CN217405414U

CN217405414U - High adhesion FCBGA encapsulates uses soaking piece structure

Info

Publication number: CN217405414U
Application number: CN202221007315.5U
Authority: CN
Inventors: 王飞; 董其刚
Original assignee: Shandong Ruisi Precision Industry Co ltd
Current assignee: Shandong Ruisi Precision Industry Co ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-09-09
Anticipated expiration: 2032-04-27

Abstract

The utility model provides a high adhesion FCBGA encapsulates uses soaking piece structure, relates to soaking piece technical field, and including the soaking piece, the lower surface of soaking piece is close to central point and puts and be equipped with the center face of bonding, and the lower surface of soaking piece is close to border position and is equipped with the border face of bonding, and the center face of bonding is equipped with rather than the heat conduction silicone grease layer of laminating mutually, and the border face of bonding is equipped with rather than the adhesive layer of laminating mutually, the upper surface and the bonding counter bore structure phase-match of adhesive layer and heat conduction silicone grease layer. The utility model provides a device among the conventional art under cold and hot alternate condition, the position that the encapsulation bonds produces the layering easily, leads to the soaking piece to break away from, and after soaking piece and chip separation, the heat that chip work produced just hardly distributes to the soaking piece through heat conduction silicone grease, leads to the heat to obtain giving off, and damages CPU or influences the problem of CPU work efficiency.

Description

High adhesion FCBGA encapsulates uses soaking piece structure

Technical Field

The utility model relates to a soaking piece technical field, concretely relates to high adhesion nature FCBGA encapsulates uses soaking piece structure.

Background

The heat equalizing sheet mainly has the functions of improving the bonding strength, improving the falling off of the heat equalizing sheet caused by the alternation of the working cold and hot of the CPU, improving the running stability of the CPU,

as shown in fig. 1, the heat spreader comprises a heat sink, heat conductive silicone grease, a chip, an adhesive and a PCB, wherein the conventional heat spreader structure is mostly formed by directly punching plates, the bonding area is smooth and flat, and the bonding capability of the heat conductive silicone grease and the adhesive is weaker.

The device gradually exposes the defects of the technology along with production and use, and mainly shows the following aspects:

the existing structure is under the condition of cold and hot alternation, the position that the encapsulation is bonded is easy to produce the layering, leads to the soaking piece to break away from, and after the soaking piece separated from the chip, the heat that the chip work produced just hardly gives off to the soaking piece through heat conduction silicone grease, leads to the heat to obtain giving off, and damages CPU or influences CPU work efficiency.

In view of the above, the prior art is obviously inconvenient and disadvantageous in practical use, and needs to be improved.

SUMMERY OF THE UTILITY MODEL

To the defect among the prior art, the utility model provides a high adhesion nature FCBGA encapsulates uses soaking piece structure for solve the device among the conventional art under cold and hot circumstances in turn, the position that the encapsulation bonds well produces the layering easily, leads to the soaking piece to break away from, after soaking piece and chip separation, the heat that chip work produced just hardly gives off to the soaking piece through heat conduction silicone grease, leads to the heat to obtain giving off, and damages CPU or influences the problem of CPU work efficiency.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a high adhesion FCBGA encapsulates and uses soaking piece structure, includes the soaking piece, the lower surface of soaking piece is close to central point and puts and be equipped with the center face of bonding, the lower surface of soaking piece is close to border position and is equipped with the border face of bonding, the center face of bonding with all be equipped with bonding counter bore structure on the border face of bonding, the center face of bonding is equipped with the heat conduction silicone grease layer rather than laminating mutually, the border face of bonding is equipped with the adhesive layer rather than laminating mutually, the adhesive layer with the upper surface and the bonding counter bore structure phase-match on heat conduction silicone grease layer.

As an optimized scheme, the bonding counter bore structure comprises a plurality of counter bores without fixed shapes.

As an optimized scheme, a plurality of counter bores without fixed shapes are irregularly arranged.

As an optimized scheme, the bonding counter bore structure comprises a plurality of pyramid-shaped counter bores.

As an optimized scheme, the pyramid-shaped counter bores are arranged in a matrix form.

As an optimized scheme, the bonding counter bore structure comprises a plurality of rectangular counter bores.

As an optimized scheme, a plurality of rectangular counter bores are arranged in a matrix manner.

As an optimized scheme, the length and the width of the pyramid-shaped counter bore and the rectangular counter bore are respectively 0.1 mm.

As an optimized scheme, the depth of the pyramid-shaped counter bore is 0.04-0.07 mm.

As an optimized scheme, the depth of the rectangular counter bore is 0.005-0.020 mm.

As an optimized scheme, the distance between a plurality of the pyramid-shaped counter bores or the distance between a plurality of the rectangular counter bores is 0.4 mm.

As an optimized scheme, the dimension of the counter bores without fixed shapes, the pyramid-shaped counter bores and the rectangular counter bores away from the outer edge of the soaking piece is 0.60 +/-0.2 mm.

Compared with the prior art, the beneficial effects of the utility model are that:

the improved structure does not increase the manufacturing cost of the product, the bonding area between the soaking piece and the chip or the PCB is correspondingly increased, the bonding strength is increased, the problem that the soaking piece falls off is avoided, the quality risk is reduced, the soaking piece with the packaging size of 31 x 31 is taken as an example, the bonding force before the improvement is 20N, the bonding force after the improvement can reach 60N, and the bonding force is improved by 200%;

the counter bore form design has the function of cold hardening during punch forming, so that the strength of the soaking plate is increased, the supporting strength of the soaking plate on the chip is improved, and the protection of the chip is facilitated;

the design of the counter bore form increases the contact area of the heat-conducting silicone grease and the soaking plate, effectively prevents the layering problem, and ensures that the heat is more stably taken out when the CPU works;

the manufacturing cost is low, and the maintenance is convenient; the design is reasonable, and the matching among structures is precise; the operation is convenient and fast; the stability in the working process is improved; the parts are few, the working procedure is simple and convenient, and the failure rate is low; the structure is simple, and the service life is long; simple and convenient operation and control, easy large-scale manufacture and installation and wide application range.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

FIG. 1 is a schematic diagram of a prior art structure;

FIG. 2 is a schematic structural view of the present invention;

FIG. 3 is a schematic structural view of the pyramid-shaped counter bore of the present invention;

FIG. 4 is a schematic structural view of the rectangular counter bore of the present invention;

fig. 5 is a schematic structural view of the counterbore without the fixed shape of the present invention.

In the figure: 1-soaking slice; 2-a thermally conductive silicone layer; 3-chip; 4-an adhesive layer; 5-a PCB board; 6-central bonding surface; 7-edge bonding surface; 8-pyramid shaped counter bores; 9-rectangular counter bores; 10-there is no fixed shape counter bore.

Detailed Description

Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.

As shown in fig. 1 to 5, high bonding nature FCBGA encapsulates uses soaking piece structure, including soaking piece 1, the lower surface of soaking piece 1 is close to central point and puts and be equipped with center bonding face 6, and the lower surface of soaking piece 1 is close to border position and is equipped with border bonding face 7, all is equipped with bonding counter bore structure on center bonding face 6 and the border bonding face 7, and center bonding face 6 is equipped with rather than the heat conduction silicone grease layer 2 that laminates mutually, border bonding face 7 is equipped with rather than the adhesive layer 4 of laminating mutually, adhesive layer 4 with the upper surface and the bonding counter bore structure phase-match of heat conduction silicone grease layer 2.

The lower surface of the heat-conducting silicone grease layer 2 contacts the chip 3, the chip 3 is positioned on the PCB 5, and the lower surface of the adhesive layer 4 is attached to the edge of the upper surface of the PCB 5.

The bonding counter bore structure comprises a plurality of counter bores 10 without fixed shapes, non-fixed shape and irregular counter bore corrosion processing are carried out, the roughness Ra is generally selected for management and control, and the Ra2-6um is required; the corrosion counter bore is generally manufactured by adopting a die stamping forming mode.

The plurality of counter bores 10 without fixed shapes are irregularly arranged.

The bonding counterbore structure comprises a plurality of pyramid-shaped counterbores 8.

The pyramid-shaped counter bores 8 are arranged in a matrix form.

The bonding counterbore structure comprises a plurality of rectangular counterbores 9.

The rectangular counter bores 9 are arranged in a matrix form.

The length and width of the pyramid-shaped counter bore 8 and the rectangular counter bore 9 are respectively 0.1 mm.

The depth of the pyramid-shaped counter bore 8 is 0.04-0.07 mm.

The depth of the rectangular counter bore 9 is 0.005-0.020 mm.

The distance between the pyramid-shaped counter bores 8 or the distance between the rectangular counter bores 9 is 0.4 mm.

The dimension of the counter bore 10 without fixed shape, the pyramid-shaped counter bore 8 and the rectangular counter bore 9 away from the outer edge of the soaking plate 1 is 0.60 +/-0.2 mm.

The soaking sheet 1 is preferably made of C1100 red copper or C2680, the bonding surface is provided with a counter bore for increasing the bonding area and the bonding force, and the product is subjected to surface electroplating treatment, generally and preferably plated with Ni and 2-9um, so that the oxidation corrosion of the copper material is prevented, and the bonding force is prevented from being influenced.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.

Claims

1. A high adhesion FCBGA encapsulates uses soaking piece structure which characterized in that: including soaking piece (1), the lower surface of soaking piece (1) is close to central point and puts and is equipped with central bonding surface (6), the lower surface of soaking piece (1) is close to border position and is equipped with border bonding surface (7), central bonding surface (6) with all be equipped with bonding counter bore structure on border bonding surface (7), central bonding surface (6) are equipped with rather than the heat conduction silicone grease layer (2) of laminating mutually, border bonding surface (7) are equipped with adhesive layer (4) rather than laminating mutually, adhesive layer (4) with the upper surface and the bonding counter bore structure phase-match of heat conduction silicone grease layer (2).

2. The high adhesion heat spreader structure for FCBGA package of claim 1, wherein: the bonding counter bore structure comprises a plurality of counter bores (10) without fixed shapes.

3. The high adhesion heat spreader structure for FCBGA package of claim 2, wherein: the plurality of counter bores (10) without fixed shapes are irregularly arranged.

4. The high adhesion heat spreader structure for FCBGA package of claim 1, wherein: the bonding counter bore structure comprises a plurality of pyramid-shaped counter bores (8).

5. The high adhesion heat spreader structure of claim 4, wherein: a plurality of the pyramid-shaped counter bores (8) are arranged in a matrix form.

6. The high adhesion FCBGA package heat spreader structure of claim 4, wherein: the bonding counter bore structure comprises a plurality of rectangular counter bores (9).

7. The high adhesion FCBGA package heat spreader structure of claim 6, wherein: the rectangular counter bores (9) are arranged in a matrix manner.

8. The high adhesion FCBGA package heat spreader structure of claim 6, wherein: the length and the width of the pyramid-shaped counter bore (8) and the rectangular counter bore (9) are respectively 0.1 mm.

9. The high adhesion heat spreader structure of claim 6, wherein: the depth of the pyramid-shaped counter bore (8) is 0.04-0.07 mm; the depth of the rectangular counter bore (9) is 0.005-0.020 mm.

10. The high adhesion FCBGA package heat spreader structure of claim 6, wherein: the distance between the pyramid-shaped counter bores (8) or the distance between the rectangular counter bores (9) is 0.4 mm.