CN215644409U - Welding tool for large warping degree long substrate of IGBT device - Google Patents
Welding tool for large warping degree long substrate of IGBT device Download PDFInfo
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- CN215644409U CN215644409U CN202121383844.0U CN202121383844U CN215644409U CN 215644409 U CN215644409 U CN 215644409U CN 202121383844 U CN202121383844 U CN 202121383844U CN 215644409 U CN215644409 U CN 215644409U
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Abstract
The utility model discloses a welding tool for a large warping degree long substrate of an IGBT device, and aims to solve the technical problem that welding deformation is easy to occur due to overlarge pre-warping degree of a copper substrate in the welding process of the IGBT device. The welding frock includes spacing frame, contact panel and bottom plate, and the bottom plate is fixed inside spacing frame, and the bottom plate forms welding groove with spacing frame, and contact panel places in welding groove, and contact panel's upper surface is recessed curved surface, and recessed curved surface rate is unanimous with the curved surface rate of the heat dissipation copper base plate of IGBT device, and contact panel's lower surface and bottom plate laminating, the bottom fretwork of bottom plate. The utility model can increase the contact area between the copper substrate and the welding hot plate, avoid welding deformation, improve the welding efficiency and reliability and further improve the reliability of the whole IGBT device.
Description
Technical Field
The utility model relates to a welding tool for a large warping degree long substrate of an IGBT device, and belongs to the technical field of power semiconductor device packaging.
Background
An Insulated Gate Bipolar Transistor (IGBT) is a short-term Insulated Gate Bipolar Transistor and is widely used in the fields of industrial control, power systems, locomotive traction, wind power generation, automobile power, and the like. At present, most IGBT devices are in welded packaging forms, the core structure of each welded device is a chip, a welding layer, a lining plate, a welding layer and a heat dissipation copper plate, the other surface of a heat dissipation copper substrate is in contact with a cooling plate after the welded device is packaged, the center of the surface is slightly convex (the warping degree is 0-0.2 mm), and a heat conduction silicone grease filling layer is arranged between the surface and the cooling plate and used for removing bubbles in a gap and improving the heat dissipation efficiency. Since the difference in thermal expansion coefficient between the soldering backing plate and the heat dissipating copper substrate is large, the flat copper substrate is likely to be dented (the contact surface with the cooling plate is dented) after soldering, and in order to make the cooling surface after soldering slightly convex, it is necessary to perform a pre-bending process on the copper substrate.
If the pre-bending warping degree is not enough, the problem of anti-concavity can not be solved, if the pre-bending warping degree is too large, the contact surface of the pre-bending warping degree and a welding hot plate is smaller, especially, the distance between the two ends of the long edge of the substrate and the heating plate is larger, the temperature rise curve difference of different areas of the substrate is larger, the welding flux melting time difference can be caused, and then the uneven thickness distribution and the tin deficiency of a welding surface welding layer between the lining plate and a copper substrate are caused. In addition, the solder layer between the backing plate and the copper substrate serves as a heat dissipation channel, and once the solder layer fails, a large amount of heat generated by the chip in the working process cannot be dissipated and fails. Therefore, how to reduce the stress of the welding layer between the copper substrate and the lining plate is important for improving the reliability of the layer to improve the reliability of the whole IGBT device.
The problem of excessive pre-warp is mainly solved by the following two methods: 1. the heating surface of the substrate during welding is a plane, the concave surface of the substrate after pre-bending during welding is arranged above the heating surface, the lining plate is arranged on the concave surface through the limiting tool for welding, and the substrate after welding generates reverse concavity under the action of welding stress to recover to the slightly convex degree of the other surface; 2. the matching degree between the substrate and the lining plate is improved by changing the material, and the material with similar CTE (coefficient of thermal expansion) to the lining plate and good heat conduction, such as AlSiC and the like, is selected, but the cost of the method is higher.
Disclosure of Invention
The utility model provides a welding tool for a long copper substrate with large warping degree of an IGBT device, aiming at the problem that the welding deformation is easy to occur due to overlarge pre-bending warping degree of the copper substrate in the welding process of the IGBT device in the prior art.
In order to solve the technical problems, the utility model adopts the following technical means:
the utility model provides a welding tool for a long substrate with large warping degree of an IGBT device, which comprises a limiting frame, a contact panel and a bottom plate, wherein the bottom plate is fixed inside the limiting frame, a welding groove is formed between the bottom plate and the limiting frame, the contact panel is placed in the welding groove, the upper surface of the contact panel is a concave curved surface, the curved surface rate of the concave curved surface is consistent with that of a heat dissipation copper substrate of the IGBT device, the lower surface of the contact panel is attached to the bottom plate, and the bottom of the bottom plate is hollow.
Furthermore, a plurality of hollow points are arranged at the bottom of the bottom plate, and the hollow depth of the hollow point close to the edge of the bottom is greater than that of the hollow point close to the center of the bottom.
Further, the cross section of the hollow point is circular or rectangular.
Furthermore, the bottom edge of the bottom plate is provided with a strip-shaped hollow structure.
Furthermore, the contact panel comprises a plurality of movable plates, the movable plates are sequentially arranged in the welding groove, a gap is formed between every two adjacent movable plates, and the upper surfaces of all the movable plates form a concave curved surface.
Furthermore, any two movable plates are connected by a rotating shaft.
Furthermore, the contact panel and the bottom plate are made of copper plates or aluminum plates.
Further, the surface flatness of the contact panel and the bottom plate is less than 50 microns, and the roughness is less than 1 um.
The following advantages can be obtained by adopting the technical means:
the utility model provides a welding tool for a long substrate with large warping degree of an IGBT device, wherein a limit frame and a bottom plate in the welding tool jointly form a tool frame structure to form a welding groove, when the IGBT device is welded, a welding hot plate is positioned below the bottom plate of the welding tool, a contact panel and a heat dissipation copper substrate of the IGBT device are placed in the welding groove, the curvature of a concave curved surface of the contact panel is consistent with that of the heat dissipation copper substrate of the IGBT device, and the curved surfaces of the contact panel and the heat dissipation copper substrate are tightly attached to each other, so that the consistency of the welding areas of different areas on the surface of the copper substrate can be improved, the heat transfer efficiency is effectively improved, and the welding efficiency and reliability are improved. In addition, the bottom of the bottom plate is hollow, so that the thermal deformation of a welding tool can be reduced, the distance between the two ends of the long edge of the radiating copper substrate and the welding hot plate can be shortened, the heating uniformity of the welding surface of the pre-bent copper substrate is further improved, the welding deformation is avoided, and the welding quality of a secondary welding layer is improved.
The contact panel of the welding tool comprises a plurality of movable plates, gaps are arranged between the adjacent movable plates, and the movable plates can slightly move in the limiting frame during welding, so that the contact panel is more attached to the heat dissipation copper substrate. Because the heat dissipation copper substrate is concave, and the two ends of the heat dissipation copper substrate are far away from the bottom of the tool when the heat dissipation copper substrate is placed in the tool, the bottom plate of the welding tool is only hollowed at the edge or the hollowed edge is deeper, so that the distance between the whole heat dissipation copper substrate and the welding hot plate is ensured to be consistent.
Drawings
Fig. 1 is a schematic structural diagram of a welding tool for a large warping degree long substrate of an IGBT device according to the present invention;
FIG. 2 is a side view of the welding tooling of the present invention;
FIG. 3 is a diagram of a tooling structure in which a movable plate is used as a contact panel in the embodiment of the present invention;
FIG. 4 is a side view of a movable plate in an embodiment of the present invention;
in the figure, 1 is a limit frame, 2 is a contact panel, 3 is a bottom plate, 4 is a hollow point or strip-shaped hollow structure, 5 is a movable plate, and 6 is a heat dissipation copper substrate.
Detailed Description
The technical scheme of the utility model is further explained by combining the accompanying drawings as follows:
the utility model provides a welding tool for a large warping degree long substrate of an IGBT device, and mainly relates to a boss type structure design of a heat dissipation copper substrate for a welded IGBT device. The core structure of the welding type IGBT device is a chip, a welding layer, a lining plate (a ceramic copper clad plate), a welding layer and a heat dissipation copper substrate, wherein the welding layer mainly comprises two parts: (1) a welding layer between the chip and the lining plate (ceramic copper clad plate, etc.); (2) and the welding layer is arranged between the lining plate and the heat dissipation copper substrate.
As shown in fig. 1 and 2, the welding tool comprises a limiting frame 1, a contact panel 2 and a bottom plate 3, wherein the bottom plate is fixed inside the limiting frame, a welding groove is formed between the bottom plate and the limiting frame, the contact panel is placed in the welding groove, the upper surface of the contact panel is a concave curved surface, the curved surface rate of the concave curved surface is consistent with that of a heat dissipation copper substrate of an IGBT device, the lower surface of the contact panel is attached to the bottom plate, and the bottom of the bottom plate is hollow. When welding is performed during the IGBT period, the heat dissipation copper substrate 6 of the IGBT device is placed above the contact panel and is in close contact with the contact panel, and the welding hot plate for welding and heating is placed below the bottom plate.
Because the radiating copper substrate is bent and the welded heating surface is a plane, the distance between the two ends of the long edge of the copper substrate and the heating plate is large during welding, and the temperature rise curve difference of different areas is large easily, so that the welding tool is designed to be hollowed out on the bottom plate, the bottom plate can be hollowed out in different shapes according to specific welding requirements, and the following rules are required for the hollowed-out: the deeper the hollowing is, the closer to the edge of the bottom plate is.
In the embodiment of the utility model, a plurality of hollowed-out points 4 are arranged at the bottom of the welding tooling bottom plate, the hollowed-out depth of the whole bottom plate is gradually increased from the middle to the edge, the hollowed-out depth of the hollowed-out point close to the edge of the bottom is greater than that of the hollowed-out point close to the center of the bottom, and the cross section of the hollowed-out point is circular or rectangular.
In addition, the welding tool can also be directly provided with a strip-shaped hollow structure 4 at the bottom edge of the bottom plate, and the strip-shaped hollow structure is parallel to the edge of the bottom plate.
In order to solve the problem that a contact panel in the welding tool is arranged to be in a curved surface structure and used for increasing the welding contact area, but in actual use, a small difference may exist between the contact panel and a radiating copper substrate, and therefore the contact panel is not attached enough, the contact panel can be arranged to be in a multi-segmented structure, as shown in fig. 3 and 4, the contact panel comprises a plurality of movable plates 5, the movable plates are sequentially placed in a welding groove and are tiled to form the whole welding groove, and a gap is formed between every two adjacent movable plates to ensure that the movable plates can move in the groove. Generally, the curvature ratios of the movable plates at the symmetrical positions are the same with the perpendicular bisector of the contact panel, and the upper surfaces of all the movable plates can form a concave curved surface, and the curvature ratio of the concave curved surface is the same as that of the heat dissipation copper substrate.
The movable plates can be not connected, and because gaps are formed among the movable plates, when the heat dissipation copper substrate is placed in the welding tool, the movable plates can slightly displace in the limiting frame under the action of pressure, so that the movable plates are attached to the heat dissipation copper substrate. Also can adopt the rotation axis to connect between arbitrary two movable plates, when the copper base plate that dispels the heat was placed in the welding frock, the movable plate can take place micro-rotation along the rotation axis under the pressure effect to with the laminating of heat dissipation copper base plate together.
In the welding tool, the contact panel and the bottom plate are made of copper plates or aluminum plates. The contact panel and the bottom plate need to be polished, the surface flatness of the contact panel and the bottom plate is less than 50 micrometers, and the roughness of the contact panel and the bottom plate is less than 1 um. The welding tool also needs to be subjected to high-temperature heat treatment and wear-resistant layer treatment.
Compared with the prior art, the contact panel of the welding tool can be tightly attached to the curved surface of the heat dissipation copper substrate, the consistency of the welding areas of different areas on the surface of the copper substrate is improved, the heat transfer efficiency is effectively improved, and the welding efficiency and reliability are improved. In addition, the bottom of the bottom plate is hollow, so that the thermal deformation of a welding tool can be reduced, the distance between the two ends of the long edge of the radiating copper substrate and the welding hot plate can be shortened, the heating uniformity of the welding surface of the pre-bent copper substrate is further improved, the welding deformation is avoided, and the welding quality of a secondary welding layer is improved. The contact panel of the welding tool comprises a plurality of movable plates, gaps are arranged between the adjacent movable plates, and the movable plates can slightly move in the limiting frame during welding, so that the contact panel is more attached to the heat dissipation copper substrate. Because the heat dissipation copper substrate is concave, and the two ends of the heat dissipation copper substrate are far away from the bottom of the tool when the heat dissipation copper substrate is placed in the tool, the bottom plate of the welding tool is only hollowed at the edge or the hollowed edge is deeper, so that the distance between the whole heat dissipation copper substrate and the welding hot plate is ensured to be consistent.
The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (8)
1. The utility model provides a welding frock for big angularity long base plate of IGBT device, a serial communication port, including spacing frame, contact panel and bottom plate, the bottom plate is fixed inside spacing frame, and the bottom plate forms welding recess with spacing frame, contact panel places in welding recess, and contact panel's upper surface is recessed curved surface, and recessed curved surface rate is unanimous with the curved surface rate of the heat dissipation copper base plate of IGBT device, contact panel's lower surface and bottom plate laminating, the bottom fretwork of bottom plate.
2. The welding tool for the IGBT device long substrate with the large warping degree according to claim 1, wherein a plurality of hollowed-out points are arranged at the bottom of the bottom plate, and the hollowed-out depth of the hollowed-out points close to the edge of the bottom is larger than the hollowed-out depth of the hollowed-out points close to the center of the bottom.
3. The welding tool for the IGBT device large warping degree long substrate according to claim 2, wherein the cross section of the hollow-out point is circular or rectangular.
4. The welding tool for the large warping degree long substrate of the IGBT device according to claim 1, wherein a strip-shaped hollow structure is arranged on the bottom edge of the bottom plate.
5. The welding tool for the IGBT device large-warpage long substrate according to claim 1, wherein the contact panel comprises a plurality of movable plates, the movable plates are sequentially placed in the welding groove, a gap is formed between every two adjacent movable plates, and the upper surfaces of all the movable plates form a concave curved surface.
6. The welding tool for the IGBT device large warping degree long substrate according to claim 5, wherein any two movable plates are connected through a rotating shaft.
7. The welding tool for the large warping degree long substrate of the IGBT device according to claim 1, wherein the contact panel and the bottom plate are copper plates or aluminum plates.
8. The welding tool for the IGBT device large warping degree long substrate according to claim 1, wherein the surface flatness of the contact panel and the bottom plate is less than 50 microns, and the roughness is less than 1 um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121383844.0U CN215644409U (en) | 2021-06-22 | 2021-06-22 | Welding tool for large warping degree long substrate of IGBT device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121383844.0U CN215644409U (en) | 2021-06-22 | 2021-06-22 | Welding tool for large warping degree long substrate of IGBT device |
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| CN215644409U true CN215644409U (en) | 2022-01-25 |
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| CN202121383844.0U Active CN215644409U (en) | 2021-06-22 | 2021-06-22 | Welding tool for large warping degree long substrate of IGBT device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
-
2021
- 2021-06-22 CN CN202121383844.0U patent/CN215644409U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115954314A (en) * | 2023-03-08 | 2023-04-11 | 四川富乐华半导体科技有限公司 | Pressing jig for ceramic copper-clad substrate |
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