CN217577382U

CN217577382U - Wafer on-chip blanking machine based on robot

Info

Publication number: CN217577382U
Application number: CN202221836201.1U
Authority: CN
Inventors: 杜进团; 赖雄华; 饶富林
Original assignee: Xiamen Kongzhi Electronic Technology Co ltd
Current assignee: Xiamen Kongzhi Electronic Technology Co ltd
Priority date: 2022-07-15
Filing date: 2022-07-15
Publication date: 2022-10-14
Anticipated expiration: 2032-07-15

Abstract

The utility model discloses a wafer feeding and discharging machine based on a robot, which comprises a frame, a workbench fixed in the frame, a tool conveying mechanism arranged above the workbench, a plurality of tools placed on the tool conveying mechanism, baskets arranged at the side of the tool conveying mechanism, a first visual positioning system arranged right above the baskets, a feeding and discharging robot fixed at the top of the frame and a second visual positioning system fixed on the feeding and discharging robot; the tooling on seted up a plurality of wafer piece groove, the end of going up unloading robot is installed and is used for snatching the wafer piece in the wafer piece groove to in the basket utensil or will the wafer piece in the basket utensil snatchs to the subassembly that snatchs in the wafer piece groove. The utility model discloses can replace the artifical unloading of going up of the automation that realizes the wafer, reduce the cost of labor, promote stability and yield, reduce the product disability rate.

Description

Wafer on-chip blanking machine based on robot

Technical Field

The utility model relates to an automatic unloader technical field on, in particular to unloader on wafer based on robot.

Background

The semiconductor chip industry has a process that the wafer is processed in the early stage, and the process needs to grind, polish and clean the surface of the wafer and then take out and insert the wafer into a special basket. At the moment, the wafer is taken out of the tool, so that great difficulty is caused, the surface of the polished and cleaned wafer cannot be contacted with any object, the wafer is thin and brittle, the supporting surface of the tool for grinding and polishing does not have any notch, and the wafer is tightly attached to the plane of the tool. At present, the wafer is manually tilted by adopting a thin sheet, wherein the wafer breakage rate is more than 1 percent due to manual proficiency, mechanical control, working fatigue and the like, and the production cost is greatly improved.

Disclosure of Invention

To the technical problem who exists in the background art, the utility model aims to provide a wafer unloading machine on can replace the manual work to get the piece based on the wafer of robot, promotes stability and yield.

In order to realize the purpose, the utility model adopts the technical scheme as follows:

the utility model provides a wafer sheet feeding and discharging machine based on robot, includes the frame, fixes inside workstation of frame, establish the frock conveying mechanism of workstation top, place a plurality of frocks on the frock conveying mechanism, establish the basket utensil of frock conveying mechanism side, establish first vision positioning system directly over the basket utensil, fix the last unloading robot at frame top and fix go up the second vision positioning system on the unloading robot. The tooling on seted up a plurality of wafer piece groove, the end of going up unloading robot is installed and is used for snatching the wafer piece in the wafer piece groove to in the basket utensil or will the wafer piece in the basket utensil snatchs to the subassembly that snatchs in the wafer piece groove.

Further, the grabbing component comprises a connecting block fixed at the tail end of the feeding and discharging robot, a sucker connecting column fixed on one side of the connecting block, an air pipe connector fixed on the other side of the connecting block, a sucker extending pipe arranged on the sucker connecting column and communicated with the air pipe connector, and a sucker arranged at the tail end of the sucker extending pipe and used for sucking and grabbing the wafer. One side of the wafer piece is provided with a chamfer, and the tail end of the sucker is provided with a pointed block which is used for inserting and tilting the wafer piece from the chamfer of the wafer piece.

Preferably, in order to improve stability better, last unloading robot's end is installed multidimensional pressure sensor, the connecting block fix multidimensional pressure sensor bottom.

The wafer is circular, and the cutting angle is a fan-shaped cutting angle.

Preferably, in order to better realize the positioning of the tool, one or more sensors for positioning the tool are fixedly mounted on the side edge of the tool conveying mechanism.

Preferably, in order to ensure the stability during the sheet taking, one or more air cylinders for laterally pushing the tool when the tool runs in place are fixedly mounted on the side edge of the tool conveying mechanism.

Further, the feeding and discharging robot is a six-axis industrial robot.

Further, frock conveying mechanism be band conveyer, band conveyer establish through a plurality of supporting plates grillages the workstation top.

Further, the two sides of the rack are provided with a tool feeding port and a tool discharging port at positions corresponding to the tool conveying mechanism respectively.

Furthermore, a display and a plurality of operating buttons are arranged on the upper part of the outer side of the rack.

The utility model discloses following beneficial effect has: the utility model provides a wafer sheet feeding and discharging machine based on robot, this feeding and discharging machine can replace the artifical automatic unloading of realizing the wafer, reduces the cost of labor, promotes stability and yield, reduces the product disability rate. The utility model discloses a robot realizes unloading in the automation of brilliant piece, simple structure is compact, and is flexible high, applicable in all products of the same kind.

Drawings

Fig. 1 is a schematic view of the three-dimensional structure of the present invention.

Fig. 2 is a schematic structural view of fig. 1 with an upper frame hidden.

Fig. 3 is a partially enlarged schematic view of a portion a in fig. 2.

Fig. 4 is a perspective view of the grasping assembly.

Fig. 5 is a schematic structural diagram of a wafer.

Description of the main component symbols: 1. a frame; 11. a feeding port of the tool; 12. a feeding port of the tool; 13. a display; 14. an operation button; 2. a work table; 3. a tool conveying mechanism; 30. a support plate; 31. a sensor; 32. a cylinder; 4. assembling; 40. a wafer slot; 5. a basket tool; 6. a first visual positioning system; 7. a loading and unloading robot; 70. a grasping assembly; 701. connecting blocks; 702. a sucker connecting column; 703. a gas pipe joint; 704. a sucker extension tube; 705. a suction cup; 706. a pointed block; 71. a multi-dimensional force sensor; 8. a second visual positioning system; 9. a wafer.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the following detailed description.

As shown in fig. 1-5, a wafer sheet feeding and discharging machine based on a robot comprises a frame 1, a workbench 2 fixed inside the frame 1, a tool conveying mechanism 3 arranged above the workbench 2, a plurality of tools 4 placed on the tool conveying mechanism 3, a basket tool 5 arranged on the side of the tool conveying mechanism 3, a first visual positioning system 6 arranged right above the basket tool 5, a feeding and discharging robot 7 fixed at the top of the frame 1, and a second visual positioning system 8 fixed on the feeding and discharging robot 7. A plurality of wafer grooves 40 are formed in the tool 4, and the tail end of the loading and unloading robot 7 is provided with a grabbing component 70 which is used for grabbing the wafer 9 in the wafer grooves 40 into the basket tool 5 or grabbing the wafer 9 in the basket tool 5 into the wafer grooves 40. The feeding and discharging robot 7 is a six-axis industrial robot.

The grabbing component 70 comprises a connecting block 701 fixed at the tail end of the loading and unloading robot 7, a sucker connecting column 702 fixed at one side of the connecting block 701, an air pipe joint 703 fixed at the other side of the connecting block 701, a sucker extension pipe 704 installed on the sucker connecting column 702 and communicated with the air pipe joint 703, and a sucker 705 arranged at the tail end of the sucker extension pipe 704 and used for sucking and grabbing the wafer 9, wherein the air pipe joint 703 is externally connected with a vacuum generating device. One side of the wafer 9 has a chamfer and the end of the suction cup 705 is provided with a pointed block 706 for inserting and tilting the wafer 9 from the chamfer of the wafer 9.

Preferably, a multidimensional pressure sensor 71 is installed at the end of the loading and unloading robot 7, and the connecting block 701 is fixed at the bottom of the multidimensional pressure sensor 71. The wafer 9 is circular and has a fan-shaped corner.

Preferably, one or more sensors 31 for positioning the tool 4 are fixedly mounted on the side of the tool conveying mechanism 3. Preferably, one or more air cylinders 32 for laterally pushing the tool 4 when the tool 4 is in place are fixedly mounted on the side edge of the tool conveying mechanism 3. The tool conveying mechanism 3 is a belt conveyor, and the belt conveyor is erected on the workbench through a plurality of supporting plates 30.

And the two sides of the frame 1 are respectively provided with a tool feeding port 11 and a tool discharging port 12 at the corresponding positions of the tool conveying mechanism 3. A display 13 and a plurality of operation buttons 14 are arranged on the upper part of the outer side of the frame 1.

The utility model discloses a theory of operation does: the wafer 9 is placed in a wafer groove 40 of the disc tool 4, and the disc tool 4 is conveyed to a wafer taking station through the tool conveying mechanism 3; when the disc tool 4 is in place, the sensor 31 confirms the position, and the cylinder 32 side pushes the tool tightly, so that the stability of taking the disc is ensured; the round wafer 9 is provided with a cutting pin, and the second vision system 8 is used for respectively cutting and positioning the six wafers 9 on the disc; the first vision system 6 positions the basket 5 and detects the piece-putting condition in the basket 5, so that the piece-breaking caused by repeated putting is avoided; a multi-dimensional force sensor 71 is fixed on the sixth shaft of the loading and unloading robot 7, and a grabbing component 70 is fixed at the front end of the multi-dimensional force sensor 71; when taking the wafer, the sharp block 706 of the grabbing component 70 is inserted from the foot cutting position of the wafer 9, slightly raises the wafer 9, and then sucks the wafer 9 through vacuum; the loading and unloading robot 7 inserts the taken wafer piece 9 into the basket 5 smoothly; the equipment can also realize that the wafer sheet 9 is taken out from the basket 5 and placed on the tool plane of the next processing procedure.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. The utility model provides a wafer on-chip blanking machine based on robot which characterized in that: including the frame, fix inside workstation of frame, establish the frock conveying mechanism of workstation top, place a plurality of frocks on the frock conveying mechanism, establish the basket utensil of frock conveying mechanism side, establish directly over the basket utensil first vision positioning system, fix the last unloading robot at frame top and fixing go up the last second vision positioning system of unloading robot, the frock on seted up a plurality of wafer piece groove, the end of going up the unloading robot is installed and is used for snatching the wafer piece of wafer piece inslot extremely in the basket utensil or will wafer piece in the basket utensil snatchs extremely the subassembly that snatchs of wafer piece inslot.

2. The robot-based wafer on-off machine of claim 1, wherein: the grabbing component comprises a connecting block fixed at the tail end of the feeding and discharging robot, a sucker connecting column fixed on one side of the connecting block, a gas pipe connector fixed on the other side of the connecting block, a sucker extending pipe arranged on the sucker connecting column and communicated with the gas pipe connector, and a sucker arranged at the tail end of the sucker extending pipe and used for sucking and grabbing wafer pieces, wherein a chamfer is formed in one side of each wafer piece, and a pointed block used for inserting and tilting the wafer pieces from the chamfer of each wafer piece is arranged at the tail end of each sucker.

3. A robot-based wafer loader/unloader as claimed in claim 2, wherein: the multi-dimensional pressure sensor is installed at the tail end of the feeding and discharging robot, and the connecting block is fixed to the bottom of the multi-dimensional pressure sensor.

4. A robot-based wafer loader/unloader as claimed in claim 2, wherein: the wafer chip is circular, and the chamfer is a sector chamfer.

5. The robot-based wafer on-off machine of claim 1, wherein: and one or more sensors for positioning the tool are fixedly arranged on the side edge of the conveying mechanism.

6. The robot-based wafer on-off machine of claim 5, wherein: and one or more air cylinders used for laterally pushing the tool when the tool runs in place are fixedly arranged on the side edge of the tool conveying mechanism.

7. The robot-based wafer on-off machine of claim 1, wherein: the feeding and discharging robot is a six-axis industrial robot.

8. The robot-based wafer on-off machine of claim 1, wherein: frock conveying mechanism be band conveyer, band conveyer establish through a plurality of supporting plates grillages the workstation top.

9. The robot-based wafer on-off machine of claim 1, wherein: and the two sides of the rack are provided with a tool feeding port and a tool discharging port respectively at the corresponding positions of the tool conveying mechanism.

10. The robot-based wafer on-off machine of claim 1, wherein: and a display and a plurality of operating buttons are arranged on the upper part of the outer side of the rack.