CN109905958A - Optical module - Google Patents
Optical module Download PDFInfo
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- CN109905958A CN109905958A CN201711308568.XA CN201711308568A CN109905958A CN 109905958 A CN109905958 A CN 109905958A CN 201711308568 A CN201711308568 A CN 201711308568A CN 109905958 A CN109905958 A CN 109905958A
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- metal layer
- circuit board
- transmission
- optical module
- transmission metal
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Abstract
Present invention discloses a kind of optical modules.The optical module includes shell, is set to the intracorporal semiconductor optical device of shell, first circuit board and second circuit board, and the first circuit board includes first substrate, the first transmission metal layer for being sequentially formed in the first substrate upper surface and the second transmission metal layer and the dielectric layer being formed between the first transmission metal layer and the second transmission metal layer；Signal transmission window is offered on the first transmission metal layer；The second circuit board includes the second substrate, the third transmission metal layer for being formed in the second substrate lower surface and the 4th transmission metal layer for being formed in the second substrate upper surface, described second circuit board one end is electrically connected with the semiconductor optical device, the third transmission metal layer of the second circuit board other end is set on the signal transmission window and is electrically connected through the signal transmission window with the first transmission metal layer, the 4th transmission metal layer and the second transmission metal layer electrical connection.
Description
Technical field
The present invention relates to a kind of optical modules, belong to optical communication device manufacturing technology field.
Background technique
In optical module field, with greatly promoting for the development of optical communication technique, especially signal transmission rate, to electricity
Interconnection between road plate and semiconductor optical device proposes more stringent challenge.Specifically, industry can use list at present
The transmission speed of wave 50G or even 100G or so baud rate, this list relative to the 4X25Gb/S form of current common 100G module
Wave bandwidth rates greatly improve.With the raising of unicast rate, the problems of Signal Integrity of high speed signal, which has also just highlighted, to be come out,
Because problems of Signal Integrity caused by the reasons such as impedance is excessively high, poor sealing performance, heat-proof quality difference becomes very severe.
Summary of the invention
The purpose of the present invention is to provide a kind of optical modules, can improve problems of Signal Integrity.
To achieve the above object, one embodiment of the invention provides a kind of optical module, and the optical module includes shell, is set to
The intracorporal semiconductor optical device of the shell, first circuit board and the electrical connection first circuit board and the semiconductor optical
The second circuit board of element, the first circuit board include first substrate, are sequentially formed in the of the first substrate upper surface
One transmission metal layer and second transmits metal layer and is formed in the first transmission metal layer and the second transmission metal layer
Between dielectric layer；Signal transmission window is offered on the first transmission metal layer；
The second circuit board includes the second substrate, the third transmission metal layer for being formed in the second substrate lower surface and formation
Metal layer, described second circuit board one end and semiconductor optical device electricity are transmitted in the 4th of the second substrate upper surface
Property connection, the second circuit board other end third transmission metal layer be set to the signal transmission window on and penetrate the letter
Number transmission window and the first transmission metal layer are electrically connected, the 4th transmission metal of the second circuit board other end
Layer and the second transmission metal layer are electrically connected.
Further improvement as an embodiment of the present invention, the first circuit board, which has, surrounds the signal transmission window
Boundary, the boundary is in U-shape, linear type or L shape.
Further improvement as an embodiment of the present invention, the second transmission metal layer and the second circuit board interval
Setting is to form gap between the second transmission metal layer and the second circuit board.
Further improvement as an embodiment of the present invention is filled with glue in the gap.
Further improvement as an embodiment of the present invention, the upper surface of the glue are higher than the second transmission metal layer
Upper surface.
Further improvement as an embodiment of the present invention, the semiconductor optical device are laser；
The optical module further includes semiconductor cooler, and the laser and described second circuit board one end, which are set to, described partly leads
On body refrigerator.
Further improvement as an embodiment of the present invention, the semiconductor cooler are set with the first circuit board interval
It sets.
Further improvement as an embodiment of the present invention, the second circuit board are ceramic circuit board.
Further improvement as an embodiment of the present invention, the 4th transmission metal of the second circuit board other end
Layer and the second transmission metal layer are realized by gold thread and are electrically connected.
Further improvement as an embodiment of the present invention, the first circuit board further include coating, the coating
It is set on at least partly upper surface of the second transmission metal layer
Compared with prior art, the beneficial effects of the present invention are: optimize the structure of first circuit board, by first circuit board
Upper setting signal transmission window, is overlapped in second circuit board on first circuit board at signal transmission window, is meeting high speed
While signal performance, the sealing performance of the optical module is ensured, and then guarantee signal integrity.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the optical module of one embodiment of the invention；
Fig. 2 is the schematic diagram of the section structure of the first circuit board of one embodiment of the invention；
Fig. 3 is the specific structure exploded view of the optical module of one embodiment of the invention；
Fig. 4 is the structural schematic diagram of the main part of the optical module of one embodiment of the invention.
Specific embodiment
Below with reference to specific embodiment shown in the drawings, the present invention will be described in detail.But these embodiments are simultaneously
The present invention is not limited, structure that those skilled in the art are made according to these embodiments, method or functionally
Transformation is included within the scope of protection of the present invention.
Join Fig. 1 to Fig. 4, one embodiment of the invention provides a kind of optical module, and the optical module includes shell and is set to institute
State the intracorporal main part 100 of shell.The shell specifically includes the upper housing 91 and lower case 92 of assembly and connection, 91 He of upper housing
Lower case 92 surrounds accommodating chamber；Main part 100 includes first circuit board 10, the second circuit board for being set to the accommodating chamber
20, the electricity component being set on first circuit board 10 and the semiconductor optical device being electrically connected with 20 phase of second circuit board
60 namely main part 100 be disposed in the housing and be supported and protected by the shell.
Clearly to express position and direction as described in this embodiment, by 92 relative position of upper housing 91 and lower case
Make reference, shown by arrow u pointing direction is defined as "upper", conversely, shown by arrow l pointing direction is defined as "lower".Wherein, into one
Step is reference with first circuit board 10, and 10 place plane of first circuit board is substantially in and the perpendicular setting of up and down direction.
First circuit board 10 is main circuit board, occupies most of space of accommodating chamber, and carry most electricity
Learn element.Second circuit board 20 is secondary circuit board, small volume, primarily to realizing semiconductor optical device 60 and first
The electric connection of circuit board 10.Semiconductor optical device 60 can be laser, be also possible to photodetector, be herein laser
Device.Semiconductor optical device 60 can be set on second circuit board 20, also can be set on other carriers.
Specifically, first circuit board 10 includes that first substrate 11, first transmits the transmission metal layer of metal layer 121, second
122 and dielectric layer 13.First transmission metal layer 121 and the second transmission metal layer 122 are sequentially formed in table on first substrate 11
Face, dielectric layer 13 is formed between the first transmission metal layer 121 and the second transmission metal layer 122, in other words, in first substrate
The first transmission metal layer 121, dielectric layer 13 and the second transmission metal layer 122 are sequentially formed on 11 upper surfaces from lower to upper.
First transmission metal layer 121 and the second transmission metal layer 122 are disposed as copper material, and keep first circuit board 10 real
Existing electric function；First transmission metal layer 121 is often used as stratum, and the second transmission metal layer 122 is often used as signals layer.
Second circuit board 20 includes the second substrate 21, third transmission metal layer 221 and the 4th transmission metal layer 222.Third
Transmission metal layer 221 is formed in 21 lower surface of the second substrate, and the 4th transmission metal layer 222 is formed in 21 upper surface of the second substrate；
Third transmission metal layer 221 and the 4th transmission metal layer 222 are disposed as copper material, and second circuit board 20 is made to realize electric breathing exercise
Energy；Third transmission metal layer 221 is often used as stratum, and the 4th transmission metal layer 222 is often used as signals layer.
20 one end of second circuit board and semiconductor optical device 60 are electrically connected, 20 other end of second circuit board and the first electricity
Road plate 10 is electrically connected, so that first circuit board 10 and semiconductor optical device 60 realize electrical property by second circuit board 20
Connection.
Specifically, signal transmission window 101, signal are offered on the first transmission metal layer 121 of first circuit board 10
On the part that transmission window 101 namely the first transmission metal layer 121 are not covered by the second transmission metal layer 122 and dielectric layer 13
The window constituted at surface.There are many its specific generation types, such as: first, the second transmission metal layer 122 and dielectric layer 13
The portion of upper surface of the first transmission metal layer 121 is partially removed and exposed by the way of windowing, to form signal biography
Defeated window 101；Another, during 10 pressing and forming of first circuit board, the second transmission metal layer 122 and dielectric layer 13 are only pressed
In on the portion of upper surface of the first transmission metal layer 121, and another part upper surface of the first transmission metal layer 121 is made to be exposed
To form signal transmission window 101.
The third of the other end (referring to above-mentioned one end being electrically connected with first circuit board 10) of second circuit board 20
Metal layer 221 is transmitted to be set on signal transmission window 101 and through 121 electricity of signal transmission window 101 and the first transmission metal layer
Property connection, that is to say, that third transmission metal layer 221 be overlapped in signal transmission window 101 first transmission metal layer 121 on
(generally), to realize the stratum of second circuit board 20 and the stratum electric connection of first circuit board 10；Second circuit board 20
The other end the 4th transmission metal layer 222 and second transmission metal layer 122 be electrically connected, to realize second circuit board 20
Signals layer and first circuit board 10 signals layer be electrically connected.
In this way, the optical module of the present embodiment makes the second electricity by the setting signal transmission window 101 on first circuit board 10
Road plate 20 is overlapped on first circuit board 10 at signal transmission window 101, while meeting high speed signal performance, ensures institute
The sealing performance of optical module is stated, and then guarantees signal integrity.
It further, can be by welding the company of being fixed between third transmission metal layer 221 and the first transmission metal layer 121
It connects, to guarantee the stability of connection structure.Auri welding material specifically can be used in it or tinbase welding material is welded.In addition,
Third transmission metal layer 221 with first transmit metal layer 121 be connected region area can according to high speed signal performance requirement into
Row minimizes design, carries out large area connection without third transmission metal layer 221 and the first transmission metal layer 121.
4th transmission metal layer 222 and the second transmission metal layer 122 are realized by bonding gold thread 30 and are electrically connected.
The thickness of dielectric layer 13 is generally equal to the sum of the thickness of third transmission metal layer 221 and the second substrate 21.?
That is, 13 lower surface of dielectric layer and third transmission 221 lower surface of metal layer are coplanar, and 13 upper surface of dielectric layer and the second substrate 21
Upper surface is coplanar.In this way, the 4th transmission metal layer 222 and the second transmission metal layer 122 are located substantially on same plane.At this
In embodiment, the 4th transmission 222 lower surface of metal layer and the second transmission 122 lower surface of metal layer are coplanar, the 4th transmission metal
222 upper surface of layer and the second transmission 122 upper surface of metal layer are coplanar.
Further, first circuit board 10 has the boundary 102 for surrounding signal transmission window 101, in the present embodiment, side
Boundary 102 is collectively formed by the side of the second transmission metal layer 122 and the side of dielectric layer 13.It boundary 102 specifically can be according to demand
Setting is in U-shape, linear type (namely linear), L shape or other shapes, and in the specific example shown in Fig. 3 and Fig. 4, boundary 102 is set
It sets in linear type, so that the second transmission metal layer 122 and dielectric layer 13, first transmit metal layer 121 and second level ladder are presented
Shape structure.
Further, the second transmission metal layer 122 and the setting of the interval of second circuit board 20, to transmit metal layer second
Gap (not indicating) is formed between 122 and second circuit board 20.Preferably, in the present embodiment, the gap is further downward
Extend and is also formed between dielectric layer 13 and second circuit board 20.That is, having between boundary 102 and second circuit board 20
There is the gap.In this way, the heat-proof quality of the optical module can be increased.
It is filled with glue 40 in the gap, distribution capacity can be increased in this way, realize that the impedance of link is continuous, further protects
Demonstrate,prove signal integrity.In the specific implementation, the glue for selecting reasonable model, parameter can be matched according to impedance requirements.
Preferably, the upper surface 401 of glue 40 is higher than the upper surface of the second transmission metal layer 122.In the present embodiment, glue
The upper surface 401 of water 40 is also simultaneously above the upper surface of the 4th transmission metal layer 222.
Further, first circuit board 10 further includes coating 14, and coating 14 is formed in the second transmission metal layer 122
At least partly on upper surface.In the present embodiment, coating 14 be set on the portion of upper surface of the second transmission metal layer 122 and
Another part upper surface of exposure the second transmission metal layer 122, so that coating 14, second transmits metal layer 122 and is situated between
Matter layer 13, first transmits metal layer 121 and three-level step structure is presented.
Coating 14 at least can be used for the second transmission metal layer 122 of protective covering lid.
Further, in the present embodiment, first circuit board 10 is set as more common ordinary circuit board, the first base
The material of plate 11 is liquid crystal polymer, polyimide or Teflon.First transmission metal layer 121 or the first of first circuit board 10
Flexible circuit board can be set above substrate 11, thus substitute medium layer 13 and the second transport layer 122 and the first substrate 11
Mutually pressing forms corresponding board structure of circuit namely dielectric layer 13 and the second transport layer 122 is substituted by the flexible circuit board.Second
Circuit board 20 is set as ceramic circuit board, and the material of the second substrate 21 is ceramics.Certain first circuit board 10 and second circuit
The number of plies of plate 20 is also possible to more than two layers.
The optical module further includes semiconductor cooler 50, and the laser and 20 one end of second circuit board (refer to above-mentioned
The one end being electrically connected with semiconductor optical device 60) it is set on semiconductor cooler 50.Semiconductor cooler 50 can be used for
Temperature is regulated and controled so that laser works are under conditions of needs.
Further, semiconductor cooler 50 and the interval of first circuit board 10 are arranged, thus the preferable heat dissipation of holding/every
Heat is further ensured that signal integrity.
Compared with prior art, the embodiment of the present invention optical module has the advantages that optimization first circuit board 10
Structure make second circuit board 20 in signal transmission window by the setting signal transmission window 101 on first circuit board 10
It is overlapped at 101 on first circuit board 10, while meeting high speed signal performance, ensures the sealing performance of the optical module,
And then guarantee signal integrity；By forming the gap between the second transmission metal layer 122 and second circuit board 20, increase
The heat-proof quality of the optical module；By filler in the gap, increases distribution capacity, realize that the impedance of link is continuous.
Although not each embodiment only includes one only it should be appreciated that this specification is described according to embodiment
Vertical technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should be by specification
As a whole, the technical solutions in the various embodiments may also be suitably combined, formed it will be appreciated by those skilled in the art that
Other embodiments.
The series of detailed descriptions listed above only for feasible embodiment of the invention specifically
Protection scope bright, that they are not intended to limit the invention, it is all without departing from equivalent implementations made by technical spirit of the present invention
Or change should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of optical module, the optical module includes shell, is set to the intracorporal semiconductor optical device of the shell, the first circuit
The second circuit board of plate and the electrical connection first circuit board and the semiconductor optical device, which is characterized in that described the
One circuit board includes first substrate, the first transmission metal layer for being sequentially formed in the first substrate upper surface and the second transmission gold
The dielectric layer for belonging to layer and being formed between the first transmission metal layer and the second transmission metal layer；First transmission
Signal transmission window is offered on metal layer；
The second circuit board includes the second substrate, the third transmission metal layer for being formed in the second substrate lower surface and formation
Metal layer, described second circuit board one end and semiconductor optical device electricity are transmitted in the 4th of the second substrate upper surface
Property connection, the second circuit board other end third transmission metal layer be set to the signal transmission window on and penetrate the letter
Number transmission window and the first transmission metal layer are electrically connected, the 4th transmission metal of the second circuit board other end
Layer and the second transmission metal layer are electrically connected.
2. optical module according to claim 1, which is characterized in that the first circuit board, which has, surrounds the signal transmission
The boundary of window, the boundary is in U-shape, linear type or L shape.
3. optical module according to claim 1, which is characterized in that the second transmission metal layer and the second circuit board
Interval setting is to form gap between the second transmission metal layer and the second circuit board.
4. optical module according to claim 3, which is characterized in that be filled with glue in the gap.
5. optical module according to claim 4, which is characterized in that the upper surface of the glue is higher than the second transmission gold
Belong to the upper surface of layer.
6. optical module according to claim 1, which is characterized in that the semiconductor optical device is laser；
The optical module further includes semiconductor cooler, and the laser and described second circuit board one end, which are set to, described partly leads
On body refrigerator.
7. optical module according to claim 6, which is characterized in that between the semiconductor cooler and the first circuit board
Every setting.
8. optical module according to claim 1, which is characterized in that the second circuit board is ceramic circuit board.
9. optical module according to claim 1, which is characterized in that the 4th transmission of the second circuit board other end
Metal layer and the second transmission metal layer are realized by gold thread and are electrically connected.
10. optical module according to claim 1, which is characterized in that the first circuit board further includes coating, described to cover
Cap rock is set on at least partly upper surface of the second transmission metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711308568.XA CN109905958B (en) | 2017-12-11 | 2017-12-11 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711308568.XA CN109905958B (en) | 2017-12-11 | 2017-12-11 | Optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109905958A true CN109905958A (en) | 2019-06-18 |
| CN109905958B CN109905958B (en) | 2021-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711308568.XA Active CN109905958B (en) | 2017-12-11 | 2017-12-11 | Optical module |
Country Status (1)
| Country | Link |
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| CN (1) | CN109905958B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114714A1 (en) * | 2019-12-13 | 2021-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201464681U (en) * | 2009-06-18 | 2010-05-12 | 河北华美光电子有限公司 | Casing structure for parallel photoelectric module |
| CN105549160A (en) * | 2015-11-27 | 2016-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US20170188461A1 (en) * | 2015-12-26 | 2017-06-29 | Chee Ling Wong | Board to board interconnect |
-
2017
- 2017-12-11 CN CN201711308568.XA patent/CN109905958B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201464681U (en) * | 2009-06-18 | 2010-05-12 | 河北华美光电子有限公司 | Casing structure for parallel photoelectric module |
| CN105549160A (en) * | 2015-11-27 | 2016-05-04 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US20170188461A1 (en) * | 2015-12-26 | 2017-06-29 | Chee Ling Wong | Board to board interconnect |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021114714A1 (en) * | 2019-12-13 | 2021-06-17 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| Publication number | Publication date |
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| CN109905958B (en) | 2021-03-16 |
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