CN217588914U - Copper substrate structure of current field effect tube - Google Patents
Copper substrate structure of current field effect tube Download PDFInfo
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- CN217588914U CN217588914U CN202123456875.7U CN202123456875U CN217588914U CN 217588914 U CN217588914 U CN 217588914U CN 202123456875 U CN202123456875 U CN 202123456875U CN 217588914 U CN217588914 U CN 217588914U
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- connecting seat
- heat dissipation
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Abstract
The utility model relates to a copper substrate structure of current field effect transistor. Including electrically conductive base and the electrode connecting seat of mutually supporting the connection, electrically conductive heat dissipation base covers copper heat dissipation base body for integrated into one piece, it is close to cover copper heat dissipation base body a side middle part of electrode connecting seat is provided with the cooperation recess, it is provided with printed circuit board to cover between copper heat dissipation base body and the electrode connecting seat, printed circuit board with the cooperation recess is mutually supported and is connected, printed circuit board is close to a side of electrode connecting seat is the circuit soldering quotation, it is the calibration face to cover a side that copper heat dissipation base body is close to the electrode connecting seat, circuit soldering quotation and calibration face are same level. The utility model discloses the practicality is strong, can effectively solve the problem that can't realize SMT automated production, avoids the low problem of radiating effect simultaneously.
Description
Technical Field
The utility model relates to an electronic information product's encapsulation technical field, concretely relates to electric current field effect tube's copper substrate structure.
Background
The field effect transistor, also known as a field effect transistor, is mainly characterized by two types, namely a junction field effect transistor and a metal oxide semiconductor field effect transistor, and is also called a unipolar transistor, wherein most carriers participate in conduction. The semiconductor device controls the current of an output loop by using the electric field effect of a control input loop, has the advantages of high input resistance (107-1015 omega), low noise, low power consumption, large dynamic range, easy integration, no secondary breakdown phenomenon, wide safe working area and the like, and is widely applied to the industrial fields of synchronous rectification switching power supplies and pulse power supplies.
The packaging structure who relates to field effect transistor among the prior art generally is for with field effect transistor beading on the circuit board, recycles the circuit board laminating on corresponding electric heat dissipation copper billet, carries out encapsulation work at last, and the field effect transistor of current encapsulation work has following problem: the field effect transistor welds electrically conductive copper block and circuit board and makes each field effect transistor parallelly connected through the pin, and this will cause electrically conductive copper block face and PCB pad face not on same horizontal plane, will influence processing scheme, causes unable realization SMT's automated production, simultaneously, there is the radiating effect difference in this kind of structural style, problem that manufacturing cost is high.
SUMMERY OF THE UTILITY MODEL
The utility model provides a solve above-mentioned not enough, provide a current field effect tube's copper base plate structure, this copper base plate structural design is reasonable, can effectively solve the problem that can't realize SMT automated production, avoids the problem that the radiating effect is low simultaneously.
The above object of the present invention is achieved by the following technical solutions:
the utility model provides a copper base plate structure of current field effect transistor, is including the electrically conductive heat dissipation base and the electrode connecting seat that mutually support and connect, electrically conductive heat dissipation base covers the copper heat dissipation base body for integrated into one piece, it is close to cover the copper heat dissipation base body a side middle part of electrode connecting seat is provided with the cooperation recess, it is provided with printed circuit board to cover between copper heat dissipation base body and the electrode connecting seat, printed circuit board with the cooperation recess is mutually supported and is connected, printed circuit board is close to a side of electrode connecting seat is the circuit bonding pad face, it is the calibration face to cover a side that the copper heat dissipation base body is close to the electrode connecting seat, circuit bonding pad face and calibration face are same level.
Furthermore, in the above technical solution, the limit vertical height of the printed circuit board relative to the electrode connecting seat is a, the limit vertical height of the matching groove relative to the electrode connecting seat is b, and a is equal to b.
Furthermore, in the above technical solution, the electrode connecting base is in a strip shape, and positioning members are disposed on two sides of the electrode connecting base, the electrode connecting base is located above the printed circuit board, and the positioning members penetrate through the electrode connecting base and the printed circuit board and are connected with the copper-clad heat dissipation base body; still be provided with the field effect nest of tubes of symmetry setting on the copper-clad heat dissipation base body, the field effect nest of tubes includes G/S utmost point pin and D level pin, G/S utmost point pin orientation electrode connecting seat just with printed circuit board is connected, D level pin with copper-clad heat dissipation base body connects.
Further, in the above technical solution, the printed circuit board includes a copper foil layer, an insulating layer, and a copper plate body, the copper plate body is connected to the inner wall surface of the fitting groove in a fitting manner, one side surface of the insulating layer is connected to the copper plate body, the other side surface is connected to the copper foil layer, and a bonding adhesive is disposed between the copper plate body and the insulating layer.
In the above technical solution, the laminating adhesive is one of or a combination of a polyvinyl acetate adhesive and a chloroprene rubber adhesive.
Further, in the above technical solution, the specific shapes of the matching groove and the printed circuit board include one or a combination of more of a rectangle, a zigzag, a triangle and a circle.
Further, in the above technical solution, heat dissipation copper exposure layers are further disposed on two sides of the copper-clad heat dissipation base body.
The beneficial effects of the utility model reside in that:
the packaging structure of the high-current field-effect tube capable of realizing automatic production in field-effect tube packaging production automation is designed by adopting a copper-based printed circuit board integrated with a conductive heat-dissipation copper block welded and attached to the printed circuit board by the field-effect tube, so that automatic production of the existing SMT production equipment is realized, and the production efficiency of the equipment is effectively improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention, the drawings that are used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is another schematic structural diagram of the present invention.
The names of the components corresponding to the numerical identifiers in fig. 1 to 2 are as follows:
a copper-clad heat dissipation base body-1; a matching groove-11; a printed wiring board-12; line land-13; calibration plane-14; copper foil layer-15; an insulating layer-16; a copper plate body-17; laminating adhesive-18; a positioning piece-2; a field effect tube group-3.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings, and in the description of the present invention, it should be noted that:
the term "connected" is to be understood broadly, and may be mechanical or electrical; they may be connected directly or indirectly through intervening media, or may be interconnected between two elements.
The terms "front", "rear", "side", "upper" and "lower" are used in the following description based on the orientation and positional relationship shown in the drawings, and are only for convenience of description of the present invention.
For those skilled in the art, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent, and is not within the protection scope of the present invention.
The present invention is further described with reference to the following specific examples, but it should be noted that the present invention is implemented on the premise of the technical solution of the present invention, and detailed embodiments and specific operation procedures are given, but the scope of the present invention is not limited to the following examples.
As shown in fig. 1 to 2, the best embodiment of this example is:
the utility model provides a copper substrate structure of current field effect transistor, is including the electrically conductive base and the electrode connecting seat of mutually supporting the connection, electrically conductive heat dissipation base covers copper heat dissipation base body 1 for integrated into one piece, it is close to cover copper heat dissipation base body 1 a side middle part of electrode connecting seat is provided with cooperation recess 11, it is provided with printed circuit board 12 to cover between copper heat dissipation base body 1 and the electrode connecting seat.
In this embodiment, a large-current field-effect transistor packaging structure capable of realizing automatic production in field-effect transistor packaging production automation is designed by adopting a copper-based printed circuit board 12 in which a conductive heat dissipation copper block welded and attached to the printed circuit board 12 is integrated with a field-effect transistor, so that automatic production by using the existing SMT production equipment is realized, and the production efficiency of the equipment is effectively improved.
Preferably, the printed circuit board 12 and the matching groove 11 are matched and connected with each other, one side surface of the printed circuit board 12 close to the electrode connecting seat is a circuit pad surface 13, one side surface of the copper-clad heat dissipation base body 1 close to the electrode connecting seat is a calibration surface 14, and the circuit pad surface 13 and the calibration surface 14 are at the same horizontal height.
In the present embodiment, the control wiring pad face 13 and the calibration face 14 are coated at the same level.
As shown in fig. 1 to 2, the limit vertical height of the printed circuit board 12 with respect to the electrode connection holder is a, and the limit vertical height of the fitting groove 11 with respect to the electrode connection holder is b, where a is equal to b.
In this embodiment, it is preferable to define the groove and sink the PCB board height synchronization rate.
As shown in fig. 1, the electrode connecting base is strip-shaped, positioning members 2 are arranged on two sides of the electrode connecting base, the electrode connecting base is located above the printed circuit board 12, and the positioning members 2 penetrate through the electrode connecting base and the printed circuit board 12 to be connected with the copper-clad heat dissipation base body 1; the copper-clad heat dissipation base body 1 is further provided with field effect tube groups 3 which are symmetrically arranged, each field effect tube group 3 comprises a G/S pole pin and a D-level pin, the G/S pole pins face the electrode connecting seat and are connected with the printed circuit board 12, and the D-level pins are connected with the copper-clad heat dissipation base body 1.
As shown in fig. 1 and 2, the printed circuit board 12 includes a copper foil layer 15, an insulating layer 16, and a copper plate body 17, wherein the copper plate body 17 is connected to an inner wall surface of the matching groove 11 in a matching manner, one side surface of the insulating layer 16 is connected to the copper plate body 17, the other side surface is connected to the copper foil layer 15, a laminating adhesive 18 is disposed between the copper plate body 17 and the insulating layer 16, and the laminating adhesive 18 is one or a combination of a polyvinyl acetate adhesive and a chloroprene rubber adhesive.
In this embodiment, the copper plate body 17 and the insulating layer 16 are close-bonded by the adhesive paste 18.
As shown in fig. 1, the specific shapes of the matching groove 11 and the printed circuit board 12 include one or a combination of more of a rectangle, a fold line, a triangle and a circle, and heat dissipation copper exposure layers are further disposed on two sides of the copper-clad heat dissipation base body 1.
In this embodiment, the heat dissipation capability of the base body is improved by preferably adopting the heat dissipation copper exposed layers arranged on the two sides of the copper-clad heat dissipation base body.
The above is to the preferred embodiment of the present invention specifically explained, not therefore the limitation the patent scope of the present invention, all in the concept of the present invention, utilize the equivalent structure change made by the content of the specification and the attached drawings, or directly/indirectly use in other related technical fields all included in the patent protection scope of the present invention.
Claims (6)
1. The utility model provides a copper substrate structure of electric current field effect transistor, includes electrically conductive heat dissipation base and the electrode connecting seat that mutually supports and connect, its characterized in that: the copper-clad heat dissipation base body (1) is formed by integrally covering the conductive heat dissipation base, the copper-clad heat dissipation base body (1) is close to the middle part of one side face of the electrode connecting seat is provided with a matching groove (11), a printed circuit board (12) is arranged between the copper-clad heat dissipation base body (1) and the electrode connecting seat, the printed circuit board (12) is matched and connected with the matching groove (11), the printed circuit board (12) is close to one side face of the electrode connecting seat and is a circuit welding disc face (13), one side face, close to the electrode connecting seat, of the copper-clad heat dissipation base body (1) is a calibration face (14), and the circuit welding disc face (13) and the calibration face (14) are at the same horizontal height.
2. The copper substrate structure of a current field effect transistor according to claim 1, wherein: the limit vertical height of the printed circuit board (12) relative to the electrode connecting seat is a, the limit vertical height of the matching groove (11) relative to the electrode connecting seat is b, and a is equal to b.
3. The copper substrate structure of a current field effect transistor according to claim 2, wherein: the electrode connecting seat is in a strip shape, positioning pieces (2) are arranged on two sides of the electrode connecting seat, the electrode connecting seat is positioned above the printed circuit board (12), and the positioning pieces (2) penetrate through the electrode connecting seat and the printed circuit board (12) and are connected with the copper-clad heat-dissipation base body (1);
still be provided with field effect nest of tubes (3) that the symmetry set up on the copper-clad heat dissipation base body (1), field effect nest of tubes (3) include G/S utmost point pin and D level pin, G/S utmost point pin orientation electrode connecting seat and with printed circuit board (12) are connected, D level pin with copper-clad heat dissipation base body (1) are connected.
4. A cu substrate structure for a current field effect transistor according to claim 3, wherein: the printed circuit board (12) comprises a copper foil layer (15), an insulating layer (16) and a copper plate body (17), the copper plate body (17) is connected with the inner wall surface of the matching groove (11) in a matching mode, one side surface of the insulating layer (16) is connected with the copper plate body (17), the other side surface of the insulating layer is connected with the copper foil layer (15), and a laminating adhesive (18) is arranged between the copper plate body (17) and the insulating layer (16).
5. The copper substrate structure of a current field effect transistor according to claim 4, wherein: the specific shapes of the matching groove (11) and the printed circuit board (12) comprise one or more of a rectangle, a fold line, a triangle and a circle.
6. The copper substrate structure of a current field effect transistor according to claim 1, wherein: and heat dissipation copper exposure layers are further arranged on two sides of the copper-clad heat dissipation base body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123456875.7U CN217588914U (en) | 2021-12-28 | 2021-12-28 | Copper substrate structure of current field effect tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123456875.7U CN217588914U (en) | 2021-12-28 | 2021-12-28 | Copper substrate structure of current field effect tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217588914U true CN217588914U (en) | 2022-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123456875.7U Active CN217588914U (en) | 2021-12-28 | 2021-12-28 | Copper substrate structure of current field effect tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217588914U (en) |
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2021
- 2021-12-28 CN CN202123456875.7U patent/CN217588914U/en active Active
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