CN210835354U

CN210835354U - Optical module and communication device

Info

Publication number: CN210835354U
Application number: CN201922133591.0U
Authority: CN
Inventors: 黄愚; 周斌; 陈骁; 李海坚; 黄旭
Original assignee: Guangwei Technology Guangzhou Co ltd
Current assignee: Guangwei Technology Guangzhou Co ltd; Liturex Guangzhou Co Ltd
Priority date: 2019-11-30
Filing date: 2019-11-30
Publication date: 2020-06-23
Anticipated expiration: 2029-11-30

Abstract

The utility model discloses an optical module and communication equipment, wherein the optical module includes base plate, electric chip, high-speed signal line and electric capacity are located on the base plate, electric capacity is connected electric chip with between the high-speed signal line, electric capacity includes first polar plate and second polar plate, first polar plate pass through the signal bonding line with the corresponding pad of electric chip is connected, the second polar plate with the high-speed signal line is connected. Because the electric chip is directly connected to the capacitor through the bonding wire, the capacitor is connected to the high-speed signal wire, and the electric chip is not connected to the high-speed signal wire through the bonding wire and the capacitor is arranged in the middle section of the path of the high-speed signal wire, the impedance discontinuity point on the high-speed signal transmission path is reduced, and the integrity of the high-speed signal is improved.

Description

Optical module and communication device

Technical Field

The utility model relates to an optical communication technical field especially relates to an optical module and communication equipment.

Background

With the rapid development of modern optical fiber communication, the optical transmission rate is rapidly increased, and especially under the requirement of a 5G system, the signal rate of an optical device is higher and higher, and meanwhile, the power consumption and the price of the optical device are required to be smaller. Therefore, the COB (chip optical module) structure has started to be used for a large scale, and the COB optical module structure is characterized by being simple, and all the optical and electrical devices are placed on the substrate (the substrate may be a circuit board or a metal plate). Therefore, a box body and a process for packaging the OSA are omitted, and the structure is greatly simplified. However, the too simple structure brings new problems, no matter what structure, the high-speed electrical signal is transmitted between the optical module and the electrical chip, and the gold wire bonding (commonly called gold wire bonding) is often used for building the high-speed electrical signal, which is the application of one gold wire bonding as shown in fig. 2. With the improvement of modern communication speed, high-speed lines for signal transmission have higher and higher signal integrity requirements, that is, requirements for signal transmission without errors are met for high-speed electric signals, a signal transmission path must have impedance continuity, gold wires are used as connection parts and are often places for destroying impedance continuity, and the length of the gold wires has a great influence on impedance discontinuity, so that the gold wires on the high-speed lines are generally required to be as short as possible. Referring to fig. 1 and fig. 2, which are a conventional BOX package structure and a COB structure, respectively, it can be seen that in the BOX package structure, due to the step structure 101 inside the BOX, the heights of the electrical chip 102 and the gold wire bonding pad 103 are substantially flush, so that the length of the gold wire 104 can be extremely short; in the COB structure (taking the substrate as the circuit board 200 as an example), the wire bonding pad 203 is on the surface of the circuit board 200, and the chip 202 is also attached to the circuit board 200, so that the wire bonding pad 205 on the chip 202 and the wire bonding pad 203 on the circuit board 200 have a height difference, and due to the process characteristics of the gold wire 204, the height difference will tend to increase the length of the gold wire 204, which in turn will affect the impedance continuity of the high-speed circuit, resulting in the problem of signal integrity. The optical module exhibits such performances as poor eye pattern and reduced sensitivity in terms of overall performance. On the high-speed signal line path of the optical module with the typical COB structure shown in fig. 2, both sides of the bond wire 204 and both sides of the capacitor 206 are positions where impedance discontinuities occur, which may compromise signal integrity.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an optical module can reduce the impedance discontinuity on the high-speed signal transmission route, improves the integrality of high-speed signal.

Another object of the present invention is to provide a communication device, which can reduce impedance discontinuity on a high-speed signal transmission path and improve the integrity of a high-speed signal.

In order to realize the above object, the utility model provides an optical module, including base plate, electric chip, high-speed signal line and electric capacity are located on the base plate, electric capacity is connected electric chip with between the high-speed signal line, electric capacity includes first polar plate and second polar plate, first polar plate pass through the signal bonding wire with the corresponding pad of electric chip is connected, the second polar plate with the high-speed signal line is connected.

Preferably, the substrate is provided with two capacitor pads corresponding to the capacitors, one of the two capacitor pads is connected to the high-speed signal line, and the first and second plates of the capacitors are respectively soldered to the two capacitor pads.

Preferably, a capacitor pad corresponding to the capacitor and connected to the high-speed signal line is disposed on the substrate, the second plate of the capacitor is soldered to the capacitor pad, and the first plate of the capacitor faces upward.

Preferably, the first plate of the capacitor is disposed proximate to the electrical chip.

Preferably, the signal bonding wire is bonded on the upper surface of the first plate of the capacitor.

Preferably, the optical module is a COB optical module.

Preferably, an end of the high-speed signal line opposite to the capacitor is connected to an optical chip or a connector.

Preferably, a metal ground is further disposed on the substrate, and the electric chip is bonded to the metal ground through a ground bonding wire.

To achieve the above another object, the present invention provides a communication device including the optical module as described above.

Compared with the prior art, the utility model discloses the electric capacity of optical module is connected between electric chip and high-speed signal line, and the first polar plate of electric capacity passes through the signal bonding line and is connected with the pad of electric chip, and the second polar plate and the high-speed signal line of electric capacity are connected. That is to say, in the utility model discloses in, electric chip is through bonding wire lug connection to electric capacity, and electric capacity reconnection to high-speed signal line, rather than connecting to high-speed signal line and establishing electric capacity in the route middle section of high-speed signal line through the bonding wire, and then has reduced the impedance discontinuity on the high-speed signal transmission route, has improved the integrality of high-speed signal.

Drawings

Fig. 1 is a schematic perspective view of an optical module of a conventional BOX package structure.

Fig. 2 is a schematic perspective view of an optical module of a conventional COB package structure.

Fig. 3 is a schematic perspective view of an optical module according to an embodiment of the present invention.

Fig. 4 is an enlarged schematic view of a portion a in fig. 3.

Fig. 5 is a schematic perspective view of an optical module according to another embodiment of the present invention.

Fig. 6 is an enlarged schematic view of a portion B in fig. 5.

Detailed Description

In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.

Please refer to fig. 3 to 6, the utility model discloses an optical module, including base plate 1, electric chip 2, high-speed signal line 3 and electric capacity 4/5, electric chip 2, high-speed signal line 3 and electric capacity 4/5 are located on base plate 1, electric capacity 4/5 is connected between electric chip 2 and high-speed signal line 3, electric capacity 4/5 includes first polar plate 41/51 and second polar plate 42/52, first polar plate 41/51 is connected with electric chip 2's corresponding pad 21 through signal bonding wire 6, second polar plate 42/52 is connected with high-speed signal line 3. Generally, the signal bonding wire 6 is bonded to the upper surface of the first plate 41/51, but not limited thereto. In the example shown in the drawing, the optical module includes two high-speed signal lines 3, and capacitances 4/5 are connected between the two high-speed signal lines 3 and corresponding pads 21 of the electric chip 2, respectively. The "optical module" herein may be an optical module having a COB or BOX package structure, and is not limited herein.

The utility model discloses the electric chip 2 of optical module is through bonding wire 6 lug connection to electric capacity 4/5, electric capacity 4/5 reconnects to high-speed signal line 3, rather than connect to high-speed signal line 3 through bonding wire 6 and establish electric capacity 4/5 in the route middle section of high-speed signal line 3 (be equivalent to having removed one section high-speed signal line 3 between electric capacity 4/5 and the signal bonding wire 6), and then reduced the impedance discontinuity on the high-speed signal transmission route, the integrality of high-speed signal has been improved.

Referring to fig. 3 and 4, in some embodiments, two capacitor pads 7 corresponding to the capacitor 4 are disposed on the substrate 1, one of the two capacitor pads 7 is connected to the high-speed signal line 3, and the first plate 41 and the second plate 42 of the capacitor 4 are respectively soldered on the two capacitor pads 7. In the example shown in fig. 5, since the two high-speed signal lines 3 and the electric chip 2 are connected with the capacitors 4, respectively, two capacitor pads 7 are provided on the substrate 1 for the two capacitors 4, respectively.

Referring to fig. 5 and 6, in other embodiments, a capacitor pad 8 corresponding to the capacitor 5 and connected to the high-speed signal line 3 is disposed on the substrate 1, the second plate 52 of the capacitor 5 is soldered to the capacitor pad 8, and the first plate 51 of the capacitor 5 faces upward. In the example shown in fig. 6, since the two high-speed signal lines 3 and the electric chip 2 are connected with the capacitors 5, respectively, one capacitor pad 8 is provided on the substrate 1 for each of the two capacitors 5.

Referring to fig. 3-6, in a preferred embodiment, the first plate 41/51 of the capacitor 4/5 is disposed proximate to the electrical chip 2. Generally speaking, the capacitor 4/5 is spaced from the electrical chip 2 by a small distance to avoid interference with the electrical chip 2, although it is not excluded that the capacitor 4/5 and the electrical chip 2 are in contact with each other, as long as the interference between the capacitor 4/5 and the electrical chip 2 can be controlled, and can be as close as possible. Since the first plate 41/51 of the capacitor 4/5 is disposed next to the electrical chip 2, and the capacitor 4/5 itself has a certain height, when the corresponding pad 21 of the electrical chip 2 and the first plate 41/51 of the capacitor 4/5 are connected by the signal bonding wire 6, the bonding position of the signal bonding wire 6 on the first plate 41/51 may have a certain height relative to the substrate 1, which is favorable for reducing the height difference between the bonding position of the corresponding pad 21 of the electrical chip 2 and the bonding position on the first plate 41/51, so that the length of the signal bonding wire 6 may be shortened. Generally, the signal bonding wire 6 is bonded on the upper surface of the first plate 41/51 of the capacitor 4/5 to facilitate the wire bonding operation of the signal bonding wire 6 and reduce the height difference of the wire bonding, but not limited thereto.

Specifically, the optical module is a COB optical module, but not limited thereto.

Referring to fig. 3 and 5, in some embodiments, the end of the high-speed signal line 3 opposite to the capacitor 4/5 is connected to an optical chip (not shown) or a connector (not shown). In the specific example shown in the drawing, the end of the high-speed signal line 3 opposite to the capacitance 4/5 is connected with a gold finger 9 to be connected with a connector through the gold finger 9.

Referring to fig. 3 to 6, in some embodiments, a metal ground 10 is further disposed on the substrate 1, and the electric chip 2 is bonded to the metal ground 10 through a ground bonding wire 11.

Please refer to fig. 3 to fig. 6, the present invention further discloses a communication device, which includes the optical module as described above.

To sum up, the utility model discloses a electric capacity 4/5 of optical module is connected between electric chip 2 and high-speed signal line 3, and first polar plate 41/51 of electric capacity 4/5 passes through signal bonding wire 6 to be connected with electric chip 2's pad 21, and electric capacity 4/5's second polar plate 42/52 is connected with high-speed signal line 3. That is to say, in the utility model discloses in, electric chip 2 is through bonding wire 6 lug connection to electric capacity 4/5, and electric capacity 4/5 reconnects to high-speed signal line 3, and is not connected to high-speed signal line 3 through bonding wire 6 and establishes electric capacity 4/5 in the path middle section of high-speed signal line 3, and then has reduced the impedance discontinuity on the high-speed signal transmission path, has improved the integrality of high-speed signal. Moreover, the utility model discloses implementation is simple, easily realizes.

The above disclosure is only a preferred embodiment of the present invention, and the scope of the claims of the present invention should not be limited thereby, and all the equivalent changes made in the claims of the present invention are intended to be covered by the present invention.

Claims

1. An optical module is characterized by comprising a substrate, an electric chip, a high-speed signal line and a capacitor, wherein the electric chip, the high-speed signal line and the capacitor are arranged on the substrate, the capacitor is connected between the electric chip and the high-speed signal line, the capacitor comprises a first polar plate and a second polar plate, the first polar plate is connected with a corresponding bonding pad of the electric chip through a signal bonding wire, and the second polar plate is connected with the high-speed signal line.

2. The optical module according to claim 1, wherein two capacitor pads corresponding to the capacitors are provided on the substrate, one of the two capacitor pads is connected to the high-speed signal line, and a first plate and a second plate of the capacitors are respectively soldered to the two capacitor pads.

3. The optical module according to claim 1, wherein a capacitor pad corresponding to the capacitor and connected to the high-speed signal line is provided on the substrate, the second plate of the capacitor is soldered to the capacitor pad, and the first plate of the capacitor is faced upward.

4. A light module as claimed in claim 2 or 3, characterized in that the first plate of the capacitor is arranged next to the electric chip.

5. The optical module of claim 4 wherein the signal bond wire is bonded to an upper surface of the first plate of the capacitor.

6. The optical module of claim 4, wherein the optical module is a COB optical module.

7. An optical module as claimed in claim 1, wherein an end of the high speed signal line opposite to the capacitor is connected to an optical chip or a connector.

8. The optical module of claim 1, wherein said substrate further has a metal ground thereon, and said electrical chip is bonded to said metal ground by a ground wire bond.

9. A communication device, characterized in that it comprises a light module according to any one of claims 1 to 8.