JP3260936B2 - Optical package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical package comprising a package for mounting an optical integrated circuit and a lid for covering the package.

[0002]

2. Description of the Related Art As shown in a schematic perspective view of FIG. 4, a conventional optical package for optically connecting an optical fiber and an optical integrated circuit mounts the optical integrated circuit and mounts the optical fiber. V-groove 24 and lead pin 25 connected to optical integrated circuit
And a lid 23 for covering the package 22. An optical integrated circuit is mounted in the package 22,
After mounting the optical fiber in the groove 24, the mounting body 22 and the lid 23 are integrated with an adhesive, and at the same time, the optical fiber is fixed in the V-groove 24, or shown in a schematic perspective view of FIG. Thus, the hole 26 is provided on the bottom surface of the mounting body 22, the optical integrated circuit A is provided on the bottom surface of the mounting body 22,
There is a configuration in which the optical fiber B is inserted into the optical fiber and fixed by an adhesive.

[0003]

However, FIG. 4 and FIG.
In the conventional optical package as shown in (1), when the V-groove 24 or the hole 26 for installing the optical fiber is provided, it is necessary to improve the positioning accuracy between the optical fiber and the light receiving portion or the light emitting portion of the optical integrated circuit. Therefore, V of the mounting body 22
There has been a problem that the grooves 24 or the holes 26 must be processed one by one with high precision, and optical fibers must be installed one by one.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-mentioned problems, and is directed to an optical package including a mounting body for mounting an optical integrated circuit and a lid covering the mounting body. A light-emitting element or light-receiving element mounting portion on a peripheral portion, and a light-receiving element receiving an optical signal from the light-emitting element at a portion facing the optical integrated circuit to adjust a light flux toward the optical integrated circuit to convert an optical path, or An optical element that receives an optical signal from an integrated circuit, adjusts a light beam to the light receiving element side, and converts an optical path;
An optical package comprising an optical signal transmitting unit for transmitting the signal between the mounting unit and the optical element unit.

[0005]

According to the present invention, an optical signal from a light emitting element provided on a mounting portion of a lid is transmitted to a light receiving portion of an optical integrated circuit mounted on a mounting body via an optical signal transmitting portion and an optical element portion. Alternatively, an optical signal from the light emitting section of the optical integrated circuit installed on the mounting body propagates to the light receiving element installed on the mounting section via the optical element section of the lid and the optical signal propagation section.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 show three embodiments of the present invention. In the drawings, the same members are denoted by the same reference numerals.

FIGS. 1A and 1B are a schematic perspective view and a sectional view showing a first embodiment of the present invention. In an optical package 1, a package 2 and a lid 3 are integrated. The mounting body 2 has a concave portion 4 for mounting the optical integrated circuit A, and the concave portion 4 has an electrode 5 for making an electrical connection between the optical integrated circuit A and the outside. Are connected by bonding wires 6. Further, the cover 3 has a mounting portion 7 for installing the light emitting side optical fiber B and the light receiving side optical fiber B ′ in the peripheral portion, an optical signal propagating portion 8 for transmitting an optical signal, an optical path conversion, and It comprises an optical element section 9 for adjusting a light beam to a light receiving section of the optical fiber B 'or the optical integrated circuit A.

There is no problem if the package 2 has the same shape and material as the package for mounting a conventional IC chip. Further, the mounting portion 7 includes an optical signal propagation portion 8
By forming an optical element 7a for adjusting the optical path such as a hologram or a prism on the connection surface with the optical signal transmission unit 8 and connecting the optical element 7a to the optical signal transmission unit 8 at an angle of 45 °, the thickness of the optical signal transmission unit 8 is reduced. With consideration, the path (optical path) of the optical signal can be easily determined, and the optical element section 9 and the optical fibers B and B ′ can be determined.
And the optical coupling can be made low loss.
Further, the optical signal propagation section 8 is formed of silicon or an optical resin represented by a transmissive polymer such as polymethyl methacrylate, and the optical element section 9 has a lens action and a prism action based on a diffraction phenomenon. It may be formed of a hologram, a relief hologram, a Fresnel lens, a refractive index change hologram, a diffractive optical element represented by a photorefractive crystal, or the like. In this embodiment, the transmission and reception of the optical signal in the optical integrated circuit A is performed by the light emitting element C composed of a vertical light emitting type semiconductor diode and the like and the light receiving element D composed of a light-speed corresponding semiconductor photodiode and the like. .

With this configuration, the optical signal emitted from the optical fiber B propagates through the optical signal propagation section 8 while being reflected at the interface with the space, and reaches the optical element section 9. After the light path is changed and the light beam is adjusted, the light can be incident on the target light receiving element D. Alternatively, on the contrary, the optical signal emitted from the light emitting element C is
After the optical path is changed and the light flux is adjusted, the light can be incident on the target optical fiber B ′ via the optical signal propagation unit 8.

Thus, the optical integrated circuit A and the optical fiber B,
When manufacturing the optical package 1 that optically couples the optical fiber B ′ with the optical fiber B, there is no need to process a V-groove or a hole for installing an optical fiber in the mounting body 2.
The optical package 1 can be manufactured very easily because it is only connected to the cover 3 in the form of an optical fiber array in which B 'is bundled at the mounting portion. In addition, when the mounting body 2 and the lid 3 are integrated, the position of the lid 3 is adjusted, and the mutual positional relationship between the optical integrated circuit A and the optical fibers B and B ′ is finely adjusted. By integrating them in such a state, low-loss coupling can be easily realized.

In this embodiment, the optical integrated circuit A and the electrode 5
Although the connection with the connection is made by the bonding wire, there is no problem even if other bump chip or tape (TAB) connection is used. In this embodiment, an optical fiber is used, but the same applies to the case where another light emitting element or light receiving element is used. Further, the optical signal propagation section 8 may have any shape as long as the optical signal propagation can be performed at least between the optical fibers B and B ′ and the optical element section 9. What is necessary is just to comprise with the material which a total reflection is made in a boundary with a surrounding surface. The optical element section 9 is manufactured in consideration of the mutual positional relationship and the distance between the optical integrated circuit A and the optical fibers B and B ′ to be used, or the position of the optical signal reaching the optical element section 9. By doing so, an optimal shape can be obtained. Furthermore, the optical signal propagation unit 8
And the optical element portion 9 are formed of a material having transparency in the used light wavelength region and not having transparency in the other wavelength regions, so that the other wavelength region does not affect optical coupling at all. For example, it is conceivable to use the property of transmitting infrared light having a wavelength longer than 980 nm to materials such as Si and Ga.

FIGS. 2A and 2B are a schematic perspective view and a sectional view, respectively, showing a second embodiment of the present invention. The concave portion 4 of the mounting body 2 shown in FIG. And a cover 3 ′ having the same shape as the cover 3 is also provided on the lower surface side. Further, the lid 3 has a shape having couplings on side surfaces in four directions.

With such a configuration, more optical fibers can be installed. Also, as shown in FIG. 2B, by forming an air gap 10 on the bottom surface of the mounting body 2,
And the total reflection at the boundary between the semiconductor device and the mounting body 3 'can be further ensured.

FIG. 3 is a schematic perspective view showing a third embodiment of the present invention.
FIG. 3 shows a diagram in which a common optical fiber B is installed on the upper side and an electric wiring 12 is formed from each of the optical packages 1 and 1 ′. With such a configuration, a large number of optical packages can be easily connected.

[0016]

As described above, according to the optical package of the present invention, the cover has a light emitting element or light receiving element mounting portion on the periphery and a light emitting element on the opposing portion to the optical integrated circuit. Receiving the optical signal and adjusting the light flux to the optical integrated circuit side to convert the optical path, or receiving the optical signal from the optical integrated circuit and adjusting the light flux to the light receiving element side to convert the optical path; and An optical package that can be manufactured very easily and can easily realize low-loss coupling by providing an optical signal propagation unit that propagates the signal between the unit and the optical element unit. can do.

[Brief description of the drawings]

FIG. 1A is a schematic perspective view showing a first embodiment of the optical package of the present invention, and FIG. 1B is a cross-sectional view taken along line XX after the optical package shown in FIG. FIG.

FIG. 2A is a schematic perspective view showing a second embodiment of the optical package of the present invention, and FIG. 2B is a sectional view taken along the line YY after the optical package shown in FIG. FIG.

FIG. 3 is a schematic perspective view showing a third embodiment of the optical package of the present invention.

FIG. 4 is a schematic perspective view showing a conventional optical package.

FIG. 5 is a schematic perspective view showing a conventional optical package.

[Explanation of symbols]

1, 1 ': Optical package 1
0: air gap 2, 22: package 1
1: Base 3, 3 ', 23: Lid 1
2: Electric wiring 4: Recess 2
4: V groove 5: Electrode 2
5: Lead pin 6: Bonding wire 2
6: Hole 7: Mounting part A
: Optical integrated circuit 7a: Optical element B,
B ': Optical fiber 8: Optical signal propagation section C
: Light emitting element 9: Optical element part D
:Light receiving element

Claims (1)

(57) [Claims] An optical integrated circuit is mounted, and the optical integrated circuit is connected to the outside.
A mounting member having an electrode for an electrical connection, in a more becomes optical package and a lid for covering the actual <br/> Sokarada, the lid, the optical fiber or the light receiving side of the light emitting side to the peripheral portion No light
A fiber attachment portion and a portion facing the optical integrated circuit receive an optical signal from the optical fiber on the light emitting side, adjust a light flux to the optical integrated circuit side, and convert the optical path, or an optical signal from the optical integrated circuit. An optical element for receiving the light and adjusting the light flux to the optical fiber on the light receiving side to convert an optical path; and an optical signal transmitting section made of an optical resin for transmitting the signal between the mounting section and the optical element section. An optical package, characterized in that: