CN219322641U - Nested composite circuit board - Google Patents

Nested composite circuit board Download PDF

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Publication number
CN219322641U
CN219322641U CN202223516291.9U CN202223516291U CN219322641U CN 219322641 U CN219322641 U CN 219322641U CN 202223516291 U CN202223516291 U CN 202223516291U CN 219322641 U CN219322641 U CN 219322641U
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China
Prior art keywords
circuit board
controller
nested
shell
heat dissipation
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CN202223516291.9U
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Chinese (zh)
Inventor
张涛
张伟平
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Digital Printed Circuit Board Co Ltd
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Digital Printed Circuit Board Co Ltd
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Priority to CN202223516291.9U priority Critical patent/CN219322641U/en
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Abstract

The utility model relates to the technical field of circuit board structures, in particular to a nested composite circuit board, which comprises: the circuit board is inserted into the embedded shell at equal intervals, the vertical heat dissipation components are installed between the circuit boards at equal intervals, the controller is fixedly installed on the side wall surface of the embedded shell, the horizontal heat dissipation components are fixedly installed at the bottom of the controller, and the contact electric connecting core is fixedly installed at the insertion position of the circuit board. The circuit board is inserted into the nested shell at equal intervals, the radiating assemblies are arranged on the bottom surface of the nested shell at equal intervals to radiate the circuit board along the vertical direction, the radiating assemblies are arranged on the side wall surface of the nested shell to radiate the circuit board along the horizontal direction, the contact electric connecting cores are arranged in the nested shell, and the circuit board is in contact electric connection with the contact electric connecting cores by utilizing the insertion of the circuit board, so that the electric connection of the circuit board is realized, and the radiating effect of the circuit board is improved.

Description

Nested composite circuit board
Technical Field
The utility model relates to the technical field of circuit board structures, in particular to a nested composite circuit board.
Background
The nested type conforming circuit board is an electronic product used in the aspect of electronic technology, along with the rapid development of the electronic technology, modern electronic products become smaller and smaller, the functions of the modern electronic products become more complex, the printed circuit board which plays a role in supporting and interconnecting electronic components is developed from single-sided to double-sided and multi-layer, the electronic components are developed towards high precision, high density and high reliability, the size is continuously reduced, and the electronic product is suitable for the requirements of the development of the current electronic products towards high density, high reliability, miniaturization and light weight.
Among the prior art, the kind of most compound circuit board in the market is more, but most accords with the circuit board and can not carry out nested operation, can not realize carrying out the protection operation with the circuit board gomphosis in the casing is inside, even can nest in the casing inside, owing to range upon range of setting, the radiating effect is relatively poor to need independently carry out electric connection to the circuit board, thereby make the circuit comparatively complicated, reduced the radiating effect of circuit board.
In view of this, it is needed to design a nested composite circuit board, insert the circuit board in the nested shell equidistant, the nested shell bottom surface sets up equidistant heat dissipation assembly and dispels the heat to the circuit board along vertical direction, install heat dissipation assembly and dispel the heat to the circuit board along horizontal direction at the lateral wall face of nested shell to be provided with the contact electricity in the nested shell and link the core, utilize the grafting of circuit board, circuit board and contact electricity link the core contact electricity to realize the electric connection of circuit board, improved the radiating effect of circuit board.
Disclosure of Invention
In order to solve the defects in the prior art, the utility model aims to provide the nested composite circuit board, wherein the circuit board is inserted into the nested shell at equal intervals, the bottom surface of the nested shell is provided with the heat dissipation assemblies at equal intervals to dissipate heat of the circuit board along the vertical direction, the side wall surface of the nested shell is provided with the heat dissipation assemblies to dissipate heat of the circuit board along the horizontal direction, and the contact electric connection core is arranged in the nested shell, so that the circuit board is in contact electric connection with the contact electric connection core by utilizing the insertion of the circuit board, and the heat dissipation effect of the circuit board is improved.
In order to achieve the above object, the technical scheme of the present utility model is as follows: a nested composite circuit board comprising: the circuit board is inserted into the nested shell at equal intervals, the vertical heat dissipation components are installed between the circuit boards at equal intervals, the controller is fixedly installed on the side wall surface of the nested shell, the horizontal heat dissipation components are fixedly installed at the bottom of the controller, and the contact electric connecting core is fixedly installed at the inserted position of the circuit board.
Further, the nested shells comprise: the device comprises a mounting groove, a controller mounting plate and a plug-in groove, wherein the plug-in groove is arranged in the mounting groove at equal intervals, and the controller mounting plate is fixedly arranged on the side wall surface of the mounting groove.
Further, the vertical heat dissipation assembly is fixedly installed at the bottom of the installation groove, and the vertical heat dissipation assembly is arranged between the inserting grooves at intervals.
Furthermore, the inserting grooves are U-shaped, and the contact electric connecting cores are fixedly arranged between the notches of the inserting grooves along the vertical direction.
Further, the controller is fixedly installed on the controller installation plate, the controller is electrically connected with the contact electric connecting core, and the horizontal heat dissipation assemblies are uniformly and fixedly installed on the bottom surface of the controller.
The beneficial effects are that:
according to the nested composite circuit board provided by the utility model, the circuit board is inserted into the nested shell at equal intervals, the radiating assemblies are arranged on the bottom surface of the nested shell at equal intervals to radiate the circuit board along the vertical direction, the radiating assemblies are arranged on the side wall surface of the nested shell to radiate the circuit board along the horizontal direction, the contact electric connecting core is arranged in the nested shell, and the circuit board is in contact electric connection with the contact electric connecting core by utilizing the insertion of the circuit board, so that the electric connection of the circuit board is realized, and the radiating effect of the circuit board is improved.
Drawings
FIG. 1 is a schematic diagram of a nested composite circuit board according to the present utility model;
FIG. 2 is a schematic top view of a nested composite circuit board according to the present utility model;
FIG. 3 is a schematic view of a nested composite circuit board controller mounting plate according to the present utility model;
fig. 4 is a schematic diagram of a contact electrical connection core of a nested composite circuit board according to the present utility model.
In the figure: the device comprises a 1-embedded shell, a 2-controller, a 3-vertical heat dissipation component, a 4-circuit board, a 5-contact electric connection core, a 6-horizontal heat dissipation component, an 11-mounting groove, a 12-controller mounting plate and a 13-plug-in groove.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
As shown in fig. 1 to 4, the present utility model discloses a nested composite circuit board, comprising: the embedded shell 1, the controller 2, the vertical heat dissipation assembly 3, the horizontal heat dissipation assembly 6, the circuit board 4 and the contact electric connection core 5, the circuit board 4 can be inserted in the embedded shell 1 at equal intervals, the vertical heat dissipation assembly 3 is installed between the circuit boards 4 at equal intervals, the controller 2 is fixedly installed on the side wall surface of the embedded shell 1, the horizontal heat dissipation assembly 6 is fixedly installed at the bottom of the controller 2, and the contact electric connection core 5 is fixedly installed at the insertion position of the circuit board 4.
In this embodiment, the nesting shell 1 includes: the device comprises a mounting groove 11, a controller mounting plate 12 and a plug groove 13, wherein the plug groove 13 is arranged in the mounting groove 11 at equal intervals, and the controller mounting plate 12 is fixedly arranged on the side wall surface of the mounting groove 11.
In this embodiment, the vertical heat dissipation components 3 are fixedly installed at the bottom of the installation groove 11, and the vertical heat dissipation components 3 are disposed between the plugging grooves 13 at intervals.
In this embodiment, the plugging slot 13 is U-shaped, and the contact electrical connection core 5 is fixedly installed between the slots of the plugging slot 13 along the vertical direction.
In this embodiment, the controller 2 is fixedly mounted on the controller mounting board 12, the controller 2 is electrically connected with the contact electrical connection core 5, and the horizontal heat dissipation assemblies 6 are uniformly and fixedly mounted on the bottom surface of the controller 2.
Working principle:
since the grommet 1 is provided with the mounting groove 11 and the controller mounting plate 12, the controller mounting plate 12 is fixedly mounted on the side wall surface of the mounting groove 11, and the insertion grooves 13 are arranged in the mounting groove 11 at equal intervals. Since the insertion groove 13 is matched with the circuit board 4, the circuit board 4 can be inserted into the insertion groove 13. And the contact electric connecting core 5 is fixedly arranged between the notches in the vertical direction in the inserting groove 13, and when the circuit board 4 is inserted in the inserting groove 13, the circuit board 4 and the contact electric connecting core 5 are contacted to take electricity. Thus, the circuit boards 4 are electrically connected in parallel.
The controller mounting plate 12 is fixedly mounted on the side wall surface of the mounting groove 11, the controller 2 is fixedly mounted on the controller mounting plate 12, and after the circuit boards 4 are equidistantly inserted into the mounting groove 11 of the nested shell 1, the circuit boards 4 are electrically connected with the controller 2 through the contact electric connection cores 5. Thereby, the connection between the controller 2 and the circuit board 4 is controlled.
Wherein, vertical heat dissipation components 3 are installed at equal intervals at the bottom of the installation groove 11, and the vertical heat dissipation components 3 blow heat dissipation air along the vertical direction to dissipate heat between the circuit boards 4. And the controller mounting plate 12 is fixedly provided with a horizontal heat radiation component 6, and the horizontal heat radiation component 6 blows heat radiation air along the horizontal direction so as to radiate heat between the upper circuit boards 4 along the horizontal direction.
According to the nested composite circuit board provided by the utility model, the circuit board 4 is inserted into the nested shell 1 at equal intervals, the bottom surface of the nested shell 1 is provided with the heat dissipation components which are arranged at equal intervals to dissipate heat of the circuit board 4 along the vertical direction, the side wall surface of the nested shell 1 is provided with the heat dissipation components which are arranged to dissipate heat of the circuit board 4 along the horizontal direction, the contact electric connection core 5 is arranged in the nested shell 1, and the circuit board 4 is in contact electric connection with the contact electric connection core 5 by utilizing the insertion of the circuit board 4, so that the electric connection of the circuit board 4 is realized, and the heat dissipation effect of the circuit board 4 is improved.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims (5)

1. A nested composite circuit board comprising: inlay shell (1), controller (2), vertical radiating element (3), horizontal radiating element (6), circuit board (4) and contact electricity even core (5), a serial communication port, but equidistant grafting in the nested shell (1) circuit board (4), equidistant vertical radiating element (3) are installed between circuit board (4), controller (2) fixed mounting is in the lateral wall face of nested shell (1), the bottom fixed mounting of controller (2) has horizontal radiating element (6), contact electricity even core (5) fixed mounting is in the grafting department of circuit board (4).
2. A nested composite circuit board according to claim 1, wherein the nested shell (1) comprises: the device comprises an installation groove (11), a controller installation plate (12) and a plug groove (13), wherein the plug groove (13) is installed in the installation groove (11) at equal intervals, and the controller installation plate (12) is fixedly installed on the side wall surface of the installation groove (11).
3. A nested composite circuit board according to claim 2, wherein the vertical heat dissipation members (3) are fixedly mounted at the bottom of the mounting slots (11), and the vertical heat dissipation members (3) are arranged between the plugging slots (13) at intervals.
4. A nested composite circuit board according to claim 3, characterized in that the insertion grooves (13) are U-shaped, and the contact electrical connection cores (5) are fixedly mounted between the notches of the insertion grooves (13) in the vertical direction.
5. The nested composite circuit board according to claim 4, wherein the controller (2) is fixedly mounted on the controller mounting board (12), the controller (2) is electrically connected with the contact electrical connection core (5), and the horizontal heat dissipation assemblies (6) are uniformly and fixedly mounted on the bottom surface of the controller (2).
CN202223516291.9U 2022-12-28 2022-12-28 Nested composite circuit board Active CN219322641U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223516291.9U CN219322641U (en) 2022-12-28 2022-12-28 Nested composite circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223516291.9U CN219322641U (en) 2022-12-28 2022-12-28 Nested composite circuit board

Publications (1)

Publication Number Publication Date
CN219322641U true CN219322641U (en) 2023-07-07

Family

ID=87035454

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223516291.9U Active CN219322641U (en) 2022-12-28 2022-12-28 Nested composite circuit board

Country Status (1)

Country Link
CN (1) CN219322641U (en)

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