WO2016150285A1

WO2016150285A1 - Optical transmission device and apparatus, and method for designing optical transmission device

Info

Publication number: WO2016150285A1
Application number: PCT/CN2016/075368
Authority: WO
Inventors: 刘京
Original assignee: 中兴通讯股份有限公司
Priority date: 2015-03-23
Filing date: 2016-03-02
Publication date: 2016-09-29
Also published as: CN106160870A

Abstract

Optical transmission device and apparatus, and method for designing optical transmission device are disclosed in the present invention. The optical transmission device in the present invention concretely includes: a first PCB board fixed to a panel; optical modules are provided on the front surface and the back surface of the first PCB board respectively, and the optical module is provided with a light port; the optical module is set to receive externally transmitted optical signal through its optical port, convert the received optical signal into an electrical signal, and convert an electrical signal processed by an electrical signal processing module into an optical signal; the electrical signal processing module is set to process the electrical signal converted by the optical module, and transmit the processed electrical signal to the optical module; the optical transmission device in the present invention can add an optical module without changing the size of the PCB board.

Description

Optical transmission device, device and design method of optical transmission device

Technical field

The present invention relates to the field of optical communication technologies, and in particular, to a method for designing an optical transmission device, a device, and an optical transmission device.

Background technique

With the continuous growth of data communication services, the network data has risen geometrically, and the massive digital media content has caused the Internet traffic to grow tenfold or even hundreds of times. These data are constantly emerging, which directly leads to the backbone network traffic every year. It is growing at a rate of 50% to 80%. At present, 100G is the main transmission medium of optical cable. The 100G system has been commercialized by major operators. The system above 100G can further improve the network capacity and reduce the transmission cost per bit on the basis of 100G, effectively solving the services faced by operators. Traffic and network bandwidth continue to grow under 4 pressures.

Take the current 10*10100G card-side customer-side board as an example. It uses 10 10G SFP++ optical modules to implement 100G service transmission. Among them, 10 SFP++ optical modules respectively convert the services of 10 optical ports into photoelectric conversion. It is transformed into an electrical signal service that can be processed by the framing chip; at the same time, the processed service is subjected to electro-optical conversion and converted into an optical signal. The SFP++ optical module is mounted on the PCB through the SFP++ optical module socket and can only be used with a single row of optical modules. As shown in Figure 1, the existing single-board optical port is assigned a picture (front view). As shown in FIG. 2, a side view of the existing single board, as shown in FIG. 3 is a top view of the existing single board; as shown in FIG. 1-3, the single board PCB 13 is provided with an optical module having an optical port 11. The single-board PCB 13 is fixed on the panel 12, wherein the single-board PCB 13 is further provided with a power socket 12 for mounting a power source, and a backplane socket 15 and a backplane socket 16 fixed to the backboard.

Although the existing boards can implement 100G service access, as the traffic volume increases, the framing chip access capability is step by step enhanced. Only 10 optical ports can not meet the needs of users, and the optical module rate is unchanged. In this case, increasing the number of optical ports becomes an inevitable way. Since the optical module socket is placed on the PCB, the number of optical ports does not increase endlessly, and it is limited by the specific size of the PCB. Therefore, how to increase the technical problem of the optical module without changing the size of the PCB board needs to be urgently solved.

Summary of the invention

The main technical problem to be solved by the present invention is to provide a design method of an optical transmission device, a device, and an optical transmission device, which can solve the technical problem of how to increase the optical module without changing the size of the PCB.

In order to solve the above technical problem, the present invention provides an optical transmission device, including: a first PCB board to which an electrical signal processing module and a panel are fixed; and an optical module, the optical module respectively disposed on a front surface and a back surface of the first PCB board Have a light port;

The optical module is configured to receive an externally transmitted optical signal through its optical port, convert the received optical signal into an electrical signal, and convert the electrical signal processed by the electrical signal processing module into an optical signal;

The electrical signal processing module is configured to process an electrical signal converted by the optical module, and process the processed telecommunications The number is transmitted to the optical module.

In an embodiment of the invention, the optical transmission device further includes: a second PCB board fixed to the panel, the second PCB board is located under the first PCB, and the electrical signal processing module is disposed at the On the second PCB board.

In an embodiment of the invention, the second PCB board is provided with an opening, at least a portion of the light module on the back side of the first PCB board being located within the opening.

In an embodiment of the invention, the first PCB board and the second PCB board are connected by a connector;

The connector is configured to transmit an electrical signal converted by the optical module on the first PCB board to the electrical signal processing module on the second PCB board; and after processing the electrical signal processing module The electrical signal is transmitted to the optical module on the first PCB.

In an embodiment of the invention, the front and back sides of the first PCB board are respectively provided with optical modules that are symmetrical with respect to the first PCB board.

In an embodiment of the invention, the optical module is mounted on the first PCB board through an optical module socket.

Also in order to solve the above technical problem, the present invention provides an optical transmission apparatus comprising the optical transmission apparatus according to any one of the above.

Also in order to solve the above technical problem, the present invention also provides a method for designing an optical transmission device, comprising the following steps:

Providing a first PCB board and an electrical signal processing module configured to process electrical signals converted by the optical module;

An optical module having an optical port is disposed on the front and back sides of the first PCB board, and the first PCB board is fixed to the panel, and the optical module is configured to receive an externally transmitted optical signal through the optical port of the first PCB. The received optical signal is converted into an electrical signal and the electrical signal processed by the electrical signal processing module is converted into an optical signal.

In an embodiment of the invention, the design method further includes:

Setting a second PCB board;

The electrical signal processing module is disposed on the second PCB board, and the second PCB board and the panel are fixed to be located below the first PCB board.

In an embodiment of the invention, the step of setting the second PCB board comprises:

Providing a second PCB board having an opening;

The step of fixing the second PCB board and the panel to be located below the first PCB board includes:

The second PCB board is fixed to the panel such that the second PCB board is located below the first PCB board and at least a portion of the light module on the back side of the first PCB board is located within the opening.

The beneficial effects of the invention are:

The present invention provides a light transmission device, a device, and a design method of the optical transmission device. The optical transmission device of the present invention specifically includes: a first PCB board fixed to the panel; and the front and back sides of the first PCB board are respectively provided with light Module, the optical module has an optical port; the optical module is configured to receive an externally transmitted optical signal through its optical port, convert the received optical signal into an electrical signal, and process the electrical signal processing module The electrical signal is converted into an optical signal; the electrical signal processing module is configured to process the electrical signal converted by the optical module, and transmit the processed electrical signal to the optical module; the optical transmission device of the present invention may The optical module is placed on the front and back of the PCB, and the longitudinal space of the panel is used to increase the number of optical modules, instead of increasing the size of the PCB to increase the optical module; compared with the prior art, the PCB can be changed without changing the PCB. In the case of board size, the number of optical modules is increased, and the optical transmission capability and efficiency are improved.

In the embodiment of the present invention, considering that if the electrical signal processing module and the optical module are disposed on the same PCB board, since the electrical signal processing module has a large height, the height of the panel is increased during design; The height of the optical transmission device of the present invention can also add a PCB board (second PCB board) under the first PCB board for placing the electrical signal processing module, and the relative distance between the large electric signal processing module and the top of the panel is avoided. The design panel height is too large.

DRAWINGS

1 is a front view of an existing single-board optical port distribution;

2 is a side view of the prior art optical port distribution;

3 is a top view of an existing single-board optical port distribution;

4 is a front elevational view of an optical transmission device according to Embodiment 1 of the present invention;

FIG. 5 is a schematic side view of an optical transmission device according to Embodiment 1 of the present invention; FIG.

FIG. 6 is a top plan view of an optical transmission device according to Embodiment 1 of the present invention; FIG.

FIG. 7 is a front elevational view of a single-board PCB according to Embodiment 1 of the present invention; FIG.

FIG. 8 is a front view of a daughter board PCB according to Embodiment 1 of the present invention; FIG.

9 is a schematic rear view of a daughter board PCB according to Embodiment 1 of the present invention;

FIG. 10 is a schematic flowchart diagram of a method for designing an optical transmission device according to Embodiment 2 of the present invention.

detailed description

The present invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1:

In view of the fact that the number of optical modules is currently limited by the specific size of the PCB, the embodiment provides an optical transmission device including: a first PCB board fixed by the electrical signal processing module and the panel; and a front and back surface of the first PCB Each is provided with an optical module, and the optical module has an optical port;

The electrical signal processing module is configured to process an electrical signal converted by the optical module, and transmit the processed electrical signal to the optical module.

Preferably, the electrical signal processing module in this embodiment may be disposed on the first PCB.

In this embodiment, the number of optical modules may be multiple, and the specific number may be set according to actual requirements.

In this embodiment, the optical module can be installed on the first PCB through the optical module socket, and one optical module socket corresponds to one optical module. Therefore, in the embodiment, the front and back sides of the first PCB board are provided with a plurality of optical module sockets. The optical module is inserted.

The optical transmission device provided in this embodiment can place an optical module on the front and back sides of the PCB, and utilize the longitudinal space of the panel to increase the number of optical modules, instead of increasing the size of the PCB to increase the optical module; Compared with the technology, the number of optical modules can be increased without changing the size of the PCB, and the optical transmission capability and efficiency can be improved.

In addition, optical modules are disposed on the front and back sides of the PCB. Since the upper and lower optical modules are separated by a layer of PCB boards, the problem of excessive interference of the optical modules can be prevented. When the optical module is installed on the PCB through the optical module socket, the optical module is always inserted in the forward direction and reversely inserted, which ensures that the optical module handle is always outward, which facilitates the insertion and removal of the optical module.

In the embodiment of the present invention, considering that if the electrical signal processing module and the optical module are disposed on the same PCB board, since the electrical signal processing module has a large height, the longitudinal space of the panel is increased by increasing the height of the panel during design. , the panel changes are large. In this embodiment, a second PCB board can be added under the first PCB board for placing the electrical signal processing module. Since the second PCB board is below the first PCB board, the electrical signal processing module is disposed on the second PCB board. The distance between the electrical signal processing module and the bottom of the panel can be reduced, so that it is not necessary to add too much or increase the height of the panel during design, which reduces cost and design difficulty. Specifically, the optical transmission device of this embodiment further includes: a second PCB board fixed to the panel, the second PCB board is located under the first PCB, and the second PCB board is fixed on the panel, The second PCB board is provided with an electrical signal processing module;

In this embodiment, the electrical signal processing module may include: a power module and a processing chip; wherein the power module may be mounted on the second PCB through a power socket on the second PCB board to supply power to the second PCB

In order to further reduce the height of the panel or to increase the height of the panel, that is, to increase the number of optical modules in the vertical space of the original panel, this embodiment may open an opening in the second PCB to reserve the optical module on the first PCB. More longitudinal space, the thickness space of the second PCB board is utilized; thus, there is no need to increase the vertical space by increasing the panel height or excessively increasing the panel height, so that the first PCB board and the second PCB board can be mounted. . For example, in this embodiment, a notch can be formed on the second PCB, that is, the second PCB board is a concave PCB board, and then fixed first. The PCB board to the panel allows the optical module disposed on the back side of the first PCB board to extend into the recess or through the recess, so that the arrangement can make full use of the longitudinal space of the panel, and the original panel can be used without changing the height of the panel.

Therefore, in the optical transmission device of this embodiment, the second PCB board is provided with an opening, and at least a portion of the optical module on the back surface of the first PCB board is located in the opening.

In order to further increase the number of optical modules, the optical module may be disposed on the front and back sides of the first PCB board in a symmetrical manner, that is, the front and back sides of the first PCB board are respectively provided with respect to the The first PCB board is symmetrical optical module; for example, an optical module is disposed on the front side, and an optical module is disposed at a position symmetrically opposite to the PCB board on the back side; in this embodiment, the optical module is disposed in a symmetric manner to fully utilize the PCB size, and the The number of optical modules set.

In this embodiment, since the electrical signal processing module and the optical module are on different PCB boards, it is also required to provide a connector configured to transmit an electrical signal between the two PCB boards; The first PCB board and the second PCB board may be connected by a connector; the connector is configured to transmit an electrical signal converted by the optical module on the first PCB board to the second PCB board The electrical signal processing module; and transmitting the electrical signal processed by the electrical signal processing module to the optical module on the first PCB.

In this embodiment, the connector may be a high speed connector that provides access for electrical signals on the first PCB board and the second PCB board. Preferably, in order to ensure the tight connection between the first PCB and the second PCB and increase the reliability of use, a fixed pillar may be fixed by adding a fixed pillar between the first PCB and the second PCB.

In order to enable the optical transmission device of the embodiment to be mounted on the backplane, the second PCB board may also be provided with a backplane socket in this embodiment.

The optical module in this embodiment may be an SFP++ optical module.

The optical transmission device of this embodiment is described in detail below, as shown in FIG. 4-6, including: a single-board PCB 24 (corresponding to the second PCB board described above) and a sub-board PCB 23 respectively fixed to the panel 22 (equivalent to the first In the present embodiment, the single-board PCB 24 block may be a retracted structure. For example, as shown in FIG. 7 , the single-board PCB 24 is a concave PCB board (refer to the figure). 7); the single board PCB 24 and the sub board PCB 23 are connected through the connector 25 to realize electrical signal transmission, specifically, the electrical signal converted by the optical module is transmitted to the single board PCB 24, and the electrical signal processing module of the single board PCB 24 is processed to transmit the electrical signal. As shown in FIG. 7 and FIG. 9, the first connector 251 is disposed on the front surface of the single-board PCB 24. The second connector 252 is disposed on the back of the sub-board PCB 23. The first connector 251 and the second connector 252 are connected. The front side and the back side of the sub-board PCB 23 can be symmetrically inserted into the optical module having the optical port 21 through the optical module socket (the optical module socket is not shown), specifically, 10 symmetry is inserted on the front and back sides of the sub-board PCB 23, respectively. Optical module with optical port 21, one optical port 21 It should be a light module; optical module daughter board PCB23 back surface portion located within the recess, with reference to FIG. 5; the electronic signal processing module disposed on the board PCB 24, is provided for processing an electric signal converted optical module. As shown in FIG. 6 and FIG. 7, in the embodiment, the single-board PCB 24 is further provided with a power socket 26 for mounting a power source, a backplane socket 27 and a backplane socket 28 fixed to the backboard.

In this embodiment, the electrical signal processing module can be composed of a power supply and a signal processing module, wherein the power supply can be a power outlet. 26 is mounted on the single board PCB 24.

Preferably, the height of the optical port 21 in the embodiment may be 10 mm, the distance between the single-board PCB 24 and the bottom of the panel 22 may be 1.5 mm, and the distance between the sub-board PCB 24 and the bottom of the panel 22 may be 2.7 mm.

The optical transmission device of the embodiment separately places the optical module on the sub-board PCB 23, and fully utilizes the longitudinal space of the panel, so that the front and the back of the sub-board are respectively installed with symmetrical optical modules to double the number of optical modules, for example, The maximum number of optical modules that can be placed on the PCB is 10. If this method is used, 20 can be placed on the original basis and placed side by side, which greatly increases the optical transmission capability of the single board, as shown in Figure 4. Compared with the prior art, the effect of increasing the number of optical modules used is achieved without changing the existing single board size and panel height, and the optical transmission capability is improved.

This embodiment also provides an optical transmission apparatus including the optical transmission apparatus as described above. The wired optical transmission device can be an OTN communication device.

Embodiment 2:

This embodiment provides a design method of an optical transmission device, as shown in FIG. 10, including the following steps:

Step 101: Set a first PCB board and an electrical signal processing module for electrical signal processing for converting the optical module.

Step 102: respectively, an optical module having an optical port is disposed on the front and back sides of the first PCB board, and the first PCB board is fixed to the panel, and the optical module is configured to receive an external transmission through its optical port. The optical signal converts the received optical signal into an electrical signal and converts the electrical signal processed by the electrical signal processing module into an optical signal.

The design method of the embodiment can utilize the longitudinal space of the panel to increase the number of optical modules, and avoid increasing the number of optical modules by increasing the size of the PCB, and improving the optical transmission capability compared with the prior art.

Preferably, the design method of this embodiment may further include:

Setting a second PCB board;

Preferably, the step of setting the second PCB board comprises:

Providing a second PCB board having an opening;

Compared with the prior art, the method of the embodiment adopts a method of increasing the use space of the longitudinal direction of the panel to realize the addition of the optical mode. The function of the block achieves the effect of increasing the number of optical modules used without changing the length of the existing boards, and improves the optical transmission capability.

The above is a further detailed description of the present invention in connection with the specific embodiments, and the specific embodiments of the present invention are not limited to the description. It will be apparent to those skilled in the art that the present invention may be made without departing from the spirit and scope of the invention.

Industrial applicability

According to the above technical solution provided by the embodiment of the present invention, the optical transmission device specifically includes: a first PCB board fixed to the panel; the front and back sides of the first PCB board are respectively provided with optical modules, and the optical module has an optical port; The optical module is configured to receive an externally transmitted optical signal through its optical port, convert the received optical signal into an electrical signal, and convert the electrical signal processed by the electrical signal processing module into an optical signal; An electrical signal processing module configured to process an electrical signal converted by the optical module and transmit the processed electrical signal to the optical module; the optical transmission device of the present invention can increase without changing a PCB size Optical module.

Claims

An optical transmission device includes: an electric circuit processing module and a first PCB board fixed to the panel; the front and back sides of the first PCB board are respectively provided with optical modules, and the optical modules have optical ports;

The optical module is configured to receive an externally transmitted optical signal through its optical port, convert the received optical signal into an electrical signal, and convert the electrical signal processed by the electrical signal processing module into an optical signal;

The electrical signal processing module is configured to process an electrical signal converted by the optical module, and transmit the processed electrical signal to the optical module.
The optical transmission device of claim 1, further comprising: a second PCB board fixed to the panel, the second PCB board being located under the first PCB, the electrical signal processing module being disposed at the On the second PCB board.
The optical transmission device of claim 2, wherein the second PCB board is provided with an opening, at least a portion of the optical module on the back side of the first PCB board being located within the opening.
The optical transmission device of claim 2, wherein the first PCB board and the second PCB board are connected by a connector;

The connector is configured to transmit an electrical signal converted by the optical module on the first PCB board to the electrical signal processing module on the second PCB board; and after processing the electrical signal processing module The electrical signal is transmitted to the optical module on the first PCB.
The optical transmission device according to any one of claims 1 to 4, wherein the front and back sides of the first PCB board are respectively provided with optical modules that are symmetrical with respect to the first PCB board.
The optical transmission device of claim 5, wherein the optical module is mounted on the first PCB board through an optical module socket.
An optical transmission device comprising: the optical transmission device according to any one of claims 1-6.
A method for designing an optical transmission device includes the following steps:

Providing a first PCB board and an electrical signal processing module configured to process electrical signals converted by the optical module;

An optical module having an optical port is disposed on the front and back sides of the first PCB board, and the first PCB board is fixed to the panel, and the optical module is configured to receive an externally transmitted optical signal through the optical port of the first PCB. The received optical signal is converted into an electrical signal and the electrical signal processed by the electrical signal processing module is converted into an optical signal.
The design method of claim 8, wherein the design method further comprises:

Setting a second PCB board;

The electrical signal processing module is disposed on the second PCB board, and the second PCB board and the panel are fixed to be located below the first PCB board.
The design method of claim 9, wherein the step of disposing the second PCB board comprises:

Providing a second PCB board having an opening;

The step of fixing the second PCB board and the panel to be located below the first PCB board includes:

The second PCB board is fixed to the panel such that the second PCB board is located below the first PCB board and at least a portion of the light module on the back side of the first PCB board is located within the opening.