CN210516747U - DPC ceramic composite substrate structure with high thermal conductivity - Google Patents
DPC ceramic composite substrate structure with high thermal conductivity Download PDFInfo
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- CN210516747U CN210516747U CN201921675330.5U CN201921675330U CN210516747U CN 210516747 U CN210516747 U CN 210516747U CN 201921675330 U CN201921675330 U CN 201921675330U CN 210516747 U CN210516747 U CN 210516747U
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Abstract
The utility model discloses a DPC ceramic composite substrate structure with high heat conductivity, which comprises a first module and a second module which are overlapped up and down; the first module comprises a first ceramic layer, a first top circuit and a first bottom circuit are respectively formed on the upper surface and the lower surface of the first ceramic layer, and a through hole is formed in the first ceramic layer and is in conductive connection with the corresponding first top circuit and the corresponding first bottom circuit; the second module comprises a second ceramic layer, the upper surface and the lower surface of the second ceramic layer penetrate through the second module to form an accommodating space, and a second top circuit and a second bottom circuit are formed on the upper surface and the lower surface of the second ceramic layer respectively. This product is formed by first module and second module are compound, and the second ceramic layer forms the box dam as increasing the layer, and this product can obtain higher layer height, and expend with heat and contract with cold coefficient is low to effectively reduce stress, can keep high insulating properties simultaneously, still can select the pottery of different colours as required, in order to obtain different light efficiencies.
Description
Technical Field
The utility model belongs to the technical field of the ceramic substrate technique and specifically relates to indicate a high heat conduction DPC ceramic composite substrate structure.
Background
For the optical device requiring hermetic package at present, it is usually necessary to provide a dam on the DPC ceramic substrate, and the accommodating space formed by the dam can be filled with package glue, so as to achieve better hermetic performance. In the prior art, a common electroplating heightening mode is usually adopted to form the box dam, and the product structure has high coefficient of expansion with heat and contraction with cold, large stress and poor insulating property. Therefore, there is a need for improvements in current DPC ceramic substrates.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a DPC ceramic composite substrate structure with high thermal conductivity, which can effectively solve the problems of high coefficient of thermal expansion and contraction, large stress and poor insulating property of the DPC ceramic substrate.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a DPC ceramic composite substrate structure with high thermal conductivity comprises a first module and a second module which are vertically overlapped; the first module comprises a first ceramic layer, a first top circuit and a first bottom circuit are respectively formed on the upper surface and the lower surface of the first ceramic layer, and a through hole is formed in the first ceramic layer and is in conductive connection with the corresponding first top circuit and the corresponding first bottom circuit; the second module comprises a second ceramic layer, the upper surface and the lower surface of the second ceramic layer penetrate through the second ceramic layer to form an accommodating space, the upper surface and the lower surface of the second ceramic layer are respectively provided with a second top circuit and a second bottom circuit, and the second bottom circuit is fixedly combined with the corresponding first top circuit.
As a preferable scheme, the first top lines are multiple, a first groove is formed between two adjacent first top lines, and the first groove is filled with and covered with light-reflecting ink.
As a preferable scheme, the first bottom lines are multiple, a second trench is formed between two adjacent first bottom lines, and the second trench is filled with solder resist ink and covered with the solder resist ink.
Preferably, the second bottom circuit and the corresponding first top circuit are fixedly combined together by means of silver paste welding, electroplating or ultrasonic thermal bonding.
Preferably, the second bottom line and the corresponding first top line are fixed together by a solder layer.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme:
this product is formed by first module and second module are compound, and the second ceramic layer forms the box dam as increasing the layer, has replaced traditional electroplating mode of increasing, and this product can obtain higher layer height, and expend with heat and contract with cold coefficient is low to effectively reduce stress, can keep high insulating properties simultaneously, still can select the pottery of different colours as required, in order to obtain different light efficiencies.
To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a cross-sectional view of a preferred embodiment of the present invention.
The attached drawings indicate the following:
10. first module 11, first ceramic layer
12. A first top line 13, a first bottom line
14. Via 15, reflective ink
16. Solder resist ink 101, first trench
102. Second groove 20, second module
21. Second ceramic layer 22, second top trace
23. Second bottom circuit 201 and accommodating space
30. Solder material layer 40 and chip
50. A lens.
Detailed Description
Referring to fig. 1, a specific structure of a preferred embodiment of the present invention is shown, which includes a first module 10 and a second module 20 stacked together.
The first module 10 includes a first ceramic layer 11, a first top line 12 and a first bottom line 13 are respectively formed on the upper and lower surfaces of the first ceramic layer 11, a via hole 14 is formed in the first ceramic layer 11, and the via hole 14 is electrically connected to the corresponding first top line 12 and first bottom line 13. In this embodiment, the first top traces 12 are multiple, a first trench 101 is formed between two adjacent first top traces 12, and the first trench 101 is filled with and covered with a reflective ink 15; the number of the first bottom lines 13 is multiple, a second groove 102 is formed between two adjacent first bottom lines 13, and the second groove 102 is filled and covered with solder resist ink 16 to maintain high insulation performance; the first top line 12 and the first bottom line 13 can freely adopt different surface treatment methods, such as silver plating, gold plating, aluminum plating, and the like, to obtain different light effect requirements.
The second module 20 includes a second ceramic layer 21, the upper and lower surfaces of the second ceramic layer 21 are formed with an accommodating space 201, the upper and lower surfaces of the second ceramic layer 21 are respectively formed with a second top line 22 and a second bottom line 23, and the second bottom line 23 is combined and fixed with the corresponding first top line 12. The second bottom lines 23 and the corresponding first top lines 12 are bonded and fixed together by means of silver paste welding, electroplating or ultrasonic thermal bonding, in this embodiment, the second bottom lines 23 and the corresponding first top lines 12 are bonded and fixed together by means of a solder layer 30; the second top trace 22 and the second bottom trace 23 can be freely applied with different surface treatments, such as silver plating, gold plating, aluminum plating, etc., to obtain different light effects.
Detailed description the manufacturing process of this embodiment is as follows:
firstly, a first module 10 and a second module 20 are manufactured, then, tin immersion is carried out on a second bottom circuit 23 of the second module 20, a layer of soldering flux is silk-screened on a first top circuit 12 corresponding to the first module 10, then, the first module 10 and the second module 20 enter a reflow soldering device together after being fixed through a positioning device, and the first module 10 and the second module 20 are fixedly soldered and combined through the soldering flux and the tin immersion layer at a reflow temperature to form a solder layer 30.
When in use, the chip 40 is placed in the upper end opening of the containing space 201 and is welded and conducted with the corresponding first top line 12; then, the lens 50 is covered, so that the lens 50 covers the upper end opening of the accommodating space 201; when the first bottom circuit 13 is connected to an external circuit, current flows through the via hole 14 to the corresponding first top circuit 12, so that the chip 40 emits light, and the light is emitted through the lens 50.
The utility model discloses a design focus lies in: this product is formed by first module and second module are compound, and the second ceramic layer forms the box dam as increasing the layer, has replaced traditional electroplating mode of increasing, and this product can obtain higher layer height, and expend with heat and contract with cold coefficient is low to effectively reduce stress, can keep high insulating properties simultaneously, still can select the pottery of different colours as required, in order to obtain different light efficiencies.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (5)
1. The utility model provides a high heat conduction DPC ceramic composite substrate structure which characterized in that: comprises a first module and a second module which are vertically overlapped together; the first module comprises a first ceramic layer, a first top circuit and a first bottom circuit are respectively formed on the upper surface and the lower surface of the first ceramic layer, and a through hole is formed in the first ceramic layer and is in conductive connection with the corresponding first top circuit and the corresponding first bottom circuit; the second module comprises a second ceramic layer, the upper surface and the lower surface of the second ceramic layer penetrate through the second ceramic layer to form an accommodating space, the upper surface and the lower surface of the second ceramic layer are respectively provided with a second top circuit and a second bottom circuit, and the second bottom circuit is fixedly combined with the corresponding first top circuit.
2. The DPC ceramic composite substrate structure of claim 1, wherein: the first top lines are multiple, a first groove is formed between every two adjacent first top lines, and the first grooves are filled with light-reflecting ink and covered with the light-reflecting ink.
3. The DPC ceramic composite substrate structure of claim 1, wherein: the first bottom circuits are multiple, a second groove is formed between every two adjacent first bottom circuits, and solder resist ink is filled in the second groove and covers the second groove.
4. The DPC ceramic composite substrate structure of claim 1, wherein: the second bottom circuit and the corresponding first top circuit are fixedly combined together in a silver glue welding, electroplating or ultrasonic thermal bonding mode.
5. The DPC ceramic composite substrate structure of claim 1, wherein: the second bottom circuit and the corresponding first top circuit are fixedly combined together through a solder layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921675330.5U CN210516747U (en) | 2019-10-09 | 2019-10-09 | DPC ceramic composite substrate structure with high thermal conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921675330.5U CN210516747U (en) | 2019-10-09 | 2019-10-09 | DPC ceramic composite substrate structure with high thermal conductivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210516747U true CN210516747U (en) | 2020-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921675330.5U Active CN210516747U (en) | 2019-10-09 | 2019-10-09 | DPC ceramic composite substrate structure with high thermal conductivity |
Country Status (1)
| Country | Link |
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| CN (1) | CN210516747U (en) |
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2019
- 2019-10-09 CN CN201921675330.5U patent/CN210516747U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: DPC ceramic composite substrate structure with high thermal conductivity Effective date of registration: 20200707 Granted publication date: 20200512 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201015 Granted publication date: 20200512 Pledgee: Guangxin (Yili) Financial Leasing Co., Ltd Pledgor: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. Registration number: Y2020980003830 |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201112 Address after: 710000 unit 1707, building 1, Wanke hi tech living Plaza, No.56 Xifeng Road, Yanta District, Xi'an, Shaanxi Province Patentee after: Xi'an Boxin Chuangda Electronic Technology Co., Ltd Address before: 523000 No. 12, ancient Liao Road, Tangxia Town, Dongguan, Guangdong Patentee before: DONGGUAN GUOCI NEW MATERIAL TECHNOLOGY Co.,Ltd. |