JP3260936B2 - Optical package - Google Patents
Optical packageInfo
- Publication number
- JP3260936B2 JP3260936B2 JP29531393A JP29531393A JP3260936B2 JP 3260936 B2 JP3260936 B2 JP 3260936B2 JP 29531393 A JP29531393 A JP 29531393A JP 29531393 A JP29531393 A JP 29531393A JP 3260936 B2 JP3260936 B2 JP 3260936B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- integrated circuit
- light
- package
- optical signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、光集積回路を実装する
実装体と、前記実装体を覆う蓋体よりなる光パッケージ
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical package comprising a package for mounting an optical integrated circuit and a lid for covering the package.
【0002】[0002]
【従来技術】従来の光ファイバと光集積回路との光学的
接続を行う光パッケージには、図4の斜視概略図に示す
ように、光集積回路を実装し、光ファイバを載置するた
めのV溝24と光集積回路に接続されるリードピン25
とを有する実装体22と、実装体22を覆うための蓋体
23よりなり、実装体22内に光集積回路を実装し、V
溝24内に光ファイバを載置した後、接着剤により実装
体22と蓋体23とを一体化させ、同時に光ファイバを
V溝24内で固定させる構成、あるいは図5の斜視概略
図に示すように、実装体22の底面に孔26を設け、実
装体22の底面上に光集積回路Aを設置し、かつ孔26
に光ファイバBを挿入して接着剤により固定させる構成
があった。2. Description of the Related Art As shown in a schematic perspective view of FIG. 4, a conventional optical package for optically connecting an optical fiber and an optical integrated circuit mounts the optical integrated circuit and mounts the optical fiber. V-groove 24 and lead pin 25 connected to optical integrated circuit
And a lid 23 for covering the package 22. An optical integrated circuit is mounted in the package 22,
After mounting the optical fiber in the groove 24, the mounting body 22 and the lid 23 are integrated with an adhesive, and at the same time, the optical fiber is fixed in the V-groove 24, or shown in a schematic perspective view of FIG. Thus, the hole 26 is provided on the bottom surface of the mounting body 22, the optical integrated circuit A is provided on the bottom surface of the mounting body 22,
There is a configuration in which the optical fiber B is inserted into the optical fiber and fixed by an adhesive.
【0003】[0003]
【発明が解決しようとする課題】ところが、図4、図5
に示すような従来の光パッケージでは、光ファイバを設
置するためのV溝24または孔26を設ける場合に、光
ファイバと光集積回路の受光部または発光部との位置決
め精度を向上させる必要があるために、実装体22のV
溝24または孔26を1つ1つ精度良く加工して、光フ
ァイバを1本1本設置しなければならないという問題が
あった。However, FIG. 4 and FIG.
In the conventional optical package as shown in (1), when the V-groove 24 or the hole 26 for installing the optical fiber is provided, it is necessary to improve the positioning accuracy between the optical fiber and the light receiving portion or the light emitting portion of the optical integrated circuit. Therefore, V of the mounting body 22
There has been a problem that the grooves 24 or the holes 26 must be processed one by one with high precision, and optical fibers must be installed one by one.
【0004】[0004]
【課題を解決するための手段】本発明は、上記問題に鑑
みてなされたものであり、光集積回路を実装する実装体
と前記実装体を覆う蓋体とよりなる光パッケージにおい
て、前記蓋体は、周部に発光素子または受光素子の取付
け部と、前記光集積回路との対向部に前記発光素子から
の光信号を受けて光集積回路側へ光束を整えて光路を変
換させ、または光集積回路からの光信号を受けて前記受
光素子側へ光束を整えて光路を変換させる光学素子と、
前記取付け部と光学素子部との間に前記信号を伝搬させ
る光信号伝搬部とが具備された光パッケージとしたもの
である。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has been made in consideration of the above-mentioned problems, and is directed to an optical package including a mounting body for mounting an optical integrated circuit and a lid covering the mounting body. A light-emitting element or light-receiving element mounting portion on a peripheral portion, and a light-receiving element receiving an optical signal from the light-emitting element at a portion facing the optical integrated circuit to adjust a light flux toward the optical integrated circuit to convert an optical path, or An optical element that receives an optical signal from an integrated circuit, adjusts a light beam to the light receiving element side, and converts an optical path;
An optical package comprising an optical signal transmitting unit for transmitting the signal between the mounting unit and the optical element unit.
【0005】[0005]
【作用】本発明によれば、蓋体の取付け部に設置された
発光素子からの光信号が光信号伝搬部、光学素子部を介
して実装体に実装された光集積回路の受光部に、あるい
は、実装体に設置された光集積回路の発光部からの光信
号が蓋体の光学素子部、光信号伝搬部を介して取付け部
に設置された受光素子に伝搬するものとなる。According to the present invention, an optical signal from a light emitting element provided on a mounting portion of a lid is transmitted to a light receiving portion of an optical integrated circuit mounted on a mounting body via an optical signal transmitting portion and an optical element portion. Alternatively, an optical signal from the light emitting section of the optical integrated circuit installed on the mounting body propagates to the light receiving element installed on the mounting section via the optical element section of the lid and the optical signal propagation section.
【0006】[0006]
【実施例】以下本発明の実施例を図面を用いて説明す
る。Embodiments of the present invention will be described below with reference to the drawings.
【0007】図1乃至図3は本発明の3つの実施例を示
し、図において同じ部材は同じ符号で示す。FIGS. 1 to 3 show three embodiments of the present invention. In the drawings, the same members are denoted by the same reference numerals.
【0008】図1(a)、(b)は本発明の第1の実施
例を示す斜視概略図とその断面図であり、光パッケージ
1は実装体2と蓋体3とを一体化させることにより構成
され、実装体2は光集積回路Aを実装する凹部4、そし
て凹部4に光集積回路Aと外部との電気的接続をさせる
ための電極5を有し、光集積回路Aと電極5はボンディ
ングワイヤ6で接続されてなる。また、蓋体3は周部に
発光側の光ファイバBと受光側の光ファイバB’を設置
するための取付け部7、光信号を伝搬する光信号伝搬部
8、光路を変換し、かつ各光ファイバB’または光集積
回路Aの受光部への光束を整える光学素子部9よりな
る。FIGS. 1A and 1B are a schematic perspective view and a sectional view showing a first embodiment of the present invention. In an optical package 1, a package 2 and a lid 3 are integrated. The mounting body 2 has a concave portion 4 for mounting the optical integrated circuit A, and the concave portion 4 has an electrode 5 for making an electrical connection between the optical integrated circuit A and the outside. Are connected by bonding wires 6. Further, the cover 3 has a mounting portion 7 for installing the light emitting side optical fiber B and the light receiving side optical fiber B ′ in the peripheral portion, an optical signal propagating portion 8 for transmitting an optical signal, an optical path conversion, and It comprises an optical element section 9 for adjusting a light beam to a light receiving section of the optical fiber B 'or the optical integrated circuit A.
【0009】なお、実装体2は、従来のICチップを実
装するパッケージと同様の形状・材質のものを使用して
何ら問題はない。また、取付け部7は、光信号伝搬部8
との接続面にホログラムやプリズム等の光路の調整を行
う光学素子7aを形成させ、かつ光信号伝搬部8に対し
て45°の角度で接続させることにより、光信号伝搬部
8の厚さを考慮すれば、光信号の経路(光路)を容易に
決めることができ、光学素子部9と光ファイバB、B’
との光学的な結合が低損失なものとすることができる。
さらに、光信号伝搬部8はシリコン、またはポリメチル
タクリル酸メチルなどの透過性ポリマーに代表される光
学樹脂で形成し、また、光学素子部9は、回折現象に基
づくレンズ作用とプリズム作用を有するホログラムやレ
リーフ型ホログラム、フレネルレンズ、屈折率変化型ホ
ログラム、フォトリフラクティブ結晶等に代表される回
折光学素子等で形成すればよい。なお、本実施例では光
集積回路Aにおける光信号の授受は、垂直発光型の半導
体ダイオード等で構成される発光素子Cと光速対応半導
体フォトダイオード等で構成される受光素子Dで行う構
成とした。There is no problem if the package 2 has the same shape and material as the package for mounting a conventional IC chip. Further, the mounting portion 7 includes an optical signal propagation portion 8
By forming an optical element 7a for adjusting the optical path such as a hologram or a prism on the connection surface with the optical signal transmission unit 8 and connecting the optical element 7a to the optical signal transmission unit 8 at an angle of 45 °, the thickness of the optical signal transmission unit 8 is reduced. With consideration, the path (optical path) of the optical signal can be easily determined, and the optical element section 9 and the optical fibers B and B ′ can be determined.
And the optical coupling can be made low loss.
Further, the optical signal propagation section 8 is formed of silicon or an optical resin represented by a transmissive polymer such as polymethyl methacrylate, and the optical element section 9 has a lens action and a prism action based on a diffraction phenomenon. It may be formed of a hologram, a relief hologram, a Fresnel lens, a refractive index change hologram, a diffractive optical element represented by a photorefractive crystal, or the like. In this embodiment, the transmission and reception of the optical signal in the optical integrated circuit A is performed by the light emitting element C composed of a vertical light emitting type semiconductor diode and the like and the light receiving element D composed of a light-speed corresponding semiconductor photodiode and the like. .
【0010】このような構成とすることにより、光ファ
イバBから出射する光信号は、光信号伝搬部8の中を空
間との界面で反射しながら伝搬して光学素子部9に到達
し、ここで光路を変更させ、かつ光束を整えた後、目的
とする受光素子Dに入射させることができる。あるいは
逆に、発光素子Cから出射する光信号は、光学素子部9
で光路を変更させ、かつ光束を整えた後、光信号伝搬部
8を介して目的とする光ファイバB’に入射させること
ができる。With this configuration, the optical signal emitted from the optical fiber B propagates through the optical signal propagation section 8 while being reflected at the interface with the space, and reaches the optical element section 9. After the light path is changed and the light beam is adjusted, the light can be incident on the target light receiving element D. Alternatively, on the contrary, the optical signal emitted from the light emitting element C is
After the optical path is changed and the light flux is adjusted, the light can be incident on the target optical fiber B ′ via the optical signal propagation unit 8.
【0011】これより、光集積回路Aと光ファイバB、
B’とを光学的に結合する光パッケージ1を製作する際
に、実装体2に光ファイバ設置用のV溝または孔を加工
する必要が全くなく、しかも、複数の光ファイバB、
B’が取付け部でまとまっている状態の光ファイバアレ
イ状で蓋体3に接続するのみであるために、非常に容易
に光パッケージ1を製作することができる。また、実装
体2と蓋体3を一体化する際に蓋体3の位置調整を行っ
て、光集積回路Aと光ファイバB、B’との相互的位置
関係を微妙に調整して、最適な状態で一体化させること
により、容易に低損失な結合を実現させることができる
ようになる。Thus, the optical integrated circuit A and the optical fiber B,
When manufacturing the optical package 1 that optically couples the optical fiber B ′ with the optical fiber B, there is no need to process a V-groove or a hole for installing an optical fiber in the mounting body 2.
The optical package 1 can be manufactured very easily because it is only connected to the cover 3 in the form of an optical fiber array in which B 'is bundled at the mounting portion. In addition, when the mounting body 2 and the lid 3 are integrated, the position of the lid 3 is adjusted, and the mutual positional relationship between the optical integrated circuit A and the optical fibers B and B ′ is finely adjusted. By integrating them in such a state, low-loss coupling can be easily realized.
【0012】なお、本実施例では光集積回路Aと電極5
との接続をボンディングワイヤによるものとしたが、他
のバンプチップやテープ(TAB)接続であっても何ら
問題はない。また、本実施例では、光ファイバを使用し
たが、他の発光素子または受光素子を使用した場合も全
く同様である。さらに、光信号伝搬部8は、少なくとも
光ファイバB、B’と光学素子部9との間で光信号伝搬
が行えれば、どのような形状であってもよく、光信号伝
搬部8とその周囲面とが境界で全反射するような材質で
構成すればよい。また、光学素子部9は、使用する光集
積回路Aと光ファイバB、B’との相互的位置関係や距
離、あるいは光学素子部9に到達する光信号の位置を考
慮に入れた上で製作することにより、最適な形状である
ものとすることができる。さらにまた、光信号伝搬部8
や光学素子部9を、使用光波長域で透過性を有し、他の
波長域では透過性を有しない材料で形成することによ
り、他の波長域が光結合に全く影響しない光パッケージ
1とすることができ、例えば、980nmより長波長側
の赤外光がSi,Ga等の材料に対し透過する性質を利
用することが考えられる。In this embodiment, the optical integrated circuit A and the electrode 5
Although the connection with the connection is made by the bonding wire, there is no problem even if other bump chip or tape (TAB) connection is used. In this embodiment, an optical fiber is used, but the same applies to the case where another light emitting element or light receiving element is used. Further, the optical signal propagation section 8 may have any shape as long as the optical signal propagation can be performed at least between the optical fibers B and B ′ and the optical element section 9. What is necessary is just to comprise with the material which a total reflection is made in a boundary with a surrounding surface. The optical element section 9 is manufactured in consideration of the mutual positional relationship and the distance between the optical integrated circuit A and the optical fibers B and B ′ to be used, or the position of the optical signal reaching the optical element section 9. By doing so, an optimal shape can be obtained. Furthermore, the optical signal propagation unit 8
And the optical element portion 9 are formed of a material having transparency in the used light wavelength region and not having transparency in the other wavelength regions, so that the other wavelength region does not affect optical coupling at all. For example, it is conceivable to use the property of transmitting infrared light having a wavelength longer than 980 nm to materials such as Si and Ga.
【0013】図2(a)と図2(b)は本発明の第2の
実施例を示す斜視概略図とその断面図であり、図1の実
装体2の凹部4を加工して下面側に貫通させて、下面側
にも蓋体3と同様の形状である蓋体3’を設置した図を
示している。また、蓋体3は4方向の側面に結合を有し
た形状としている。FIGS. 2A and 2B are a schematic perspective view and a sectional view, respectively, showing a second embodiment of the present invention. The concave portion 4 of the mounting body 2 shown in FIG. And a cover 3 ′ having the same shape as the cover 3 is also provided on the lower surface side. Further, the lid 3 has a shape having couplings on side surfaces in four directions.
【0014】このような構成とすることにより、より多
くの光ファイバを設置することができるようになる。ま
た、図2(b)に示すように、実装体2の底面にエアー
ギャップ10を形成させることにより、光信号伝搬部8
と実装体3’との境界での全反射をより確実にすること
ができるようになる。With such a configuration, more optical fibers can be installed. Also, as shown in FIG. 2B, by forming an air gap 10 on the bottom surface of the mounting body 2,
And the total reflection at the boundary between the semiconductor device and the mounting body 3 'can be further ensured.
【0015】図3は本発明の第3の実施例を示す斜視概
略図であり、2つの光パッケージ1、1’をベース11
上に設置して、共通の光ファイバBを有し、かつ各光パ
ッケージ1、1’より電気配線12を形成させた図を示
す。このような構成とすることにより、多数の光パッケ
ージを容易に接続することができるようになる。FIG. 3 is a schematic perspective view showing a third embodiment of the present invention.
FIG. 3 shows a diagram in which a common optical fiber B is installed on the upper side and an electric wiring 12 is formed from each of the optical packages 1 and 1 ′. With such a configuration, a large number of optical packages can be easily connected.
【0016】[0016]
【発明の効果】以上説明したように、本発明の光パッケ
ージによれば、蓋体は、周部に発光素子または受光素子
の取付け部と、前記光集積回路との対向部に前記発光素
子からの光信号を受けて光集積回路側へ光束を整えて光
路を変換させ、または光集積回路からの光信号を受けて
前記受光素子側へ光束を整えて光路を変換させる光学素
子と、前記取付け部と光学素子部との間に前記信号を伝
搬させる光信号伝搬部とが具備されたことによって、非
常に容易に製作でき、しかも容易に低損失な結合を実現
させることができる光パッケージを提供することができ
る。As described above, according to the optical package of the present invention, the cover has a light emitting element or light receiving element mounting portion on the periphery and a light emitting element on the opposing portion to the optical integrated circuit. Receiving the optical signal and adjusting the light flux to the optical integrated circuit side to convert the optical path, or receiving the optical signal from the optical integrated circuit and adjusting the light flux to the light receiving element side to convert the optical path; and An optical package that can be manufactured very easily and can easily realize low-loss coupling by providing an optical signal propagation unit that propagates the signal between the unit and the optical element unit. can do.
【図1】(a)は本発明の光パッケージの第1の実施例
を示す斜視概略図であり、(b)は(a)に示す光パッ
ケージを一体化させた後のXーX線断面図である。FIG. 1A is a schematic perspective view showing a first embodiment of the optical package of the present invention, and FIG. 1B is a cross-sectional view taken along line XX after the optical package shown in FIG. FIG.
【図2】(a)は本発明の光パッケージの第2の実施例
を示す斜視概略図であり、(b)は(a)に示す光パッ
ケージを一体化させた後のYーY線断面図である。FIG. 2A is a schematic perspective view showing a second embodiment of the optical package of the present invention, and FIG. 2B is a sectional view taken along the line YY after the optical package shown in FIG. FIG.
【図3】本発明の光パッケージの第3の実施例を示す斜
視概略図である。FIG. 3 is a schematic perspective view showing a third embodiment of the optical package of the present invention.
【図4】従来の光パッケージを示す斜視概略図である。FIG. 4 is a schematic perspective view showing a conventional optical package.
【図5】従来の光パッケージを示す斜視概略図である。FIG. 5 is a schematic perspective view showing a conventional optical package.
1、1’:光パッケージ 1
0:エアーギャップ 2、22:実装体 1
1:ベース 3、3’、23:蓋体 1
2:電気配線 4 :凹部 2
4:V溝 5 :電極 2
5:リードピン 6 :ボンディングワイヤ 2
6:孔 7 :取付け部 A
:光集積回路 7a:光学素子 B、
B’:光ファイバ 8 :光信号伝搬部 C
:発光素子 9 :光学素子部 D
:受光素子1, 1 ': Optical package 1
0: air gap 2, 22: package 1
1: Base 3, 3 ', 23: Lid 1
2: Electric wiring 4: Recess 2
4: V groove 5: Electrode 2
5: Lead pin 6: Bonding wire 2
6: Hole 7: Mounting part A
: Optical integrated circuit 7a: Optical element B,
B ': Optical fiber 8: Optical signal propagation section C
: Light emitting element 9: Optical element part D
:Light receiving element
Claims (1)
の電気的接続をするための電極を有する実装体と、該実
装体を覆う蓋体とよりなる光パッケージにおいて、前記
蓋体は、周部に発光側の光ファイバまたは受光側の光フ
ァイバの取付け部と、前記光集積回路との対向部に前記
発光側の光ファイバからの光信号を受けて光集積回路側
へ光束を整えて光路を変換させ、または光集積回路から
の光信号を受けて前記受光側の光ファイバへ光束を整え
て光路を変換させる光学素子と、前記取付け部と光学素
子部との間に前記信号を伝搬させる光学樹脂からなる光
信号伝搬部とが具備されたことを特徴とする光パッケー
ジ。An optical integrated circuit is mounted, and the optical integrated circuit is connected to the outside.
A mounting member having an electrode for an electrical connection, in a more becomes optical package and a lid for covering the actual <br/> Sokarada, the lid, the optical fiber or the light receiving side of the light emitting side to the peripheral portion No light
A fiber attachment portion and a portion facing the optical integrated circuit receive an optical signal from the optical fiber on the light emitting side, adjust a light flux to the optical integrated circuit side, and convert the optical path, or an optical signal from the optical integrated circuit. An optical element for receiving the light and adjusting the light flux to the optical fiber on the light receiving side to convert an optical path; and an optical signal transmitting section made of an optical resin for transmitting the signal between the mounting section and the optical element section. An optical package, characterized in that:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29531393A JP3260936B2 (en) | 1993-11-25 | 1993-11-25 | Optical package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29531393A JP3260936B2 (en) | 1993-11-25 | 1993-11-25 | Optical package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07146423A JPH07146423A (en) | 1995-06-06 |
JP3260936B2 true JP3260936B2 (en) | 2002-02-25 |
Family
ID=17818995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29531393A Expired - Fee Related JP3260936B2 (en) | 1993-11-25 | 1993-11-25 | Optical package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3260936B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000055665A2 (en) * | 1999-03-16 | 2000-09-21 | Framatome Connectors International | Modular optoelectronic connector |
-
1993
- 1993-11-25 JP JP29531393A patent/JP3260936B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07146423A (en) | 1995-06-06 |
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