CN217469970U

CN217469970U - RF and DC combine optical module flexplate as an organic whole

Info

Publication number: CN217469970U
Application number: CN202221587480.2U
Authority: CN
Inventors: 张润泽; 黄庆; 张绍友
Original assignee: Wuxi Dekeli Optoelectronic Technology Co ltd; Chengdu Tac Genray Co ltd
Current assignee: Wuxi Dekeli Optoelectronic Technology Co ltd; Chengdu Tac Genray Co ltd
Priority date: 2022-06-23
Filing date: 2022-06-23
Publication date: 2022-09-20
Anticipated expiration: 2032-06-23

Abstract

The utility model relates to an optical module technical field discloses a RF and DC close optical module flexbile as an organic whole, including the flexbile plate body, flexbile plate body one end is provided with can carry out pad one of electricity connection with PCB end pad, and the other end is provided with can carry out pad two of electricity connection with optical device end pad. The utility model discloses the pad of well optical module flexible board body one is used for carrying out electric connection with PCB end pad, and pad two is used for carrying out the electricity with optical device end pad and is connected, has realized the signal transmission between the PCB circuit board of optical module and the optical device. The flexible board body integrates the RF flexible board and the DC flexible board into a whole, and the flexible board is designed into a flexible board, so that the flexible board is simple to produce, high in efficiency and low in cost.

Description

RF and DC combine optical module flexplate as an organic whole

Technical Field

The utility model relates to an optical module technical field, concretely relates to RF and DC close optical module flexplate as an organic whole.

Background

With the increase of the scale of the optical transmission system, the requirements of the optical module are gradually developing toward miniaturization and high density, and the functions are diversified.

The optical module includes an optical modulator chip and an electrical interface divided into a Radio Frequency (RF) flex for connecting to RF electrodes of high-speed signals and a Direct Current (DC) flex for connecting to DC electrodes controlling the optical modulator chip. And the existing optical module RF and DC flexible board is generally designed into two flexible boards separately, so that the cost is higher and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

Based on above problem, the utility model provides a RF and DC close optical module flexbile as an organic whole, the pad of optical module flexbile body one be used for carrying out electric connection with PCB end pad, pad two be used for with optical device end pad carry out the electricity be connected, realized the signal transmission between the PCB circuit board of optical module and the optical device. The flexible board body integrates the RF flexible board and the DC flexible board into a whole, and the flexible board is designed into a flexible board, so that the flexible board is simple to produce, high in efficiency and low in cost.

In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:

the utility model provides a RF and DC combine optical module flexplate as an organic whole, includes the flexplate body, and flexplate body one end is provided with can carries out the pad one that is connected electrically with PCB end pad, and the other end is provided with can carries out the pad two that is connected electrically with optical device end pad.

Further, the second bonding pad includes an RF bonding pad and a DC bonding pad.

Furthermore, the flexible board body comprises a printed circuit layer electrically connected with the first bonding pad and the second bonding pad, and insulating layers attached to two sides of the printed circuit layer.

Further, the printed circuit layer comprises an L1 layer, an L2 layer and an L3 layer which are arranged from top to bottom in sequence, wherein the L1 layer is used for walking RF high-speed lines; the L2 layer is positioned right below the high-speed line of the L1 layer and is a complete reference layer of the high-speed line and used for ensuring impedance continuity and the shortest signal return path; the L3 layer is used to walk the DC low speed lines.

Further, the L3 layer runs a part of the DC low-speed line, and the L2 layer runs another part of the DC low-speed line close to the edge of the flexible board body.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses the first pad of well optical module flexible board body is used for carrying out electric connection with PCB end pad, and pad two is used for carrying out the electricity with optical device end pad and is connected, has realized the signal transmission between the PCB circuit board of optical module and the optical device.

2. The flexible board body combines the RF flexible board and the DC flexible board into a whole, and the flexible board is designed into one flexible board, so that the flexible board is simple to produce, high in efficiency and low in cost.

Drawings

FIG. 1 is a schematic diagram illustrating an embodiment of an RF and DC integrated optical module flexible board;

FIG. 2 is a schematic structural diagram of a flexible board body according to an embodiment;

FIG. 3 is a schematic diagram of the layout and structure of the L1 layer and the L2 layer of the printed circuit layer in an embodiment;

FIG. 4 is a schematic diagram of an exemplary embodiment of a printed circuit layer L3 layer layout structure;

wherein: 1. a flexible board body; 2. a first bonding pad; 3. an RF bonding pad; 4. a DC bonding pad; 5. a printed circuit layer; 6. an insulating layer.

Detailed Description

To make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the following examples and drawings, and the exemplary embodiments and descriptions thereof of the present invention are only used for explaining the present invention, and are not intended as limitations of the present invention.

Example (b):

referring to fig. 1-4, an RF and DC integrated optical module flexible board includes a flexible board body 1, a first bonding pad 2 electrically connected to a bonding pad at a PCB end is disposed at one end of the flexible board body 1, and a second bonding pad electrically connected to a bonding pad at an optical device end is disposed at the other end of the flexible board body.

In this embodiment, a TOSA optical device is taken as an example for explanation, the first bonding pad 2 of the optical module flexible board body 1 is used for being electrically connected with a bonding pad at a PCB end, and the second bonding pad is used for being electrically connected with a bonding pad at an optical device end, so that signal transmission between the PCB circuit board of the optical module and the TOSA optical device is realized.

The second bonding pad comprises an RF bonding pad 3 and a DC bonding pad 4, the flexible board body 1 in the embodiment integrates the traditional RF and DC flexible boards into a whole, and the flexible board is designed into a flexible board, so that the production is simple, the efficiency is high, and the cost is low.

The integrated optical module flexible board design in the embodiment can be applied to high-speed optical module products such as 10G/40G/50G/100G/200G/400G/800G and the like.

The flexible board body 1 comprises a printed circuit layer 5 electrically connected with a first bonding pad 2 and a second bonding pad, and insulating layers 6 attached to two sides of the printed circuit layer 5; the insulating layer 6 can avoid the problem that short circuit is generated due to mutual contact between the printed circuit layer 5 or the bonding pad, and the stability of high-frequency and low-frequency signal transmission of the optical module is ensured.

The printed circuit layer 5 in the embodiment comprises an L1 layer, an L2 layer and an L3 layer which are arranged from top to bottom in sequence, wherein the L1 layer is used for walking RF high-speed lines; the L2 layer is positioned right below the high-speed line of the L1 layer and is a complete reference layer of the high-speed line, so that the impedance continuity and the shortest signal return path can be ensured; the L3 layer is used to walk the DC low speed lines. The RF and DC low-speed lines are isolated as much as possible, and signals are prevented from interfering with each other.

In this embodiment, the L3 layer runs part of the DC low speed line; the L2 layer is close to the edge of the flexible board body 1 and runs another part of DC low-speed line (dotted line in figure 3), avoids the direct lower side of the high-speed line, does not damage the reference plane of the high-speed line, enables the RF and the DC low-speed line to be isolated as much as possible, and prevents signals from interfering with each other.

The above is the embodiment of the present invention. The specific parameters in the above embodiments and embodiments are only for the purpose of clearly expressing the verification process of the present invention, and are not used to limit the patent protection scope of the present invention, the patent protection scope of the present invention is still subject to the claims, and all the equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the protection scope of the present invention.

Claims

1. An optical module flexible board integrating RF and DC is characterized in that: the flexible printed circuit board comprises a flexible board body (1), wherein one end of the flexible board body (1) is provided with a first bonding pad (2) which can be electrically connected with a bonding pad at a PCB end, and the other end of the flexible board body is provided with a second bonding pad which can be electrically connected with a bonding pad at an optical device end.

2. The RF and DC integrated optical module flex of claim 1, wherein: the second bonding pad comprises an RF bonding pad (3) and a DC bonding pad (4).

3. The RF and DC integrated optical module flex of claim 1 or 2, wherein: the flexible board body (1) comprises a printed circuit layer (5) electrically connected with a first bonding pad (2) and a second bonding pad, and two insulating layers (6) attached to the two sides of the printed circuit layer (5).

4. The integrated RF and DC optical module patch of claim 3, wherein: the printed circuit layer (5) comprises an L1 layer, an L2 layer and an L3 layer which are arranged from top to bottom in sequence, and the L1 layer is used for walking RF high-speed lines; the L2 layer is positioned right below the high-speed line of the L1 layer and is a complete reference layer of the high-speed line and used for ensuring impedance continuity and the shortest signal return path; the L3 layer is used to walk DC low speed lines.

5. The integrated RF and DC optical module patch of claim 4, wherein: the L3 layer runs a part of DC low-speed line, and the L2 layer runs another part of DC low-speed line close to the edge of the flexible board body (1).