CN217608042U - Solvent-resistant electromagnetic shielding film insulating coating structure - Google Patents
Solvent-resistant electromagnetic shielding film insulating coating structure Download PDFInfo
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- CN217608042U CN217608042U CN202220939989.2U CN202220939989U CN217608042U CN 217608042 U CN217608042 U CN 217608042U CN 202220939989 U CN202220939989 U CN 202220939989U CN 217608042 U CN217608042 U CN 217608042U
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Abstract
The utility model discloses a solvent-resistant electromagnetic shielding film insulating coating structure belongs to electromagnetic shielding film field, including the substrate, from type layer and insulating printing ink layer, from the surface of type layer coating at the substrate, insulating printing ink layer coating is on the surface from the type layer, and insulating printing ink layer includes the sputtering layer that from interior to exterior set gradually, shields layer and solvent-resistant layer. Through set up solvent-resistant layer in the insulating ink layer in the electromagnetic shielding film outside, the solvent resistance that has shown the electromagnetic shielding film has improved, can avoid electromagnetic shielding film from this because of with FPC flexible circuit board pressfitting in-process contact organic solvent and cause the reduction of insulating properties to play better insulation and guard action to FPC flexible circuit board.
Description
Technical Field
The utility model relates to an electromagnetic shielding film field especially relates to a solvent-resistant electromagnetic shielding film insulating coating structure.
Background
In the production process of the FPC flexible circuit board, the electromagnetic shielding film is required to be pressed on the surface of the FPC at high temperature and high pressure, and interference current is conducted away in a grounding mode. After the electromagnetic shielding film is pressed with the FPC flexible circuit board, the insulating layer is positioned on the outermost surface of the FPC flexible circuit board, and part of working procedures of the FPC flexible circuit board need to be contacted with an organic solvent. Therefore, how to avoid the influence of the organic solvent on the electromagnetic shielding film is an urgent problem to be solved.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electromagnetic shielding film insulating coating structure of resistant solvent to solve one or more technical problem that exist among the above-mentioned background art.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a solvent-resistant electromagnetic shielding film insulating coating structure, includes the substrate, leaves type layer and insulating printing ink layer, it is in to leave the type layer coating the surface of substrate, insulating printing ink layer coating is in from the surface on type layer, insulating printing ink layer includes sputtering layer, shielding layer and the solvent-resistant layer that sets gradually from inside to outside.
Preferably, the solvent-resistant layer is a film layer formed of a modified polyimide resin.
Preferably, the surface of the base material is also provided with a bonding layer, and the release layer is coated on the surface of the bonding layer.
Preferably, the surface of the substrate is corona treated to form the adhesive layer.
Preferably, the shielding layer is a film layer formed of a carbon black resin.
Preferably, the substrate is one of a polyester film, a polyimide film, a polystyrene film and a polycarbonate film.
Preferably, the surface roughness of the substrate is Ra1 to 5 μm, the gloss of the substrate is 15 to 30, and the light transmittance of the substrate is 40 to 70%.
Preferably, the thickness of the substrate is 25 to 125 μm, the thickness of the release layer is 200 to 500nm, the thickness of the sputtering layer is 100 to 110nm, the thickness of the shielding layer is 3 to 15 μm, and the thickness of the solvent-resistant layer is 1 to 5 μm.
The utility model has the advantages that: the solvent-resistant layer is arranged in the insulating ink layer on the outermost side of the electromagnetic shielding film, so that the solvent resistance of the electromagnetic shielding film is remarkably improved, the phenomenon that the insulating property of the electromagnetic shielding film is reduced due to the fact that the electromagnetic shielding film is in contact with an organic solvent in the pressing process of the FPC flexible circuit board can be avoided, and the FPC flexible circuit board is well insulated and protected.
Drawings
The accompanying drawings are provided to further illustrate the present invention, but the content in the accompanying drawings does not constitute any limitation to the present invention.
Fig. 1 is a schematic overall structure diagram of one embodiment of the present invention.
Wherein: the ink comprises a substrate 1, a release layer 2, an insulating ink layer 3, a sputtering layer 31, a shielding layer 32 and a solvent-resistant layer 33.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the drawings.
The solvent-resistant electromagnetic shielding film insulating coating structure of this embodiment refers to fig. 1, including substrate 1, from type layer 2 and insulating ink layer 3, from type layer 2 coating on the surface of substrate 1, insulating ink layer 3 coating is on the surface from type layer 2, and insulating ink layer 3 includes that from interior to exterior sets gradually at sputter layer 31, shielding layer 32 and the solvent-resistant layer 33 from type layer 2 surface. Wherein, the release layer 2 is formed by curing a release agent. The sputtering layer 31 is formed by sputtering a metal such as copper or a nickel alloy as a conductive layer on the surface of the shielding layer 32 and applying a conductive paste.
From this, this embodiment sets up solvent-resistant layer 33 in insulating ink layer 3 at the electromagnetic shielding film outside, is showing and is improving the solvent resistance of electromagnetic shielding film, can avoid electromagnetic shielding film from this because of with FPC flexible circuit board pressfitting in-process contact organic solvent and cause the reduction of insulating properties to play better insulating and guard action to FPC flexible circuit board.
Preferably, the solvent-resistant layer 33 is a film layer formed of a modified polyimide resin. Polyimide resin has the characteristic that solubility is strong, and through setting up the rete that is formed by modified polyimide resin, when the contact organic solvent, through the dissolution of modified polyimide resin to organic solvent, the solvent resistance that has showing and has improved electromagnetic shield membrane insulating coating.
Preferably, the surface of the substrate 1 is further provided with an adhesive layer, and the release layer 2 is coated on the surface of the adhesive layer. From this, through setting up the tie coat, improved from the cohesiveness between type layer 2 and the substrate 1 for difficult and substrate 1 of peeling off after the type layer 2 solidification, thereby improved the quality of electromagnetic shielding film product.
Further, the surface of the substrate 1 is formed into a bonding layer by corona treatment. Therefore, the adhesive layer can be formed by performing corona treatment on the surface of the substrate 1, so that the adhesion between the release layer 2 and the substrate 1 is improved, and the process difficulty is low.
Preferably, the shielding layer 32 is a film layer formed of carbon black resin. The shielding layer 32 is made of carbon black resin, and the insulating ink layer 3 is black to provide hiding property, thereby preventing electrification of the electromagnetic shielding film due to static electricity.
Preferably, the substrate 1 is one of a polyester film, a polyimide film, a polystyrene film, and a polycarbonate film. Wherein, the mechanical strength and the dimensional stability are improved by adopting the polyester film to carry out extension processing. The substrate 1 is selected as the transparent substrate 1, and a foamed polyester film, a synthetic resin film containing a white pigment such as titanium dioxide carbon, or other pigments may be used.
Preferably, since the substrate 1 is finally separated from the insulating layer, the surface of the insulating layer after separation is required to have a matting effect, and the surface of the synthetic film for the substrate 1 is required to have a certain matting and roughness, with Ra of 1 to 5 μm, preferably 2.0 μm, a gloss of 15 to 30, preferably 18 to 22, and a light transmittance of 40 to 70%, preferably 45 to 55%.
Preferably, the thickness of the substrate 1 is set to be 25 μm to 125 μm, which meets the requirements of light weight, strength and rigidity of the material peeled from the insulating ink layer 3; the thickness of the release layer 2 is 200-500 nm, and the thickness of the sputtering layer 31 is 100-110 nm; the thickness of the shielding layer 32 is set to be 3-15 μm, so that the sputtering layer 31 with poor covering performance can be prevented from being seen through, sufficient insulation can be obtained, the overall thickness of the electromagnetic shielding film can be prevented from being too thick, and the requirement of thinning the mobile phone can be met; the solvent-resistant layer 33 has a thickness of 1 to 5 μm.
The insulating ink layer 3 of the present embodiment may contain various additives such as a flame retardant, an antibacterial agent, a fungicide, an antioxidant, a plasticizer, a leveling agent, a flow control agent, an antifoaming agent, and a dispersant, when the functions of the present invention are not impaired.
The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and is not to be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive step, and these embodiments are all intended to fall within the scope of the present invention.
Claims (8)
1. The utility model provides a solvent-resistant electromagnetic shielding film insulating coating structure, its characterized in that includes the substrate, leaves type layer and insulating printing ink layer, it is in to leave the type layer coating the surface of substrate, insulating printing ink layer coating is in leave the surface on type layer, insulating printing ink layer includes sputter layer, shielding layer and the solvent-resistant layer that sets gradually from inside to outside.
2. The insulation coating structure of a solvent-resistant electromagnetic shielding film according to claim 1, wherein the solvent-resistant layer is a film layer formed of a modified polyimide resin.
3. The insulating coating structure of a solvent-resistant electromagnetic shielding film according to claim 1, wherein the surface of the substrate is further provided with an adhesive layer, and the release layer is coated on the surface of the adhesive layer.
4. The structure of claim 3, wherein the adhesive layer is formed on the surface of the substrate by corona treatment.
5. The insulation coating structure of a solvent-resistant electro-magnetic shielding film according to claim 1, wherein the shielding layer is a film layer formed of carbon black resin.
6. The insulating coating structure of a solvent-resistant electromagnetic shielding film according to claim 1, wherein the substrate is one of a polyester film, a polyimide resin film, a polystyrene film, and a polycarbonate film.
7. The insulation coating structure of solvent-resistant EMI shielding film according to claim 6, wherein the surface roughness of the substrate is Ra 1-5 μm, the glossiness of the substrate is 15-30, and the light transmittance of the substrate is 40-70%.
8. The insulation coating structure of a solvent-resistant electromagnetic shielding film according to claim 1, wherein the thickness of the substrate is 25 μm to 125 μm, the thickness of the release layer is 200 nm to 500nm, the thickness of the sputtered layer is 100 nm to 110nm, the thickness of the shielding layer is 3 μm to 15 μm, and the thickness of the solvent-resistant layer is 1 μm to 5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220939989.2U CN217608042U (en) | 2022-04-21 | 2022-04-21 | Solvent-resistant electromagnetic shielding film insulating coating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220939989.2U CN217608042U (en) | 2022-04-21 | 2022-04-21 | Solvent-resistant electromagnetic shielding film insulating coating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217608042U true CN217608042U (en) | 2022-10-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220939989.2U Active CN217608042U (en) | 2022-04-21 | 2022-04-21 | Solvent-resistant electromagnetic shielding film insulating coating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN217608042U (en) |
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- 2022-04-21 CN CN202220939989.2U patent/CN217608042U/en active Active
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