CN201464681U - Casing structure for parallel photoelectric module - Google Patents
Casing structure for parallel photoelectric module Download PDFInfo
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- CN201464681U CN201464681U CN200920108790XU CN200920108790U CN201464681U CN 201464681 U CN201464681 U CN 201464681U CN 200920108790X U CN200920108790X U CN 200920108790XU CN 200920108790 U CN200920108790 U CN 200920108790U CN 201464681 U CN201464681 U CN 201464681U
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- optoelectronic module
- base
- shell mechanism
- groove
- parallel optoelectronic
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Abstract
The utility model discloses a casing structure for parallel photoelectric module, which comprises a chassis, a heat radiating piece, a fixing sleeve, a front gland and a rear gland, wherein the chassis comprises a front end groove and a bottom end groove, the heat radiating piece is mounted on the opposite of the bottom end groove, the fixing sleeve is connected with the front end groove, and the front gland and the rear gland are respectively arranged on the bottom end groove. The casing structure has simple structure and practical function, and can effectively radiate heat through the heat radiating pin arranged on the opposite of the circuit board.
Description
Technical field
The utility model relates to the photoelectric communication field, particularly relates to a kind of shell mechanism that is used for the parallel optoelectronic module.
Background technology
Broadband network communication how to realize at present high speed, vast capacity is the research focus of countries in the world, for making full use of the high capacity transmission bandwidth, solve the problem of the message transmission rate of network node, the insider works out various optical-electric modules, and this optical-electric module comprises serial optical-electric module and parallel optoelectronic module; Relatively more difficult in the data of transmission 40Gb/s or above speed for the serial optical-electric module, performance has chromatic dispersion, and insurmountable problem all appears in signal modulation technique and encapsulation technology etc.; Occur the parallel optoelectronic module on this basis, obtain superelevation speed, Large Volume Data transmission by the parallel optoelectronic module that adopts highdensity hyperchannel design.Especially very fast in the development of short-range data communication aspects parallel optoelectronic module, for example can be with the data transmission in the interconnected and LAN (Local Area Network) of parallel optoelectronic module application between large-scale communication system dorsulum and backboard.
Along with the development of technology such as vertical cavity surface emitting laser (VCSEL) array, high-speed dedicated integrated circuit, the practicability stage has been moved towards in the development of parallel module gradually.
The parallel optoelectronic module is that the serial optical-electric module is compared with single-channel optical-electric module, the device density of parallel optoelectronic module is high, need photoelectricity Coupling Design, heat radiation, electromagnetic interference shield design and the circuit design of parallel module all to be complementary with this module simultaneously, reasonably component design is the key that module performance guarantees.Therefore, need the shell of design one cover parallel optoelectronic module, to solve problems such as heat radiation, electromagnetic interference (EMI), shielding.
The utility model content
The purpose of this utility model provide a kind of simple in structure, function is practical, be used for the shell mechanism of parallel optoelectronic module cheaply.
For achieving the above object, the technical solution of the utility model provides a kind of shell mechanism that is used for the parallel optoelectronic module, and described shell mechanism comprises:
Base, described base comprise front end groove and bottom groove;
Heat radiator is installed in the back side of described bottom groove;
Fixed cover is connected with described front end groove;
Preceding gland, rear pressing cover is separately positioned on the groove of described bottom.
Wherein, described shell mechanism also comprises the tail plug that is installed on the described fixed cover.
Wherein, described shell mechanism comprises that also card is placed on the over cap on the electric connector of described parallel optoelectronic module.
Wherein, be provided with heat conductive silica gel between described heating radiator and the described base.
Wherein, described front end groove is connected by a semi-cylindrical hill with the bottom groove.
Wherein, described heat radiator is provided with four strip through holes, is connected with described base by screw.
Above-mentioned utility model technical scheme has following advantage: the utility model is simple in structure, and the function practicality by being arranged on the heat radiator of back of circuit board, can effectively be dispelled the heat.
Description of drawings
Fig. 1 is a kind of explosive view that is used for parallel optoelectronic module housing structure of the utility model embodiment;
Fig. 2 is a kind of cut-open view that is used for parallel optoelectronic module housing structure of the utility model embodiment;
Fig. 3 is the structural representation of a kind of base of the utility model embodiment.
Wherein: 1: over cap; 2: preceding gland; 3: rear pressing cover; 4: the photovoltaic element of parallel optoelectronic module; 5: the circuit board of parallel optoelectronic module; 6: base; 7: heat radiator; 8: screw; 9: the tail plug; 10: fixed cover; 11: pedestal lobe; 12: the front end groove of base; 13: the bottom groove of base; 14: electric connector.
Embodiment
Below in conjunction with drawings and Examples, embodiment of the present utility model is described in further detail.Following examples only are used for the technical solution of the utility model more clearly is described, and can not limit protection domain of the present utility model with this.
In conjunction with Fig. 1～Fig. 3, the utility model relates to a kind of parallel optoelectronic module housing structure, comprise base 6, fixed cover 9, heat radiator 7, preceding gland 2, rear pressing cover 3 and screw, the bottom and the front end face of base 6 have groove, be respectively the front end groove 12 of base and the bottom groove 13 of base, the front end groove 12 of base is used for being connected with the photovoltaic element of parallel optoelectronic module, be provided with between the circuit board of the photovoltaic element of parallel optoelectronic module (vertically part) and the front end groove 12 that heat sink (heat sink of present embodiment is supported and thermolysis, material is an aluminium, be shaped as sheet, being close to the circuit board back is provided with, because vertical portion parallel circuit plate is thin gentleer, so play supporting role; The caloric requirement of circuit board chips sheds, so play thermolysis.), scribble heat conductive silica gel between the heat sink and front end groove 12, so that end face between the two closely contacts, reach better heat radiating effect.That is, when the work of the photovoltaic element of parallel optoelectronic module, its circuit board produces heat, heat sink heat that can this circuit chip on board of fast Absorption, and with heat transferred base 6, dispel the heat by the heat radiator 7 that is connected with base 6 again.The bottom groove 13 of base is used to encapsulate the circuit board 5 (horizontal component) of parallel optoelectronic module.The position that the front end groove 12 of base and the bottom groove 13 of base are connected is provided with pedestal lobe 11; Fixed cover 9 has the through hole of a notch cuttype, is used for fixing and mounting adapter; Heat radiator 7 produces heat by the upper surface of four screw retention and base 6 during the parallel optoelectronic module that is used to shed work; Preceding gland 2, rear pressing cover 3 engage with the lower surface of base 6, are used to encapsulate the circuit board 5 of parallel optoelectronic module.
The front end groove 12 of base 6 has one semicircular protruding 11 with the junction of bottom groove 13; so that circuit board vertically the flexible PCB of part and horizontal part office be close on the semi-cylindrical hill; in case excessively bending; playing the effect of protection flexible PCB. two small columns of two symmetrical small sircle holes of the front end face of base 6 and fixed cover 10 rear ends are equipped; so that good being installed in base 6 and the fixed cover 10 of the photoelectricity part after the coupling well. the little square column of two symmetrical distributions and the step of a round platform formula threaded hole are arranged in the bottom groove 13 of base 6; be used to support the horizontal component of circuit board; circuit board level partly being secured in the bottom groove of base by rear pressing cover 3 with a screw. the front end of preceding gland 2 is provided with two links; the both sides, rear end are respectively arranged with projection; during installation; two links of preceding gland 2 are adhered to the lower end forward part of base 6 with glue; the projection of both sides, its rear end will be pressed in the bottom groove 13; the horizontal circuit boards of good optoelectronic components of will being coupled simultaneously partly is secured in the bottom groove 13 of base 6. and the adapter of the photoelectricity part that coupling is good is loaded on earlier in the fixed cover 10; having on the fixed cover end face of small column and the base 6 has the end face of small sircle hole to be stained with glue; with two end faces cooperating by cylinder and circular hole; they are cemented. tail plug 9 is inserted in fixed cover 10 front aperture in the module that assembles; play the not effect of proofing dust and protecting adapter during duty of parallel optoelectronic module. over cap 1 card is placed on the electric connector 14 of photoelectricity part, plays and protect the not electric connector of the optical-electric module of duty.
As can be seen from the above embodiments, the utility model example structure is simple, and the function practicality by being arranged on the heat radiator of back of circuit board, can effectively be dispelled the heat, and effective holding circuit plate.
The above only is a preferred implementation of the present utility model; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the utility model know-why; can also make some improvements and modifications, these improvements and modifications also should be considered as protection domain of the present utility model.
Claims (6)
1. a shell mechanism that is used for the parallel optoelectronic module is characterized in that, described shell mechanism comprises:
Base, described base comprise front end groove and bottom groove;
Heat radiator is installed in the back side of described bottom groove;
Fixed cover is connected with described front end groove;
Preceding gland, rear pressing cover is separately positioned on the groove of described bottom.
2. the shell mechanism that is used for the parallel optoelectronic module as claimed in claim 1 is characterized in that, described shell mechanism also comprises the tail plug that is installed on the described fixed cover.
3. the shell mechanism that is used for the parallel optoelectronic module as claimed in claim 1 is characterized in that, described shell mechanism comprises that also card is placed on the over cap on the electric connector of described parallel optoelectronic module.
4. the shell mechanism that is used for the parallel optoelectronic module as claimed in claim 1 is characterized in that, is provided with heat conductive silica gel between described heating radiator and the described base.
5. the shell mechanism that is used for the parallel optoelectronic module as claimed in claim 1 is characterized in that, described front end groove is connected by a semi-cylindrical hill with the bottom groove.
6. the shell mechanism that is used for the parallel optoelectronic module as claimed in claim 1 is characterized in that, described heat radiator is provided with four strip through holes, is connected with described base by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920108790XU CN201464681U (en) | 2009-06-18 | 2009-06-18 | Casing structure for parallel photoelectric module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920108790XU CN201464681U (en) | 2009-06-18 | 2009-06-18 | Casing structure for parallel photoelectric module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201464681U true CN201464681U (en) | 2010-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200920108790XU Expired - Lifetime CN201464681U (en) | 2009-06-18 | 2009-06-18 | Casing structure for parallel photoelectric module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201464681U (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104076451A (en) * | 2013-03-28 | 2014-10-01 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion system and photoelectric conversion device thereof |
| CN104503040A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| US9134491B2 (en) | 2013-03-27 | 2015-09-15 | Hon Hai Precision Industry Co., Ltd. | Optical module for transferring optical signal to electrical signal and optical module assembly used thereof |
| CN106970445A (en) * | 2017-04-26 | 2017-07-21 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| CN109283631A (en) * | 2017-07-19 | 2019-01-29 | 苏州旭创科技有限公司 | Optical module |
| CN109905958A (en) * | 2017-12-11 | 2019-06-18 | 苏州旭创科技有限公司 | Optical module |
| CN110494784A (en) * | 2017-04-10 | 2019-11-22 | 申泰公司 | With the interconnection system for keeping feature |
| CN111149200A (en) * | 2017-09-28 | 2020-05-12 | Ｋｙｂ株式会社 | Component mounting body and electronic apparatus |
| CN113391412A (en) * | 2021-07-16 | 2021-09-14 | 亨通洛克利科技有限公司 | High-efficient radiating 800G optical module |
| US11171432B2 (en) | 2016-08-15 | 2021-11-09 | Samtec, Inc. | Anti-backout latch for interconnect system |
| USD960107S1 (en) | 2017-12-06 | 2022-08-09 | Samtec, Inc. | Electrical connector |
-
2009
- 2009-06-18 CN CN200920108790XU patent/CN201464681U/en not_active Expired - Lifetime
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9134491B2 (en) | 2013-03-27 | 2015-09-15 | Hon Hai Precision Industry Co., Ltd. | Optical module for transferring optical signal to electrical signal and optical module assembly used thereof |
| CN104076451B (en) * | 2013-03-28 | 2016-10-05 | 富士康(昆山)电脑接插件有限公司 | Photo-translating system and photo-electric conversion device thereof |
| CN104076451A (en) * | 2013-03-28 | 2014-10-01 | 富士康(昆山)电脑接插件有限公司 | Photoelectric conversion system and photoelectric conversion device thereof |
| CN104503040A (en) * | 2014-12-31 | 2015-04-08 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| CN104503040B (en) * | 2014-12-31 | 2016-08-24 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| US11171432B2 (en) | 2016-08-15 | 2021-11-09 | Samtec, Inc. | Anti-backout latch for interconnect system |
| US11735844B2 (en) | 2016-08-15 | 2023-08-22 | Samtec, Inc. | Anti-backout latch for interconnect system |
| CN110494784B (en) * | 2017-04-10 | 2023-03-10 | 申泰公司 | Interconnect system with retention feature |
| US11196195B2 (en) | 2017-04-10 | 2021-12-07 | Samtec, Inc. | Interconnect system having retention features |
| CN110494784A (en) * | 2017-04-10 | 2019-11-22 | 申泰公司 | With the interconnection system for keeping feature |
| CN106970445B (en) * | 2017-04-26 | 2019-08-16 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| CN106970445A (en) * | 2017-04-26 | 2017-07-21 | 中航海信光电技术有限公司 | Parallel optical transceiver module |
| CN109283631A (en) * | 2017-07-19 | 2019-01-29 | 苏州旭创科技有限公司 | Optical module |
| CN111149200A (en) * | 2017-09-28 | 2020-05-12 | Ｋｙｂ株式会社 | Component mounting body and electronic apparatus |
| USD960107S1 (en) | 2017-12-06 | 2022-08-09 | Samtec, Inc. | Electrical connector |
| CN109905958B (en) * | 2017-12-11 | 2021-03-16 | 苏州旭创科技有限公司 | Optical module |
| CN109905958A (en) * | 2017-12-11 | 2019-06-18 | 苏州旭创科技有限公司 | Optical module |
| CN113391412A (en) * | 2021-07-16 | 2021-09-14 | 亨通洛克利科技有限公司 | High-efficient radiating 800G optical module |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100512 |