CN113140553A - Packaging structure and backlight source - Google Patents
Packaging structure and backlight source Download PDFInfo
- Publication number
- CN113140553A CN113140553A CN202110341897.4A CN202110341897A CN113140553A CN 113140553 A CN113140553 A CN 113140553A CN 202110341897 A CN202110341897 A CN 202110341897A CN 113140553 A CN113140553 A CN 113140553A
- Authority
- CN
- China
- Prior art keywords
- light
- colloid
- hole
- transmitting
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 239000000084 colloidal system Substances 0.000 claims abstract description 95
- 230000008033 biological extinction Effects 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000006978 adaptation Effects 0.000 claims 1
- 230000031700 light absorption Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 10
- 239000008393 encapsulating agent Substances 0.000 description 19
- 239000003292 glue Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000003086 colorant Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the technical field of light emitting diodes, and provides a packaging structure and a backlight source for keyboard keys. According to the packaging structure provided by the invention, after the light-emitting chip is powered and emits light by the substrate, part of light passes through the light-transmitting colloid and then is emitted to the outside from the first light-transmitting hole, meanwhile, part of light passes through the light-transmitting colloid and is emitted to the outside from the first light-transmitting hole after being reflected by the surface of the light-reflecting colloid, and the light-absorbing colloid can effectively block light from leaking laterally, so that the light intensity emitted to the outside from the first light-transmitting hole is increased, namely the luminous light intensity of the packaging structure is higher.
Description
Technical Field
The invention relates to the technical field of light emitting diodes, and particularly provides a packaging structure and a backlight source for keyboard keys.
Background
The light emitting diode packaging structure for functional indication in the keyboard adopts the packaging structure shown in fig. 1, after the light emitting chip is packaged with the transparent adhesive 01 for one time, a layer of opaque black adhesive 02 is packaged on the transparent adhesive 01, and the black adhesive layer 02 is provided with a light outlet hole.
However, as the product is upgraded, the current packaging structure design has certain limitations that the product emits light through the light emitting hole, and the black glue layer 02 wraps five surfaces of the product, which are not the light emitting hole. Under the condition that the basic structure is not changed, the brightness and the light leakage prevention function of the product are difficult to improve by changing the high-brightness light-emitting chip or the raw material.
Disclosure of Invention
The invention aims to provide a packaging structure and a backlight source for keyboard keys, and aims to solve the problem that the existing packaging structure is low in brightness.
In order to achieve the purpose, the invention adopts the technical scheme that:
in a first aspect, the application provides a packaging structure, include the base plate, locate luminous chip on the base plate, encapsulate in the printing opacity colloid in the outside of luminous chip, encapsulate in the reflection of light colloid in the outside of printing opacity colloid and encapsulate in the extinction colloid in the outside of reflection of light colloid, set up on the extinction colloid with the corresponding first light trap of luminous chip, set up on the reflection of light colloid with the corresponding second light trap of first light trap, the printing opacity colloid has and keeps away from the upper surface of base plate, the reflection of light colloid reaches the extinction colloid all extends to the top of upper surface, just first light trap reaches the second light trap all is located the top of upper surface.
The invention has the beneficial effects that: according to the packaging structure provided by the invention, after the light-emitting chip is powered and emits light by the substrate, part of light passes through the light-transmitting colloid and then is emitted to the outside from the first light-transmitting hole, meanwhile, part of light passes through the light-transmitting colloid and is emitted to the outside from the first light-transmitting hole after being reflected by the surface of the light-reflecting colloid, and the light-absorbing colloid can effectively block light from leaking laterally, so that the light intensity emitted to the outside from the first light-transmitting hole is increased, namely the luminous light intensity of the packaging structure is higher.
In one embodiment, the first light-transmitting hole and the second light-transmitting hole are communicated, and the inner peripheral wall of the first light-transmitting hole and the inner peripheral wall of the second light-transmitting hole are flush.
In one embodiment, the first light hole and the second light hole are communicated to form a light emitting hole, and the inner diameter of the light emitting hole is gradually increased along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is gradually reduced along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is increased and then reduced along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is firstly reduced and then increased along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is reduced along the light emitting direction of the packaging structure and then is kept unchanged; or the inner diameter of the light emitting hole is increased and then kept unchanged along the light emitting direction of the packaging structure, or the inner diameter of the light emitting hole is kept constant along the light emitting direction of the packaging structure.
In one embodiment, the package structure further comprises a lens member mounted within the first light-transmitting hole or the second light-transmitting hole.
In one embodiment, the lens member is integrally formed with the light transmissive gel.
In one embodiment, the light-transmitting colloid has a light-emitting surface corresponding to the light-emitting hole, the light-transmitting colloid extends into the second light-transmitting hole, and the light-emitting surface of the light-transmitting colloid is flush with the top end surface of the reflective colloid, or the light-transmitting colloid extends into the first light-transmitting hole, and the light-emitting surface of the light-transmitting colloid is flush with the top end surface of the light-absorbing colloid.
In one embodiment, the light-transmitting colloid has a light-emitting surface corresponding to the light-emitting hole, and the light-emitting surface of the light-transmitting colloid is flush with the upper surface of the light-transmitting colloid.
In one embodiment, the light absorbing colloid is a black colloid, the light reflecting colloid is a white colloid, and the light transmitting colloid is a transparent colloid or a fluorescent colloid.
In one embodiment, the circumferential side wall of the light-transmitting colloid is inclined towards the light-emitting chip to form a light-transmitting inclined surface, and the circumferential inner side wall of the light-reflecting colloid is provided with a reflecting inclined surface matched with the light-transmitting inclined surface.
In a second aspect, the present application further provides a backlight source for a keyboard key, including the above package structure.
The invention has the beneficial effects that: the backlight source for the keyboard keys provided by the invention has the prompting or indicating effect with higher light intensity on the basis of the light emitting chip.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a cross-sectional view of a prior art package structure;
fig. 2 is a cross-sectional view of a package structure according to an embodiment of the invention;
FIG. 3 is a cross-sectional view of a package structure according to an embodiment of the invention;
FIG. 4 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 5 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 7 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 8 is a cross-sectional view of a package structure according to an embodiment of the present invention;
FIG. 9 is a cross-sectional view of a package structure according to an embodiment of the present invention;
fig. 10 is a cross-sectional view of a package structure according to an embodiment of the invention.
Wherein, in the figures, the respective reference numerals:
the light-emitting device includes a package structure 100, a substrate 10, a light-emitting chip 20, a light-transmitting encapsulant 30, an upper surface 30a, a light-emitting surface 30b, a light-reflecting encapsulant 40, a light-absorbing encapsulant 50, a first light-transmitting hole 62, a second light-transmitting hole 61, a light-transmitting inclined surface 31, a reflecting inclined surface 41, a light-reflecting convex portion 42, a reflecting surface 42a, a light-emitting hole 60, a lens 70, a first light-transmitting surface 71, a second light-transmitting surface 72, and a light-absorbing adhesive layer 80.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings, which is for convenience and simplicity of description, and does not indicate or imply that the referenced device or assembly must have a particular orientation, be constructed and operated in a particular orientation, and thus, is not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other or mutually interacted. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 2 and 10, a package structure 100 of the present application includes a substrate 10, a light emitting chip 20 disposed on the substrate 10, a transparent encapsulant 30 packaged outside the light emitting chip 20, a reflective encapsulant 40 packaged outside the transparent encapsulant 30, and a light absorbing encapsulant 50 packaged outside the reflective encapsulant 40, wherein the light absorbing encapsulant 50 is provided with a first light hole 62 corresponding to the light emitting chip 20, the reflective encapsulant 40 is provided with a second light hole 61 corresponding to the first light hole 62, the transparent encapsulant 30 has an upper surface 30a far away from the substrate 10, the reflective encapsulant 40 and the light absorbing encapsulant 50 both extend above the upper surface 30a, and the first light hole 62 and the second light hole 61 are both located above the upper surface 30 a. Here, the light-transmitting colloid is an encapsulating colloid such as epoxy resin, and may be a transparent colloid or a fluorescent colloid, and the light-reflecting colloid 40 and the light-absorbing colloid 50 are epoxy resin having different light transmittance and corresponding colors, for example.
In the package structure 100 provided by the present invention, after the light emitting chip 20 is powered by the substrate 10 to emit light, part of the light passes through the transparent colloid 30 and then is emitted from the first light hole 62 to the outside, and meanwhile, part of the light passes through the transparent colloid 30 and is reflected by the surface of the reflective colloid 40 and then is emitted from the first light hole 62 to the outside, so that the intensity of the light emitted from the first light hole 62 to the outside is increased, that is, the intensity of the light emitted from the package structure 100 is higher, and the light absorbing colloid 50 can effectively block the light from leaking to the side.
Referring to fig. 3, in an embodiment, a circumferential side wall of the light-transmissive colloid 30 is inclined toward the light-emitting chip 20 to form a light-transmissive inclined surface 31, and a circumferential inner side wall of the light-reflective colloid 40 has a reflective inclined surface 41 adapted to the light-transmissive inclined surface 31. It can be understood that, the external diameter of the circumference lateral wall of the light-transmitting colloid 30 is different from bottom to top, for example, the external diameter of the circumference lateral wall of the light-transmitting colloid 30 increases step by step along the light-emitting direction of the packaging structure 100, thus, the circumference lateral wall of the light-transmitting colloid 30 forms the light-transmitting inclined surface 31, the light-transmitting colloid 30 is packaged and covered by the light-reflecting colloid 40, then the reflection inclined surface 41 is formed on the circumference inside wall of the light-reflecting colloid 40, the internal diameter of the reflection inclined surface 41 of the circumference inside wall of the light-reflecting colloid 40 increases step by step along the light-emitting direction of the packaging structure 100, the light emitted by the light-emitting chip 20 is emitted to the outside from the second light-transmitting hole 61 and the first light-transmitting hole 62 through the reflection inclined surface 41 with a high probability, and the light-emitting intensity of the packaging structure 100 is improved.
Referring to fig. 4, in another embodiment, one side wall of the transparent adhesive 30 is recessed toward the light emitting chip 20 to form a cavity, one inner side wall of the reflective adhesive 40 protrudes toward the cavity to form a reflective protrusion 42, and the reflective protrusion 42 has a reflective surface 42a for reflecting light of the light emitting chip 20 to the first light hole 62 and the second light hole 61. It is understood that, in order to obtain a larger reflection angle, a concave cavity is formed on the circumferential side wall of the transparent glue 30, the reflective glue 40 fills the concave cavity during the packaging process to form the reflective protrusion 42, and the surface of the reflective protrusion 42 contacting with the inner wall of the concave cavity is the reflective surface 42a, and similarly, the reflective surface 42a can also improve the luminous intensity of the packaging structure 100. Further, in another embodiment, the light reflecting protrusion 42 may surround the light emitting chip 20 at the center, i.e., a circle of the reflecting surface 42a is formed at the outer side of the light emitting chip 20.
In one embodiment, the light absorbing gel 50 is a black gel. It is understood that the black glue colloid is a black epoxy. Of course, the light absorbing colloid 50 may be epoxy resin with other colors according to actual needs.
In one embodiment, the reflective gel 40 is a white gel. It is understood that the white glue colloid is a white epoxy resin. Of course, the reflective colloid 40 may be epoxy resin with other colors according to actual needs.
Referring to fig. 2, 7 and 8, in an embodiment, the first light hole 62 and the second light hole 61 are communicated to form the light emitting hole 60, a peripheral wall of the first light hole 62 and a peripheral wall of the second light hole 61 may be flush to facilitate light to be emitted from the light emitting hole 60, and an inner diameter of the light emitting hole 60 is gradually increased along a light emitting direction of the package structure 100. It can be understood that the size of the inner diameter of the light emitting hole 60 affects the light emitting angle and brightness of the package structure 100. When the inner diameter of the light emitting hole 60 increases step by step along the light emitting direction of the package structure 100, a larger light emitting angle can be obtained; here, the inner diameter of the first light transmission hole 62 and the inner diameter of the second light transmission hole 61 are increased in stages. And, according to actual requirements, the inner diameter of the light emitting hole 60 may also be gradually reduced along the light emitting direction of the package structure 100, so as to obtain a smaller light emitting angle and focusing brightness, that is, the inner diameter of the first light transmitting hole 62 and the inner diameter of the second light transmitting hole 61 are both gradually reduced. Of course, according to the actual requirement, the light-emitting angle and the brightness of the package structure 100 are finely adjusted, and the inner diameter of the light-emitting hole 60 further includes the following situations: the inner diameter of the light emitting hole 60 increases and then decreases along the light emitting direction of the package structure 100, that is, the inner diameter of the second light transmitting hole 61 increases step by step, and the inner diameter of the first light transmitting hole 62 decreases step by step; the inner diameter of the light emitting hole 60 is first decreased and then increased along the light emitting direction of the package structure 100, that is, the inner diameter of the second light transmitting hole 61 is gradually decreased, and the inner diameter of the first light transmitting hole 62 is gradually increased; alternatively, the inner diameter of the light emitting hole 60 is reduced first and then remains unchanged along the light emitting direction of the package structure 100, that is, the inner diameter of the second light transmitting hole 61 is gradually reduced, and the inner diameter of the first light transmitting hole 62 remains unchanged; alternatively, the inner diameter of the light emitting hole 60 is increased first and then remains unchanged along the light emitting direction of the package structure 100, that is, the inner diameter of the second light transmitting hole 61 is increased step by step, and the inner diameter of the first light transmitting hole 62 remains unchanged. Alternatively, referring to fig. 10, the inner diameter of the light emitting hole 60 is kept constant along the light emitting direction of the package structure 100, i.e. the inner diameter of the first light transmitting hole 62 and the inner diameter of the second light transmitting hole 61 are the same.
Referring to fig. 2, 3, 8 and 10, the transparent encapsulant 30 has a light-emitting surface 30b corresponding to the light-emitting hole 60, and the light-emitting surface 30b of the transparent encapsulant 60 is flush with the upper surface 30a of the transparent encapsulant 6.
Referring to fig. 9, in an embodiment, the transparent adhesive 30 extends into the second transparent hole 61, and the light emitting surface 30b of the transparent adhesive 30 is flush with the top end surface of the reflective adhesive 40. It can be understood that, in this case, the second light hole 61 is filled with the light transmissive colloid 30, and the light emitting surface 30b of the filled light transmissive colloid 30 is flush with the top end surface of the reflective colloid 40, so that the light emitted from the light emitting chip 20 is always wrapped by the reflective colloid 40, and finally emitted from the light emitting surface 30b of the light transmissive colloid 30 and emitted from the first light hole 62 to the outside; in another embodiment, the light-transmissive encapsulant 30 extends into the first light-transmissive hole 62, and the light-emitting surface 30b of the light-transmissive encapsulant 62 is flush with the top end surface of the light-absorbing encapsulant 50.
Referring to fig. 5, in an embodiment, the package structure 100 further includes a lens element 70, and the lens element 70 is installed in the first light hole 62 or the second light hole 61, or installed in the first light hole 62 and the second light hole 61. It can be understood that the lens member 70 is used to ensure that the light emitting hole 60 is not blocked by the filling of the foreign object, and further to adjust the light shape of the package structure 100.
Referring to fig. 5, the lens element 70 has a first light-transmitting surface 71 facing the light-emitting chip 20 and a second light-transmitting surface 72 corresponding to the first light-transmitting surface 71, and the first light-transmitting surface 71 and/or the second light-transmitting surface 72 are arc-shaped. As can be understood, the light-gathering effect is obtained by the arc shape of the first light-transmitting surface 71 and/or the second light-transmitting surface 72; in another embodiment, the lens member 70 may be integrally formed with the light transmissive gel 30.
Referring to fig. 6, in one embodiment, a light absorbing glue layer 80 is coated on the substrate 10, and the light absorbing glue layer 80 is circumferentially disposed at a connection position of the light absorbing glue 50 and the substrate 10. It can be understood that the light absorbing glue layer 80 is used for blocking the light transmitting gap at the connection position of the light absorbing glue 50 and the substrate 10, and preventing the light of the light emitting chip 20 from leaking from the light transmitting gap. Here, the light absorbing paste layer 80 is black epoxy.
The present application further provides a backlight source for a keyboard key, including the above package structure 100.
The packaging structure 100 provided by the invention is used as a backlight source of keyboard keys, and on the basis of the packaging structure 100, a prompt or indication effect with higher light intensity can be obtained.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A package structure, comprising: including the base plate, locate luminous chip on the base plate, encapsulate in the printing opacity colloid in the outside of luminous chip, encapsulate in the reflection of light colloid in the outside of printing opacity colloid and encapsulate in the extinction colloid in the outside of reflection of light colloid, set up on the extinction colloid with the corresponding first light trap of luminous chip, set up on the reflection of light colloid with the corresponding second light trap of first light trap, the printing opacity colloid has and keeps away from the upper surface of base plate, reflection of light colloid reaches the extinction colloid all extends to the top of upper surface, just first light trap reaches the second light trap all is located the top of upper surface.
2. The package structure of claim 1, wherein: the first light hole is communicated with the second light hole, and the peripheral wall of the inner side of the first light hole is flush with the peripheral wall of the inner side of the second light hole.
3. The package structure of claim 1, wherein: the first light hole and the second light hole are communicated to form a light emitting hole, and the inner diameter of the light emitting hole is gradually increased along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is gradually reduced along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is increased and then reduced along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is firstly reduced and then increased along the light emitting direction of the packaging structure; or the inner diameter of the light emitting hole is reduced along the light emitting direction of the packaging structure and then is kept unchanged; or the inner diameter of the light emitting hole is increased and then kept unchanged along the light emitting direction of the packaging structure, or the inner diameter of the light emitting hole is kept constant along the light emitting direction of the packaging structure.
4. The package structure of claim 3, wherein: the packaging structure further comprises a lens piece, and the lens piece is arranged in the first light-transmitting hole or the second light-transmitting hole.
5. The package structure of claim 4, wherein: the lens piece and the light-transmitting colloid are integrally formed.
6. The package structure of claim 3, wherein: the light-transmitting colloid is provided with a light-emitting surface corresponding to the light-emitting hole, the light-transmitting colloid extends into the second light-transmitting hole, the light-emitting surface of the light-transmitting colloid is flush with the top end surface of the light-reflecting colloid, or the light-transmitting colloid extends into the first light-transmitting hole, and the light-emitting surface of the light-transmitting colloid is flush with the top end surface of the light-absorbing colloid.
7. The package structure of claim 3, wherein: the light-transmitting colloid is provided with a light-emitting surface corresponding to the light-emitting hole, and the light-emitting surface of the light-transmitting colloid is flush with the upper surface of the light-transmitting colloid.
8. The package structure according to any one of claims 1 to 7, wherein: the light absorption colloid is a black colloid, the reflective colloid is a white colloid, and the light transmission colloid is a transparent colloid or a fluorescent colloid.
9. The package structure of claim 1, wherein: the circumference lateral wall orientation of printing opacity colloid the slope of emitting chip forms the printing opacity inclined plane, the circumference inside wall of reflection of light colloid have with the reflection inclined plane of printing opacity inclined plane adaptation.
10. A backlight, characterized by: comprising a package structure according to any of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110341897.4A CN113140553A (en) | 2020-10-20 | 2021-03-30 | Packaging structure and backlight source |
| TW110206177U TWM618981U (en) | 2020-10-20 | 2021-05-28 | Package structure and backlight module |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022344693 | 2020-10-20 | ||
| CN202022344693X | 2020-10-20 | ||
| CN202110341897.4A CN113140553A (en) | 2020-10-20 | 2021-03-30 | Packaging structure and backlight source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113140553A true CN113140553A (en) | 2021-07-20 |
Family
ID=76820098
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120651622.6U Active CN214588894U (en) | 2020-10-20 | 2021-03-30 | Packaging structure and backlight source |
| CN202110341897.4A Pending CN113140553A (en) | 2020-10-20 | 2021-03-30 | Packaging structure and backlight source |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120651622.6U Active CN214588894U (en) | 2020-10-20 | 2021-03-30 | Packaging structure and backlight source |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN214588894U (en) |
| TW (1) | TWM618981U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115084341A (en) * | 2022-05-11 | 2022-09-20 | 弘凯光电(江苏)有限公司 | Light emitting diode packaging device and light emitting diode packaging method |
-
2021
- 2021-03-30 CN CN202120651622.6U patent/CN214588894U/en active Active
- 2021-03-30 CN CN202110341897.4A patent/CN113140553A/en active Pending
- 2021-05-28 TW TW110206177U patent/TWM618981U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWM618981U (en) | 2021-11-01 |
| CN214588894U (en) | 2021-11-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4172196B2 (en) | Light emitting diode | |
| CN109888079B (en) | Deep ultraviolet light emitting diode package | |
| US20030002272A1 (en) | Light-emitting diode | |
| EP1418628A1 (en) | Light emitting device using led | |
| US10754191B2 (en) | Display light source module having encapsulated LEDs and reflective recess with reflective patterns | |
| JP2004111882A (en) | Light emitting apparatus | |
| CN113823723A (en) | Light emitting diode packaging structure | |
| CN214588894U (en) | Packaging structure and backlight source | |
| JP2007142289A (en) | Light-emitting apparatus | |
| JP2004349646A (en) | Light-emitting device | |
| CN111640846B (en) | Deep ultraviolet LED packaging and lamp | |
| CN220155560U (en) | Packaging structure and lamp panel | |
| TW201806188A (en) | Light emitting diode | |
| CN107957010B (en) | Light source device | |
| CN210325851U (en) | LED packaging structure | |
| KR101309762B1 (en) | Led package with downwardly relfective surface | |
| KR101334314B1 (en) | Light emitting diode lamp and method of fabricating the same | |
| CN214542278U (en) | LED lamp bead and backlight source | |
| TWI817620B (en) | Light emitting diode packaging device and light emitting diode packaging method | |
| CN221150058U (en) | Prevent side light leak LED packaging structure | |
| KR100968846B1 (en) | Lighting apparatus using light emitting diode | |
| CN110600601A (en) | Light leakage prevention LED structure and manufacturing method thereof | |
| KR101334315B1 (en) | Light emitting diode lamp and method of fabricating the same | |
| JP2000252525A (en) | Light emitting diode lamp | |
| KR101337601B1 (en) | Led package with downwardly relfective surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |