CN216600654U

CN216600654U - Heat sink device

Info

Publication number: CN216600654U
Application number: CN202123450745.2U
Authority: CN
Inventors: 虞俊伟; 闫大鹏; 施建宏
Original assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Current assignee: Wuhan Raycus Fiber Laser Technologies Co Ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-05-24
Anticipated expiration: 2031-12-31

Abstract

The application discloses heat abstractor, heat abstractor include bottom plate, apron and vortex piece, and the bottom plate is provided with the recess, and the apron is connected with the bottom plate, and the apron covers the recess in order to form the runner, and the runner is used for the cooling liquid to flow, and the apron is used for with treating the heat abstractor contact in order to treat the heat abstractor and dispel the heat. The flow disturbing piece is arranged in the groove and used for increasing the heat exchange efficiency of the cooling liquid. The heat abstractor in this application can be connected with treating the heat dissipation device through the apron, and the apron can be to the heat of treating the heat dissipation device of coolant liquid transmission, sets up the heat exchange efficiency that the vortex piece improved the coolant liquid to utilize the coolant liquid to take away the heat of treating the heat dissipation device. The heat dissipation device in the embodiment of the application can dissipate heat of the device to be dissipated, and normal operation of the device to be dissipated is guaranteed.

Description

Heat sink device

Technical Field

The application belongs to the heat dissipation field, especially relates to heat abstractor.

Background

Due to the development of semiconductor laser materials and the progress of the manufacturing process level, the single-chip power reaches nearly 20W, but the requirement of industrial production for high-power laser cannot be met. In order to obtain a high power semiconductor laser output, the number of chips is generally increased to achieve a high output. Accordingly, the associated power supply equipment needs to provide a significant current for proper operation of the laser. In the process of power supply equipment operation, power supply equipment can produce a large amount of heats, if the heat dissipation problem can not be fine solution, not only can power supply equipment's performance receive the influence, the life-span of other modules still can reduce in the laser instrument.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a heat dissipation device which can dissipate heat of a device to be dissipated.

An embodiment of the present application provides a heat dissipation device, including:

the bottom plate is provided with a groove;

the cover plate is connected with the bottom plate, covers the groove to form a flow channel, the flow channel is used for cooling liquid to flow, and the cover plate is used for being in contact with a device to be cooled so as to cool the device to be cooled;

and the turbulence piece is arranged in the groove and used for increasing the heat exchange efficiency of the cooling liquid.

Optionally, the cover plate is provided with an installation surface, the installation surface is in contact with the device to be cooled, and the flatness of the installation surface is smaller than a preset value, so that the heat transfer efficiency between the device to be cooled and the cover plate is improved.

Optionally, a threaded hole is formed in the cover plate, a stud is arranged on the device with the heat sink, and the stud is locked in the threaded hole to connect the cover plate and the device to be heat-dissipated.

Optionally, the heat dissipation apparatus further includes a fixing member, and the device to be dissipated is connected to the cover plate through the fixing member.

Optionally, the cover plate is provided with a lightening hole to reduce the cost of the heat dissipation device.

Optionally, the vortex piece includes connecting plate and a plurality of vortex unit, the vortex unit with the connecting plate is connected, and is a plurality of the vortex unit is arranged along first direction dislocation, first direction with the flow direction of coolant liquid has and predetermines the contained angle, so that the vortex unit blocks the coolant liquid is in order to produce the vortex.

Optionally, each of the spoiler units is provided with a flow hole extending along the first direction, two adjacent flow holes are arranged in a staggered manner and communicated with each other, and the cooling liquid can flow into the flow holes from two sides of the spoiler unit to form convection.

Optionally, the spoiler unit includes:

the first supporting part is connected with the connecting plate;

the second supporting part is arranged opposite to the first supporting part and is connected with the connecting plate;

the first supporting part and the second supporting part are connected through the connecting part, the connecting part is arranged at one end, away from the connecting plate, of the first supporting part, and the first supporting part, the second supporting part and the connecting part form the circulation hole.

Optionally, the connecting plate is connected to the bottom plate, and the connecting portion is connected to the cover plate.

Optionally, the cooling liquid is water, a refrigerant or ethanol.

In the embodiment of the application, the heat dissipation device comprises a bottom plate, a cover plate and a turbulence piece, the bottom plate is provided with a groove, the cover plate is connected with the bottom plate, the cover plate covers the groove to form a flow channel, the flow channel is used for flowing cooling liquid, and the cover plate is used for being in contact with the device to be dissipated so as to dissipate heat of the device to be dissipated. The flow disturbing piece is arranged in the groove and used for increasing the heat exchange efficiency of the cooling liquid. The heat abstractor in this application can be connected with treating the heat dissipation device through the apron, and the apron can be to the heat of treating the heat dissipation device of coolant liquid transmission, sets up the heat exchange efficiency that the vortex piece improved the coolant liquid to utilize the coolant liquid to take away the heat of treating the heat dissipation device. The heat dissipation device in the embodiment of the application can dissipate heat of the device to be dissipated, and normal operation of the device to be dissipated is guaranteed.

Drawings

The technical solutions and advantages of the present application will become apparent from the following detailed description of specific embodiments of the present application when taken in conjunction with the accompanying drawings.

Fig. 1 is an exploded schematic view of a heat dissipation device according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural view of the cover plate in fig. 1.

Fig. 3 is a schematic structural diagram of the bottom plate in the bitmap 1.

Fig. 4 is a schematic structural view of the spoiler of fig. 1.

FIG. 5 is a schematic view of the spoiler in accordance with an embodiment of the present application.

Fig. 6 is a schematic flow chart illustrating a method for manufacturing a heat dissipation device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, fig. 1 is an exploded schematic view of a heat dissipation device according to an embodiment of the present disclosure. The heat dissipating apparatus 100 can be connected with a device to be dissipated to cool the device to be dissipated. The heat dissipation device 100 comprises a cover plate 4, a bottom plate 5 and a flow disturbing piece 6, wherein a groove 51 is formed in the bottom plate 5, the cover plate 4 is connected with the bottom plate 5, the cover plate 4 covers the groove 51 to form a flow channel, the flow channel is used for allowing cooling liquid 9 to flow, and the cover plate 4 is used for being in contact with a device to be dissipated to dissipate heat of the device to be dissipated.

Heat abstractor 100 in this application can be through apron 4 with treat the heat abstractor contact, and apron 4 can treat the heat of heat abstractor to the transmission of coolant liquid 9, and the heat exchange efficiency of coolant liquid 9 can be improved in the setting of vortex piece 6 to utilize coolant liquid 9 to take away the heat of treating the heat abstractor. The heat dissipation device 100 in the embodiment of the present application can dissipate heat of a device to be dissipated, so as to ensure normal operation of the device to be dissipated.

Referring to fig. 2, fig. 2 is a schematic structural diagram of the cover plate in fig. 1. In order to improve the mounting accuracy and the heat transfer efficiency of the device to be cooled, the cover plate 4 may be provided with a mounting surface 43, the flatness of the mounting surface 43 needs to be smaller than a preset value, and the mounting surface 43 is in contact with the device to be cooled to ensure good heat transfer between the device to be cooled and the cover plate 4. It can be understood that the mounting surface 43 directly abuts against the device to be heat-dissipated, and when the flatness of the mounting surface 43 is small, that is, the mounting surface 43 is sufficiently "flat", the mounting surface 43 which is sufficiently flat can be in better contact with the device to be heat-dissipated, so that a gap between the device to be heat-dissipated and the mounting surface 43 is avoided, and the heat transfer efficiency between the device to be heat-dissipated and the cover plate 4 is improved. Illustratively, the mounting surface 43 has a flatness of less than 0.1 mm.

The cover plate 4 is connected with a device to be cooled, a threaded hole 42 can be formed in the cover plate 4, and the threaded hole 42 can be a through hole for processing. Correspondingly, the device to be cooled can be provided with a stud, and a design process of pressing and riveting the stud is adopted. The stud is locked in the threaded hole 42 to connect the cover plate 4 and the device to be cooled, and it can be understood that the stud and the threaded hole 42 can be used for connection, and the device to be cooled and the cover plate 4 can be pressed against each other, so that the heat transfer efficiency is improved. Illustratively, the cover plate 4 may have a minimum thickness of 9 mm, the stud may have a height of 5 mm, and the threaded hole 42 may have a depth of more than 7 mm.

Referring to fig. 1 and fig. 2, in order to adjust the distance between the heat dissipation apparatus 100 and the device to be dissipated, the heat dissipation apparatus 100 may further include a fixing member 7, and the device to be dissipated is connected to the cover plate 4 through the fixing member 7. The fixing member 7 functions like a gasket, and when the device to be cooled is connected to the heat dissipation apparatus 100, the fixing members 7 with different thicknesses may be selected to connect the device to be cooled and the cover plate 4, thereby adjusting the distance between the heat dissipation apparatus 100 and the device to be cooled.

Due to the requirements of heat dissipation and processing, the cover plate 4 needs to be made of a material with good heat transfer effect and high strength, such as 6-material aluminum alloy. Lightening holes 41 can be further formed in the cover plate 4 to further reduce the weight and cost of the heat sink 100.

Referring to fig. 3, fig. 3 is a schematic structural diagram of the bottom plate in bitmap 1. The recess 51 in the base plate 5 may be designed according to one or more of the size, temperature distribution or shape of the device to be heat dissipated. Illustratively, the groove 51 may be S-shaped, square-shaped or rectangular, and accordingly, the flow channel may also be S-shaped, square-shaped or rectangular. The sectional area of the groove 51 can be calculated according to the heat dissipation requirement, and when the heat dissipation requirement is large, the sectional area of the groove 51 is large, and when the heat dissipation requirement is small, the sectional area of the groove 51 is small.

Referring to fig. 4, fig. 4 is a schematic structural diagram of the spoiler of fig. 1. The spoiler 6 is arranged in the groove 51 to increase the heat dissipation area of the cooling liquid 9 and improve the heat exchange effect of the cooling liquid 9, and the spoiler 6 is usually designed below a part which has larger heat dissipation power density or requires low-temperature work, so as to ensure that the device to be cooled is not overheated or runs abnormally due to overheating.

The spoiler 6 comprises a connecting plate 62 and a plurality of spoiler units 61, the spoiler units 61 are connected with the connecting plate 62 and are arranged in a staggered manner along a first direction X of the spoiler units 61. The first direction X and the flowing direction of the cooling liquid 9 have a preset included angle, so that the spoiler units 61 block the cooling liquid 9, and when the cooling liquid 9 flows through the spoiler units 61, each spoiler unit 61 can break the boundary layer of the cooling liquid 9 and generate a vortex.

It should be noted that, a plurality of vortex units 61 are arranged along the first direction X in a staggered manner, and a plurality of rows of vortex units 61 can be arranged on the connecting plate 62, so that the arrangement of the vortex units 61 has repeatability, the processing is convenient, the production cost can be effectively reduced, and the production efficiency is improved.

Each flow disturbing unit 61 is provided with a flow hole 611 extending along the first direction X, two adjacent flow holes 611 are arranged in a staggered manner and communicated with each other, and the cooling liquid 9 can flow into the flow holes 611 from two sides of the flow disturbing unit 61 to form convection, so that the heat exchange efficiency of the cooling liquid 9 is improved.

Each spoiler unit 61 includes a first supporting portion 612, a second supporting portion 613, and a connecting portion 614, wherein the first supporting portion 612 and the second supporting portion 613 are disposed opposite to each other, and both the first supporting portion 612 and the second supporting portion 613 protrude from the connecting plate 62. The connecting portion 614 is used to connect to the first supporting portion 612 and the second supporting portion 613, and the connecting portion 614 is located at one end of the spoiler unit 61 away from the connecting plate 62. The connection portion 614, the first support portion 612, and the second connection portion 614 form a flow hole 611 therebetween. The plurality of turbulent flow units 61 are sequentially connected along the first direction X, and in two adjacent turbulent flow units 61, the connecting plate 62 of one turbulent flow unit 61 is connected with the connecting plate 62 of the other adjacent turbulent flow unit 61 in a staggered manner, so that two adjacent circulation holes 611 are arranged in a staggered manner and communicated with each other.

For example, please refer to fig. 5, fig. 5 is a schematic operation diagram of a spoiler in an embodiment of the present application. Three turbulence units, namely a first turbulence unit 61a, a second turbulence unit 61b and a third turbulence unit 61c, are adjacently arranged. When the coolant 9 flows, the coolant 9 hits the first supporting portion of the second spoiler unit 61b, and is divided into a first path of coolant 91 and a second path of coolant 92 under the blockage of the first supporting portion, and the two paths of coolant respectively flow to the two sides of the second spoiler unit 61 b. Then, the first path of cooling liquid 91 meets the first supporting part of the first turbulent flow unit 61a and enters the circulation hole of the second turbulent flow unit 61b under the blockage of the first supporting part; the second cooling liquid 92 meets the first supporting portion of the second turbulent flow unit 61b, the second cooling liquid 92 enters the circulation hole of the second turbulent flow unit 61b under the blocking of the first supporting portion, the first cooling liquid 91 and the second cooling liquid 92 form convection in the circulation hole of the second turbulent flow unit 61b, and the heat exchange efficiency is improved. Further, the coolant continuously flows to touch the second support part of the second spoiler unit 61b and is divided into two coolant paths under the blocking of the second support part, one coolant path flows from the flow hole of the second spoiler unit 61b to the flow hole of the first spoiler unit 61a, and the coolant path can also realize convection in the flow hole of the first spoiler unit 61 a; the other path flows from the circulation of the second spoiler unit 61b to the circulation hole of the third spoiler unit 61c, and the one path of the coolant can also realize convection in the circulation hole of the third spoiler unit 61 c.

It can be understood that the first supporting portion 612 and the second supporting portion 613 in the flow disturbing unit 61 can form a vortex in the cooling liquid 9, and the adjacent two flow disturbing units 61 are arranged in a staggered manner, so that convection can be formed in the cooling liquid 9 in the flow through hole 611, the heat exchange efficiency of the cooling liquid 9 is further improved, and the heat dissipation effect of the heat dissipation device 100 is enhanced. When the cooling liquid 9 flows through the baffle units 61, each baffle unit 61 can break the boundary layer of the cooling liquid 9 and generate a vortex, and further flow in the first direction X by the guidance of the flow holes 611, so as to increase the heat convection efficiency of the cooling liquid 9 in the baffle units 61. Illustratively, two adjacent flow disturbing units are staggered by 1 mm, and the width of each flow hole 611 is 2 mm, so that the resistance to the flow of the cooling liquid 9 is reduced as much as possible while the flow disturbing effect is achieved. The first direction X and the flowing direction Y of the cooling liquid form a predetermined included angle, so that the first supporting portion 612 and the second supporting portion 613 can block the cooling liquid 9 to help the formation of the vortex and the convection, for example, the included angle between the first direction X and the flowing direction Y of the cooling liquid is 90 °. The plurality of turbulence units 61 are arranged along the first direction X, and the connection plate 62 may be provided with a plurality of rows of turbulence units 61 to further improve the heat dissipation effect. The shape of the flow holes 611 may be rectangular, trapezoidal, wedge-shaped, or the like, which is not limited herein.

It can be understood that different components in the device to be cooled have different requirements for heat dissipation, and therefore, when designing the flow channel, the sectional area of the flow channel can be designed according to the heat dissipation requirements. The sectional area of the runner can be enlarged at a place with large heat dissipation requirements, and the plurality of turbulence members 6 are arranged in the runner, so that the more the turbulence members 6 are, the better the heat dissipation effect is.

The cooling liquid 9 may be water, a refrigerant, or a liquid with high heat exchange efficiency such as ethanol, and the specific type of the cooling liquid 9 is not limited herein.

At present, common heat dissipation methods such as natural cooling (convection and radiation), forced air cooling, immersed natural convection cooling, forced water cooling and the like are widely applied to the industries of communication, laser, new energy and the like. Generally, different ways are selected for heat dissipation according to factors such as heat flux density, volume power and temperature rise speed of the equipment. For equipment with small space and poor heat dissipation conditions, a forced water cooling mode is generally adopted for heat dissipation, and the current forced water cooling heat dissipation structure has the problem of high production cost.

Referring to fig. 6, fig. 6 is a schematic flow chart illustrating a method for manufacturing a heat dissipation device according to an embodiment of the present application, the method for manufacturing the heat dissipation device includes:

301. and providing a cover plate, and machining lightening holes and threaded holes on the cover plate.

302. And providing a connecting plate, and rolling the connecting plate to form the turbulence unit.

It should be noted that the structure and arrangement of the spoiler unit 61 are repetitive, so that roll forming may be selected as the processing method of the spoiler 6. Correspondingly, 3 series aluminum alloy with good rolling performance can be selected as the material of the spoiler 6, and the processing mode of roll forming can effectively reduce the production cost and the production efficiency. It is understood that the spoiler 6 may be machined first, and then the cover plate 4 may be machined, without limitation.

303. Providing a bottom plate, and stamping a groove on the bottom plate.

304. Removing burrs on the bottom plate and cleaning stains on the bottom plate.

It should be noted that, the bottom plate 5 is formed by a stamping process, so that the bottom plate 5 needs to be made of a material with a better stamping performance, and the thickness of the substrate of the bottom plate 5 needs to be smaller. Illustratively, the thickness of the bottom plate 5 is less than 3 mm, and the bottom plate 5 may be stamped by using 3 series aluminum alloy.

It will be appreciated that the recesses 51 are used to form flow channels and that the regions of the base plate 5 not provided with recesses 51 need to be welded to the cover plate 4. Therefore, after stamping, the flatness of the non-groove 51 region on the bottom plate 5 needs to be smaller than the preset flatness, so as to ensure that the welding material can fully fill the gap between the cover plate 4 and the bottom plate 5 in the subsequent welding process, for example, the flatness of the non-groove 51 region on the bottom plate 5 can be smaller than 0.5 mm.

After the bottom plate 5 is pressed, burrs are formed on the work, and stains such as grease and dust are formed on the surface of the work. This will affect the subsequent welding process and thus clean the bottom plate 5 and remove burrs before welding.

305. And arranging the turbulence piece in the groove, placing welding fluxes between the turbulence piece and the bottom plate, between the bottom plate and the cover plate and between the turbulence piece and the cover plate, and arranging the cover plate on the bottom plate so that the cover plate covers the groove.

306. The base plate, the cover plate, the spoiler and the solder are heated integrally, and the solder is melted to connect the base plate, the cover plate and the spoiler as a whole.

The cover plate 4, the bottom plate 5 and the spoiler 6 which are placed according to preset positions are placed in a welding device, and welding can be completed by melting welding flux at high temperature. It is understood that a welding furnace can weld about 2000 water-cooled heat sinks 100, which is approximately equal to 200 machining centers and the machining capacity of friction stir welding equipment. Therefore, the method for producing the heat sink 100 according to the present disclosure can greatly improve the production efficiency of the heat sink 100.

In the related art, two methods are generally used for producing the heat dissipation device 100. One is to process a flow channel on an aluminum block by adopting a mechanical processing mode and then connect the two processed and formed aluminum blocks into a whole by adopting a friction welding process. The second is to open an aluminum section mould, draw the water channel to form, and connect the two ends of the water channel into a whole by adopting a mode of plugging plates and sealing rings and screws. It can be understood that both production methods have problems of excessive cost and low production efficiency.

In the embodiment of the present application, the stamping process is adopted to process the groove 51 on the bottom plate 5, and the bottom plate 5 and the cover plate 4 are welded to produce the heat dissipation device 100, compared with the machining or die drawing, the stamping process can reduce the manufacturing cost of the heat dissipation device 100, and greatly improve the production efficiency of the heat dissipation device 100.

It should be noted that the connecting plate 62 of the spoiler 6 is connected to the bottom plate 5, and the connecting portion 614 of the spoiler 6 is connected to the cover plate 4, so that the spoiler 6 is restricted to a fixed position in the flow channel, thereby preventing the position of the spoiler from being shifted due to the flow of the coolant 9. The solder may be in the form of a rectangular solder pad, such as a solder pad having dimensions of 4.6 mm x 4.0 mm x 0.05 mm.

It should be noted that the spoiler 6 is disposed in the flow channel, and the cover plate 4 and the groove 51 on the base plate 5 together form the flow channel, so that the spoiler 6 needs to be first placed in the groove 51 on the base plate 5, and the solder is placed at the corresponding position, and then the cover plate 4 is covered.

The cover plate 4, the bottom plate 5, the spoiler 6, and the solder are put into a furnace together and heated, and the solder is melted and solidified to complete the connection of the respective members. It can be understood that, during the sintering process, the molten solder has certain fluidity, which may cause the position of each component to shift, for example, the cover plate 4 and the bottom plate 5 shift and deviate from the pre-placed position, thereby causing poor consistency of the finished product and low product yield. Therefore, the bottom plate 5 and the cover plate 4 can be pressed by using a clamp, so that the cover plate 4 is prevented from sliding due to melting of the solder in the sintering process, and the sintering consistency is ensured. Meanwhile, the clamp provides pressure to the cover plate 4 and the bottom plate 5 in the sintering process, and solder voids are prevented from being generated between the cover plate 4 and the bottom plate 5. The use of the clamp can also control the deformation in the welding process, and the yield of products is improved. Illustratively, the heat sink 100 is required to deform less than 0.5 mm during soldering.

307. The mounting surface is milled on the cover plate.

After welding, the device mounting surface 43 of the integral water-cooling heat dissipation equipment is milled, the position flatness of the mounted device is required to be less than 0.1 mm, the abutting of the device to be cooled and the mounting surface 43 is further guaranteed, and heat transfer efficiency is improved.

308. And detecting the defects of the welding position by using ultrasonic waves, and detecting the tightness of the heat dissipation device.

Illustratively, a solder defect such as a solder void can be detected by ultrasonic waves.

After the welding of the heat dissipation device 100 is completed, the cooling liquid 9 needs to be introduced, and in order to avoid leakage of the cooling liquid 9 during use, the tightness of the heat dissipation device 100 needs to be tested in the production stage, and for example, the heat dissipation device is subjected to a pressure test of 1.2 mpa after the production is completed, and the pressure maintaining time is 30 minutes.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The heat dissipation device provided by the embodiment of the present application is described in detail above, and the principle and the implementation of the present application are explained in the present application by applying specific examples, and the description of the above embodiment is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A heat dissipating device, comprising:

the bottom plate is provided with a groove;

2. The heat dissipation device as claimed in claim 1, wherein the cover plate is provided with a mounting surface, the mounting surface is in contact with the device to be dissipated, and the flatness of the mounting surface is less than a preset value, so as to improve the heat transfer efficiency between the device to be dissipated and the cover plate.

3. The heat dissipating device of claim 2, wherein the cover plate has a threaded hole, and the device to be dissipated has a stud locked in the threaded hole to connect the cover plate and the device to be dissipated.

4. The heat dissipating device of claim 3, further comprising a fixing member, wherein the device to be dissipated and the cover plate are connected by the fixing member.

5. The heat sink as claimed in any one of claims 1 to 4, wherein the cover plate is provided with lightening holes to reduce the cost of the heat sink.

6. The heat dissipation device of any one of claims 1 to 4, wherein the spoiler comprises a connecting plate and a plurality of spoiler units, the spoiler units are connected with the connecting plate, the spoiler units are arranged in a staggered manner along a first direction, and the first direction has a preset included angle with a flowing direction of the cooling liquid, so that the spoiler units block the cooling liquid to generate a vortex.

7. The heat dissipating device as claimed in claim 6, wherein each of the flow disturbing units has flow holes extending along a first direction, two adjacent flow holes are arranged in a staggered manner and are communicated with each other, and the cooling fluid can flow into the flow holes from both sides of the flow disturbing unit to form convection.

8. The heat dissipating device of claim 7, wherein the flow disturbing unit comprises:

the first supporting part is connected with the connecting plate;

9. The heat dissipating device of claim 8, wherein the connecting plate is connected to the base plate and the connecting portion is connected to the cover plate.

10. The heat sink according to any one of claims 1 to 4, wherein the coolant is water, refrigerant or ethanol.