CN206226837U

CN206226837U - Optical module circuit board based on BOB layouts

Info

Publication number: CN206226837U
Application number: CN201621383279.7U
Authority: CN
Inventors: 宋娟娟
Original assignee: Shanghai Gongjin Communication Technology Co Ltd
Current assignee: Shanghai Gongjin Communication Technology Co Ltd
Priority date: 2016-12-16
Filing date: 2016-12-16
Publication date: 2017-06-06
Anticipated expiration: 2026-12-16

Abstract

The utility model is related to a kind of optical module circuit board based on BOB layouts, including mainboard, CPU module, DDR modules, BOB control lines, driving IC and BOSA devices, on described mainboard, described driving IC's described CPU module, DDR modules, BOB control lines, driving IC and BOSA devices is connected by described BOB control lines with described CPU module.Using the circuit board, it is directly connected to by 9 pins and mainboard of BOSA, simplifies cumbersome welding procedure in traditional optical module, the effective utilization rate for improving PCB reduces product cost, increases product reliability；Traditional optical module internal structure is also optimized, the internal circuit board of optical module is reduced, the length of product is shortened, the space of mainboard is improve, manufacturability is improved, fraction defective and human cost is reduced；Radome can also be increased and decreased according to the technical requirements of product, be with a wide range of applications.

Description

Optical module circuit board based on BOB layouts

Technical field

The utility model is related to technical field of photo communication, more particularly to optical module technical field, specifically refers to one kind and is based on The optical module circuit board of BOB layouts.

Background technology

With developing rapidly for city light net construction, the optic communication epoch arrive.Demand to optical mode plate is increasing.Pass System optical module by base, upper lid, BOSA (Bi-Directional Optical Sub-Assembly, light transceiver module), PCBA (Printed Circuit Board Assembly, IC printed board), PIN (pin), metal shell, dust plug Composition, its structure is cumbersome, size is larger, high expensive, and complex manufacturing, and fraction defective is high.In assembling, because it passes through 20 PINs and pcb board connect to realize signal transmission, as long as rosin joint occurs in a place, product then needs to reprocess or scrap.

Utility model content

The purpose of this utility model is the shortcoming for overcoming above-mentioned prior art, there is provided one kind can be laid out based on BOB Realize simplifying the welding procedure in optical module, improve the utilization rate of PCB and reduce the optical module circuit board of product cost.

To achieve these goals, the utility model has following composition：

This is based on the optical module circuit board of BOB layouts, including mainboard, CPU module, DDR modules, BOB control lines, driving IC With BOSA devices, described CPU module, DDR modules, BOB control lines, driving IC and BOSA devices is located at described mainboard On, described CPU module is connected with described DDR modules, described driving IC by described BOB control lines with it is described CPU module is connected, and described driving IC is connected with described BOSA devices.

It is preferred that described BOSA devices include multiple pins, described multiple pins are connected with described mainboard.

It is preferred that described circuit board also includes differential impedance control line, described driving IC is also by described difference Electric impedance control line is connected with described CPU module.

It is preferred that described circuit board also includes radome, described radome is arranged on described mainboard.

More preferably, described radome surrounds described driving IC and described BOSA devices.

The optical module circuit board based on BOB layouts in the utility model is employed, by 9 PIN and mainboard of BOSA It is directly connected to, simplifies welding procedure cumbersome in the middle of traditional optical module, it is simple for structure, reliable and stable, it is effective to improve PCB's Utilization rate, reduces product cost, increases product reliability；Traditional optical module internal structure is also optimized, optical module is reduced Internal circuit board, shortens the length of product, improves the space of mainboard, improves manufacturability, reduces fraction defective and people Power cost；Radome can also be increased and decreased according to the technical requirements of product, be with a wide range of applications.

Brief description of the drawings

Fig. 1 is the schematic diagram of the optical module circuit board based on BOB layouts of the present utility model.

Fig. 2 is the schematic layout pattern of the optical module circuit board based on BOB layouts of the present utility model.

Fig. 3 is the wiring diagram of the optical module circuit board based on BOB layouts of the present utility model.

Fig. 4 is the layout 3D schematic diagrames of the Without Shielding Cover of the optical module circuit board based on BOB layouts of the present utility model.

Fig. 5 is the layout 3D schematic diagrames for having radome of the optical module circuit board based on BOB layouts of the present utility model.

Description of reference numerals：

1 CPU module

2 DDR modules

3 BOB control lines

4 differential impedance control lines

5 radomes

6 drive IC

7 BOSA devices

Specific embodiment

In order to more clearly describe technology contents of the present utility model, traveling one is entered with reference to specific embodiment The description of step.

This is based on the optical module circuit board of BOB layouts, including mainboard, CPU module 1, DDR modules 2, BOB control lines 3, drive Dynamic IC6 and BOSA devices 7, described CPU module 1, DDR modules 2, BOB control lines 3, drive IC6 and BOSA devices 7 to be located at On described mainboard, described CPU module 1 is connected with described DDR modules 2, and described driving IC6 is by described BOB Control line 3 is connected with described CPU module 1, and described driving IC6 is connected with described BOSA devices 7.

In a kind of preferably implementation method, described BOSA devices include multiple pins, described multiple pins with Described mainboard is connected.

In a kind of preferably implementation method, described circuit board also includes differential impedance control line 4, described driving IC6 is also connected by described differential impedance control line 4 with described CPU module 1.

In a kind of preferably implementation method, described circuit board also includes radome 5, and described radome 5 is arranged at On described mainboard.

In a kind of more preferably implementation method, described radome 5 surrounds described driving IC and described BOSA devices.

As shown in figure 1, the design uses new design concept, and it is that a kind of space optical module of saving is designed, light can be reduced Module PCB usable floor area, to reach simplified production, the purpose of reduces cost, new BOB modules layout designs it is main from From the aspect of two：

1st, cancel the PCBA inside optical module, all devices are all moved on on mainboard；

2nd, radome can be customized according to the actual requirements.

As shown in Figures 2 and 3, the utility model technology is by BOSA and drive for a kind of specific embodiment of the present utility model The dynamic direct lay of circuit, can be according to the real space of mainboard on the mainboard of product, and it is appropriate to be carried out on the premise of performance is ensured Adjustment, flexibility ratio is high and save space.Existing ripe production technology can be by wave-soldering reality now for the BOSA encapsulation of 9pin It is existing, cross stove yield higher.Should be noted that the cabling of BOSA TX circuits should be as far as possible short when actual lay is designed；PON TX and PONRX does the control of 100 Ω ± 10% differential impedances, and does isometric treatment.

In another specific embodiment, as shown in Figure 4 and Figure 5, can also be determined according to the actual technical requirements of product Whether upper part is needed, to meet the shipment demand of different clients and area, also there is stronger flexibility ratio in terms of cost control.

In this description, the utility model is described with reference to its specific embodiment.But it is clear that still can be with Various modification can be adapted and conversion is without departing from spirit and scope of the present utility model.Therefore, specification and drawings are considered as It is illustrative and not restrictive.

Claims

1. it is a kind of based on BOB layout optical module circuit board, it is characterised in that described circuit board include mainboard, CPU module, DDR modules, BOB control lines, drive IC and BOSA devices, described CPU module, DDR modules, BOB control lines, drive IC and On described mainboard, described CPU module is connected BOSA devices with described DDR modules, and described driving IC leads to Cross described BOB control lines to be connected with described CPU module, described driving IC is connected with described BOSA devices.

2. it is according to claim 1 based on BOB layout optical module circuit board, it is characterised in that described BOSA devices Including multiple pins, described multiple pins are connected with described mainboard.

3. it is according to claim 1 based on BOB layout optical module circuit board, it is characterised in that described circuit board is also Including differential impedance control line, described driving IC is also connected by described differential impedance control line with described CPU module Connect.

4. it is according to claim 1 based on BOB layout optical module circuit board, it is characterised in that described circuit board is also Including radome, described radome is arranged on described mainboard.

5. it is according to claim 4 based on BOB layout optical module circuit board, it is characterised in that described radome bag Enclose described driving IC and described BOSA devices.