CN217305762U - Temperature control device of dry etching machine - Google Patents

Abstract

The utility model discloses a temperature control device of dry etching machine, the on-line screen storage device comprises a base, the top center department of base installs the equipment stand, the inside joint of equipment stand is fixed with the temperature control mainboard, it has the heat conduction silica gel layer to fill between equipment stand and the temperature control mainboard, the top joint of base is fixed with down the casing, semiconductor refrigeration piece is installed to the top inner wall of casing down, the top at the equipment stand is fixed through leading cold piece joint in the bottom of semiconductor refrigeration piece, the top center department of casing installs the toper fin with semiconductor refrigeration piece top contact down. The utility model discloses a semiconductor refrigeration piece that sets up absorbs the heat that produces in the temperature control mainboard working process, gives off the external air through the toper fin with the heat simultaneously, makes the temperature control mainboard can work under constant temperature environment for a long time, promotes the life of temperature control mainboard.

Description

Temperature control device of dry etching machine

Technical Field

The utility model relates to a dry etching machine accessory technical field specifically is a temperature control device of dry etching machine.

Background

The dry etching process needs to be completed by using a dry etching machine, and the dry etching machine comprises a processing cavity, wherein a lower polar plate and an upper polar plate are arranged in the processing cavity. When dry etching is carried out, reaction gas is introduced into the processing cavity from the air hole of the upper antenna plate, plasma is generated by glow discharge, and the plasma diffuses downwards to react with the substrate arranged on the lower electrode plate, so that the substrate is etched. Temperature control is an indispensable part in dry etching, and various temperature control devices have become common devices in controller systems of various industrial factories.

However, under long-term operation of the dry etching machine, the electronic components in the temperature control device are prone to heating and burning due to continuous use, thereby shortening the lifetime of the components and possibly even causing short circuit or device failure. Therefore, it is necessary to design a temperature control device of the dry etching machine.

SUMMERY OF THE UTILITY MODEL

To the above circumstances, for overcoming prior art's defect, the utility model provides a temperature control device of dry etching machine, the utility model discloses a semiconductor refrigeration piece that sets up absorbs the heat that produces in the temperature control mainboard working process, distributes the heat to the outside air through the toper fin simultaneously, makes the temperature control mainboard can work under constant temperature environment for a long time, promotes the life of temperature control mainboard.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a temperature control device of dry etching machine, includes the base, the top center department of base installs the equipment seat, the inside joint of equipment seat is fixed with the temperature control mainboard, it has heat conduction silica gel layer to fill between equipment seat and the temperature control mainboard, the top joint of base is fixed with down the casing, semiconductor refrigeration piece is installed to the top inner wall of casing down, the bottom of semiconductor refrigeration piece is fixed at the top of equipment seat through leading cold piece joint, the top center department of casing installs the toper fin with semiconductor refrigeration piece top contact down.

Preferably, the top of the lower shell is provided with an upper shell, the inner wall of the top of the upper shell is provided with a heat radiation fan, and the periphery of the upper shell is provided with heat radiation holes.

Preferably, the upper shell is screwed and fixed on the top of the lower shell.

Preferably, four turning positions in top of base department have seted up the spout, the inside of spout is rotated and is connected with the swing arm, the inside slip of spout has the slider of being connected with the swing arm meshing, the card frame is installed at the top of slider, the card frame joint is fixed at last casing card downthehole portion all around.

Preferably, rubber feet are fixed around the bottom of the base.

The utility model has the advantages that:

1. the semiconductor refrigeration piece absorbs heat generated in the working process of the temperature control main board, and the conical cooling piece dissipates the heat into the outside air, so that the temperature control main board can work in a constant temperature environment for a long time, and the service life of the temperature control main board is prolonged;

2. cold air flow is blown downwards from the top of the conical radiating fin through the arranged radiating fan and is exhausted from the radiating holes after passing through the surface of the conical radiating fin, so that the radiating efficiency of the conical radiating fin is improved;

3. the rotating rod is rotated to drive the sliding block to move in the sliding groove, so that the clamping frame is clamped in the clamping holes on the periphery of the upper shell, the fixing stability is good, and the installation and the disassembly are convenient.

Drawings

The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:

FIG. 1 is a schematic view of the overall plane structure of the present invention;

FIG. 2 is a schematic view of the base of the present invention;

fig. 3 is a schematic sectional plan view of the lower and upper housings of the present invention;

the reference numbers in the figures: 1. a base; 2. a lower housing; 3. an upper housing; 4. heat dissipation holes; 5. rotating the rod; 6. a clamping frame; 7. a chute; 8. a slider; 9. an equipment base; 10. a temperature control main board; 11. a heat conductive silica gel layer; 12. clamping holes; 13. a semiconductor refrigerating sheet; 14. a tapered heat sink; 15. a heat radiation fan; 16. a cold conducting sheet; 17. rubber feet.

Detailed Description

In the following, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings.

Example one

Given by fig. 1, fig. 2 and fig. 3, the utility model provides the following technical scheme: a temperature control device of a dry etching machine comprises a base 1, an equipment seat 9 is installed at the center of the top of the base 1, a temperature control mainboard 10 is fixed in the equipment seat 9 in a clamping mode, a heat conduction silica gel layer 11 is filled between the equipment seat 9 and the temperature control mainboard 10, a lower shell 2 is fixed at the top of the base 1 in a clamping mode, a semiconductor refrigerating sheet 13 is installed on the inner wall of the top of the lower shell 2, the bottom of the semiconductor refrigerating sheet 13 is fixed at the top of the equipment seat 9 in a clamping mode through a cold conducting sheet 16, a conical radiating sheet 14 which is in contact with the top of the semiconductor refrigerating sheet 13 is installed at the center of the top of the lower shell 2, an N-type semiconductor material and a P-type semiconductor material of the semiconductor refrigerating sheet 13 are connected into a galvanic couple pair, after direct current is switched on in the circuit, energy transfer can be generated, and the current flows to a joint of the P-type element from the N-type element to absorb heat, become the cold junction, flow into the joint release heat of N type component by P type component, become the hot junction, the cold junction and the 11 contacts of heat conduction silica gel layer of semiconductor refrigeration piece 13, absorb the heat that produces in the temperature control mainboard 10 course of the work, in giving off the outside air with the heat through toper fin 14 simultaneously, make temperature control mainboard 10 can work under constant temperature environment for a long time, promote temperature control mainboard 10's life.

Preferably, rubber feet 17 are fixed around the bottom of the base 1.

Example two

Referring to fig. 1 and fig. 3, as another preferred embodiment, the difference from the first embodiment is that an upper housing 3 is mounted on the top of a lower housing 2, a heat dissipation fan 15 is mounted on the inner wall of the top of the upper housing 3, heat dissipation holes 4 are formed around the upper housing 3, cold air flow is blown downwards from the top of a conical heat dissipation fin 14 by the arranged heat dissipation fan 15, and the cold air flow is exhausted from the heat dissipation holes 4 after passing through the surface of the conical heat dissipation fin 14, so as to improve the heat dissipation efficiency of the conical heat dissipation fin 14.

Preferably, the upper shell 3 is screwed and fixed on the top of the lower shell 2, and the connection stability is good.

EXAMPLE III

Referring to fig. 1 and 2, as another preferred embodiment, as the difference with embodiment one, spout 7 has been seted up to four turning positions in top of base 1, the inside rotation of spout 7 is connected with swing arm 5, the inside slip of spout 7 has the slider 8 of being connected with the meshing of swing arm 5, card frame 6 is installed at the top of slider 8, inside card hole 12 around last casing 3 is fixed to card frame 6 joint, swing arm 5 rotates, drive slider 8 at the inside motion of spout 7, make card frame 6 block inside last casing 3 card hole 12 around, not only fixed stability is good, and the installation is dismantled conveniently.

The working principle is as follows:

an N-type semiconductor material and a P-type semiconductor material of the semiconductor refrigeration sheet 13 are connected to form couple time, after direct current is switched on in the circuit, energy transfer can be generated, the current is absorbed by a joint of an N-type element flowing to a P-type element and becomes a cold end, the joint of the P-type element flowing to the N-type element releases heat and becomes a hot end, the cold end of the semiconductor refrigeration sheet 13 is contacted with the heat-conducting silica gel layer 11, the heat generated in the working process of the temperature control mainboard 10 is absorbed, meanwhile, cold air flow is blown downwards from the top of the conical cooling fin 14 through the arranged cooling fan 15 and is discharged from the cooling hole 4 after passing through the surface of the conical cooling fin 14, so that the temperature control mainboard 10 can work in a constant temperature environment for a long time, and the service life of the temperature control mainboard 10 is prolonged.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (5)

1. The utility model provides a temperature control device of dry etching machine, includes base (1), its characterized in that: the utility model discloses a semiconductor refrigeration piece, including base (1), equipment seat (9), the inside joint of equipment seat (9) is fixed with temperature control mainboard (10), it has heat conduction silica gel layer (11) to fill between equipment seat (9) and temperature control mainboard (10), the top joint of base (1) is fixed with down casing (2), semiconductor refrigeration piece (13) are installed to the top inner wall of casing (2) down, the top at equipment seat (9) is fixed through leading cold piece (16) joint in the bottom of semiconductor refrigeration piece (13), the top center department of casing (2) installs toper fin (14) with semiconductor refrigeration piece (13) top contact down.

2. The temperature control device of the dry etching machine according to claim 1, characterized in that: the improved shell structure is characterized in that an upper shell (3) is installed at the top of the lower shell (2), a heat dissipation fan (15) is installed on the inner wall of the top of the upper shell (3), and heat dissipation holes (4) are formed in the periphery of the upper shell (3).

3. The temperature control device of the dry etching machine according to claim 2, characterized in that: the upper shell (3) is screwed and fixed at the top of the lower shell (2).

4. The temperature control device of the dry etching machine according to claim 1, characterized in that: the four turning positions in top of base (1) department of having seted up spout (7), the inside of spout (7) is rotated and is connected with swing arm (5), the inside slip of spout (7) has slider (8) of being connected with swing arm (5) meshing, card frame (6) are installed at the top of slider (8), card frame (6) joint is fixed inside last casing (3) card hole (12) all around.

5. The temperature control device of the dry etching machine according to claim 1, characterized in that: rubber bottom feet (17) are fixed around the bottom of the base (1).

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