CN217591218U

CN217591218U - Packaging structure

Info

Publication number: CN217591218U
Application number: CN202220209629.7U
Authority: CN
Inventors: 舒伟峰; 陈清华
Original assignee: Hangzhou Clounix Technology Ltd
Current assignee: Yunhe Zhiwang Shanghai Technology Co ltd
Priority date: 2022-01-25
Filing date: 2022-01-25
Publication date: 2022-10-14
Anticipated expiration: 2032-01-25

Abstract

The utility model discloses a packaging structure, include: the chip packaging structure comprises a PCB, a first packaging substrate, a main chip, at least one co-packaging module and at least one connector corresponding to the co-packaging module; the first packaging substrate is arranged on the PCB, the main chip, the connector and the common packaging module are all arranged on the first packaging substrate, the connector and the common packaging module corresponding to the connector are contacted to form electric connection, and the main chip and the connector are arranged in a separated mode and are electrically connected with the connector through wiring. The utility model discloses compare in the mode of traditional optical module, have small, the low power dissipation, shorter walking the line, occupation space is little, high-speed signal's performance advantage such as better, cost increase is not many. Compared with the mainstream common packaging technology, the embodiment can be compatible with the optical fiber and the passive cable simultaneously, is more flexible, has wider application range and much lower cost, has low requirement on manufacturing equipment, and is very suitable for large-scale production.

Description

Packaging structure

Technical Field

The utility model relates to a packaging field especially relates to an encapsulation structure.

Background

On some semiconductor devices, it is often necessary to integrate a chip and a module (optical module or electrical module). Taking an optical module as an example, as shown in fig. 1, a conventional packaging manner is that a chip and an optical module are not in the same package, where a main chip and the optical module are connected through a connector on a PCB, and inside the optical module, a DSP chip, an optical driver chip and a TIA chip are also connected through a small PCB. Because the optical module and the PCB board where the main chip is located are connected through the connector, various optical modules can be conveniently replaced to achieve optimal cost and performance. Under the condition that the distance is relatively close, the optical module can be replaced by a passive cable for directly transmitting an electric signal instead of an optical signal, so that the cost is greatly reduced, and the optical module is widely applied to large-scale data centers and medium and small enterprises.

However, as the signal speed between the main chip and the optical module increases, the signal loss is higher and higher, and the transmission distance is shorter, so that the conventional optical module cannot meet the requirement of high-speed signal transmission more and more. On the basis, the mainstream research direction in the industry turns to co-packaging technology, and now the mainstream implementation method of the optoelectronic co-packaging is shown in fig. 2.

In fig. 2, a main chip and an optical package substrate are connected through a package substrate, and a Digital Signal Processor (DSP) and an optical device are provided on the optical package substrate and interconnected through the optical package substrate. The optical packaging substrate and the packaging substrate can be welded together, or can be pressed together by mechanical stress through a mechanical piece, so that the co-packaged optical module can be replaced.

Although the existing co-packaging technology can effectively solve the problem of signal transmission quality, the design of the existing co-packaging technology is more complex and the cost is high. Moreover, the optical module can only be applied, and cannot be replaced by a passive cable as a conventional optical module, so that the cost cannot be reduced.

SUMMERY OF THE UTILITY MODEL

In view of the above problems, an object of the embodiments of the present invention is to provide a package structure to improve the above problems.

The embodiment of the utility model provides a packaging structure, it includes: the chip packaging structure comprises a PCB, a first packaging substrate, a main chip, at least one co-packaging module and at least one connector corresponding to the co-packaging module; the first packaging substrate is arranged on the PCB, the main chip, the connector and the common packaging module are all arranged on the first packaging substrate, the connector and the common packaging module corresponding to the connector are contacted to form electric connection, and the main chip and the connector are arranged in a separated mode and are electrically connected with the connector through wiring.

Preferably, the co-packaged module is an optical module.

Preferably, the co-packaged module is an electrical module.

Preferably, the co-packaged module includes a second package substrate, and the connector makes contact and electrical connection with the co-packaged module through the second package substrate.

Preferably, the connectors are disposed at the side of the co-packaged module.

Preferably, the connector is disposed between the co-packaged module and the first package substrate.

Preferably, the main chip and the co-package module are disposed on an upper side of the first package substrate.

Preferably, the main chip and the co-package module are disposed on upper and lower sides of the first package substrate.

Preferably, the second package substrate and the first package substrate are connected by soldering.

Preferably, the second package substrate and the first package substrate are crimped together by mechanical stress.

In summary, the connector is directly used for co-packaging of the main chip and the co-packaged module in the embodiment; and simultaneously, the co-packaging design of the optical fiber and the passive cable is compatible. Compared with the traditional optical module mode shown in fig. 1, the optical module has the advantages of small size, low power consumption, shorter wiring, small occupied space, better performance of high-speed signals and the like, and the cost is not increased much. Compared with the mainstream co-encapsulation technology shown in fig. 2, the embodiment can be compatible with the optical fiber and the passive cable at the same time, is more flexible, has a wider application range and a lower cost, has low requirements on manufacturing equipment, and is very suitable for mass production.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic diagram of a package of a conventional main chip and an optical module.

Fig. 2 is a schematic diagram of a prior art co-packaging technique.

Fig. 3 is a schematic diagram of a package structure according to an embodiment of the present invention.

Fig. 4 is a schematic diagram of a package of a main chip and an optical module.

Figure 5 is a schematic diagram of a package of a main chip and an electrical module.

Fig. 6 is a schematic structural view of the co-package module disposed on two sides of the first package substrate.

Fig. 7-9 are schematic diagrams of configurations in which connectors are disposed at different locations of a co-packaged module.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 3, an embodiment of the present invention provides a package structure, which includes: the package structure comprises a PCB (printed circuit board) 10, a first package substrate 20, a main chip 30, at least one co-package module 40 and at least one connector 50 corresponding to the co-package module; the first package substrate 20 is disposed on the PCB 10, the main chip 30, the connector 50 and the co-package module 40 are disposed on the first package substrate 20, the connector 50 and the co-package module 40 corresponding thereto are in contact with each other to form an electrical connection, and the main chip 30 and the connector 50 are separately disposed and electrically connected to each other through a wire.

In this embodiment, the PCB board 10 is a carrier for the above devices, and plays a role of fixing, electrically connecting and supporting.

In the present embodiment, the first package substrate 20 is an important component material of the chip package body, and mainly plays a role of carrying and protecting the main chip and the upper main chip 30 and the lower PCB 10. Wherein, the main chip 30 is determined according to different semiconductor devices, and the present invention is not described herein.

In this embodiment, the co-packaged module 40 is a replaceable module, which can be set according to the actually required semiconductor device and can be replaced to realize the required function.

As shown in fig. 4, the co-packaged module 40 may be an optical module. The optical module includes a second package substrate 41, a Digital Signal Processor (DSP) 42 and an optical device 43 are disposed on the second package substrate 41, the DSP 42 and the optical device 43 are interconnected through the second package substrate 41, and the optical device 43 can be used for connecting an external optical fiber.

As shown in fig. 5, the co-packaged module 40 may be an electrical module. The electrical module comprises a second package substrate 41 and electrical connectors 44, the electrical connectors 44 being usable for connecting external electrical cables.

It is understood that, in the present embodiment, there may be one or more co-packaged modules 40, and each co-packaged module 40 is correspondingly provided with one connector 50. As shown in fig. 6, the co-package module 40 may be disposed on the top surface of the first package substrate 20, or may be disposed on the bottom surface of the first package substrate 20.

In the present embodiment, the connector 50 is in contact with and electrically connected to the co-packaged module 40 through the second package substrate 41. The second package substrate 41 and the first package substrate 20 may be connected by welding, or may be pressed together by mechanical stress, which is not limited in the present invention.

As shown in fig. 7 to 9, the connector 50 may be disposed in various ways, for example, the connector is disposed at a side of the common package module 40 (including four sides), or disposed between the common package module 40 and the first package substrate 20, which are within the scope of the present invention.

In summary, the connector 50 is directly used for co-packaging the main chip 30 and the co-packaged module 40 in the present embodiment; and the co-packaging design of the optical fiber and the passive cable is compatible. Compared with the traditional optical module mode shown in fig. 1, the optical module has the advantages of small size, low power consumption, shorter wiring, small occupied space, better performance of high-speed signals and the like, and the cost is not increased much. Compared with the mainstream co-encapsulation technology shown in fig. 2, the embodiment can be compatible with the optical fiber and the passive cable at the same time, is more flexible, has a wider application range and a lower cost, has low requirements on manufacturing equipment, and is very suitable for mass production.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A package structure, comprising: the chip packaging structure comprises a PCB, a first packaging substrate, a main chip, at least one co-packaging module and at least one connector corresponding to the co-packaging module; the first packaging substrate is arranged on the PCB, the main chip, the connector and the common packaging module are all arranged on the first packaging substrate, the connector and the common packaging module corresponding to the connector are contacted to form electric connection, and the main chip and the connector are arranged in a separated mode and are electrically connected with the connector through wiring.

2. The package structure of claim 1, wherein the co-packaged module is an optical module.

3. The package structure of claim 1, wherein the co-packaged module is an electrical module.

4. The package structure of claim 1, wherein the co-packaged module comprises a second package substrate, and the connector makes contact and electrical connection with the co-packaged module through the second package substrate.

5. The package structure of claim 1, wherein the connector is disposed on a side of the co-packaged module.

6. The package structure of claim 1, wherein the connector is disposed between the co-packaged module and the first package substrate.

7. The package structure of claim 1, wherein the main chip and the co-package module are disposed on an upper side of the first package substrate.

8. The package structure of claim 1, wherein the main chip and the co-package module are disposed on upper and lower sides of the first package substrate.

9. The package structure of claim 4, wherein the second package substrate and the first package substrate are connected by soldering.

10. The package structure of claim 4, wherein the second package substrate and the first package substrate are crimped together by mechanical stress.