CN217389088U - Multilayer circuit board convenient for heat dissipation - Google Patents
Multilayer circuit board convenient for heat dissipation Download PDFInfo
- Publication number
- CN217389088U CN217389088U CN202220680767.3U CN202220680767U CN217389088U CN 217389088 U CN217389088 U CN 217389088U CN 202220680767 U CN202220680767 U CN 202220680767U CN 217389088 U CN217389088 U CN 217389088U
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- CN
- China
- Prior art keywords
- circuit board
- heat dissipation
- multilayer circuit
- heat transfer
- turbofan
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- 229920003023 plastic Polymers 0.000 claims abstract description 6
- 239000004033 plastic Substances 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 4
- 238000009434 installation Methods 0.000 description 11
- 230000009975 flexible effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a convenient radiating multilayer circuit board, include: the heat dissipation assembly comprises a circuit board unit group, a heat transfer assembly, a heat dissipation assembly and a turbofan; the circuit board unit group is arranged in the multilayer circuit board body; the heat transfer component is arranged on the lower end face of a plurality of groups of circuit board units in the multilayer circuit board body, and the upper surface and the lower surface of the heat transfer component are both subjected to leveling treatment; the heat dissipation assembly is arranged on the lower end face of the heat transfer assembly; the turbofan is arranged on the lower end face of the heat dissipation assembly, and each group of turbofan is vertically aligned with one group of circuit board unit group above; the outer frame body is arranged outside the multilayer circuit board body, the bottom of the multilayer circuit board body is provided with a bottom plate, and the outer frame body is made of PC plastic materials. The utility model discloses the structure sets up rationally, sets up heat transfer and radiator unit at the lower terminal surface of multilayer circuit board, conveniently carries out the sparse heat of large tracts of land, and usable radiator fan carries out rapid cooling and handles simultaneously, wholly sets up the heat dissipation and more conveniently saves trouble.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to convenient radiating multilayer circuit board.
Background
The multilayer circuit board is also called as a printed circuit board and a printed circuit board, is an important electronic component, is a support body of an electronic component, and is a provider for electrical connection of the electronic component; at present, the multilayer circuit board has a wide application range, and all the fields of electric appliances are related, so the multilayer circuit board is very important in the aspect of safety. However, in the multilayer circuit board in the prior art, the number of layers is large, so that heat generated inside is not easy to evacuate, the internal temperature is quickly raised, certain potential safety hazards exist in use, and the service life of the multilayer circuit board is influenced.
SUMMERY OF THE UTILITY MODEL
For overcoming the defect that prior art exists, provide a convenient radiating multilayer circuit board now to solve prior art's multilayer circuit board because the number of piles sets up comparatively much, inside produced heat is not easy sparse, leads to inside temperature to rise fast, uses to have certain potential safety hazard, and influences its life's problem.
In order to achieve the above object, there is provided a multilayer circuit board facilitating heat dissipation, comprising: the heat dissipation assembly comprises a circuit board unit group, a heat transfer assembly, a heat dissipation assembly and a turbofan;
the circuit board unit group is arranged in the multilayer circuit board body;
the heat transfer assembly is arranged on the lower end face of the multiple groups of circuit board unit groups in the multilayer circuit board body, and the upper surface and the lower surface of the heat transfer assembly are both subjected to leveling treatment;
the heat dissipation assembly is arranged on the lower end face of the heat transfer assembly;
and each group of turbofan is vertically aligned with one group of circuit board unit group above.
Furthermore, the outer frame body is arranged outside the multilayer circuit board body, a bottom plate is arranged at the bottom of the multilayer circuit board body, and the outer frame body is made of PC plastic.
Further, be provided with the multiunit installation cover in the outer frame body, and all there is a set of threaded rod through threaded connection in every group installation cover to the flexible activity of threaded rod is in the installation cover, and the lower extreme of threaded rod is fixed with the base simultaneously, and the base chooses for use the silica gel material.
Furthermore, the thickness of the heat transfer component is set to be 1.8-2.8mm, and the heat transfer component is made of an aluminum-copper alloy material.
Furthermore, the heat dissipation assembly adopts a heat dissipation fin group structure, a plurality of groups of fins are transversely arranged, and the height of the fins is set to be 3 mm.
Furthermore, the outside of turbofan is provided with the protection casing, and the narrow width setting down in the protection casing to the lower port department of protection casing is provided with the net frame, and the stainless steel surface structure is selected for use to the net frame.
The beneficial effects of the utility model reside in that:
1. the utility model discloses the outer framework that well multilayer circuit board originally external set up is the environmental protection plastics material, has good fire resistance and oxidation resistance, and life is more permanent.
2. The utility model discloses the installation cover, threaded rod and the base that set up in the outer framework of china and abroad constitute bearing structure together, and the threaded rod passes through screw thread swing joint in the installation cover, and clockwise rotation bores in toward the installation cover, and anticlockwise rotation stretches out toward the threaded rod outward, the high position of convenient adjustment threaded rod, and the base texture of threaded rod lower extreme is soft simultaneously, supports stable antiskid.
4. The utility model discloses well heat transfer unit directly sets up the lower terminal surface of this internal multiunit circuit board unit group of multilayer circuit board, can carry the produced heat of circuit board unit group during the operation down, conveniently carry the heat to the radiator unit in fast, carry out the sparse of large tracts of land on the radiator unit, conveniently carry out the large tracts of land cooling and handle.
5. The utility model discloses well turbofan's setting can accelerate the cooling rate of circuit board unit group, utilizes forced air cooling heat dissipation fast to save time to the processing of cooling down in the short time.
Drawings
Fig. 1 is a schematic top view of an embodiment of the present invention;
fig. 2 is a schematic bottom view of an embodiment of the present invention;
fig. 3 is a schematic cross-sectional structure diagram of an embodiment of the present invention;
fig. 4 is a schematic view of the circuit board unit group installation according to the embodiment of the present invention.
In the figure: 1. a multilayer wiring board body; 10. an outer frame body; 11. installing a sleeve; 12. a threaded rod; 13. a base; 14. a base plate; 2. a circuit board unit group; 3. a heat transfer assembly; 4. a heat dissipating component; 5. a turbo fan; 50. a protective cover; 51. and (6) screen frames.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will be readily apparent to those skilled in the art from the disclosure herein. The present invention can also be implemented or applied through other different specific embodiments, and various details in the present specification can be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.
Fig. 1 is the utility model discloses overlook the sketch map, fig. 2 is the utility model discloses the bottom surface sketch map, fig. 3 do of the embodiment the utility model discloses a section structure sketch map and fig. 4 do the utility model discloses a circuit board unit group installation sketch map of embodiment.
Referring to fig. 1 to 4, the utility model provides a convenient radiating multilayer circuit board, include: the heat dissipation module comprises a circuit board unit group 2, a heat transfer module 3, a heat dissipation module 4 and a turbofan 5; the circuit board unit group 2 is arranged in the multilayer circuit board body 1; the heat transfer component 3 is arranged on the lower end face of the multiple groups of circuit board unit groups 2 in the multilayer circuit board body 1, and the upper surface and the lower surface of the heat transfer component 3 are both subjected to leveling treatment; the heat dissipation component 4 is arranged on the lower end face of the heat transfer component 3; turbofan 5 installs in radiator unit 4's lower terminal surface, and every turbofan 5 all aligns the setting from top to bottom with a set of circuit board unit group 2 in the top.
In this embodiment, an outer frame 10 is disposed outside the multilayer circuit board body 1, a bottom plate 14 is disposed at the bottom of the multilayer circuit board body 1, and the outer frame 10 is made of PC plastic.
As a preferred embodiment, the outer frame 10 of the multi-layer circuit board 1 of the present invention is made of environment-friendly plastic, and has good flame retardancy and oxidation resistance, and a longer service life.
In this embodiment, be provided with multiunit installation cover 11 in the outer frame 10, and all have a set of threaded rod 12 through threaded connection in every group installation cover 11 to the flexible activity of threaded rod 12 is in installation cover 11, and the lower extreme of threaded rod 12 is fixed with base 13 simultaneously, and base 13 chooses for use the silica gel material.
As an embodiment of preferred, the utility model discloses the mounting sleeve 11, threaded rod 12 and the base 13 that set up in the outer frame body 10 constitute bearing structure together, and threaded rod 12 passes through screw thread swing joint in mounting sleeve 11, and clockwise rotation bores in mounting sleeve 11, and anticlockwise rotation stretches out toward threaded rod 12 outward, makes things convenient for the high position of adjustment threaded rod 12, and the base 13 texture of threaded rod 12 lower extreme is soft simultaneously, supports and stabilizes anti-skidding.
In this embodiment, the thickness of the heat transfer component 3 is set to be 1.8-2.8mm, and the heat transfer component 3 is made of aluminum-copper alloy; the heat dissipation component 4 adopts a heat dissipation fin group structure, a plurality of groups of fins are transversely arranged, and the height of the fins is set to be 3 mm.
As an embodiment of preferred, the utility model discloses well heat transfer unit 3 directly sets up multiunit circuit board unit group 2's lower terminal surface in multilayer circuit board body 1, can be with circuit board unit group 2 produced heat during operation down transport, conveniently carry the heat to radiator unit 4 in fast, carry out evacuation of large tracts of land on radiator unit 4, conveniently carry out the treatment of cooling down by a large scale.
In the present embodiment, the outside of the turbofan 5 is provided with the protection cover 50, and the protection cover 50 is arranged to be narrow at the top and wide at the bottom, and the lower port of the protection cover 50 is provided with the mesh frame 51, and the mesh frame 51 adopts a stainless steel mesh structure.
As an embodiment of preferred, the utility model discloses well turbofan 5's setting can accelerate circuit board unit group 2's cooling rate, utilizes the forced air cooling heat dissipation fast more to save time to cool down in the short time and handle.
The utility model discloses can effectively solve prior art's multilayer line board because the number of piles sets up comparatively many, inside produced heat is easy sparse not, and it is fast to lead to inside temperature to rise, uses to have certain potential safety hazard, and influences its life's problem, the utility model discloses the structure sets up rationally, sets up heat transfer and radiator unit at multilayer line board's lower terminal surface, conveniently carries out the sparse heat of large tracts of land, and usable radiator fan carries out rapid cooling and handles simultaneously, wholly sets up the heat dissipation and more conveniently saves trouble.
Claims (6)
1. A multilayer circuit board facilitating heat dissipation, comprising: the heat dissipation module comprises a circuit board unit group (2), a heat transfer module (3), a heat dissipation module (4) and a turbofan (5);
the circuit board unit group (2) is arranged in the multilayer circuit board body (1);
the heat transfer component (3) is arranged on the lower end face of the multiple groups of circuit board unit groups (2) in the multilayer circuit board body (1), and the upper surface and the lower surface of the heat transfer component (3) are both subjected to flattening treatment;
the heat dissipation component (4) is arranged on the lower end face of the heat transfer component (3);
turbofan (5) installs the lower terminal surface at radiator unit (4), every turbofan of group (5) all aligns the setting from top to bottom with a set of circuit board unit group (2) in top.
2. The multilayer circuit board convenient for heat dissipation according to claim 1, wherein an outer frame (10) is disposed outside the multilayer circuit board body (1), a bottom plate (14) is disposed at the bottom of the multilayer circuit board body (1), and the outer frame (10) is made of PC plastic.
3. The multilayer circuit board convenient for heat dissipation according to claim 2, wherein a plurality of sets of mounting sleeves (11) are arranged in the outer frame body (10), each set of mounting sleeve (11) is internally connected with a set of threaded rod (12) through threads, the threaded rods (12) are movably and telescopically arranged in the mounting sleeves (11), a base (13) is fixed at the lower end of each threaded rod (12), and the base (13) is made of silica gel.
4. The multilayer circuit board convenient for heat dissipation according to claim 1, wherein the thickness of the heat transfer component (3) is set to 1.8-2.8mm, and the heat transfer component (3) is made of aluminum-copper alloy.
5. The multilayer circuit board convenient for heat dissipation according to claim 1, wherein the heat dissipation assembly (4) is a heat dissipation fin set structure, and multiple sets of fins are arranged in a transverse direction, and the height of the fins is set to be 3 mm.
6. The multilayer circuit board convenient for heat dissipation according to claim 1, wherein a protective cover (50) is disposed on the outer side of the turbofan (5), the protective cover (50) is disposed with a narrow top and a wide bottom, a mesh frame (51) is disposed at the lower port of the protective cover (50), and the mesh frame (51) is made of stainless steel mesh.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220680767.3U CN217389088U (en) | 2022-03-28 | 2022-03-28 | Multilayer circuit board convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220680767.3U CN217389088U (en) | 2022-03-28 | 2022-03-28 | Multilayer circuit board convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217389088U true CN217389088U (en) | 2022-09-06 |
Family
ID=83105341
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220680767.3U Active CN217389088U (en) | 2022-03-28 | 2022-03-28 | Multilayer circuit board convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217389088U (en) |
-
2022
- 2022-03-28 CN CN202220680767.3U patent/CN217389088U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 19 Jinhua Road, Shuixi Industrial Park, Zhanggong District, Ganzhou City, Jiangxi Province, 341000 Patentee after: Ganzhou Chaoyue Technology Co.,Ltd. Address before: 341000 Jiangxi Ganzhou Zhanggong District Water West cobalt molybdenum rare metal industrial base Patentee before: Ganzhou Chao Yue Technology Co.,Ltd. |
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| CP03 | Change of name, title or address |