JPH0332069A - Optical semiconductor device - Google Patents
Optical semiconductor deviceInfo
- Publication number
- JPH0332069A JPH0332069A JP1167932A JP16793289A JPH0332069A JP H0332069 A JPH0332069 A JP H0332069A JP 1167932 A JP1167932 A JP 1167932A JP 16793289 A JP16793289 A JP 16793289A JP H0332069 A JPH0332069 A JP H0332069A
- Authority
- JP
- Japan
- Prior art keywords
- light
- lens
- shielding case
- condenser lens
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims description 12
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 230000035945 sensitivity Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 230000037237 body shape Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、各種電子機器に用いられる光半導体装置に関
し、特に指向性が広くかつ高感度化が要求されるリモコ
ン用受光装置等に係る。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an optical semiconductor device used in various electronic devices, and particularly to a light receiving device for a remote control, etc., which is required to have wide directivity and high sensitivity.
〈従来技術〉
従来の光半導体装置（リモコン用受光装置）のパッケー
ジ構造を第３図にて説明する。<Prior Art> The package structure of a conventional optical semiconductor device (remote control light receiving device) will be explained with reference to FIG.
図示の如く、受光素子１は、一般的に透光性樹脂２を用
いトランスファーモールドにてその上部（受光素子１上
）に集光レンズ３を有する透光樹脂体４で被覆されてい
る。なお、第３図中、５はリードフレームである。As shown in the figure, the light-receiving element 1 is generally covered with a light-transmitting resin body 4 having a condenser lens 3 on the upper part (above the light-receiving element 1) by transfer molding using a light-transmitting resin 2. In addition, in FIG. 3, 5 is a lead frame.
この場合、受光素子ｌのサイズをＡとし、例えば約４５
°の半値角を有する指向特性を得ることができる光学系
の集光レンズ３の半径Ｒをｒｌ。In this case, the size of the light-receiving element l is A, and for example, about 45
Let rl be the radius R of the condenser lens 3 of the optical system that can obtain a directivity characteristic having a half-value angle of °.
受光素子ｌの受光面の中心から集光レンズ３の半径Ｒま
での距離Ｑを１２３とすると、第４図に示すＭの様な指
向特性を得ることができる。そこで、正面感度を約２倍
に上げるためにＲをｒ２ （ｒ２ ＞ｒ ｌ ）、Ｑを
１２４（Ｒ４＞１２３）トｌト、Ｌの様に感度は上がる
が指向性が狭くなってしまう。If the distance Q from the center of the light-receiving surface of the light-receiving element 1 to the radius R of the condenser lens 3 is 123, a directional characteristic like M shown in FIG. 4 can be obtained. Therefore, in order to approximately double the frontal sensitivity, R is set to r2 (r2 > r l ), Q is set to 124 (R4>123), and the sensitivity increases, but the directivity becomes narrower.
この様に、受光素子ｌのサイズＡを固定すると、どんな
Ｒ，Ｑの組み合せにおいても約４５°の半値角を有し、
感度を約２倍にする様な指向特性は得ることができない
。In this way, if the size A of the light receiving element l is fixed, any combination of R and Q will have a half value angle of about 45°,
Directional characteristics that approximately double the sensitivity cannot be obtained.
よって、Ｋに示す様に必要な指向性を保ち、かつ感度を
向上させるためには、受光素子ｌのサイズＡを大きくし
、ＲとＱとの組み合せで得るしか方法がない。Therefore, in order to maintain the necessary directivity and improve the sensitivity as shown in K, the only way is to increase the size A of the light receiving element l and obtain it by combining R and Q.
〈 発明が解決しようとする課題 〉
上記従来技術において、受光素子のサイズを大きくする
ことで、必要な指向性を保ち、かつ感度を向上させる方
法によれば、今日、ＩＣと受光部との一体型素子（ＯＦ
ＩＣ）か多く用いられており、受光素子のサイズを大き
くするためにはＩＣの回路設計をやり直す必要が有り、
コスト面でもチップコストが大幅に上昇する。<Problems to be Solved by the Invention> In the above-mentioned prior art, according to the method of increasing the size of the light-receiving element to maintain the necessary directivity and improve the sensitivity, it has become difficult to integrate the IC and the light-receiving part. Body shape element (OF
(IC) is widely used, and in order to increase the size of the photodetector, it is necessary to redesign the IC circuit design.
In terms of cost, chip costs will increase significantly.
これに対応するために、透光樹脂体４以外に集光レンズ
６を設け、透光樹脂体４だけでは受光できない部分の光
を受光素子１の受光面に導く構造が提案されている。In order to cope with this, a structure has been proposed in which a condensing lens 6 is provided in addition to the light-transmitting resin body 4, and the light in the portion that cannot be received by the light-transmitting resin body 4 alone is guided to the light-receiving surface of the light-receiving element 1.
この構造の場合、第５図に示す様に透光樹脂体４の受光
面４ａが平坦な場合には反射が生じ感度か下がるため、
第６図の様に透光樹脂体４側にも集光レンズ３を設け、
反射光を減らす必要があり、またｃ、ｄのサイズが大き
くなるため装置自体の形状が大型化となる。In this structure, as shown in FIG. 5, if the light-receiving surface 4a of the transparent resin body 4 is flat, reflection occurs and the sensitivity decreases.
As shown in FIG. 6, a condenser lens 3 is also provided on the transparent resin body 4 side,
It is necessary to reduce reflected light, and the size of c and d increases, resulting in an increase in the size of the device itself.
そこで、本発明は、上記課題に鑑み、装置自体を大きく
することなく、指向性が広く、かつ高感度の指向特性を
実現できる光半導体装置の提供を目的とする。SUMMARY OF THE INVENTION In view of the above-mentioned problems, the present invention aims to provide an optical semiconductor device that can achieve a wide directivity and highly sensitive directivity characteristics without increasing the size of the device itself.
〈 課題を解決するための手段 〉
本発明による課題解決手段は、第１．２図の如く、受光
素子ｌＯと、該受光素子１０を透光性樹脂１１にて被覆
形成されその上部に集光レンズ１２を有する透光樹脂体
１３と、該透光樹脂体１３が収納されその上部に集光レ
ンズ１４を有する遮光ケース１５とを備え、前記遮光ケ
ース１５の集光レンズ１４の外周面１４ａが凸面状に形
成され、内周面１４ｂが凹面状に形成され、該遮光ケー
ス１５の集光レンズ１４が透光樹脂体１３の集光レンズ
１２の同一中心軸上に配置され、前記透光樹脂体１３の
集光レンズ１２と遮光ケース１５の集光レンズ１４との
間に空隙１６が設けられたものである。<Means for Solving the Problems> The means for solving the problems according to the present invention, as shown in FIG. It is equipped with a light-transmitting resin body 13 having a lens 12, and a light-shielding case 15 in which the light-transmitting resin body 13 is housed and having a condensing lens 14 on the top thereof, and the outer peripheral surface 14a of the condensing lens 14 of the light-shielding case 15 is The condensing lens 14 of the light-shielding case 15 is arranged on the same central axis as the condensing lens 12 of the light-transmitting resin body 13, and the inner peripheral surface 14b is formed in a concave shape. A gap 16 is provided between the condenser lens 12 of the body 13 and the condenser lens 14 of the light shielding case 15.
〈作用〉
上記課題解決手段において、受光素子１０を透光樹脂体
４にて被覆して集光レンズＩ２を有する透光樹脂体Ｉ３
を形成し、透光樹脂体１３を集光レンズ１４を有する遮
光ケース１５に収納する。<Operation> In the above problem solving means, the light receiving element 10 is covered with the light transmitting resin body 4 and the light transmitting resin body I3 having the condenser lens I2 is provided.
The light-transmitting resin body 13 is housed in a light-shielding case 15 having a condensing lens 14.
このとき、遮光ケース１５の集光レンズ１４の外周面１
４ａを凸面状に形成し、内周面１４ｂを凹面状に形成し
ているので、従来（こ比べ透光樹脂体１３を連光ケース
１５の奥まで挿入することができ、遮光ケース１５のサ
イズを縮小することができる。At this time, the outer peripheral surface 1 of the condensing lens 14 of the light shielding case 15
4a is formed in a convex shape and the inner circumferential surface 14b is formed in a concave shape, so that the light-transmitting resin body 13 can be inserted deep into the continuous light case 15, and the size of the light-shielding case 15 can be reduced compared to the conventional case. can be reduced.
また、受光素子ＩＯは、遮光ケース！５の集光レンズＩ
４および透光樹脂体１３の集光レンズ１２を介して入射
光を受光する。Also, the light receiving element IO is covered with a light shielding case! 5 condenser lens I
4 and a condensing lens 12 of a transparent resin body 13 to receive incident light.
このとき、透光樹脂体１３の集光レンズ１２と遮光ケー
ス１５の集光レンズ１４との間に空隙１６を設けている
ので、遮光ケース１５の集光レンズＩ４を透過する入射
光の屈折方向が調整され、入射光の受光素子ＩＯへの集
光効率が向上し、受光素子１０のサイズを大きくするこ
となく透光樹脂体１３だけでは受光できない部分の光も
受光素子ＩＯの受光面に導くことができ、理想的な指向
特性にほぼ近い特性を得ることができる。At this time, since a gap 16 is provided between the condenser lens 12 of the light-transmitting resin body 13 and the condenser lens 14 of the light-shielding case 15, the direction of refraction of the incident light passing through the condenser lens I4 of the light-shielding case 15 is is adjusted, the efficiency of condensing incident light onto the light receiving element IO is improved, and light from areas that cannot be received by the transparent resin body 13 alone is guided to the light receiving surface of the light receiving element IO without increasing the size of the light receiving element 10. This makes it possible to obtain characteristics that are almost close to ideal directional characteristics.
〈実施例〉
以下、本発明の一実施例を第１図ないし第２図に基づい
て説明する。<Example> An example of the present invention will be described below with reference to FIGS. 1 and 2.
第１図は本発明の一実施例を示す光半導体装置の断面図
、第２図は同じくその指向性を示す図である。FIG. 1 is a sectional view of an optical semiconductor device showing an embodiment of the present invention, and FIG. 2 is a diagram showing the directivity thereof.
第１図の如く、本実施例の光半導体装置（リモコン用受
光装置）は、受光素子１０と、該受光素子ＩＯを透光性
樹脂１１にて被覆形成されその上部？こ集光レンズ１２
を有する透光樹脂体１３と、該透光樹脂体１３が収納さ
れその上部に集光レンズ１４を有する遮光ケース１５と
を備え、前記遮光ケース１５の集光レンズ１４の外周面
１４ａが凸面状に形成され、内周面１４ｂが凹面状に配
され、該遮光ケース夏５の集光レンズ１４が透光樹脂体
１３の集光レンズ１２の同一中心軸上に配置され、前記
透光樹脂体１３の集光レンズ１２と遮光ケース１５の集
光レンズ１４との間に空隙１６が設けられたものである
。As shown in FIG. 1, the optical semiconductor device (light receiving device for remote control) of this embodiment includes a light receiving element 10, and the light receiving element IO is covered with a transparent resin 11. This condensing lens 12
and a light-shielding case 15 in which the light-transmitting resin body 13 is housed and has a condensing lens 14 on the top thereof, and the outer peripheral surface 14a of the condensing lens 14 of the light-shielding case 15 is convex. The inner peripheral surface 14b is arranged in a concave shape, the condenser lens 14 of the light-shielding case 5 is arranged on the same central axis as the condenser lens 12 of the light-transmitting resin body 13, and the light-transmitting resin body A gap 16 is provided between the condenser lens 12 of No. 13 and the condenser lens 14 of the light shielding case 15.
前記受光素子ｌＯは、フォトトランジスタ等が使用され
ており、リードフレーム１７に搭載されている。The light receiving element IO uses a phototransistor or the like, and is mounted on the lead frame 17.
前記透光樹脂体１３は、透光性樹脂（透光性エポキシ樹
脂）１１を用いてトランスファーモールドにより形成さ
れている。該透光樹脂体１３の集光レンズ１２は、半球
レンズであって、受光素子１０の上方に配置されており
、その半径は、受光素子ｌＯの受光面の中心ＰからＲ１
に設定されている。The transparent resin body 13 is formed by transfer molding using a transparent resin (transparent epoxy resin) 11. The condensing lens 12 of the light-transmitting resin body 13 is a hemispherical lens and is arranged above the light receiving element 10, and its radius is R1 from the center P of the light receiving surface of the light receiving element IO.
is set to .
前記遮光ケースＩ５は、遮光性樹脂１８により透光樹脂
体Ｉ３が収納される収納室１９を有する円筒形に形成さ
れており、その上部開口に集光レンズ１４が配置されて
いる。該遮光ケース１５の集光レンズ１４は、屈折率が
Ｎ＝１．５８であるポリカーボネイトにより凸レンズ状
に形成されている。集光レンズ１４の内径は、透光樹脂
体１３の集光レンズ１２の同一中心軸上でＲ２に設定さ
れ、同様に外径はＲ３に設定されている。The light-shielding case I5 is formed into a cylindrical shape having a storage chamber 19 made of light-shielding resin 18 in which the light-transmitting resin body I3 is housed, and a condensing lens 14 is disposed in the upper opening thereof. The condensing lens 14 of the light shielding case 15 is formed into a convex lens shape using polycarbonate having a refractive index of N=1.58. The inner diameter of the condenser lens 14 is set to R2 on the same central axis as the condenser lens 12 of the transparent resin body 13, and the outer diameter is similarly set to R3.
そして、前記受光素子１０のサイズをＡとし、受光素子
ｌＯの受光面の中心Ｐから透光樹脂体１３の集光レンズ
１２の半径Ｒ１の中心Ｐｌまでの距離をＩ２１１同様に
遮光ケース１５の集光レンズ１４の内径Ｒ２の中心Ｐ２
までの距離をＱ２、集光レンズ１４の外径Ｒ３の中心Ｐ
３までの距離をＱ３とした場合に、受光素子ＩＯのサイ
ズＡと受光素子１０の受光面の中心Ｐから集光レンズ１
２゜！５の半径Ｒ１，Ｒ２，Ｒ３の中心ＰＩ、Ｐ２．Ｐ
３の距離Ｑ １ 、Ｑ２．１２３との関係は、およそＡ
：Ｒ１：Ｒ２：Ｒ３＝ｌ：３．５：３．０＋３．５Ａ：
１２１ ： Ｑ２： １２３＝ｌ：１．７：１．２：
０．７になっている。なお、この数値は、透光樹脂体Ｉ
３の集光レンズ１２の屈折率がＮ−１，５４、遮光ケー
ス１５の集光レンズ１３の屈折率がＮ＝１５８の場合で
ある。The size of the light-receiving element 10 is assumed to be A, and the distance from the center P of the light-receiving surface of the light-receiving element 10 to the center Pl of the radius R1 of the condensing lens 12 of the light-transmitting resin body 13 is determined as I211. Center P2 of inner diameter R2 of optical lens 14
Q2, the center P of the outer diameter R3 of the condenser lens 14
3 is the distance from the size A of the light receiving element IO and the center P of the light receiving surface of the light receiving element 10 to the condenser lens 1.
2°! 5, the centers of radii R1, R2, R3 PI, P2. P
The relationship between distance Q 1 and Q2.123 of 3 is approximately A
:R1:R2:R3=l:3.5:3.0+3.5A:
121: Q2: 123=l:1.7:1.2:
It has become 0.7. Note that this value is based on the translucent resin body I
This is a case where the refractive index of the condenser lens 12 of No. 3 is N-1, 54, and the refractive index of the condenser lens 13 of the light shielding case 15 is N=158.
上記構成において、受光素子ｌＯを透光性樹脂１１にて
被覆して集光レンズ１２を有する透光樹脂体１３を形成
し、透光樹脂体１３を集光レンズ１４を有する遮光ケー
ス１５に収納する。In the above configuration, the light-receiving element IO is covered with a light-transmitting resin 11 to form a light-transmitting resin body 13 having a condensing lens 12, and the light-transmitting resin body 13 is housed in a light-shielding case 15 having a condensing lens 14. do.
このとき、遮光ケース１５の集光レンズ！４の外周面１
４ａを凸面状に形成し、内周面１４ｂを凹面状に形成し
ているので、従来に比べ透光樹脂体Ｉ３を遮光ケース１
５の奥まで挿入することができ、遮光ケース１５のサイ
ズを縮小することができる。At this time, the condensing lens of the light shielding case 15! 4 outer peripheral surface 1
4a is formed in a convex shape, and the inner circumferential surface 14b is formed in a concave shape.
5, the size of the light-shielding case 15 can be reduced.
また、受光素子ｌＯは、遮光ケースＩ５の集光レンズ１
４および透光樹脂体１３の集光レンズ１２を介して入射
光を受光する。In addition, the light receiving element IO is connected to the condenser lens 1 of the light-shielding case I5.
4 and a condensing lens 12 of a transparent resin body 13 to receive incident light.
このとき、透光樹脂体１３の集光レンズ１２と遮光ケー
ス１５の集光レンズ１４との間に空隙１６を設けている
ので、遮光ケース１５の集光レンズ１４を透過する入射
光の屈折方向が調整され、入射光の受光素子ＩＯへの集
光効率が向上し、受光素子ｌＯのサイズを大きくするこ
となく透光樹脂体１３だけでは受光できない部分の光も
受光素子１０の受光面に導くことができ、第２図の如く
、理想的な指向特性Ｘにほぼ近い特性Ｙを得ることがで
きる。At this time, since a gap 16 is provided between the condenser lens 12 of the light-transmitting resin body 13 and the condenser lens 14 of the light-shielding case 15, the direction of refraction of the incident light that passes through the condenser lens 14 of the light-shielding case 15 is is adjusted, the efficiency of condensing incident light onto the light receiving element IO is improved, and light that cannot be received by the transparent resin body 13 alone is guided to the light receiving surface of the light receiving element 10 without increasing the size of the light receiving element 10. As shown in FIG. 2, it is possible to obtain a characteristic Y that is almost close to the ideal directional characteristic X.
したがって、装置自体を大きくすることなく、指向性が
広く、かつ高感度の指向特性を実現できる。Therefore, it is possible to achieve a directional characteristic with wide directivity and high sensitivity without increasing the size of the device itself.
なお、本発明は、上記実施例に限定されるものではなく
、本発明の範囲内で上記実施例に多くの修正および変更
を加え得ることは勿論である。It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.
例えば、上記実施例ではリモコン受光装置について記載
したか、発光素子と受光素子とを光学的に結合するフォ
トインタラプタ等の光結合装置に本発明を適用しても良
い。For example, in the above embodiments, the remote control light receiving device has been described, but the present invention may be applied to an optical coupling device such as a photointerrupter that optically couples a light emitting element and a light receiving element.
〈発明の効果〉
以上の説明から明らかな通り、本発明によると、遮光ケ
ースの集光レンズの外周面を凸面状に形成し、内周面を
凹面状に形成しているので、従来に比べ透光樹脂体を遮
光ケースの奥まで挿入することができ、遮光ケースのサ
イズを縮小することができる。<Effects of the Invention> As is clear from the above description, according to the present invention, the outer circumferential surface of the condensing lens of the light-shielding case is formed in a convex shape, and the inner circumferential surface is formed in a concave shape. The light-transmitting resin body can be inserted deep into the light-shielding case, and the size of the light-shielding case can be reduced.
また、透光樹脂体の集光レンズと遮光ケースの集光レン
ズとの間に空隙を設けているので、遮光ケースの集光レ
ンズを透過する入射光の屈折方向が調整され、入射光の
受光素子への集光効率が向上し、受光素子のサイズを大
きくすることなく透光樹脂体だけでは受光できない部分
の光も受光素子の受光面に導くことができ、理想的な指
向特性にほぼ近い特性を得ることができる。In addition, since a gap is provided between the light-transmitting resin condenser lens and the light-shielding case's condenser lens, the refraction direction of the incident light that passes through the light-shielding case's condenser lens is adjusted, and the incident light is received. The efficiency of condensing light to the element is improved, and light that cannot be received by the translucent resin body alone can be guided to the light-receiving surface of the light-receiving element without increasing the size of the light-receiving element, which is close to the ideal directional characteristic. characteristics can be obtained.
したがって、装置自体を大きくすることなく、指向性が
広く、かつ高感度の指向特性を実現できるといった優れ
た効果がある。Therefore, there is an excellent effect that a wide directivity and highly sensitive directivity characteristics can be realized without increasing the size of the device itself.
第１図は本発明の一実施例を示す光半導体装置の断面図
、第２図は同じくその指向性を示す図、第３図は従来の
光半導体装置の断面図、第４図は同じくその指向特性を
示す図、第５．６図は他の従来例を示す断面図である。
ｌＯ：受光素子、１！：透光性樹脂、１２．１４：集光
レンズ、１３：透光樹脂体、１５二遮光ケース、１６：
空隙。
出 願 人 シャープ株式会社FIG. 1 is a cross-sectional view of an optical semiconductor device showing an embodiment of the present invention, FIG. 2 is a view also showing its directivity, FIG. 3 is a cross-sectional view of a conventional optical semiconductor device, and FIG. FIG. 5.6, a diagram showing directional characteristics, is a sectional view showing another conventional example. lO: Light receiving element, 1! : Transparent resin, 12.14: Condensing lens, 13: Transparent resin body, 15 Two light-shielding cases, 16:
void. Applicant Sharp Corporation
Claims (1)
その上部に集光レンズを有する透光樹脂体と、該透光樹
脂体が収納されその上部に集光レンズを有する遮光ケー
スとを備え、前記遮光ケースの集光レンズの外周面が凸
面状に形成され、内周面が凹面状に形成され、該遮光ケ
ースの集光レンズが透光樹脂体の集光レンズの同一中心
軸上に配置され、前記透光樹脂体の集光レンズと遮光ケ
ースの集光レンズとの間に空隙が設けられたことを特徴
とする光半導体装置。A light-receiving element, a light-transmitting resin body formed by covering the light-receiving element with a light-transmitting resin and having a condensing lens on the upper part, and a light-shielding case in which the light-transmitting resin body is housed and having a condensing lens on the upper part. The condensing lens of the light-shielding case has an outer peripheral surface formed in a convex shape and an inner peripheral surface formed in a concave shape, and the condensing lens of the light-shielding case is aligned with the same central axis of the condensing lens made of a transparent resin body. An optical semiconductor device, wherein a gap is provided between the condenser lens of the light-transmitting resin body and the condenser lens of the light-shielding case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1167932A JPH0716017B2 (en) | 1989-06-28 | 1989-06-28 | Optical semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1167932A JPH0716017B2 (en) | 1989-06-28 | 1989-06-28 | Optical semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0332069A true JPH0332069A (en) | 1991-02-12 |
| JPH0716017B2 JPH0716017B2 (en) | 1995-02-22 |
Family
ID=15858732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1167932A Expired - Fee Related JPH0716017B2 (en) | 1989-06-28 | 1989-06-28 | Optical semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0716017B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5321297A (en) * | 1990-11-16 | 1994-06-14 | Kabushiki Kaisha Toshiba | Solid state image pickup device having light conversion lens formed on a strip layer |
| KR100381677B1 (en) * | 1994-06-14 | 2003-07-18 | 소니 가부시끼 가이샤 | Receiver |
| US7800840B2 (en) | 2008-09-10 | 2010-09-21 | E-Pin Optical Industry Co., Ltd. | Convex-fresnel LED lens and LED assembly thereof |
| US7980733B2 (en) | 2008-06-30 | 2011-07-19 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for wide distribution patterns and LED assembly using the same |
| US7993035B2 (en) | 2008-06-30 | 2011-08-09 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for narrow distribution patterns and LED assembly using the same |
| US8011811B2 (en) | 2008-06-30 | 2011-09-06 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for central distribution patterns and LED assembly using the same |
| US8042975B2 (en) | 2008-09-10 | 2011-10-25 | E-Pin Optical Industry Co., Ltd. | Plano-fresnel LED lens and LED assembly thereof |
| US11221533B2 (en) | 2015-12-15 | 2022-01-11 | Ricoh Company, Ltd. | Electrochromic device |
-
1989
- 1989-06-28 JP JP1167932A patent/JPH0716017B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5321297A (en) * | 1990-11-16 | 1994-06-14 | Kabushiki Kaisha Toshiba | Solid state image pickup device having light conversion lens formed on a strip layer |
| KR100381677B1 (en) * | 1994-06-14 | 2003-07-18 | 소니 가부시끼 가이샤 | Receiver |
| US7980733B2 (en) | 2008-06-30 | 2011-07-19 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for wide distribution patterns and LED assembly using the same |
| US7993035B2 (en) | 2008-06-30 | 2011-08-09 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for narrow distribution patterns and LED assembly using the same |
| US8011811B2 (en) | 2008-06-30 | 2011-09-06 | E-Pin Optical Industry Co., Ltd. | Aspherical LED angular lens for central distribution patterns and LED assembly using the same |
| US7800840B2 (en) | 2008-09-10 | 2010-09-21 | E-Pin Optical Industry Co., Ltd. | Convex-fresnel LED lens and LED assembly thereof |
| US8042975B2 (en) | 2008-09-10 | 2011-10-25 | E-Pin Optical Industry Co., Ltd. | Plano-fresnel LED lens and LED assembly thereof |
| US11221533B2 (en) | 2015-12-15 | 2022-01-11 | Ricoh Company, Ltd. | Electrochromic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0716017B2 (en) | 1995-02-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |