CN217504068U - Multi-cycle heat dissipation device for aluminum oxide plate - Google Patents
Multi-cycle heat dissipation device for aluminum oxide plate Download PDFInfo
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- CN217504068U CN217504068U CN202221185781.2U CN202221185781U CN217504068U CN 217504068 U CN217504068 U CN 217504068U CN 202221185781 U CN202221185781 U CN 202221185781U CN 217504068 U CN217504068 U CN 217504068U
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- base
- heat dissipation
- air deflector
- plate
- spout
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an alumina plate is with multiple cycle heat abstractor, include: base, heating panel, cooling fan and aviation baffle, aviation baffle pass through the top of leg joint at the base, the top of base is equipped with back mesa and preceding mesa, and symmetrical arrangement has a plurality of cooling fan on back mesa and the preceding mesa, open the inboard surface of base has back spout and preceding spout, placing of heating panel activity is in back spout and preceding spout, open the surface of heating panel has a plurality of standing grooves, compare with prior art, the utility model discloses following beneficial effect has: a plurality of alumina plates can be radiated at one time, so that the multi-cycle radiating work is realized.
Description
Technical Field
The utility model belongs to the heat-radiating equipment field, in particular to alumina plate is with multiple cycle heat abstractor.
Background
Need dispel the heat after alumina plate produces, the radiator among the prior art all inserts alumina plate on the board that has the recess, directly blows alumina plate's surface with the fan, though this kind can dispel the heat, but inefficiency, simultaneously under the blowing of fan, alumina plate also is convenient for take out or put down from the recess.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems in the prior art, and provides a multi-circulation heat dissipation device for an alumina plate.
The utility model discloses a following technical scheme realizes: a multi-cycle heat sink for an alumina plate, comprising: the heat dissipation device comprises a base, a heat dissipation plate, heat dissipation fans and an air deflector, wherein the air deflector is connected above the base through a support, a rear table board and a front table board are arranged at the top of the base, a plurality of heat dissipation fans are symmetrically arranged on the rear table board and the front table board, a rear sliding groove and a front sliding groove are formed in the inner side surface of the base, the heat dissipation plate is movably placed in the rear sliding groove and the front sliding groove, and a plurality of placing grooves are formed in the surface of the heat dissipation plate.
In a preferred embodiment, the front and rear decks have a plurality of fixing holes formed in their surfaces, and the base is fixed to the floor by means of expansion screws inserted through the plurality of fixing holes.
As a preferred embodiment, the front side of the heat dissipation plate is connected with a front slider, the rear side of the heat dissipation plate is connected with a rear slider, the front slider is matched with the front sliding groove, the rear slider is matched with the rear sliding groove, the heat dissipation plate is placed between the front sliding groove and the rear sliding groove through the front slider and the rear slider, and the width of the heat dissipation plate is twice of that of the base.
As a preferred embodiment, the air deflector takes the middle position as an axis, two sides of the air deflector bend downwards, the width of the air deflector is the same as the length of the base, when in actual use, the heat dissipation fan generates wind to dissipate heat of the alumina plate, the wind absorbing the surface temperature of the alumina plate expands due to heating and flows upwards, and cools gradually along with the flow, because two sides of the air deflector bend downwards, the cooled wind flows downwards along two sides of the air deflector, and the heat of the alumina plate is dissipated again under the driving of the heat dissipation fan.
As a preferred embodiment, a semiconductor refrigerator is arranged at the bottom of the air deflector, the temperature at the bottom of the air deflector can be reduced by arranging the semiconductor refrigerator, when the air deflector is in actual use, the heat dissipation fan generates air to dissipate heat of the aluminum oxide plate, the air absorbing the surface temperature of the aluminum oxide plate expands due to heating and flows upwards, the air rapidly cools under the action of the semiconductor refrigerator, the cooled air flows downwards along the two sides of the air deflector, and the aluminum oxide plate is dissipated again under the driving of the heat dissipation fan.
After the technical scheme is adopted, the beneficial effects of the utility model are that: a plurality of alumina plates can be radiated at one time, so that the multi-cycle radiating work is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic view of the overall structure of a multiple circulation heat dissipation device for an aluminum oxide plate of the present invention.
Fig. 2 is a schematic view of a heat dissipating plate of the multi-cycle heat dissipating device for an aluminum oxide plate of the present invention.
Fig. 3 is a schematic view of the base of the multiple circulation heat dissipation device for alumina plate of the present invention.
In the figure, 1-base, 11-back table top, 12-front table top, 13-back sliding chute, 14-front sliding chute, 15-heat dissipation plate, 16-back sliding block, 17-front sliding block, 18-placing chute, 19-alumina plate, 21-heat dissipation fan and 22-air deflector.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1 to 3, the present invention provides a technical solution: a multi-cycle heat sink for an alumina plate, comprising: base 1, heating panel 15, cooling fan 21 and aviation baffle 22, aviation baffle 22 passes through the top of leg joint at base 1, base 1's top is equipped with back mesa 11 and preceding mesa 12, back mesa 11 and preceding mesa 12 go up symmetrical arrangement have a plurality of cooling fan 21, base 1's inboard surface is opened there are back spout 13 and preceding spout 14, placing of heating panel 15 activity is in back spout 13 and preceding spout 14, the surface of heating panel 15 is opened there are a plurality of standing grooves 18.
As an embodiment of the present invention, the front table-board 12 and the rear table-board 11 are provided with a plurality of fixing holes on their surfaces, and the expansion screws are inserted into the fixing holes, so as to fix the base 1 on the ground.
The front side of the heat dissipation plate 15 is connected with a front slide block 17, the rear side of the heat dissipation plate 15 is connected with a rear slide block 16, the front slide block 17 is matched with a front chute 14, the rear slide block 16 is matched with a rear chute 13, the heat dissipation plate 15 is placed between the front chute 14 and the rear chute 13 through the front slide block 17 and the rear slide block 16, the width of the heat dissipation plate 15 is twice of that of the base 1, in practical use, a worker can insert an aluminum oxide plate needing heat dissipation and cooling into the placing groove 18 to enable the aluminum oxide plate to be perpendicular to the heat dissipation fans 21, then the heat dissipation plate 15 is pushed to enable the aluminum oxide plate needing cooling to be located between the heat dissipation fans 21 on two sides, the aluminum oxide plate is subjected to heat dissipation and cooling through wind power generated by the heat dissipation fans 21, after heat dissipation is completed, the cooled aluminum oxide plate is far away from the heat dissipation fans 21 on two sides by pushing the heat dissipation plate 15, then the heat dissipation plate 15 is taken down, because the width of the base 1 is twice, therefore, in the time of practical use, can be when half alumina plate dispels the heat the cooling, can take off or place half alumina plate, this device once can dispel the heat to a plurality of alumina plate to this realizes multiple circulation heat dissipation work.
As an embodiment of the utility model, aviation baffle 22 uses the intermediate position as the axle, both sides downwarping, the width of aviation baffle 22 is the same with base 1's length, in the time of practical use, radiator fan 21 produces wind, dispel the heat to aluminum oxide plate, the wind that absorbs aluminum oxide plate surface temperature is heated the inflation, upward flow, along with flowing cooling gradually, because aviation baffle 22's both sides downwarping, so the wind after the cooling can flow along aviation baffle 22's both sides downwarping, drive at radiator fan 21 is dispelled the heat to aluminum oxide plate once more.
As an embodiment of the utility model, the bottom of aviation baffle 22 is provided with a semiconductor cooler, through setting up the semiconductor cooler, can be so that the temperature of aviation baffle 22 bottom reduces, in the time of practical use, radiator fan 21 produces wind, dispel the heat to aluminum oxide plate, the wind that absorbs aluminum oxide plate surface temperature is heated the thermal expansion, upwards flow, become cold rapidly under semiconductor cooler's effect, wind after the cooling can flow downwards along aviation baffle 22's both sides, drive at radiator fan 21 is dispelled the heat to aluminum oxide plate once more.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (5)
1. A multi-cycle heat sink for an alumina plate, comprising: the heat dissipation device comprises a base, a heat dissipation plate, heat dissipation fans and an air deflector, wherein the air deflector is connected above the base through a support.
2. The multi-cycle heat sink for alumina plates as claimed in claim 1, wherein: the front table top and the rear table top are provided with a plurality of fixing holes on the surfaces, and the expansion screws penetrate through the fixing holes, so that the base is fixed on the ground.
3. The multi-cycle heat sink for alumina plates as claimed in claim 2, wherein: the front side of heating panel is connected with preceding slider, the rear side of heating panel is connected with the back slider, preceding slider and preceding spout cooperation, back slider and back spout cooperation, the heating panel is through preceding slider and back slider, places in the front between spout and the back spout, the width of heating panel is the twice of base money.
4. The multi-cycle heat sink for alumina plates as claimed in claim 1, wherein: the air deflector takes the middle position as an axis, two sides of the air deflector are bent downwards, and the width of the air deflector is the same as the length of the base.
5. The multi-cycle heat sink for alumina plates as claimed in claim 4, wherein: the bottom of the air deflector is provided with a semiconductor refrigerator, and the temperature of the bottom of the air deflector can be reduced by arranging the semiconductor refrigerator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221185781.2U CN217504068U (en) | 2022-05-18 | 2022-05-18 | Multi-cycle heat dissipation device for aluminum oxide plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221185781.2U CN217504068U (en) | 2022-05-18 | 2022-05-18 | Multi-cycle heat dissipation device for aluminum oxide plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217504068U true CN217504068U (en) | 2022-09-27 |
Family
ID=83353362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221185781.2U Active CN217504068U (en) | 2022-05-18 | 2022-05-18 | Multi-cycle heat dissipation device for aluminum oxide plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217504068U (en) |
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2022
- 2022-05-18 CN CN202221185781.2U patent/CN217504068U/en active Active
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