JPH0716017B2 - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPH0716017B2
JPH0716017B2 JP1167932A JP16793289A JPH0716017B2 JP H0716017 B2 JPH0716017 B2 JP H0716017B2 JP 1167932 A JP1167932 A JP 1167932A JP 16793289 A JP16793289 A JP 16793289A JP H0716017 B2 JPH0716017 B2 JP H0716017B2
Authority
JP
Japan
Prior art keywords
light
condenser lens
resin body
shielding case
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1167932A
Other languages
Japanese (ja)
Other versions
JPH0332069A (en
Inventor
順三 石崎
元 樫田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1167932A priority Critical patent/JPH0716017B2/en
Publication of JPH0332069A publication Critical patent/JPH0332069A/en
Publication of JPH0716017B2 publication Critical patent/JPH0716017B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Optical Communication System (AREA)
  • Light Receiving Elements (AREA)

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、各種電子機器に用いられる光半導体装置に関
し、特に指向性が広くかつ高感度化が要求されるリモコ
ン用受光装置等に係る。
Description: TECHNICAL FIELD The present invention relates to an optical semiconductor device used in various electronic devices, and more particularly to a light receiving device for a remote controller which has a wide directivity and requires high sensitivity.

〈従来技術〉 従来の光半導体装置(リモコン用受光装置)のバツケー
ジ構造を第3図にて説明する。
<Prior Art> A package structure of a conventional optical semiconductor device (light receiving device for remote control) will be described with reference to FIG.

図示の如く、受光素子1は、一般的に透光性樹脂2を用
いトランスフアーモールドにてその上部(受光素子1
上)に集光レンズ3を有する透光樹脂体4で被覆されて
いる。なお、第3図中、5はリードフレームである。
As shown in the figure, the light receiving element 1 is generally made of a translucent resin 2 and the upper part (the light receiving element 1 is formed by transfer molding).
The upper part is covered with a transparent resin body 4 having a condenser lens 3. In FIG. 3, 5 is a lead frame.

この場合、受光素子1のサイズをAとし、例えば約45°
の半値角を有する指向特性を得ることができる光学系の
集光レンズ3の半径Rをr1、受光素子1の受光面の中心
から集光レンズ3の半径Rまでの距離lをl3とすると、
第4図に示すMの様な指向特性を得ることができる。そ
こで、正面感度を約2倍に上げるためにRをr2(r2>r
1)、lをl4(l4>l3)とすると、Lの様に感度は上が
るが指向性が狭くなつてしまう。
In this case, the size of the light receiving element 1 is A, for example, about 45 °
When the radius R of the condenser lens 3 of the optical system capable of obtaining the directional characteristic having the half-value angle of r1 is r1, and the distance l from the center of the light receiving surface of the light receiving element 1 to the radius R of the condenser lens 3 is l3,
It is possible to obtain a directional characteristic such as M shown in FIG. Therefore, R is r2 (r2> r
1) When 1 is set to l4 (l4> l3), the sensitivity increases as in L, but the directivity becomes narrower.

この様に、受光素子1のサイズAを固定すると、どんな
R、lの組み合せにおいても約45°の半値角を有し、感
度を約2倍にする様な指向特性は得ることができない。
In this way, if the size A of the light receiving element 1 is fixed, any combination of R and l has a half value angle of about 45 °, and it is not possible to obtain a directional characteristic that doubles the sensitivity.

よつて、Kに示す様に必要な指向性を保ち、かつ感度を
向上させるためには、受光素子1のサイズAを大きく
し、Rとlとの組み合せで得るしか方法がない。
Therefore, in order to maintain the necessary directivity as shown by K and improve the sensitivity, the only method is to increase the size A of the light receiving element 1 and obtain it by combining R and l.

〈発明が解決しようとする課題〉 上記従来技術において、受光素子のサイズを大きくする
ことで、必要な指向性を保ち、かつ感度を向上させる方
法によれば、今日、ICと受光部との一体型素子(OPIC)
が多く用いられており、受光素子のサイズを大きくする
ためにはICの回路設計をやり直す必要が有り、コスト面
でもチツプコストが大幅に上昇する。
<Problems to be Solved by the Invention> According to the method of increasing the size of the light-receiving element to maintain the necessary directivity and improve the sensitivity in the above-mentioned conventional technique, one of the IC and the light-receiving section is currently used. Body element (OPIC)
However, it is necessary to redesign the IC circuit in order to increase the size of the light receiving element, and the cost of the chip increases significantly.

これに対応するために、透光樹脂体4以外に集光レンズ
6を設け、透光樹脂体4だけでは受光できない部分の光
を受光素子1の受光面に導く構造が提案されている。
In order to deal with this, a structure has been proposed in which a condenser lens 6 is provided in addition to the light-transmissive resin body 4 so that light in a portion that cannot be received by the light-transmissive resin body 4 alone is guided to the light-receiving surface of the light-receiving element 1.

この構造の場合、第5図に示す様に透光樹脂体4の受光
面4aが平坦な場合には反射が生じ感度が下がるため、第
6図の様に透光樹脂体4側にも集光レンズ3を設け、反
射光を減らす必要があり、またc,dのサイズが大きくな
るため装置自体の形状が大型化となる。
In the case of this structure, as shown in FIG. 5, when the light-receiving surface 4a of the transparent resin body 4 is flat, reflection occurs and the sensitivity is lowered. Therefore, as shown in FIG. It is necessary to provide the optical lens 3 to reduce the reflected light, and since the sizes of c and d become large, the shape of the device itself becomes large.

そこで、本発明は、上記課題に鑑み、装置自体を大きく
することなく、指向性が広く、かつ高感度の指向特性を
実現できる光半導体装置の提供を目的とする。
Therefore, in view of the above problems, it is an object of the present invention to provide an optical semiconductor device which has wide directivity and can realize highly sensitive directional characteristics without increasing the size of the device itself.

〈課題を解決するための手段〉 本発明による課題解決手段は、第1,2図の如く、受光素
子10と、該受光素子10を透光性樹脂11にて被覆形成され
その上部に集光レンズ12を有する透光樹脂体13と、該透
光樹脂体13が収納されその上部に集光レンズ14を有する
遮光ケース15とを備え、前記遮光ケース15の集光レンズ
14の外周面14aが凸面状に形成され、内周面14bが凹面状
に形成され、該遮光ケース15の集光レンズ14が透光樹脂
体13の集光レンズ12の同一中心軸上に配置され、前記透
光樹脂体13の集光レンズ12と遮光ケース15の集光レンズ
14との間に空隙16が設けられたものである。
<Means for Solving the Problems> The means for solving the problems according to the present invention is, as shown in FIGS. 1 and 2, a light-receiving element 10 and a light-transmitting resin 11 covering the light-receiving element 10. A light-transmitting resin body 13 having a lens 12 and a light-shielding case 15 having the light-transmitting resin body 13 housed therein and having a condenser lens 14 above the light-transmitting resin body 13 are provided.
The outer peripheral surface 14a of 14 is formed in a convex shape, the inner peripheral surface 14b is formed in a concave shape, the condenser lens 14 of the light shielding case 15 is arranged on the same central axis of the condenser lens 12 of the transparent resin body 13. The condensing lens 12 of the transparent resin body 13 and the condensing lens of the light shielding case 15
A gap 16 is provided between the gap 14 and the gap 14.

〈作用〉 上記課題解決手段において、受光素子10を透光性樹脂11
にて被覆して集光レンズ12を有する透光樹脂体13を形成
し、透光樹脂体13を集光レンズ14を有する遮光ケース15
に収納する。
<Operation> In the above-mentioned means for solving the problems, the light receiving element 10 is provided with the translucent resin 11
To form a light-transmitting resin body 13 having a condenser lens 12, and the light-transmitting resin body 13 has a light-shielding case 15 having a condenser lens 14.
To store.

このとき、遮光ケース15の集光レンズ14の外周面14aを
凸面状に形成し、内周面14bを凹面状に形成しているの
で、従来に比べ透光樹脂体13を遮光ケース15の奥まで挿
入することができ、遮光ケース15のサイズを縮小するこ
とができる。
At this time, since the outer peripheral surface 14a of the condensing lens 14 of the light shielding case 15 is formed in a convex shape and the inner peripheral surface 14b is formed in a concave shape, the light-transmitting resin body 13 is deeper than the conventional one in the light shielding case 15. Can be inserted, and the size of the light shielding case 15 can be reduced.

また、受光素子10は、遮光ケース15の集光レンズ14およ
び透光樹脂体13の集光レンズ12を介して入射光を受光す
る。
Further, the light receiving element 10 receives incident light via the condenser lens 14 of the light shielding case 15 and the condenser lens 12 of the translucent resin body 13.

このとき、透光樹脂体13の集光レンズ12と遮光ケース15
の集光レンズ14との間に空隙16を設けているので、遮光
ケース15の集光レンズ14を透過する入射光の屈折方向が
調整され、入射光の受光素子10への集光効率が向上し、
受光素子10のサイズを大きくすることなく透光樹脂体13
だけでは受光できない部分の光も受光素子10の受光面に
導くことができ、理想的な指向特性にほぼ近い特性を得
ることができる。
At this time, the condenser lens 12 of the translucent resin body 13 and the light shielding case 15
Since the air gap 16 is provided between the condenser lens 14 and the condenser lens 14, the refraction direction of the incident light transmitted through the condenser lens 14 of the light shielding case 15 is adjusted, and the efficiency of condensing the incident light to the light receiving element 10 is improved. Then
A light-transmitting resin body 13 without increasing the size of the light-receiving element 10.
Light in a portion that cannot be received by itself can be guided to the light receiving surface of the light receiving element 10, and characteristics close to ideal directional characteristics can be obtained.

〈実施例〉 以下、本発明の一実施例を第1図ないし第2図に基づい
て説明する。
<Embodiment> An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第1図は本発明の一実施例を示す光半導体装置の断面
図、第2図は同じくその指向性を示す図である。
FIG. 1 is a sectional view of an optical semiconductor device showing an embodiment of the present invention, and FIG. 2 is a view showing its directivity.

第1図の如く、本実施例の光半導体装置(リモコン用受
光装置)は、受光素子10と、該受光素子10を透光性樹脂
11にて被覆形成されその上部に集光レンズ12を有する透
光樹脂体13と、該透光樹脂体13が収納されその上部に集
光レンズ14を有する遮光ケース15とを備え、前記遮光ケ
ース15の集光レンズ14の外周面14aが凸面状に形成さ
れ、内周面14bが凹面状に配され、該遮光ケース15の集
光レンズ14が透光樹脂体13の集光レンズ12の同一中心軸
上に配置され、前記透光樹脂体13の集光レンズ12と遮光
ケース15の集光レンズ14との間に空隙16が設けられたも
のである。
As shown in FIG. 1, the optical semiconductor device (light receiving device for remote control) of this embodiment includes a light receiving element 10 and a light transmitting resin.
The light-shielding case is provided with a light-transmitting resin body 13 which is covered with 11 and has a condenser lens 12 on the upper portion thereof, and a light-shielding case 15 which houses the light-transmitting resin body 13 and has a condenser lens 14 on the upper portion thereof. The outer peripheral surface 14a of the condenser lens 14 of 15 is formed in a convex shape, the inner peripheral surface 14b is arranged in a concave shape, the condenser lens 14 of the light shielding case 15 is the same as the condenser lens 12 of the transparent resin body 13. It is arranged on the central axis, and an air gap 16 is provided between the condenser lens 12 of the translucent resin body 13 and the condenser lens 14 of the light shielding case 15.

前記受光素子10は、フオトトランジスタ等が使用されて
おり、リードフレーム17に搭載されている。
The light receiving element 10 uses a phototransistor or the like and is mounted on the lead frame 17.

前記透光樹脂体13は、透光性樹脂(透光性エポキシ樹
脂)11を用いてトランスフアーモールドにより形成され
ている。該透光樹脂体13の集光レンズ12は、半球レンズ
であつて、受光素子10の上方に配置されており、その半
径は、受光素子10の受光面の中心PからR1に設定されて
いる。
The translucent resin body 13 is formed by a transfer molding using a translucent resin (translucent epoxy resin) 11. The condensing lens 12 of the translucent resin body 13 is a hemispherical lens and is arranged above the light receiving element 10, and its radius is set from the center P of the light receiving surface of the light receiving element 10 to R1. .

前記遮光ケース15は、遮光性樹脂18により透光樹脂体13
が収納される収納室19を有する円筒形に形成されてお
り、その上部開口に集光レンズ14が配置されている。該
遮光ケース15の集光レンズ14は、屈折率がN=1.58であ
るポリカーボネイトにより凸レンズ状に形成されてい
る。集光レンズ14の内径は、透光樹脂体13の集光レンズ
12の同一中心軸上でR2に設定され、同様に外径はR3に設
定されている。
The light-shielding case 15 is made up of a light-transmitting resin body 13 made of a light-shielding resin 18.
Is formed in a cylindrical shape having a storage chamber 19 in which the condenser lens 14 is accommodated. The condenser lens 14 of the light-shielding case 15 is formed in a convex lens shape with a polycarbonate having a refractive index of N = 1.58. The inner diameter of the condenser lens 14 is the condenser lens of the transparent resin body 13.
They are set to R2 on the same 12 central axes, and similarly the outer diameter is set to R3.

そして、前記受光素子10のサイズをAとし、受光素子10
の受光面の中心Pから透光樹脂体13の集光レンズ12の半
径R1の中心P1までの距離を1、同様に遮光ケース15の
集光レンズ14の内径R2の中心P2までの距離をl2、集光レ
ンズ14の外径R3の中心P3までの距離をl3とした場合に、
受光素子10のサイズAと受光素子10の受光面の中心Pか
ら集光レンズ12,15の半径R1,R2,R3の中心P1,P2,P3の距
離1,l2,l3との関係は、およそ A:R1:R2:R3=1:3.5:3.0:3.5 A:1:l2:l3=1:1.7:1.2:0.7 になつている。なお、この数値は、透光樹脂体13の集光
レンズ12の屈折率がN=1.54、遮光ケース15の集光レン
ズ13の屈折率がN=1.58の場合である。
Then, the size of the light receiving element 10 is set to A, and the light receiving element 10
Is 1 from the center P of the light receiving surface of the transparent resin body 13 to the center P1 of the radius R1 of the condenser lens 12 of the light-transmitting resin body 13, and similarly l2 is the distance from the center P2 of the inner diameter R2 of the condenser lens 14 of the light shielding case 15. , If the distance from the outer diameter R3 of the condenser lens 14 to the center P3 is l3,
The relationship between the size A of the light receiving element 10 and the distances 1, l2, l3 of the centers P1, P2, P3 of the radii R1, R2, R3 of the condenser lenses 12,15 from the center P of the light receiving surface of the light receiving element 10 is approximately A: R1: R2: R3 = 1: 3.5: 3.0: 3.5 A: 1: l2: l3 = 1: 1.7: 1.2: 0.7. In addition, this numerical value is when the refractive index of the condensing lens 12 of the transparent resin body 13 is N = 1.54, and the refractive index of the condensing lens 13 of the light shielding case 15 is N = 1.58.

上記構成において、受光素子10を透光性樹脂11にて被覆
して集光レンズ12を有する透光樹脂体13を形成し、透光
樹脂体13を集光レンズ14を有する遮光ケース15に収納す
る。
In the above structure, the light receiving element 10 is covered with the transparent resin 11 to form the transparent resin body 13 having the condenser lens 12, and the transparent resin body 13 is housed in the light shielding case 15 having the condenser lens 14. To do.

このとき、遮光ケース15の集光レンズ14の外周面14aを
凸面状に形成し、内周面14bを凹面状に形成しているの
で、従来に比べ透光樹脂体13を遮光ケース15の奥まで挿
入することができ、遮光ケース15のサイズを縮小するこ
とができる。
At this time, since the outer peripheral surface 14a of the condensing lens 14 of the light shielding case 15 is formed in a convex shape and the inner peripheral surface 14b is formed in a concave shape, the light-transmitting resin body 13 is deeper than the conventional one in the light shielding case 15. Can be inserted, and the size of the light shielding case 15 can be reduced.

また、受光素子10は、遮光ケース15の集光レンズ14およ
び透光樹脂体13の集光レンズ12を介して入射光を受光す
る。
Further, the light receiving element 10 receives incident light via the condenser lens 14 of the light shielding case 15 and the condenser lens 12 of the translucent resin body 13.

このとき、透光樹脂体13の集光レンズ12と遮光ケース15
の集光レンズ14との間に空隙16を設けているので、遮光
ケース15の集光レンズ14を透過する入射光の屈折方向が
調整され、入射光の受光素子10への集光効率が向上し、
受光素子10のサイズを大きくすることなく透光樹脂体13
だけでは受光できない部分の光も受光素子10の受光面を
導くことができ、第2図の如く、理想的な指向特性Xに
ほぼ近い特性Yを得ることができる。
At this time, the condenser lens 12 of the translucent resin body 13 and the light shielding case 15
Since the air gap 16 is provided between the condenser lens 14 and the condenser lens 14, the refraction direction of the incident light transmitted through the condenser lens 14 of the light shielding case 15 is adjusted, and the efficiency of condensing the incident light to the light receiving element 10 is improved. Then
A light-transmitting resin body 13 without increasing the size of the light-receiving element 10.
Even a portion of the light that cannot be received by itself can be guided to the light receiving surface of the light receiving element 10, and as shown in FIG. 2, a characteristic Y close to the ideal directional characteristic X can be obtained.

したがつて、装置自体を大きくすることなく、指向性が
広く、かつ高感度の指向特性を実現できる。
Therefore, a wide directivity and a highly sensitive directivity characteristic can be realized without increasing the size of the device itself.

なお、本発明は、上記実施例に限定されるものではな
く、本発明の範囲内で上記実施例に多くの修正および変
更を加え得ることは勿論である。
The present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

例えば、上記実施例ではリモコン受光装置について記載
したが、受光素子と受光素子とを光学的に結合するフオ
トインタラプタ等の光結合装置に本発明を適用しても良
い。
For example, although the remote control light receiving device has been described in the above embodiments, the present invention may be applied to an optical coupling device such as a photo interrupter that optically couples a light receiving element and a light receiving element.

〈発明の効果〉 以上の説明から明らかな通り、本発明によると、遮光ケ
ースの集光レンズの外周面を凸面状に形成し、内周面を
凹面状に形成しているので、従来に比べ透光樹脂体を遮
光ケースの奥まで挿入することができ、遮光ケースのサ
イズを縮小することができる。
<Effects of the Invention> As is apparent from the above description, according to the present invention, since the outer peripheral surface of the condensing lens of the light shielding case is formed in a convex shape, and the inner peripheral surface is formed in a concave shape, compared to the conventional The light-transmitting resin body can be inserted all the way into the light-shielding case, and the size of the light-shielding case can be reduced.

また、透光樹脂体の集光レンズと遮光ケースの集光レン
ズとの間に空隙を設けているので、遮光ケースの集光レ
ンズを透過する入射光の屈折方向が調整され、入射光の
受光素子への集光効率が向上し、受光素子のサイズを大
きくすることなく透光樹脂体だけでは受光できない部分
の光も受光素子の受光面に導くことができ、理想的な指
向特性にほぼ近い特性を得ることができる。
Further, since a gap is provided between the condenser lens of the light-transmitting resin body and the condenser lens of the light shielding case, the refraction direction of the incident light passing through the condenser lens of the light shielding case is adjusted and the incident light is received. The light-collecting efficiency of the element is improved, and the light of the part that cannot be received only by the translucent resin body can be guided to the light-receiving surface of the light-receiving element without increasing the size of the light-receiving element. The characteristics can be obtained.

したがつて、装置自体を大きくすることなく、指向性が
広く、かつ高感度の指向特性を実現できるといつた優れ
た効果がある。
Therefore, if a wide directivity and a highly sensitive directivity characteristic can be realized without enlarging the device itself, an excellent effect is obtained.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の一実施例を示す光半導体装置の断面
図、第2図は同じくその指向性を示す図、第3図は従来
の光半導体装置の断面図、第4図は同じくその指向特性
を示す図、第5,6図は他の従来例を示す断面図である。 10:受光素子、11:透光性樹脂、12,14:集光レンズ、13:
透光樹脂体、15:遮光ケース、16:空隙。
FIG. 1 is a sectional view of an optical semiconductor device showing an embodiment of the present invention, FIG. 2 is a diagram showing its directivity, FIG. 3 is a sectional view of a conventional optical semiconductor device, and FIG. FIGS. 5 and 6 are sectional views showing other conventional examples showing the directional characteristics. 10: light receiving element, 11: translucent resin, 12, 14: condenser lens, 13:
Light-transmitting resin body, 15: light-shielding case, 16: void.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】受光素子と、該受光素子を透光性樹脂にて
被覆形成されその上部に集光レンズを有する透光樹脂体
と、該透光樹脂体が収納されその上部に集光レンズを有
する遮光ケースとを備え、前記遮光ケースの集光レンズ
の外周面が凸面状に形成され、内周面が凹面状に形成さ
れ、該遮光ケースの集光レンズが透光樹脂体の集光レン
ズの同一中心軸上に配置され、前記透光樹脂体の集光レ
ンズと遮光ケースの集光レンズとの間に空隙が設けられ
たことを特徴とする光半導体装置。
1. A light-receiving element, a light-transmitting resin body covering the light-receiving element with a light-transmitting resin and having a condenser lens on an upper portion thereof, and a light-transmitting resin body housed therein and a condenser lens on an upper portion thereof. And a light-shielding case having a light-shielding case, wherein the light-shielding case has a condenser lens having an outer peripheral surface formed in a convex shape and an inner peripheral surface formed in a concave shape. An optical semiconductor device, wherein the optical semiconductor device is arranged on the same central axis of a lens, and an air gap is provided between the condenser lens of the translucent resin body and the condenser lens of the light shielding case.
JP1167932A 1989-06-28 1989-06-28 Optical semiconductor device Expired - Fee Related JPH0716017B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1167932A JPH0716017B2 (en) 1989-06-28 1989-06-28 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1167932A JPH0716017B2 (en) 1989-06-28 1989-06-28 Optical semiconductor device

Publications (2)

Publication Number Publication Date
JPH0332069A JPH0332069A (en) 1991-02-12
JPH0716017B2 true JPH0716017B2 (en) 1995-02-22

Family

ID=15858732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1167932A Expired - Fee Related JPH0716017B2 (en) 1989-06-28 1989-06-28 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPH0716017B2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960000223B1 (en) * 1990-11-16 1996-01-03 가부시키가이샤 도시바 Solid state image device and method of manufacturing the same
JP3601076B2 (en) * 1994-06-14 2004-12-15 ソニー株式会社 Light receiving device
TWI357164B (en) 2008-06-30 2012-01-21 E Pin Optical Industry Co Ltd Aspherical led angular lens for narrow distributio
TWI395908B (en) 2008-06-30 2013-05-11 E Pin Optical Industry Co Ltd Aspherical led angular lens for central distribution patterns and led assembly using the same
TWI361261B (en) 2008-06-30 2012-04-01 E Pin Optical Industry Co Ltd Aspherical led angular lens for wide distribution patterns and led assembly using the same
TWI364120B (en) 2008-09-10 2012-05-11 E Pin Optical Industry Co Ltd Convex-fresnel led lens for angular distribution patterns and led assembly thereof
TW201011349A (en) 2008-09-10 2010-03-16 E Pin Optical Industry Co Ltd Plano-Fresnel LED lens for angular distribution patterns and LED assembly thereof
AU2016374204B2 (en) 2015-12-15 2019-05-30 Ricoh Company, Ltd. Electrochromic apparatus

Also Published As

Publication number Publication date
JPH0332069A (en) 1991-02-12

Similar Documents

Publication Publication Date Title
KR100678694B1 (en) Micro integral optic device
CN104765109B (en) Light projector device and sensor
WO2020006706A1 (en) Fingerprint module and electronic device
EP0253810A1 (en) Electromagnetic radiation circuit element
JPH0716017B2 (en) Optical semiconductor device
JPH1168147A (en) Lens for light-receiving element
JP2005223135A (en) Optical communication module
JP3430088B2 (en) Optical transceiver module
JP2636048B2 (en) Optical semiconductor device
CN206497228U (en) The packaged lens fiber array coupled for VSCEL or PIN arrays
JPH06216406A (en) Optical transmitter
JPH07168061A (en) Light transmitting receiving module
JPS6390866A (en) Semiconductor photodetector device
JPH10307237A (en) Integrated type semiconductor device for optical communication
JPH05283661A (en) Solid state image pickup
JPH0685314A (en) Photocoupler, photocoupler array and photoelectric sensor
JPH06151973A (en) Optical semiconductor device
JP2571996Y2 (en) Light transmission device
JP3907542B2 (en) Optical communication module
CN218039223U (en) Photoelectric detector TO packaging structure
CN220419710U (en) Optical element, light emitting device and optical distance sensing module
JPS6242558A (en) Solid-state image pickup device
JP2833972B2 (en) Optical coupling device
CN106842428A (en) For the self focusing light fibre array and its manufacture method of the coupling of VSCEL or PIN arrays
JP2000277761A (en) Condenser and light receiving device

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees