.XU CN202222685341U CN219476685U CN 219476685 U CN219476685 U CN 219476685U CN 202222685341 U CN202222685341 U CN 202222685341U CN 219476685 U CN219476685 U CN 219476685U
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Abstract
Embodiments of the present application provide a semiconductor package including: a carrier; a light emitting member and a light receiving member arranged side by side on the carrier; and a filter layer coating the light emitting member and the light receiving member, the filter layer including a light-transmitting body and dye particles dispersed in the body. The present utility model provides a semiconductor package for reducing the size of a product based on reducing noise interference of a light receiving end.
Description
Technical Field
Embodiments of the present application relate to a semiconductor package.
Background
With the rise of wearable devices, mobile communication devices and micro-sensors with smart communication connection functions (e.g. bluetooth, wiFi), in addition to the higher and higher demands of various Bio-detection and sensing devices, the Bio-sensors (Bio sensor) are integrated into a single system-in-package (System In a Package, SIP) to meet the market demand. As shown in FIG. 1, a light-tight dam (Opaque dam) 10 is used to enclose and isolate a light-emitting diode (LED) 12 (light-emitting end) and a Photodiode (PD) 14 (receiving end), then a light-transmitting silica gel 16 is filled, the LED 12 emits a light source, and the light source is reflected back to the PD 14 after reaching a measured object, so that measurement abnormality is easily caused by interference of external noise 20, although an optical film 18 can be coated on the surface to filter light with an unnecessary wavelength (i.e. noise 20), the light-transmitting silica gel 16 is easily affected by high temperature to deteriorate due to the fact that the optical film 18 is coated on the light-transmitting silica gel 16 by adopting a high-temperature process such as evaporation or sputtering, the material type is limited, the material cost is high, and the cost of Units Per Hour is reduced and increased due to one more process.
The prior art TWM405514U discloses that a phosphor material, which may comprise a mixture of a silica gel (silica gel) and an epoxy resin (epoxy resin), may comprise a plurality of phosphor particles (e.g., yellow phosphor particles) may change the color temperature. The prior art TW397260U discloses that the encapsulant (such as epoxy or silica gel) contains a wavelength conversion material for converting the wavelength of the light emitting chip into other wavelengths, a filtering material for absorbing part of the light emitting wavelength (which may be a phosphor, a fluorescent dye, a fluorescent material or a material with the same effect), and a filtering material for absorbing part of the light emitting wavelength, so as to convert the light emitting wavelength of the light emitting chip and emit different wavelength of color light. That is, the prior art only discloses that the color temperature or wavelength of the light emitting end is changed by using a dye, and the problem that the receiving end is interfered by the noise 20 cannot be solved.
Disclosure of Invention
In view of the problems in the related art, an object of the present utility model is to provide a semiconductor package that reduces the size of the product while reducing the noise interference of the light receiving end.
To achieve the above object, embodiments of the present application provide a semiconductor package including: a carrier; a light emitting member and a light receiving member arranged side by side on the carrier; and a filter layer coating the light emitting member and the light receiving member, the filter layer being for filtering light reaching the light receiving member from the outside.
In some embodiments, the semiconductor package further comprises: the first light blocking body is arranged on the carrier and positioned between the light emitting piece and the light receiving piece, and is used for blocking light emitted by the light emitting piece from directly reaching the light receiving piece through the filter layer.
In some embodiments, the first light blocker divides the filter layer into a first light-transmitting portion covering the light emitting member and a second light-transmitting portion covering the light receiving member.
In some embodiments, the second light-transmitting portion is for filtering light reaching the light-receiving member from the outside.
In some embodiments, the material of the first light-transmitting portion and the second light-transmitting portion is the same.
In some embodiments, the first light-transmitting portion is configured to enhance the light-emitting efficiency of the light-emitting member.
In some embodiments, the first light blocking body has a first end contacting the carrier and a second end opposite the first end, the first end having a lateral dimension greater than a lateral dimension of the second end.
In some embodiments, the filter layer covers at least a portion of the top surface of the first light blocker.
In some embodiments, the semiconductor package further comprises: the second light-blocking body is arranged on the carrier and surrounds the filter layer and the first light-blocking body, and the first light-blocking body and the second light-blocking body completely surround the side walls of the first light-blocking body and the second light-blocking body.
In some embodiments, the first light blocker contacts the second light blocker, and the first light blocker and the second light blocker completely separate the first light transmitting portion and the second light transmitting portion.
Drawings
Fig. 1 shows a schematic view of a prior art semiconductor package.
Fig. 2 is a top view of a semiconductor package according to an embodiment of the present application, and fig. 3 and 4 are cross-sectional views of different embodiments taken along line A-A of fig. 2.
Detailed Description
For a better understanding of the spirit of embodiments of the present application, reference is made to the following description of some preferred embodiments of the present application.
Embodiments of the present application will be described in detail below. Throughout the specification, identical or similar components and components having identical or similar functions are denoted by similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are used to provide a basic understanding of the present application. The examples of the present application should not be construed as limiting the present application.
As used herein, the terms "substantially," "substantially," and "about" are used to describe and illustrate minor variations. When used in connection with an event or circumstance, the terms can refer to instances where the event or circumstance occurs precisely and instances where it occurs to the close approximation.
In this specification, unless specified or limited otherwise, relative terms such as: the terms "central," "longitudinal," "lateral," "front," "rear," "right," "left," "interior," "exterior," "lower," "upper," "horizontal," "vertical," "above," "below," "upper," "lower," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the directions as described in the discussion or as illustrated in the drawings. These relative terms are for convenience of description only and do not require that the present application be constructed or operated in a particular orientation.
For ease of description, "first," "second," "third," etc. may be used herein to distinguish between different components of a figure or series of figures. The terms "first," "second," "third," and the like are not intended to describe corresponding components.
Referring to fig. 2-4, fig. 2 is a top view, fig. 3 and 4 are cross-sectional views of various embodiments taken along line A-A of fig. 2, embodiments of the present application provide a semiconductor package 100 comprising: a carrier 30; the light emitting member 32 and the light receiving member 34 are arranged side by side on the carrier 30; and a filter layer 40 covering the light emitting member 32 and the light receiving member 34, the filter layer 40 including a light-transmitting body 42 and dye particles 44 dispersed in the body 42, the body 42 protecting the light emitting member 32 and the light receiving member 34. In some embodiments, the filter layer 40 of the present application uses materials disclosed in prior art TW 397260U. The embodiment of the application not only uses the filter layer 40 on the light emitting element 32, but also uses the filter layer 40 on the light receiving element 34, and the filter layer 40 is used for filtering the light reaching the light receiving element 34 from the outside.
In addition, since the optical film 18 as in the prior art fig. 1 is not required, high temperature processes such as vapor deposition or sputtering are avoided when the optical film 18 is formed, damage to the filter layer 40 is avoided, the filter layer 40 is not required to be limited to a high temperature resistant material, and the material has high elasticity in material selection and low material cost.
In some embodiments, the semiconductor package 100 further includes: the first light blocking body 50 is disposed on the carrier 30 and located between the light emitting element 32 and the light receiving element 34, and the first light blocking body 50 is used for blocking the light emitted by the light emitting element 32 from reaching the object to be tested, but directly reaching the light receiving element 34 through the filter layer 40.
In some embodiments, the first light blocker 50 divides the filter layer 40 into a first light-transmitting portion 402 covering the light emitting member 32 and a second light-transmitting portion 404 covering the light receiving member 34.
In some embodiments, the dye particles 44 are disposed in the second transparent portion 404, not disposed in the first transparent portion 402, i.e. disposed on one side of the light receiving element 34, so as to filter the light reaching the light receiving element 34 from the outside, and remove noise in the environment, so that the light receiving element 34 receives a purer signal, for example, only the light (for example, 500-600 nm) with the wavelength of detecting the blood oxygen concentration can penetrate the body 42 to reach the light receiving element 34, thereby improving the accuracy and reliability of measurement.
In some embodiments, the dye particles 44 are also located in the first light-transmitting portion 402, that is, the material in the first light-transmitting portion 402 and the second light-transmitting portion 404 are the same, and the first light-transmitting portion 402 and the second light-transmitting portion 404 may be formed in the same process, saving the forming process.
In some embodiments, the dye particles 44 include fluorescent dye particles dispersed in the first light-transmissive portion 402 and the second light-transmissive portion 404.
In some embodiments, the dye particles 44 may also include non-fluorescent dye (e.g. methyl blue, methyl violet, etc.) particles, and different dyes may be doped according to the application requirements, and after the non-fluorescent dye particles and the fluorescent dye particles are mixed into the liquid silica gel, the wavelength of the light emitted by the light emitting element 32 is changed after passing through the filter layer 40. For example, the non-fluorescent dye particles include red dye particles, and the light emitted from the light emitting element 32 is converted into red light (wavelength of 620 to 750nm, frequency of 400 to 484 THz) through the filter layer 40; the non-fluorescent dye particles include violet dye particles, and the light emitted from the light emitting element 32 passes through the filter layer 40 and is converted into violet light (wavelength 380-450nm, frequency 668-789 THz); the non-fluorescent dye particles include blue dye particles, and the light emitted from the light emitting element 32 is converted into blue light (wavelength of 450-495nm, frequency of 608-668 THz) through the filter layer 40; the non-fluorescent dye particles include green dye particles, and the light emitted from the light emitting element 32 is converted into green light (wavelength: 495-570nm, frequency: 526-606 THz) through the filter layer 40; the non-fluorescent dye particles include yellow dye particles, and the light emitted from the light emitting element 32 is converted into yellow light (wavelength of 570-590nm, frequency of 508-526 THz) after passing through the filter layer 40; the non-fluorescent dye particles include orange dye particles, and the light emitted from the light emitting element 32 is converted into orange light (wavelength of 590-620nm, frequency of 484-508 THz) after passing through the filter layer 40. Therefore, the doping amounts of the non-fluorescent dye particles and the fluorescent dye particles can be adjusted according to different color spectrum requirements, the elasticity of adjusting the color light is far greater than that of the optical film 18 in the prior art fig. 1, and the color light is easy to adjust compared with the optical film 18 in the prior art. Further, it is possible to configure such that the light passing through the filter layer 40 is converted into light of a wavelength (for example, a wavelength of 500 to 600 nm) that can be used as an optical signal of a biosensor (for example, for detecting blood oxygen concentration).
The fluorescent dye particles can improve the luminous efficiency of the light emitting elements 32, reduce the number of the required light emitting elements 32, improve the productivity of the product, reduce the cost, and achieve the purpose of making the product light, thin and small.
In some embodiments, the fluorescent dye particles are located in the first light-transmitting portion 402.
In some embodiments, the fluorescent dye particles are also located in the second light-transmitting portion 404.
In some embodiments, as shown in fig. 4, the first light blocker 50 has a first end 501 contacting the carrier 30 and a second end 502 opposite the first end 501, the first end 501 having a lateral dimension greater than the lateral dimension of the second end 502.
In some embodiments, not shown in fig. 3 and 4, the filter layer 40 covers at least a portion of the top surface of the first light blocker 50.
In some embodiments, the semiconductor package 100 further includes: the second light blocker 52 is disposed on the carrier 30 and surrounds the filter layer 40 and the first light blocker 50, and the first light blocker 50 and the second light blocker 52 completely surround the sidewalls of the filter layer 40. In some embodiments, the top surfaces of first light blocker 50, second light blocker 52, and filter layer 40 are coplanar. In some embodiments, not shown in fig. 3 and 4, the filter layer 40 covers at least a portion of the top surface of the second light blocker 52.
In some embodiments, the first light blocker 50 contacts the second light blocker 52, and the first light blocker 50 and the second light blocker 52 completely separate the first light transmitting portion 402 and the second light transmitting portion 404.
Referring to fig. 2, in some embodiments, in a top view, the first light blocking body 50 and the second light blocking body 52 together form a solar structure, the second light blocking body 52 forms a peripheral structure of the solar structure, and the first light blocking body 50 forms a lateral structure of an interior of the solar structure.
In some embodiments, carrier 30 is a flexible circuit board (FPC).
In some embodiments, the light emitting member 32 is a Light Emitting Diode (LED).
In some embodiments, the light receiver 34 is a Biosensor (Biosensor) that includes a Photodiode (PD).
In some embodiments, the body 42 is a photocurable material.
In some embodiments, the body 42 is a silicon gel (SiO 2) material.
In some embodiments, the semiconductor package 100 further includes: a first lead 60 electrically connecting the light emitting member and the carrier 30; and a second lead 62 electrically connecting the light receiving member 34 and the carrier 30.
In some embodiments, the present application also provides a method of forming a semiconductor package 100, comprising: the light emitting element 32 and the light receiving element 34 are placed on the carrier 30, then the opaque silica gel is injection-molded on the carrier 30 and cured to form the first light blocking body 50 and the second light blocking body 52, non-fluorescent dye particles and fluorescent dye particles are doped in a silica gel material, the materials are injected into a space surrounded by the first light blocking body 50 and the second light blocking body 52 to form the filter layer 40, the filter layer 40 covers the light emitting element 32, the light receiving element 34 and the carrier 30, the semi-finished product can be kept for a period of time, and baking and curing are performed after the upper surface of the filter layer 40 is flat, so that the semiconductor package 100 is formed.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (10)
1. A semiconductor package, comprising:
a carrier;
a light emitting member and a light receiving member arranged side by side on the carrier; and
and a filter layer coating the light emitting member and the light receiving member, the filter layer being for filtering light reaching the light receiving member from the outside.
2. The semiconductor package of claim 1, further comprising:
the first light blocking body is arranged on the carrier and positioned between the light emitting piece and the light receiving piece, and is used for blocking light emitted by the light emitting piece from directly reaching the light receiving piece through the filter layer.
3. The semiconductor package according to claim 2, wherein the first light blocking body divides the filter layer into a first light transmitting portion that covers the light emitting member and a second light transmitting portion that covers the light receiving member.
4. A semiconductor package according to claim 3, wherein the second light transmitting portion is for filtering light reaching the light receiving member from the outside.
5. The semiconductor package according to claim 4, wherein the first light transmitting portion and the second light transmitting portion are made of the same material.
6. The semiconductor package according to claim 5, wherein the first light transmitting portion is for improving luminous efficiency of the light emitting member.
7. The semiconductor package of claim 2, wherein the first light blocking body has a first end contacting the carrier and a second end opposite the first end, the first end having a lateral dimension greater than a lateral dimension of the second end.
8. The semiconductor package of claim 7, wherein the filter layer covers at least a portion of a top surface of the first light blocking body.
9. The semiconductor package of claim 3, further comprising:
the second light-blocking body is arranged on the carrier and surrounds the filter layer and the first light-blocking body, and the first light-blocking body and the second light-blocking body completely surround the side walls of the first light-blocking body and the second light-blocking body.
10. The semiconductor package of claim 9, wherein the first light blocker contacts the second light blocker, the first light blocker and the second light blocker completely separating the first light transmissive portion and the second light transmissive portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222685341.XU CN219476685U (en) | 2022-10-12 | 2022-10-12 | Semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222685341.XU CN219476685U (en) | 2022-10-12 | 2022-10-12 | Semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219476685U true CN219476685U (en) | 2023-08-04 |
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ID=87467308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222685341.XU Active CN219476685U (en) | 2022-10-12 | 2022-10-12 | Semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219476685U (en) |
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2022
- 2022-10-12 CN CN202222685341.XU patent/CN219476685U/en active Active
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