CN203722989U - Heat radiation apparatus of dual-layer optical module - Google Patents

Heat radiation apparatus of dual-layer optical module Download PDF

Info

Publication number
CN203722989U
CN203722989U CN201420031367.5U CN201420031367U CN203722989U CN 203722989 U CN203722989 U CN 203722989U CN 201420031367 U CN201420031367 U CN 201420031367U CN 203722989 U CN203722989 U CN 203722989U
Authority
CN
China
Prior art keywords
optical module
radiator
upper strata
lower floor
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420031367.5U
Other languages
Chinese (zh)
Inventor
凌昕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celestica Technology Consultancy Shanghai Co Ltd
Original Assignee
Celestica Technology Consultancy Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celestica Technology Consultancy Shanghai Co Ltd filed Critical Celestica Technology Consultancy Shanghai Co Ltd
Priority to CN201420031367.5U priority Critical patent/CN203722989U/en
Application granted granted Critical
Publication of CN203722989U publication Critical patent/CN203722989U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model provides a heat radiation apparatus of a dual-layer optical module. The heat radiation apparatus is composed of an upper-layer radiator, a lower-layer radiator, a PCBA board, and an optical module housing. PCBA recessed holes are formed in the PCBA board; the optical module housing is fixed at the PCBA board; and optical module housing upper-layer recessed holes and optical module housing lower-layer recessed holes are respectively formed in the front side and the back side. Upper-layer radiator protruding portions arranged at the back of the upper-layer radiator pass through the optical module housing upper-layer recessed holes and are contacted with surfaces of upper-layer optical modules; Lower-layer radiator protruding portions arranged at the lower-layer radiator pass through the PCBA recessed holes and the optical module housing lower-layer recessed holes and are contacted with surface of lower-layer optical modules. The PCBA board and the upper-layer radiator are fixed by bolts. With the heat radiation apparatus, the contact thermal resistance between the radiators and the dual-layer optical module can be reduced; the heat radiation capability of the dual-layer optical module is enhanced; and a heat radiation problem of the intensive optical module can be solved.

Description

A kind of heat abstractor of double-deck optical module
Technical field
The present invention relates to a kind of heat abstractor, particularly relate to a kind of heat abstractor of double-deck optical module.
Background technology
Optical module is comprised of opto-electronic device, functional circuit and optical interface etc.Wherein, opto-electronic device comprises and transmits and receives two parts.Briefly, the major function of optical module realizes opto-electronic conversion exactly, at transmitting terminal, converts the electrical signal to light signal, after transmitting, at receiving terminal, converts light signal to the signal of telecommunication again by optical fiber, thereby realizes the transmission of information.
In the eurypalynous optical module of crowd, especially the power consumption of QSFP optical module and SFP+ optical module is more and more higher.Therefore, the heat radiation of optical module has also become to carry out the bottleneck of the switch development of high rate data transmission.Traditional optical module heat radiation can not meet the demand of existing switch heat radiation.Especially present a lot of optical modules have adopted bi-layer compact type structure, cause density of heat flow rate sharply to rise.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of heat abstractor of double-deck optical module, it is by reducing the mode of the contact heat resistance between radiator and double-deck optical module, effectively improve the heat-sinking capability of double-deck optical module, guaranteed the proper communication function of double-deck optical module.
For achieving the above object and other relevant objects, the invention provides a kind of heat abstractor of double-deck optical module, the heat radiation for upper strata optical module and lower floor's optical module, at least comprises: upper strata radiator, lower floor's radiator, PCBA plate and optical module shell; Wherein, on described PCBA plate, be provided with several PCBA plate shrinkage pools; Described optical module shell is fixed on described PCBA plate, and on its front and back, is respectively arranged with optical module shell upper strata shrinkage pool and optical module shell lower floor shrinkage pool; Described upper strata optical module and described lower floor optical module are from top to bottom placed in described optical module shell successively; The back side of described upper strata radiator is provided with several upper strata radiator protuberances, and described upper strata radiator protuberance, through described optical module shell upper strata shrinkage pool, contacts with the surface of described upper strata optical module; On described lower floor radiator, be provided with several lower floor's radiator protuberances, described lower floor radiator protuberance contacts with the surface of described lower floor optical module through described PCBA plate shrinkage pool and described optical module shell lower floor shrinkage pool; Described PCBA plate and described upper strata radiator fix by screw.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: the front of described upper strata radiator is provided with some fin.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: fix by spring screw between described PCBA plate and described upper strata radiator.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: the thermal source part of described upper strata optical module contacts with described upper strata radiator protuberance; The thermal source part of described lower floor optical module contacts with described lower floor radiator.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: described upper strata radiator and described lower floor radiator are made by aluminum material.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: place, the radiator back side, described upper strata is provided with some fin away from a side of described optical module shell.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: described optical module shell upper strata shrinkage pool and described upper strata radiator protuberance are rectangle or circle, and the two size matches.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: described optical module shell lower floor's shrinkage pool and described lower floor radiator protuberance are rectangle or circle, and the two size matches.
According to the heat abstractor of above-mentioned double-deck optical module, wherein: described upper strata optical module and described lower floor optical module all adopt QSFP/SFP+ optical module.
As mentioned above, the heat abstractor of double-deck optical module of the present invention, has following beneficial effect:
Than traditional optical module heat radiation device, the heat abstractor of double-deck optical module of the present invention has reduced the contact heat resistance between radiator and double-deck optical module, has strengthened the heat-sinking capability of double-deck optical module, has solved the heat dissipation problem of intensive optical module.
Accompanying drawing explanation
Fig. 1 is shown as the forward structure schematic diagram of the heat abstractor of double-deck optical module of the present invention;
Fig. 2 is shown as the structural representation dorsad of the heat abstractor of double-deck optical module of the present invention;
Fig. 3 is shown as the forward structure schematic diagram on optical module shell upper strata in the present invention;
Fig. 4 is shown as the structural representation dorsad of optical module shell lower floor in the present invention;
Fig. 5 is shown as the heat abstractor of double-deck optical module of the present invention and removes the structural representation after the radiator of upper strata;
Fig. 6 is shown as the present invention's structural representation of radiator at the middle and upper levels;
Fig. 7 is shown as the heat abstractor of double-deck optical module of the present invention and removes the structural representation after lower floor's radiator;
Fig. 8 is shown as the structural representation of lower floor's radiator in the present invention.
Assembly label declaration
1 upper strata radiator
11 upper strata radiator protuberances
12 upper strata radiator inserted sheets
2 lower floor's radiators
21 lower floor's radiator protuberances
3 PCBA plates
31 PCBA plate shrinkage pools
4 upper strata optical modules
5 lower floor's optical modules
6 optical module shells
61 optical module shell upper strata shrinkage pools
62 optical module shell lower floor shrinkage pools
7 spring screws
8 double-screw bolts
Embodiment
Below, by specific instantiation explanation embodiments of the present invention, those skilled in the art can understand other advantages of the present invention and effect easily by the disclosed content of this specification.The present invention can also be implemented or be applied by other different embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present invention.
It should be noted that, the diagram providing in the present embodiment only illustrates basic conception of the present invention in a schematic way, satisfy and only show with assembly relevant in the present invention in graphic but not component count, shape and size drafting while implementing according to reality, during its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
With reference to Fig. 1-Fig. 8, the heat abstractor of double-deck optical module of the present invention comprises that upper strata radiator 1, lower floor's radiator 2, PCBA plate 3 and optical module shell 6(are also referred to as optical module cage).Wherein, on PCBA plate 3, be provided with several PCBA plate shrinkage pools 31.Optical module shell 6 is fixed on PCBA plate 3 by the pin pin on it, and on its front and back, is respectively arranged with several optical module shell upper strata shrinkage pools 61 and optical module shell lower floor shrinkage pool 62.Optical module shell lower floor shrinkage pool 62 is oppositely arranged with PCBA plate shrinkage pool 31.Upper strata optical module 4 and lower floor's optical module 5 are from top to bottom placed in optical module shell 6 successively.The back side of upper strata radiator 1 is provided with upper strata radiator protuberance 11, and front is provided with some fin.Upper strata radiator protuberance 11, through optical module shell upper strata shrinkage pool 61, contacts with the surface of upper strata optical module 4.On lower floor's radiator 2, be provided with several lower floor's radiator protuberances 21, lower floor's radiator protuberance 21 contacts through the surface of PCBA plate shrinkage pool 31 and shrinkage pool 62Yu lower floor of optical module shell lower floor optical module 5.Therefore, optical module can directly contact with radiator, thereby has reduced the contact heat resistance between optical module and radiator, has improved radiating efficiency.Between PCBA plate 3 and upper strata radiator 1, by screw, fix.
With reference to Fig. 1, preferably, between PCBA plate 3 and upper strata radiator 1, by spring screw (being Spring screws 7 and double-screw bolt 8), fix.Therefore, when optical module inserts optical module shell 61, levels radiator can produce a precompression to optical module, and radiator can better be contacted with optical module, thereby reduced contact heat resistance, dispels the heat accelerating.
Preferably, the thermal source of upper strata optical module 4 part (i.e. the hottest surface) contacts with upper strata radiator protuberance 11, and the thermal source of lower floor's optical module 5 partly (the hottest surface) contacts with lower floor radiator 2.By allowing the thermal source of optical module contact with radiator, can realize better the heat radiation of optical module.
In a preferred embodiment of the invention, upper strata radiator 1 and lower floor's radiator 2 are made by aluminum material.Radiator 1 place, the back side in upper strata is provided with some fin 12 away from a side of optical module shell 6, for further optical module being dispelled the heat.Lower floor's radiator 2 is that a side is with the aluminium sheet of some protuberances.
Preferably, optical module shell upper strata shrinkage pool 61 and upper strata radiator protuberance 11 are rectangle, circle or other shapes, and the two size matches.
Similarly, shrinkage pool 62He lower floor of optical module shell lower floor radiator protuberance 21 is rectangle, circle or other shapes, and the two size matches.
In the present invention, upper strata optical module 4 and lower floor's optical module 5 all adopt QSFP/SFP+ optical module.
In sum, the heat abstractor of double-deck optical module of the present invention has reduced the contact heat resistance between radiator and double-deck optical module, has strengthened the heat-sinking capability of double-deck optical module, has solved the heat dissipation problem of intensive optical module.So the present invention has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all can, under spirit of the present invention and category, modify or change above-described embodiment.Therefore, such as in affiliated technical field, have and conventionally know that the knowledgeable, not departing from all equivalence modifications that complete under disclosed spirit and technological thought or changing, must be contained by claim of the present invention.

Claims (9)

1. a heat abstractor for double-deck optical module, the heat radiation for upper strata optical module and lower floor's optical module, is characterized in that, at least comprises: upper strata radiator, lower floor's radiator, PCBA plate and optical module shell; Wherein, on described PCBA plate, be provided with several PCBA plate shrinkage pools; Described optical module shell is fixed on described PCBA plate, and on its front and back, is respectively arranged with optical module shell upper strata shrinkage pool and optical module shell lower floor shrinkage pool; Described upper strata optical module and described lower floor optical module are from top to bottom placed in described optical module shell successively; The back side of described upper strata radiator is provided with several upper strata radiator protuberances, and described upper strata radiator protuberance, through described optical module shell upper strata shrinkage pool, contacts with the surface of described upper strata optical module; On described lower floor radiator, be provided with several lower floor's radiator protuberances, described lower floor radiator protuberance contacts with the surface of described lower floor optical module through described PCBA plate shrinkage pool and described optical module shell lower floor shrinkage pool; Described PCBA plate and described upper strata radiator fix by screw.
2. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: the front of described upper strata radiator is provided with some fin.
3. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: between described PCBA plate and described upper strata radiator, by spring screw, fix.
4. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: the thermal source part of described upper strata optical module contacts with described upper strata radiator protuberance; The thermal source part of described lower floor optical module contacts with described lower floor radiator.
5. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: described upper strata radiator and described lower floor radiator are made by aluminum material.
6. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: place, the radiator back side, described upper strata is provided with some fin away from a side of described optical module shell.
7. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: described optical module shell upper strata shrinkage pool and described upper strata radiator protuberance are rectangle or circle, and the two size matches.
8. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: described optical module shell lower floor's shrinkage pool and described lower floor radiator protuberance are rectangle or circle, and the two size matches.
9. the heat abstractor of double-deck optical module according to claim 1, is characterized in that: described upper strata optical module and described lower floor optical module all adopt QSFP/SFP+ optical module.
CN201420031367.5U 2014-01-17 2014-01-17 Heat radiation apparatus of dual-layer optical module Expired - Lifetime CN203722989U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420031367.5U CN203722989U (en) 2014-01-17 2014-01-17 Heat radiation apparatus of dual-layer optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420031367.5U CN203722989U (en) 2014-01-17 2014-01-17 Heat radiation apparatus of dual-layer optical module

Publications (1)

Publication Number Publication Date
CN203722989U true CN203722989U (en) 2014-07-16

Family

ID=51162104

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420031367.5U Expired - Lifetime CN203722989U (en) 2014-01-17 2014-01-17 Heat radiation apparatus of dual-layer optical module

Country Status (1)

Country Link
CN (1) CN203722989U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104320938A (en) * 2014-10-30 2015-01-28 成都康特电子高新科技有限责任公司 Cell gateway system based on radio and television network system
WO2016150285A1 (en) * 2015-03-23 2016-09-29 中兴通讯股份有限公司 Optical transmission device and apparatus, and method for designing optical transmission device
CN106856653A (en) * 2015-12-08 2017-06-16 华为技术有限公司 A kind of radio frequency extension apparatus and its part
CN110806620A (en) * 2018-08-06 2020-02-18 华为技术有限公司 Single board and network equipment
WO2023087587A1 (en) * 2021-11-16 2023-05-25 中兴通讯股份有限公司 Optional module heat dissipation apparatus and communication device
TWI839032B (en) * 2022-12-20 2024-04-11 明泰科技股份有限公司 Separate heat sink with suspension mechanism and optical module system thereof

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104320938A (en) * 2014-10-30 2015-01-28 成都康特电子高新科技有限责任公司 Cell gateway system based on radio and television network system
WO2016150285A1 (en) * 2015-03-23 2016-09-29 中兴通讯股份有限公司 Optical transmission device and apparatus, and method for designing optical transmission device
CN106160870A (en) * 2015-03-23 2016-11-23 中兴通讯股份有限公司 The method for designing of light transmitting device, equipment and light transmitting device
CN106856653A (en) * 2015-12-08 2017-06-16 华为技术有限公司 A kind of radio frequency extension apparatus and its part
CN106856653B (en) * 2015-12-08 2023-11-03 华为技术有限公司 Remote radio device and components thereof
CN110806620A (en) * 2018-08-06 2020-02-18 华为技术有限公司 Single board and network equipment
WO2023087587A1 (en) * 2021-11-16 2023-05-25 中兴通讯股份有限公司 Optional module heat dissipation apparatus and communication device
TWI839032B (en) * 2022-12-20 2024-04-11 明泰科技股份有限公司 Separate heat sink with suspension mechanism and optical module system thereof

Similar Documents

Publication Publication Date Title
CN203722989U (en) Heat radiation apparatus of dual-layer optical module
CN208805597U (en) Optical transmission device with radiator structure
US9255703B2 (en) Light pipe heat sink element
CN101998801A (en) Radiating device
CN104270928B (en) Optical module installation system
CN204887856U (en) Double -deck optical module heat radiation structure
CN204652856U (en) A kind of heat abstractor
CN204406021U (en) A kind of micro projector
CN204761934U (en) Optical module heat dissipation apparatus
EP3300471A1 (en) Single plate heat radiation device and method
CN104218142B (en) A kind of direct insertion LED lamp bead encapsulating structure
RU103892U1 (en) LED MODULE
CN208172310U (en) The optical module shell of radiating structure design
CN203194083U (en) Tooth-shaped heat dissipater with fins for XFP (10 gigabit small form factor pluggable) optical module
CN206741164U (en) A kind of backlight and liquid crystal display die set
CN205037132U (en) Electronic device
CN206196240U (en) Heat radiation structure assembly of mobile terminal and mobile terminal
CN205248302U (en) LED photo engine structure
CN210840219U (en) Convenient radiating plug-in type multilayer circuit board
CN209248094U (en) The radiator structure of the SFP integrated module of optical transceiver
CN206802865U (en) A kind of LED lamp cup bulkhead lamp
CN204678101U (en) Light engine arrangement
CN211424306U (en) LED lighting power chip with good heat dissipation
CN210093834U (en) Small-sized medium-power solid-state relay
CN108366484A (en) A kind of PCB and electronic equipment

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20140716

CX01 Expiry of patent term