CN217336232U - Roadside computing device and vehicle - Google Patents

Roadside computing device and vehicle Download PDF

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Publication number
CN217336232U
CN217336232U CN202123433447.2U CN202123433447U CN217336232U CN 217336232 U CN217336232 U CN 217336232U CN 202123433447 U CN202123433447 U CN 202123433447U CN 217336232 U CN217336232 U CN 217336232U
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heat
heat dissipation
roadside computing
computing device
component
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CN202123433447.2U
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张昌会
冯志辉
邓志伟
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Zhidao Network Technology Beijing Co Ltd
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Zhidao Network Technology Beijing Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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Abstract

The utility model discloses a trackside computing equipment and vehicle, which comprises a housin, first radiator unit, second radiator unit and calculation subassembly, first radiator unit is at the surface of casing, second radiator unit, the setting is at casing first radiator unit's internal surface dorsad, calculation subassembly sets up the inside at the casing, calculation subassembly includes circuit board and the part that generates heat, the circuit board is provided with a plurality of parts that generate heat, the circuit board can be dismantled with casing first radiator unit's internal surface dorsad and be connected, the part that generates heat is contradicted with a second radiator unit respectively and is connected, the heat that the part that generates heat produced in the course of the work can disperse fast to casing and first radiator unit through the second radiator unit, casing and first radiator unit can realize natural heat dissipation through the convection current of outside air, the radiating efficiency is high, can not produce the heat and pile up.

Description

Roadside computing device and vehicle
Technical Field
The utility model relates to an automatic driving technical field specifically is a trackside computing equipment and vehicle.
Background
The roadside computing equipment is a core component of road-side infrastructure equipment in a vehicle-road cooperation scene and is also a brain of a roadside perception system and is mainly used for edge perception and fusion computing. The method accurately identifies road network traffic states, events, vehicles and the like based on full and continuous environment information through technologies such as video networking, artificial intelligence, edge calculation and the like, collects data, and simultaneously realizes safety assistance and efficiency guidance support for automatically driven vehicles and V2X internet vehicles by fusing, processing and distributing the collected data, thereby assisting the intelligent and digital traffic perception of highways and improving the management level.
The roadside computing equipment provides an edge mode computing service, and a side cloud computing architecture of the roadside computing service is cooperatively matched with a central cloud computing resource and is used for supplementing and optimizing the computing capability of the central cloud. The intelligent multi-door multi-class general perception system is concentrated on video perception, has rich perception capabilities of target detection, attribute extraction, event detection and the like, is oriented to the intelligent high-speed multi-door general perception requirements, provides perception data services with relatively low time delay and higher precision, performs detection and analysis on related events such as parking, congestion, illegal lane changing and the like through real-time video acquisition, outputs traffic parameters such as traffic flow, average speed, time occupancy, space occupancy, headway distance, queuing length and the like, achieves beyond-the-horizon navigation based on digital twin ability, and plays an important role in application scenes such as automatic driving, vehicle-road cooperation, vehicle networking and the like.
The roadside computing device comprises a computing unit, the computing unit generates a large amount of heat in the working process, and if the heat is not dissipated timely, the temperature of the roadside computing device can be continuously increased, so that the computing unit is burnt out.
Based on the above situation, it is highly desirable to provide a roadside computing device capable of dissipating heat in time during operation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a trackside computing equipment, this equipment can dispel the heat fast at the in-process of work, can not produce the heat and pile up.
The application provides a roadside computing device comprising: a housing having an accommodating space therein; the first heat dissipation assembly is arranged on the outer surface of the shell; the second heat dissipation assemblies are provided with a plurality of second heat dissipation assemblies which are arranged on the inner surface of the shell opposite to the first heat dissipation assembly; the computing assembly is arranged in the shell and comprises a circuit board and a plurality of heating components, the circuit board is detachably mounted on the inner surface of the shell, and each heating component is respectively connected with one second heat dissipation assembly in an abutting mode.
In some optional embodiments, the first heat dissipation assembly comprises a plurality of first heat dissipation components, and the plurality of first heat dissipation components are arranged on the outer surface of the shell in an array.
In some alternative embodiments, the first heat sink member is any one of a heat sink copper sheet and a heat sink aluminum sheet.
In some alternative embodiments, an outer surface of the housing is provided with at least one of an oxide layer and a paint layer.
In some alternative embodiments, the second heat dissipation assembly includes a thermally conductive layer through which each of the heat generating components is connected with the housing inner surface.
In some alternative embodiments, the second heat dissipation assembly includes a heat conductive layer, a second heat dissipation member, and a heat conductive layer arranged in a stack, the heat generating member abutting one of the heat conductive layers, the other of the heat conductive layers abutting the housing inner surface.
In some optional embodiments, the second heat dissipation assembly includes a heat conductive layer and a second heat dissipation part, the heat generating part is abutted against the heat conductive layer, and the second heat dissipation part is welded on the inner surface of the shell.
In some alternative embodiments, the second heat sink piece is a heat pipe or a vapor chamber.
In some optional embodiments, the thermally conductive layer is at least one of a thermally conductive silicone layer, and a thermally conductive gel layer.
In some optional embodiments, the housing includes an upper cover, a lower cover, and a sidewall connecting the upper cover and the lower cover, and the first heat dissipation assembly is welded to the upper cover, or the first heat dissipation assembly is integrally formed with the upper cover.
In some optional embodiments, the electronic device comprises a plurality of supporting columns and a plurality of fixing elements, wherein the plurality of supporting columns are uniformly arranged on the inner surface of the upper cover, and one fixing element is detachably connected with one supporting column to fix the circuit board on each supporting column.
On the other hand, the utility model provides a vehicle, including the on-board unit, the on-board unit can carry out the information interaction with the roadside computing equipment, the roadside computing equipment is the roadside computing equipment that any one above mentioned.
Compared with the prior art, the method has the following technical effects:
1. the utility model provides a trackside computing equipment, which comprises a housin, first radiator unit, second radiator unit and computing component, first radiator unit is at the surface of casing, second radiator unit, the setting is at the casing internal surface of first radiator unit dorsad, computing component sets up the inside at the casing, computing component includes circuit board and the part that generates heat, the circuit board is provided with a plurality of parts that generate heat, the circuit board can be dismantled with the casing internal surface of first radiator unit dorsad and be connected, the part that generates heat is contradicted with a second radiator unit respectively and is connected, the heat that the part that generates heat produced in the course of the work can disperse fast to casing and first radiator unit through second radiator unit, casing and first radiator unit can realize natural heat dissipation through the convection current of outside air, the radiating efficiency is high, can not produce the heat and pile up.
2. The utility model provides a vehicle, the on-board unit of this vehicle can carry out the information interaction with the trackside computing equipment, and trackside computing equipment can be for the vehicle lasts stable transmission trackside information, provides support to the safety assistance and the guide of vehicle.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic cross-sectional structural diagram of a roadside computing device according to an embodiment of the present invention;
fig. 2 is a schematic view of an appearance structure of a roadside computing device according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a second heat dissipation assembly in a roadside computing device according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a second heat dissipation assembly in a roadside computing device according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a second heat dissipation assembly in a roadside computing device according to another embodiment of the present invention.
Reference numerals: 1-a shell; 11-upper cover; 12-lower cover; 13-a side wall; 14-a bump; 2-a first heat dissipation assembly; 21-a first heat sink member; 3-a second heat dissipation assembly; 31-a thermally conductive layer; 32-a second heat sink member; 4-a computation component; 41-a circuit board; 42-a heat-generating component; 5-support column.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making creative efforts shall fall within the protection scope of the present application.
The utility model provides a trackside computing device, as shown in FIG. 1 and FIG. 2, include: a housing 1, a first heat sink assembly 2, a second heat sink assembly 3, and a computing assembly 4. The housing 1 has a certain receiving space therein. The first heat dissipation assembly 2 is disposed on an outer surface of the case 1. The plurality of second heat dissipation assemblies 3 are arranged, the plurality of second heat dissipation assemblies 3 are located inside the shell 1, and the plurality of second heat dissipation assemblies 3 are arranged on the inner surface, back to the first heat dissipation assembly 2, of the shell 1. The calculation component 4 is arranged in the casing 1, the calculation component 4 comprises a circuit board 41 and a heat generating component 42, the circuit board 41 is provided with a plurality of heat generating components 42, the circuit board 41 is detachably mounted on the inner surface of the casing 1, each heat generating component 42 is respectively abutted against and connected with one second heat radiating component 3, heat generated by the heat generating component 42 in the working process can be quickly dissipated to the casing 1 and the first heat radiating component 2 through the second heat radiating component 32, the casing 1 and the first heat radiating component 2 can realize natural heat dissipation through convection of outside air, the heat dissipation efficiency is high, and heat accumulation cannot be generated.
Specifically, the housing 1 may be made of an aluminum alloy or a thermally conductive plastic. The circuit board 41 is electrically connected to the heat generating component 42, and the heat generating component 42 is a chip.
Further, as shown in fig. 2, the housing 1 includes an upper cover 11, a lower cover 12, and a side wall 13, the side wall 13 connects the upper cover 11 and the lower cover 12, the side wall 13, the upper cover 11, and the lower cover 12 form a housing structure having an inner space, and alternatively, the side wall 13 and the upper cover 11 may be integrally formed. The upper cover 11 includes an inner surface facing the accommodating space and an outer surface facing away from the accommodating space. The first heat sink assembly 2 is welded to the upper cover 11, and optionally, the first heat sink assembly 2 is welded to the outer surface of the upper cover 11, or the first heat sink assembly 2 and the upper cover 11 are integrally formed.
Further, as shown in fig. 1, the first heat sink assembly 2 includes a plurality of first heat sink members 21, and the plurality of first heat sink members 21 are arranged in an array on the outer surface of the housing 1. The first heat dissipation member 21 is made of any one of a heat dissipation copper sheet and a heat dissipation aluminum sheet, and the heat dissipation member made of the above materials has the advantages of good heat conductivity, light weight and easiness in processing. The first heat dissipation member 21 is disposed on an outer surface of the upper cover 11, and heat dissipation is achieved by heat exchange between the first heat dissipation member 21 and the upper cover 11, and the housing 1 and the first heat dissipation assembly 2 can achieve natural heat dissipation through convection of external air.
In some alternative embodiments, as shown in fig. 1, the roadside computing device includes a plurality of support posts 5 and a plurality of fixing members, the plurality of support posts 5 are uniformly disposed on the inner surface of the upper cover 11, and one fixing member is detachably connected to one support post 5 to fix the circuit board 41 to each support post 5.
Specifically, the plurality of support columns 5 are uniformly provided on the inner surface of the upper cover 11. A plurality of fixing elements are bolts, and threaded holes are formed in the supporting columns 5. The edge position of the circuit board 41 is provided with a plurality of through holes, each through hole corresponds to a threaded hole of each support column, and the fixing element passes through the through hole, enters the threaded hole and is in threaded connection with the inner surface of the threaded hole surrounded by the support columns 5.
Further, as shown in fig. 1, the circuit board 41 passes through a gap formed between the support post 5 and the upper cover 11. The inner surface of the upper cover 11 is provided with a plurality of protrusions 14, each protrusion 14 corresponds to a heating component 42 of the circuit board 41 one by one, a second heat dissipation assembly 3 is arranged between the lower surface of the protrusion 14 and the heating component 42, one end of the second heat dissipation assembly 3 abuts against the heating component 42, and the other end of the second heat dissipation assembly 3 is welded or abuts against the lower surface of the protrusion 14.
In some alternative embodiments, the outer surface of the housing 1 is provided with at least one of an oxide layer and a paint layer, both of which can enhance the radiation heat dissipation capability of the housing 1.
In some alternative embodiments, as shown in fig. 3, the second heat dissipation assembly 3 includes a heat conductive layer 31, and each heat generating component 42 is connected to the inner surface of the housing 1 through the heat conductive layer 31. The second heat dissipation component 3 is used for conducting heat emitted by the calculation component 4 to the first heat dissipation component 2, so that the temperature of the calculation component 4 is kept at a level capable of stably working, the calculation component 4 is prevented from being damaged due to poor heat dissipation, and the service life is prolonged.
Specifically, the heat conductive layer 31 may be at least one of a heat conductive silicone layer, and a heat conductive gel layer. When the heat generating component 42 is in contact with the inner surface of the housing 1, it is impossible to make a complete contact, and there is always some air gap therebetween, and the thermal conductivity of air is very small, thus resulting in a relatively large contact thermal resistance. The use of the heat conductive layer 31 fills this air gap, which reduces contact resistance and improves heat dissipation performance. At least one of a heat conductive silicone grease layer, a heat conductive silicone rubber layer, and a heat conductive gel layer is applied between the case 1 and the heat generating component 42, reducing the contact thermal resistance therebetween. The heat-conducting silicone grease is a high-heat-conducting insulating silicone material, is hardly cured, and can be kept in a grease state for a long time at the temperature of-50 ℃ to +230 ℃. The insulating material has excellent electrical insulating property, excellent heat conductivity, low freeness (tending to zero), high and low temperature resistance, water resistance, ozone resistance and aging resistance. The heat conductive silica gel layer is a heat conductive silica gel pad, which can well fill the gap between the inner surface of the upper cover 11 and the heat generating component 42, and push air out of the contact surface between the upper cover 11 and the heat generating component 42, so that the contact surface between the upper cover 11 and the heat generating component 42 can be fully contacted with each other. The high-performance heat-conducting gel is prepared by taking silica gel as a matrix and filling various high-performance ceramic powders, and the heat-conducting gel layer has the characteristics of high heat conductivity coefficient, low thermal resistance, good fit on a heat-radiating part, insulation, capability of automatically filling gaps, furthest increased limited contact area and capability of being infinitely compressed.
In some alternative embodiments, as shown in fig. 4, the second heat dissipation assembly 3 includes a heat conductive layer 31, a second heat dissipation part 32 and a heat conductive layer 31 which are stacked, the heat generating part 42 is abutted against one of the heat conductive layers 31, and the other heat conductive layer 31 is abutted against the inner surface of the housing 1.
Specifically, the upper and lower surfaces of the second heat sink member 32 are each provided with a heat conductive layer 31. The heat conductive layer 31 may be at least one of a heat conductive silicone layer, and a heat conductive gel layer. The second heat sink 32 is a heat pipe or a vapor chamber.
In some alternative embodiments, as shown in fig. 5, the second heat dissipation assembly 3 includes a heat conduction layer 31 and a second heat dissipation member 32 which are stacked, the heat generating member 42 abuts against the heat conduction layer 31, and the second heat dissipation member 32 is welded to the inner surface of the housing 1.
Specifically, the heat conductive layer 31 may be at least one of a heat conductive silicone layer, and a heat conductive gel layer. The heat conducting layer 31 is arranged between the second heat dissipation assembly 3 and the heat generating component 42, and the heat conducting layer 31 fills an air gap at the contact surface between the second heat dissipation assembly 3 and the heat generating component 42, so that the contact thermal resistance can be reduced, and the heat dissipation performance can be improved. The other surface of the second heat dissipation assembly 3 is welded with the inner surface of the upper cover 11. The second heat sink 32 is a heat pipe or a vapor chamber.
The utility model provides a roadside computing device, including casing 1, first radiator unit 2, second radiator unit 3 and computing unit 4, first radiator unit 2 is at the surface of casing, second radiator unit 3, set up at the internal surface of casing 1 back to first radiator unit 2, computing unit 4 sets up in the inside of casing, computing unit 4 includes circuit board 41 and heating part 42, circuit board 41 is provided with a plurality of heating parts 42, circuit board 41 and the internal surface of casing back to first radiator unit 2 can be dismantled and be connected, heating part 42 is contradicted with a second radiator unit 3 respectively and is connected, the heat that heating part 42 produced in the course of the work can be dispersed to casing 1 and first radiator unit 2 fast through second radiator unit 32, casing 1 and first radiator unit 2 can realize the natural heat dissipation through the convection current of outside air, the radiating efficiency is high, no heat build-up occurs.
The utility model provides a vehicle, the on-board unit of this vehicle can carry out the information interaction with the trackside computing equipment, and trackside computing equipment can be for the vehicle lasts stable transmission trackside information, provides support to the safety assistance and the guide of vehicle.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A roadside computing device comprising:
a housing (1) having an accommodating space therein;
the first heat dissipation assembly (2) is arranged on the outer surface of the shell (1);
the second heat dissipation assemblies (3) are provided with a plurality of heat dissipation assemblies which are arranged on the inner surface of the shell (1) opposite to the first heat dissipation assembly (2);
the computer component (4) is arranged inside the shell (1), the computer component (4) comprises a circuit board (41) and a heat generating component (42), the circuit board (41) is provided with a plurality of heat generating components (42), the circuit board (41) is detachably mounted on the inner surface of the shell (1), and each heat generating component (42) is respectively in interference connection with one of the second heat radiating components (3).
2. The roadside computing apparatus of claim 1, wherein the first heat sink assembly (2) comprises a plurality of first heat sink members (21), the plurality of first heat sink members (21) being arrayed on an outer surface of the housing (1).
3. The roadside computing device of claim 2, wherein the first heat sink member (21) is any one of a heat sink copper sheet and a heat sink aluminum sheet.
4. The roadside computing device of claim 1, wherein an outer surface of the housing (1) is provided with at least one of an oxide layer and a paint layer.
5. The roadside computing device of claim 1, wherein the second heat dissipation assembly (3) comprises a thermally conductive layer (31); alternatively, the first and second electrodes may be,
the second heat dissipation component (3) comprises a heat conduction layer (31), a second heat dissipation component (32) and the heat conduction layer (31) which are arranged in a stacked mode; alternatively, the first and second electrodes may be,
the second heat dissipation assembly (3) comprises a heat conduction layer (31) and a second heat dissipation component (32) which are arranged in a stacked mode.
6. The roadside computing apparatus of claim 5, wherein the second heat sink component (32) is a heat pipe or a heat spreader.
7. The roadside computing apparatus of claim 5, wherein the thermally conductive layer (31) is at least one of a thermally conductive silicone layer, and a thermally conductive gel layer.
8. The roadside computing device of claim 1, wherein the housing (1) comprises an upper cover (11), a lower cover (12) and a side wall (13), the side wall (13) connecting the upper cover (11) and the lower cover (12), the first heat dissipating assembly (2) being welded to the upper cover (11), or the first heat dissipating assembly (2) being integrally formed with the upper cover (11).
9. The roadside computing apparatus according to claim 8, comprising a plurality of support columns (5) and a plurality of fixing members, the plurality of support columns (5) being uniformly provided on an inner surface of the upper cover (11), one of the fixing members being detachably connected to one of the support columns (5) to fix the circuit board (41) to each of the support columns (5).
10. A vehicle comprising an on-board unit capable of information interaction with a roadside computing device, the roadside computing device being as recited in any one of claims 1 to 9.
CN202123433447.2U 2021-12-30 2021-12-30 Roadside computing device and vehicle Active CN217336232U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202123433447.2U CN217336232U (en) 2021-12-30 2021-12-30 Roadside computing device and vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202123433447.2U CN217336232U (en) 2021-12-30 2021-12-30 Roadside computing device and vehicle

Publications (1)

Publication Number Publication Date
CN217336232U true CN217336232U (en) 2022-08-30

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Application Number Title Priority Date Filing Date
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