CN209248094U - The radiator structure of the SFP integrated module of optical transceiver - Google Patents
The radiator structure of the SFP integrated module of optical transceiver Download PDFInfo
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- CN209248094U CN209248094U CN201920178282.2U CN201920178282U CN209248094U CN 209248094 U CN209248094 U CN 209248094U CN 201920178282 U CN201920178282 U CN 201920178282U CN 209248094 U CN209248094 U CN 209248094U
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- bronze medal
- electronic device
- thermally conductive
- conductive copper
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Abstract
The utility model discloses a kind of radiator structures of SFP integrated module of optical transceiver, the electronic device of the SFP integrated module of optical transceiver is arranged on pcb board, upper casing is equipped with the first bronze medal cap, the first thermally conductive copper core is equipped between first bronze medal cap and electronic device, the second end of first bronze medal cap abuts the top of electronic device, and the first spring is equipped between the first end of the first thermally conductive copper core and the slot bottom of the first accommodation groove.Bottom case is equipped with the second bronze medal cap, the second end end face of second bronze medal cap is equipped with the second accommodation groove, it is equipped with the second thermally conductive copper core in second accommodation groove, and is equipped with second spring between the first end of the second thermally conductive copper core and the slot bottom of the second accommodation groove, second end abuts the bottom of electronic device.The utility model has the beneficial effects that can directly be radiated to the primary electron device inside optical module, radiating efficiency is greatly improved, and meets the design of SFP integrated module of optical transceiver miniaturization.
Description
Technical field
The utility model relates to the technical field of optical module, in particular to a kind of heat dissipation knot of the SFP integrated module of optical transceiver
Structure.
Background technique
The SFP integrated module of optical transceiver is widely used in the communications field, because its is compact-sized, so that on communication equipment veneer
Multiple grafting ports can be set to connect the SFP integrated module of optical transceiver, to substantially increase the communication capacity of communication system.
But because SFP optical module structure integrated with sending and receiving is compact, heat dissipation capacity is larger, influences its working performance to a certain extent.Existing SFP
Miscellaneous dissipate is arranged by the surface of shell in the SFP integrated module of optical transceiver mostly in the radiator structure of the integrated module of optical transceiver
Hot device is contacted with the shell of the SFP integrated module of optical transceiver by radiator and is radiated, cannot be with the light transmit-receive integrated mould of SFP
The electronic device of main heating source in block contacts, and radiating efficiency is low, and radiator is disposed entirely within the SFP integrated module of optical transceiver
Surface of shell be not suitable for small-sized to the SFP integrated module of optical transceiver so that the overall space of the SFP integrated module of optical transceiver increases
The design requirement of change.
Utility model content
In view of the problems of the existing technology, the main purpose of the utility model is to provide a kind of light transmit-receive integrated mould of SFP
The radiator structure of block, it is intended to which the radiator structure for solving existing optical module cannot directly carry out directly the electronic device inside optical module
Heat dissipation is connect, heat dissipation effect is poor, and radiator structure occupied space is big, does not meet and sets to the miniaturization of the SFP integrated module of optical transceiver
The problem of meter.
To achieve the above object, the utility model proposes the SFP integrated module of optical transceiver radiator structure comprising: on
The electronic device of shell, bottom case and pcb board, the SFP integrated module of optical transceiver is arranged on pcb board, and pcb board and electronic device setting exist
Between upper casing and bottom case.It is characterized in that, upper casing is equipped with several first through hole, several first through hole are separately positioned on electronic device
Top.The first bronze medal cap is equipped in each first through hole, the top of upper casing, and first are protruded in the first end end face of the first bronze medal cap
The first end end face of copper cap is equipped with several first grooves.The second end of first bronze medal cap passes through first through hole, and the of the first bronze medal cap
Two ends end face are equipped with the first accommodation groove.The first thermally conductive copper core is equipped between first bronze medal cap and electronic device, the first thermally conductive copper core
First end is inserted into the first accommodation groove, and second end abuts the top of electronic device, and the first end of the first thermally conductive copper core and the
The first spring is equipped between the slot bottom of one accommodation groove.Pcb board is equipped with several second through-holes, and the second through-hole is separately positioned on electronics
The bottom of device.Bottom case be equipped with several one-to-one third through-holes of second through-hole, the second bronze medal cap is equipped in third through-hole,
The bottom of the first end end face protrusion bottom case of second bronze medal cap, and the first end end face of the second bronze medal cap is equipped with several second grooves.The
The second end of two bronze medal caps passes through third through-hole, and extends into the second through-hole, and the second end end face of the second bronze medal cap is equipped with second and holds
Set slot, be equipped with the second thermally conductive copper core in the second accommodation groove, and the slot bottom of the first end of the second thermally conductive copper core and the second accommodation groove it
Between be equipped with second spring, second end abut electronic device bottom.
Preferably, between the first thermally conductive copper core and the top of electronic device and the second thermally conductive copper core and electronic device
Heat-conducting silicone grease is coated between bottom.
Preferably, the top of the upper casing and the bottom of the bottom case are equipped with cooling fin.
It compared with prior art, the utility model has the beneficial effects that: can be to the primary electron device inside optical module
It is directly radiated, greatly improves radiating efficiency, and meet the design of SFP integrated module of optical transceiver miniaturization.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of radiator structure of the utility model SFP integrated module of optical transceiver；
Fig. 2 is the three-dimensional structure diagram of the first bronze medal cap in an embodiment of the present invention；
Fig. 3 is the three-dimensional structure diagram of the SFP integrated module of optical transceiver in an embodiment of the present invention；
The utility model aim is realized, the embodiments will be further described with reference to the accompanying drawings for functional characteristics and advantage.
Specific embodiment
The utility model proposes a kind of radiator structures of SFP integrated module of optical transceiver.
Referring to Fig.1-2, Fig. 1 is that the structure of one embodiment of radiator structure of the utility model SFP integrated module of optical transceiver is shown
It is intended to, Fig. 2 is the three-dimensional structure diagram of the first bronze medal cap in an embodiment of the present invention.
As shown in Figure 1, the radiator structure of the SFP integrated module of optical transceiver can be directly right in the utility model embodiment
The electronic device of main heating source radiates inside the SFP integrated module of optical transceiver comprising: upper casing 100, bottom case 200 and pcb board
The electronic device 400 of 300, the SFP integrated modules of optical transceiver is arranged on pcb board 300, and pcb board 300 and electronic device 400 are arranged
Between upper casing 100 and bottom case 200.It is characterized in that, upper casing 100 is equipped with several first through hole, several first through hole are set respectively
It sets in the top of electronic device 400.The first bronze medal cap 110, the first end end face of the first bronze medal cap 110 are equipped in each first through hole
The top of upper casing 100 is protruded, and as shown in Fig. 2, the first end end face of the first bronze medal cap 110 is equipped with several first grooves 111.First
The second end of copper cap 110 passes through first through hole, and the second end end face of the first bronze medal cap 110 is equipped with the first accommodation groove.First bronze medal cap
The first thermally conductive copper core 500 is equipped between 110 and electronic device 400, the first end of the first thermally conductive copper core 500 is inserted into the first accommodation groove
Interior, second end abuts the top of electronic device 400, and the slot bottom of the first end of the first thermally conductive copper core 500 and the first accommodation groove
Between be equipped with the first spring, solve hardness between the first thermally conductive copper core 500 and electronic device 400 and abut, be easily destroyed electronics device
The problem of part.Pcb board 300 is equipped with several second through-holes, and the second through-hole is separately positioned on the bottom of electronic device 400.Bottom case
200 be equipped with several one-to-one third through-holes of second through-hole, the second bronze medal cap 210, the second bronze medal cap are equipped in third through-hole
The bottom of 210 first end end face protrusion bottom case 200, and the first end end face of the second bronze medal cap 210 is equipped with several second grooves.The
The second end of two bronze medal caps 210 passes through third through-hole, and extends into the second through-hole, and the second end end face of the second bronze medal cap 210 is equipped with
Second accommodation groove, the second accommodation groove is interior to be equipped with the second thermally conductive copper core 600, and the first end of the second thermally conductive copper core 600 is held with second
It sets and is equipped with second spring between the slot bottom of slot, second end abuts the bottom of electronic device 400, solves the second thermally conductive copper core 600
The problem of hardness abuts, is easily destroyed electronic device between electronic device 400.
Specifically, in the present embodiment, to prevent the first thermally conductive copper core 500 and the contact surface of electronic device 400 from having gap,
And reduce radiating efficiency.Between first thermally conductive copper core 500 and the top of electronic device 400 and the second thermally conductive copper core 600 and electricity
Heat-conducting silicone grease is coated between the bottom of sub- device 400.
Specifically, in the present embodiment, as shown in figures 1 and 3, whole to further increase the SFP integrated module of optical transceiver
Radiating efficiency, the top of upper casing 100 and the bottom of bottom case 200 are equipped with cooling fin 700.
Technical solutions of the utility model are respectively equipped with by the upper casing 100 and bottom case 200 in the SFP integrated module of optical transceiver
One thermally conductive copper core 500 and the second thermally conductive copper core 600, the first thermally conductive copper core 500 and the second thermally conductive copper core 600 are received with SFP light respectively
400 surface elasticity of the electronic device contact for sending out main heating source inside integrated module is realized 400 heat of electronic device of main heating source
Amount passes to the first thermally conductive copper core 500 and the second thermally conductive copper core 600.First thermally conductive copper core 500 and the second thermally conductive copper core 600 are distinguished
With the second end in contact of the first bronze medal cap 110 and the second bronze medal cap 210, the first end of the first bronze medal cap 110 and the second bronze medal cap 210 is worn respectively
It crosses upper casing 100 and bottom case 200 arrives the outside of the SFP integrated module of optical transceiver, realization conducts heat to the SFP integrated module of optical transceiver
Outside.And by being equipped with several first grooves 111 in the first end end face of the first bronze medal cap 110 respectively, the of the second bronze medal cap 210
One end end face is equipped with several second grooves, increases cooling surface area, to improve radiating efficiency.
It compared with prior art, the utility model has the beneficial effects that: can be to the primary electron device inside optical module
400 are directly radiated, and radiating efficiency is greatly improved, and meet the design of SFP integrated module of optical transceiver miniaturization.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
Under all utility models in the utility model are conceived, equivalent structure made based on the specification and figures of the utility model
Transformation, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (3)
1. a kind of radiator structure of the SFP integrated module of optical transceiver comprising: upper casing, bottom case and pcb board, the light transmit-receive integrated mould of SFP
The electronic device of block is arranged on the pcb board, and the pcb board and electronic device are arranged between the upper casing and bottom case；Its
It is characterized in that, the upper casing is equipped with several first through hole, and several first through hole are separately positioned on the upper of the electronic device
Side；The first bronze medal cap is equipped in each first through hole, the top of the upper casing is protruded in the first end end face of the first bronze medal cap
Portion, and the first end end face of the first bronze medal cap is equipped with several first grooves；The second end of the first bronze medal cap passes through described the
One through-hole, and the second end end face of the first bronze medal cap is equipped with the first accommodation groove；The first bronze medal cap and the electronic device it
Between be equipped with the first thermally conductive copper core, the first end of the first thermally conductive copper core is inserted into first accommodation groove, and second end abuts
The top of the electronic device, and the is equipped between the first end of the first thermally conductive copper core and the slot bottom of first accommodation groove
One spring；The pcb board is equipped with several second through-holes, and second through-hole is separately positioned on the bottom of the electronic device；
The bottom case be equipped with several one-to-one third through-holes of second through-hole, the second bronze medal is equipped in the third through-hole
Cap, the bottom of the bottom case is protruded in the first end end face of the second bronze medal cap, and the first end end face of the second bronze medal cap is equipped with
Several second grooves；The second end of the second bronze medal cap passes through the third through-hole, and extends into second through-hole, described
The second end end face of second bronze medal cap is equipped with the second accommodation groove, is equipped with the second thermally conductive copper core in second accommodation groove, and described the
Second spring is equipped between the first end of two thermally conductive copper cores and the slot bottom of second accommodation groove, second end abuts the electronics
The bottom of device.
2. the radiator structure of the SFP integrated module of optical transceiver as described in claim 1, which is characterized in that first conduction copper
It is coated between core and the top of the electronic device and between the second thermally conductive copper core and the bottom of the electronic device
Heat-conducting silicone grease.
3. such as the radiator structure of the described in any item SFP integrated modules of optical transceiver of claim 1-2, which is characterized in that on described
The top of shell and the bottom of the bottom case are equipped with cooling fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920178282.2U CN209248094U (en) | 2019-01-30 | 2019-01-30 | The radiator structure of the SFP integrated module of optical transceiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920178282.2U CN209248094U (en) | 2019-01-30 | 2019-01-30 | The radiator structure of the SFP integrated module of optical transceiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209248094U true CN209248094U (en) | 2019-08-13 |
Family
ID=67536953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920178282.2U Active CN209248094U (en) | 2019-01-30 | 2019-01-30 | The radiator structure of the SFP integrated module of optical transceiver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209248094U (en) |
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2019
- 2019-01-30 CN CN201920178282.2U patent/CN209248094U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210702 Address after: 518000 area a on the second floor, area D on the third floor and area a on the fourth floor of deliwei Industrial Park on the east side of Dalang South Road, building 11, Hebei Industrial Zone, Hualian community, Longhua street, Shenzhen City, Guangdong Province Patentee after: FLYIN OPTRONICS Co.,Ltd. Address before: 4 / F, deliwei Industrial Park, Dalang street, Longhua District, Shenzhen, Guangdong 518000 Patentee before: Shenzhen Yichuang Feiyuguang Communication Technology Co.,Ltd. |