CN217506042U - Circuit board production test fixture - Google Patents

Abstract

The embodiment of the application provides a circuit board production test fixture, can realize batch program burning and function test, simple structure, and equipment utilization is high. The tool comprises a recording and measuring assembly, a bearing assembly and a pressing assembly; the recording and testing assembly comprises a debugging box body, a JTAG program burning debugger arranged in the debugging box body, a JTAG concentrator and a test probe interface board fixedly arranged on the upper surface of the debugging box body; the JTAG program burning debugger is connected with the plurality of test probes on the test probe interface board through the JTAG concentrator; the bearing assembly is arranged on the upper surface of the debugging box body and comprises a bearing positioning plate and a plurality of elastic stand columns; the bearing positioning plate bears the PCBA to be burned and is provided with a plurality of guide holes; the pressing component pushes the bearing positioning plate to be close to the debugging box body, so that the plurality of test probes are in contact with the test pins in the PCBA to be burned through the corresponding plurality of guide holes.

Description

Circuit board production test fixture

Technical Field

One or more embodiments of the application relate to circuit board processing technology field, especially relate to a circuit board production test fixture.

Background

In the production and manufacturing process of the PCBA, the PCBs are subjected to jointed board manufacturing and jointed board patch welding sometimes in order to improve the utilization rate of the PCBs and improve the efficiency of PCB patch welding. The panels comprise a plurality of PCBA units with the same function. This involves batch programming and functional testing of chips in multiple PCBA units contained on these panels. In some related technical schemes, a plurality of program burners are adopted for simultaneously burning programs on a plurality of PCBAs through USB expansion, and the mode needs to be provided with a plurality of program burners, so that the equipment utilization rate is low; or a gating control circuit is constructed by adopting a relay or a multi-path selection switch, and programs are burned on a plurality of PCBAs in turn, and the special signal switching control circuit is arranged in the mode, so that the complexity of a tool circuit is greatly increased. Moreover, the existing program burning tool has single function and cannot realize the burning and testing functions at the same time.

SUMMERY OF THE UTILITY MODEL

In view of this, an object of one or more embodiments of the present application is to provide a circuit board production test fixture, which can meet the requirements of batch program burning and function testing, and has a simple structure and a high equipment utilization rate.

Based on the above purpose, one or more embodiments of the present application provide a circuit board production test fixture, which includes a recording and testing component, a bearing component, and a pressing component;

the recording and testing component comprises a debugging box body, a JTAG program burning debugger arranged in the debugging box body, a JTAG concentrator and a testing probe interface board fixedly arranged on the upper surface of the debugging box body;

the JTAG program burning debugger is connected with a plurality of test probes on the test probe interface board through the JTAG concentrator, and the test probes are used for contacting with test pins of a PCBA board to be burned to form electrical connection;

the bearing assembly comprises a bearing positioning plate arranged in parallel with the upper surface of the debugging box body and a plurality of elastic stand columns arranged between the bearing positioning plate and the debugging box body;

the PCBA board to be burned is borne by the bearing positioning plate, a plurality of guide holes are formed in the bearing positioning plate, and the guide holes correspond to the test probes on the test probe interface board;

the pressing component pushes the bearing positioning plate to be close to the debugging box body, so that the plurality of test probes are in contact with the test pins in the PCBA to be burned through the corresponding plurality of guide holes.

Optionally, the JTAG hub includes a plurality of hub interfaces and a plurality of expansion interfaces;

the JTAG program burning debugger is connected with a plurality of test probes on the test probe interface board through the JTAG concentrator, and comprises the following steps:

a plurality of JTAG ports of the JTAG program burning debugger are connected with a plurality of line concentration interfaces of the JTAG concentrator;

a plurality of expansion interfaces of the JTAG concentrator are connected with a plurality of test probes;

in the JTAG concentrator, the plurality of line concentration interfaces and the plurality of expansion interfaces adopt a daisy chain electric connection form for line expansion.

Optionally, the plurality of line concentration interfaces of the JTAG hub include a TDI line concentration interface, a TDO line concentration interface, a TCK line concentration interface, and a TMS line concentration interface;

a plurality of expansion interfaces of the JTAG concentrator are divided into a plurality of interface groups, and the plurality of interface groups are respectively used for being connected with a plurality of PCBA boards to be burned;

the interface group comprises a TDI extended interface, a TDO extended interface, a TCK extended interface and a TMS extended interface;

the line expansion is carried out between the plurality of line concentration interfaces and the plurality of expansion interfaces in a daisy chain electrical connection mode, and the line expansion method comprises the following steps:

the TCK line concentration interface is respectively connected with the TCK expansion interfaces in the plurality of interface groups, and the plurality of TCK expansion interfaces are connected in parallel;

the TMS line concentration interface is respectively connected with the TMS expansion interfaces in the plurality of interface groups, and the plurality of TMS expansion interfaces are connected in parallel;

the TDI line concentration interface and the TDO line concentration interface are connected with the TDI extended interface and the TDO extended interface in a plurality of interface groups in a cascading mode.

Optionally, a normally closed switch is disposed between the TDI expansion interface and the TDO expansion interface in the interface group;

and the normally closed switch is disconnected after the test probes corresponding to the TDI extended interface and the TDO extended interface are contacted with the test pins of the PCBA to be burned.

Optionally, a plurality of positioning grooves arranged in an array are arranged on one side of the bearing positioning plate away from the debugging box body;

the constant head tank is used for placing wait to burn the PCBA board.

Optionally, the plurality of guide holes in the bearing positioning plate are tapered through holes, and the aperture of the upper outlet of the guide holes is smaller than that of the lower outlet of the guide holes.

Optionally, the pressing assembly includes a pneumatic driving device, a fixed back plate for mounting the pneumatic driving device, and two supporting columns for supporting the fixed back plate;

the lower ends of the supporting stand columns are fixedly connected with the upper surface of the debugging box body, the upper ends of the supporting stand columns are fixedly connected with the fixed back plate, and the two supporting stand columns and the fixed back plate form a gantry structure;

the pneumatic driving device is used for driving the ejector rod to reciprocate in the vertical direction, and the lower end of the ejector rod is fixedly connected with the horizontally arranged pressing plate.

Optionally, the pressing assembly further comprises a solenoid valve, and the solenoid valve is used for controlling the pneumatic driving device.

Optionally, the pressing plate is a flexible pressing plate.

From the foregoing, the circuit board production test tool provided in one or more embodiments of the present application has the following beneficial technical effects:

(1) in the circuit board production test tool, the JTAG program burning debugger serves as a program burning device, a user program can be downloaded and burnt into a PCBA chip to be burnt through a plurality of test probes and a plurality of test pins of the PCBA to be burnt, program burning requirements are met, meanwhile, the JTAG program burning debugger can also access signal logic state information inside the PCBA chip to be burnt through a plurality of test pins, and therefore the requirement for function detection of the PCBA to be burnt can be achieved according to the signal logic state information.

(2) The JTAG concentrator is used as a middleware of the JTAG program burning debugger and the PCBA boards to be burned, circuit expansion is carried out on the JTAG program burning debugger, batch program burning and function testing can be carried out on the PCBA boards to be burned, the number of circuits can be reduced, and the circuit structure is simplified.

(3) The test probe interface board is provided with a plurality of test probes, the test probes on the test probe interface board can pass through the guide holes to accurately and stably contact with the test pins of the PCBA to be burned, which are borne by the bearing positioning plate, under the guidance of the corresponding guide holes when the bearing positioning plate is pressed by a pressing component to move close to the debugging box body. The accurate contact of test probe and test pin is guided to utilize the guide hole in bearing the locating plate, guarantees the electric connection stability of the long-time work of frock, can avoid long-time work test probe wearing and tearing and the contact failure problem that deformation probably caused.

Drawings

In order to more clearly illustrate one or more embodiments of the present application or technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only one or more embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort from these drawings.

Fig. 1 is a schematic structural diagram of a circuit board production test fixture according to one or more embodiments of the present disclosure;

FIG. 2 is a block diagram illustrating an electrical schematic of the JTAG hub in a circuit board production test tool according to one or more embodiments of the present disclosure;

fig. 3 is a schematic top view of the positioning board for testing production of circuit board according to one or more embodiments of the present disclosure;

fig. 4 is a schematic structural diagram of a hold-down assembly in a circuit board production test tool according to one or more embodiments of the present disclosure.

Detailed Description

For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

It is to be understood that unless otherwise defined, technical or scientific terms used in one or more embodiments of the present application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in one or more embodiments of the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.

The technical solution of the present application will be described below with reference to specific examples.

The embodiment of the application provides a circuit board production test tool.

As shown in fig. 1, a circuit board production test tool according to one or more embodiments of the present application includes a recording component 1, a carrying component 2, and a pressing component 3;

the recording and testing component 1 includes a debugging box 101, a Joint Test Action Group (JTAG) program recording debugger 102 disposed in the debugging box 101, a JTAG hub 103, and a Test probe interface board 1043 fixedly disposed on an upper surface of the debugging box.

The JTAG program burning debugger 102 is connected to the plurality of test probes 1041 on the test probe interface Board 104 through the JTAG hub 103, and the test probes 1041 are used for contacting with test pins of a Printed Circuit Board (PCBA Board) 203 to be burned to form an electrical connection;

the bearing assembly 2 comprises a bearing positioning plate 201 arranged parallel to the upper surface of the debugging box body and a plurality of elastic stand columns 202 arranged between the bearing positioning plate and the debugging box body.

The bearing positioning plate 201 is used for bearing the PCBA board 203 to be burned, a plurality of guiding holes 2011 are arranged in the bearing positioning plate 201, and the plurality of guiding holes 2011 correspond to the plurality of test probes 1041 on the test probe interface board 104;

the pressing component 3 is configured to push the bearing positioning plate 201 to approach the debugging box 101, so that the plurality of test probes 1041 are in contact with the test pins in the PCBA board 203 to be burned through the corresponding plurality of guide holes 2011. In some alternative embodiments, the pressing assembly 3 may include a moving mechanism that is displaced in the vertical direction, and the moving mechanism is disposed directly above the load lock plate 201, and may apply pressure to the load lock plate 201 by moving downward in the vertical direction to push it close to the debugging box 101.

When a production test is performed, the pressing component 3 applies pressure to the bearing positioning plate 201 to push the bearing positioning plate 201 to approach the debugging box 101, in this process, the bearing positioning plate 201 will gradually approach the test probe interface board 104 fixedly disposed on the upper surface of the debugging box 101, and the plurality of test probes 1041 on the test probe interface board 104 will gradually approach the test pins of the PCBA board 203 to be burned under the guidance of the plurality of guide holes 2011 in the bearing positioning plate 201 until the test probes contact the test pins. The plurality of test probes 1041 are in electrical connection with the plurality of test pins on the PCBA board to be burned after contacting, at this time, the JTAG program burning debugging 102 is connected with the plurality of PCBA boards to be burned through the JTAG concentrator, batch program burning can be performed on the plurality of chips in the PCBA board to be burned through the plurality of test probes 1041, signal logic state information of the chips in the PCBA board to be burned can be acquired through the plurality of test probes 1041, and function testing is performed on the plurality of PCBA board chips to be burned according to the signal logic state information.

In the circuit board production test tool, the JTAG program burning debugger serves as a program burning device and is electrically connected with a plurality of test pins of the PCBA to be burned through a plurality of test probes, so that a user program can be downloaded and burnt into a chip of the PCBA to be burned to meet program burning requirements, meanwhile, the JTAG program burning debugger can access signal logic state information inside the chip of the PCBA to be burned through a plurality of test pins, and therefore the requirement for function detection of the PCBA to be burned can be met according to the signal logic state information. The JTAG concentrator is adopted as a middleware of the JTAG program burning debugger and the PCBA boards to be burned, circuit expansion is carried out on the JTAG program burning debugger, batch program burning and function testing of the PCBA boards to be burned are achieved, meanwhile, the number of circuits can be reduced, and the circuit structure is simplified.

As shown in fig. 2, in a circuit board production test tool provided in one or more alternative embodiments of the present application, the JTAG hub 103 includes a plurality of hub interfaces and a plurality of expansion interfaces.

The JTAG program burning debugger is connected with a plurality of test probes on the test probe interface board through the JTAG concentrator, and comprises:

and a plurality of JTAG ports of the JTAG program burning debugger are connected with a plurality of hub interfaces of the JTAG hub.

And a plurality of expansion interfaces of the JTAG concentrator are connected with a plurality of test probes.

The JTAG concentrator is JTAG circuit expansion equipment comprising a plurality of expansion interfaces, and can be connected with JTAG program burning and testing ports of a plurality of PCBA main control circuits through the physical expansion interfaces, so that program burning and testing can be carried out on a plurality of PCBA circuit boards or main control chips on jointed boards through one JTAG program burning debugger, and the aim of simplifying and rapidly carrying out batch program burning and testing is achieved.

In some optional embodiments of the present application, the plurality of hub interfaces of the JTAG hub include a TDI (test data in) hub interface 1031, a TDO (test data out) hub interface 1032, a TCK (test clock) hub interface 1033, and a TMS (test mode select) hub interface 1034.

The TDI line concentration interface 1031, the TDO line concentration interface 1032, the TCK line concentration interface 1033, and the TMS line concentration interface 1034 are respectively connected to a TDI port, a TDO port, and a TCK port in the JTAG program burning debugger, and correspondingly connected to a TMS port.

And the plurality of expansion interfaces of the JTAG concentrator are divided into a plurality of interface groups, and the plurality of interface groups are respectively used for being connected with the plurality of PCBA boards to be burned.

The interface set includes a TDI extension interface 1035, a TDO extension interface 1036, a TCK extension interface 1037, and a TMS extension interface 1038.

Through a plurality of the test probes, the TDI extension interface 1035, the TDO extension interface 1036, the TCK extension interface 1037, and the TMS extension interface 1038 in the interface group are respectively used for being connected with a TDI port, a TDO port, a TCK port, and a TMS port of the PCBA board to be burned.

In the JTAG concentrator, a plurality of the concentrator interfaces and a plurality of the expansion interfaces adopt an electrical connection form of a Daisy Chain (Daisy Chain) for line expansion.

The TCK hub interface 1033 is connected to the TCK expansion interfaces 1037 in the plurality of interface groups, and the plurality of TCK expansion interfaces 1037 are connected in parallel.

The TMS line concentrator interface 1034 is connected to a plurality of TMS extension interfaces 1038 of the interface group, and the plurality of TMS extension interfaces 1038 are connected in parallel.

The TDI hub interface 1031 and the TDO hub interface 1032 are connected to the TDI extension interface 1035 and the TDO extension interface 1036 in a plurality of interface groups in a cascade manner.

The test data input TDI signal comes out from a TDI port of a program burning debugger, enters the TDI extension interface 1035 in a first interface group through the TDI hub interface of the JTAG hub, and then enters the TDI extension interface 1035 in a next interface group from the TDO extension interface 1036, so that the TDO extension interface 1036 in the former group is connected with the TDI extension interface 1035 in the latter group, and the TDO extension interface 1036 in the last group returns to the TDO port of the JTAG program burning debugger through the TDO hub interface 1032. Such a physical connection of the JTAG daisy-chain is completed.

The JTAG concentrator also comprises a VCC power supply which provides an external power supply required by the work for the PCBA to be burned and debugged. Therefore, the program burning debugger supporting the daisy chain can detect the chip cores (including MCU, DSP, FPGA and the like) connected to the PCBA on the daisy chain, and the JTAG program burning debugger can select a plurality of PCBAs or the chip cores on the PBA splice board to carry out program burning and function testing.

In a circuit board production test fixture provided in one or more optional embodiments of the present application, a normally closed switch is disposed between the TDI extension interface and the TDO extension interface in the interface group;

and the normally closed switch is disconnected after the test probes corresponding to the TDI expansion interface and the TDO expansion interface are contacted with the test pins of the PCBA to be burned, and the PCBA to be burned is connected into a daisy chain loop.

By adopting the design, the signal integrity of the TDI and the TDO in the JTAG daisy-chain loop can be ensured, so that the physical connection of the TDI and the TDO signal loops is complete. Therefore, the number of PCBA boards which can be borne on the corresponding bearing positioning plate 201 of the JTAG concentrator can be flexibly adjusted, and the placing positions of a plurality of PCBA boards to be burned can also be flexibly adjusted.

As shown in fig. 3, in a circuit board production test fixture provided in one or more optional embodiments of the present application, a plurality of positioning grooves arranged in an array are disposed on a side of the bearing positioning plate 201 away from the debugging box 101. The positioning groove is used for placing the PCBA board 203 to be burned. When the PCBA board 203 to be burned is placed in the plurality of positioning grooves on the bearing positioning plate 201, the positions of the plurality of test pins on the PCBA board 203 to be burned correspond to the positions of the plurality of guide holes 2011 in the bearing positioning plate 201, and the test probes 1041 can accurately contact the test pins on the PCBA board to be burned through the guide holes 2011.

In some alternative embodiments of the present application, the plurality of guiding holes 2011 in the bearing positioning plate are tapered through holes, the upper exit aperture is smaller than the lower exit aperture, and the upper exit aperture is slightly larger than the diameter of the test probe. Considering under the actual conditions through long-time work, wearing and deformation may appear in test probe 1041, guide hole 2011 adopts the bell mouth, even test probe 1041 appears the deformation of certain degree and bends, also can guarantee that test probe 1041 accurately gets into guide hole 2011 to under the guide of guide hole 2011 with wait to burn the accurate contact of test pin on the PCBA board, guide hole 2011 is right test probe 1041 position has certain error correction effect.

As shown in fig. 4, in a circuit board production test tool provided in one or more alternative embodiments of the present application, the pressing assembly 3 includes a pneumatic driving device 301, a fixed back plate 302 for installing the pneumatic driving device, and two supporting columns 303 for supporting the fixed back plate.

The lower end of the supporting column 303 is fixedly connected with the upper surface of the debugging box body 101, the upper end of the supporting column 303 is fixedly connected with the fixed back plate 302, and the two supporting columns 303 and the fixed back plate 302 form a gantry structure.

The pneumatic driving device 301 is used for driving the push rod 3011 to reciprocate in the vertical direction, and the lower end of the push rod is fixedly connected with the horizontally arranged pressing plate 3012. In some optional embodiments, the hold-down assembly 3 further comprises a solenoid valve 3013, and the solenoid valve 3013 is used for controlling the pneumatic driving device 301. The electromagnetic valve 3013 can accurately control the air inflow of the pneumatic driving device 301, so that the driving ejector rod 3011 is precisely and linearly controlled in the vertical direction, the pressing component 3 can stably control and push the bearing positioning plate 201 to be close to the moving distance of the debugging box 101, and the PCBA plate damage caused by overlarge pressure can be avoided.

In some alternative embodiments, the pressing plate 3012 is a flexible pressing plate, for example, the pressing plate 3012 is made of rubber or flexible PVC. There are a plurality of electronic components and electronic circuit including the chip on the PCBA, clamp plate 3012 as with treat the component of burning PCBA board direct contact, adopt flexible material can protect electronic components on the PCBA board not damaged.

Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the spirit of the present disclosure, features from the above embodiments or from different embodiments may also be combined, steps may be implemented in any order, and there are many other variations of the different aspects of one or more embodiments of the present application as described above, which are not provided in detail for the sake of brevity.

In addition, well-known power/ground connections to Integrated Circuit (IC) chips and other components may or may not be shown in the provided figures, for simplicity of illustration and discussion, and so as not to obscure one or more embodiments of the application. Furthermore, apparatus may be shown in block diagram form in order to avoid obscuring the understanding of one or more embodiments of the present application, and this also takes into account the fact that specifics with respect to implementation of such block diagram apparatus are highly dependent upon the platform within which the one or more embodiments of the present application are to be implemented (i.e., specifics should be well within purview of one skilled in the art). Where specific details (e.g., circuits) are set forth in order to describe example embodiments of the disclosure, it should be apparent to one skilled in the art that one or more embodiments of the disclosure can be practiced without, or with variation of, these specific details. Accordingly, the description is to be regarded as illustrative instead of restrictive.

While the present disclosure has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of these embodiments will be apparent to those of ordinary skill in the art in light of the foregoing description. For example, other memory architectures (e.g., dynamic ram (dram)) may use the discussed embodiments.

It is intended that the present application one or more embodiments embrace all such alternatives, modifications and variations as fall within the broad scope of the appended claims. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of one or more embodiments of the present disclosure are intended to be included within the scope of the present disclosure.

Claims (9)

1. A circuit board production test tool is characterized by comprising a recording and testing assembly, a bearing assembly and a pressing assembly;

the recording and testing assembly comprises a debugging box body, a JTAG program burning debugger arranged in the debugging box body, a JTAG concentrator and a test probe interface board fixedly arranged on the upper surface of the debugging box body;

the JTAG program burning debugger is connected with a plurality of test probes on the test probe interface board through the JTAG concentrator, and the test probes are used for contacting with test pins of a PCBA board to be burned to form electrical connection;

the bearing assembly comprises a bearing positioning plate arranged in parallel with the upper surface of the debugging box body and a plurality of elastic stand columns arranged between the bearing positioning plate and the debugging box body;

the PCBA board to be burned is borne by the bearing positioning plate, a plurality of guide holes are formed in the bearing positioning plate, and the guide holes correspond to the test probes on the test probe interface board;

the pressing component pushes the bearing positioning plate to be close to the debugging box body, so that the plurality of test probes are in contact with the test pins in the PCBA to be burned through the corresponding plurality of guide holes.

2. The production test tool of claim 1, wherein the JTAG hub includes a plurality of hub interfaces and a plurality of expansion interfaces;

the JTAG program burning debugger is connected with a plurality of test probes on the test probe interface board through the JTAG concentrator, and comprises:

a plurality of JTAG ports of the JTAG program burning debugger are connected with a plurality of line concentration interfaces of the JTAG concentrator;

a plurality of expansion interfaces of the JTAG concentrator are connected with a plurality of test probes;

in the JTAG concentrator, the plurality of line concentration interfaces and the plurality of expansion interfaces adopt a daisy chain electric connection form for line expansion.

3. The production test tool of claim 2, wherein the plurality of hub interfaces of the JTAG hub include a TDI hub interface, a TDO hub interface, a TCK hub interface, and a TMS hub interface;

a plurality of expansion interfaces of the JTAG concentrator are divided into a plurality of interface groups, and the plurality of interface groups are respectively used for being connected with a plurality of PCBA boards to be burned;

the interface group comprises a TDI extended interface, a TDO extended interface, a TCK extended interface and a TMS extended interface;

the line expansion is carried out between the plurality of line concentration interfaces and the plurality of expansion interfaces in a daisy chain electrical connection mode, and the line expansion method comprises the following steps:

the TCK line concentration interface is respectively connected with the TCK expansion interfaces in the plurality of interface groups, and the plurality of TCK expansion interfaces are connected in parallel;

the TMS line concentration interface is respectively connected with the TMS expansion interfaces in the plurality of interface groups, and the plurality of TMS expansion interfaces are connected in parallel;

the TDI line concentration interface and the TDO line concentration interface are connected with the TDI expansion interface and the TDO expansion interface in a plurality of interface groups in a cascading mode.

4. The production testing tool of claim 3, wherein a normally closed switch is disposed between the TDI expansion interface and the TDO expansion interface in the interface group;

and the normally closed switch is disconnected after the test probes corresponding to the TDI extended interface and the TDO extended interface are contacted with the test pins of the PCBA to be burned.

5. The production test tool according to claim 1, wherein a plurality of positioning grooves arranged in an array are formed in one side of the bearing positioning plate, which is far away from the debugging box body;

the constant head tank is used for placing wait to burn the PCBA board.

6. The production test tool of claim 1, wherein the plurality of guide holes in the bearing and positioning plate are tapered through holes, and the diameter of the upper outlet is smaller than that of the lower outlet.

7. The production test tool according to claim 1, wherein the pressing assembly comprises a pneumatic driving device, a fixed back plate for mounting the pneumatic driving device and two supporting upright posts for supporting the fixed back plate;

the lower ends of the supporting stand columns are fixedly connected with the upper surface of the debugging box body, the upper ends of the supporting stand columns are fixedly connected with the fixed back plate, and the two supporting stand columns and the fixed back plate form a gantry structure;

the pneumatic driving device is used for driving the ejector rod to reciprocate in the vertical direction, and the lower end of the ejector rod is fixedly connected with the horizontally arranged pressing plate.

8. The production test tool of claim 7, wherein the hold-down assembly further comprises a solenoid valve, and the solenoid valve is used for controlling the pneumatic driving device.

9. The production test tool of claim 7, wherein the pressure plate is a flexible pressure plate.

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