CN212570971U

CN212570971U - Radiator with multi-surface radiating pipes

Info

Publication number: CN212570971U
Application number: CN202021771306.4U
Authority: CN
Inventors: 曹梦堂; 王华伟
Original assignee: Zhejiang Bangruida Technology Co ltd
Current assignee: Zhejiang Bangruida Technology Co ltd
Priority date: 2020-08-21
Filing date: 2020-08-21
Publication date: 2021-02-19
Anticipated expiration: 2030-08-21

Abstract

A radiator with multi-surface radiating pipes comprises a radiating assembly and a heat conducting assembly arranged at the bottom of the radiating assembly. The heat dissipation assembly comprises a heat dissipation fin group, at least one heat dissipation cavity penetrating through the heat dissipation fin group, and a heat dissipation element arranged on one side of the heat dissipation fin group. The heat conduction assembly comprises a heat pipe base arranged at the bottom of the radiating fin group, at least two installation cavities which sequentially penetrate through the heat pipe base and the radiating fin group, and at least one heat conduction structure which is fixed in the heat pipe base and correspondingly penetrates through the installation cavities respectively. This radiator with multiaspect cooling tube makes whole radiator device even by lower supreme temperature, and heat conduction efficiency is high, and the radiating component heat dissipation is fast.

Description

Radiator with multi-surface radiating pipes

Technical Field

The utility model belongs to the technical field of the radiator, especially a radiator with multiaspect cooling tube.

Background

With the rapid development of the chip industry, especially the wide application of the CPU chip, consumers also pay more and more attention to the performance of the chip, and present CPU manufacturers also pay more and more attention to the power consumption of the CPU, so people hope that the smaller the TDP power consumption is, the better the TDP power consumption is, the smaller the CPU heat generation is, and the easier the heat dissipation is.

In the existing chip test socket technology, a heat dissipation device is mostly made of a single metal material and is air-cooled or is additionally provided with an air-cooled heat dissipation device or a complex water-cooled heat dissipation mechanism, and when a CPU chip with larger power consumption is tested, the defect that the test device is exposed violently exists, the heat dissipation performance is poor, and the risk of liquid leakage can occur under the condition of the water-cooled heat dissipation mechanism, so that an integrated circuit is short-circuited and damaged; the test performance of the chip is affected; therefore, a new heat dissipation device is needed to meet the performance requirements of chip testing.

SUMMERY OF THE UTILITY MODEL

In view of the above, the present invention provides a heat sink with multiple radiating pipes to solve the above problems.

A radiator with multi-surface radiating pipes comprises a radiating assembly and a heat conducting assembly arranged at the bottom of the radiating assembly. The heat dissipation assembly comprises a heat dissipation fin group, at least one heat dissipation cavity penetrating through the heat dissipation fin group, and a heat dissipation element arranged on one side of the heat dissipation fin group. The heat conduction assembly comprises a heat pipe base arranged at the bottom of the radiating fin group, at least two installation cavities which sequentially penetrate through the heat pipe base and the radiating fin group, and at least one heat conduction structure which is fixed in the heat pipe base and correspondingly penetrates through the installation cavities respectively.

Furthermore, the heat dissipation fin group comprises a heat dissipation bearing support piece arranged at the upper end of the heat pipe base and at least two heat dissipation fins sequentially stacked on the heat dissipation bearing support piece along the penetrating direction of the heat dissipation cavity.

Furthermore, the radiating element is connected with the radiating fin group through a limiting welding structure.

Furthermore, the limiting welding structure comprises a fixed support plate arranged on one side of the radiating fin group, two strip-shaped inner embedded grooves arranged at intervals on one side, close to the fixed support plate, of the radiating fin group, and two positioning convex parts arranged on the fixed support plate and correspondingly embedded into the strip-shaped inner embedded grooves, wherein the positioning convex parts are welded and fixed with the strip-shaped inner embedded grooves.

Furthermore, a yielding hole is formed in the fixing carrier plate, and the radiating element is arranged on one side, far away from the radiating fin group, of the fixing carrier plate.

Furthermore, the heat conducting structure comprises at least one inner heat pipe arranged in the mounting cavity in the middle of the radiating fin group in a penetrating mode, and at least three outer heat pipes arranged in the mounting cavity in the circumferential direction of the inner heat pipe in a penetrating mode.

Further, the length of the inner heat pipe is greater than the length of the outer heat pipe.

Further, liquid heat-conducting media are filled in the inner heat pipe and the outer heat pipe.

Furthermore, the radiator of the multi-surface radiating pipe also comprises a test socket arranged below the heat pipe base and a chip arranged at the upper end of the test socket, and the upper end of the chip is directly contacted with the inner heat pipe.

Compared with the prior art, the utility model provides a pair of corresponding test socket of radiator collocation with multiaspect cooling tube uses, the heat and the heat pipe bottom surface in close contact with that the chip surface produced, the heat pipe base passes through heat conduction structure with the heat that the chip produced and conducts fast to direct and with the radiating fin group of air contact, produce the forced convection cold air and form directional air current channel at installation cavity and radiating cavity body after the fixed radiating element circular telegram in side, thereby with the heat quick give off in the air, and utilize liquid heat-conducting medium heat conduction rate to cooperate high-power radiating element rapidly among the heat conduction structure, make whole radiator device by lower supreme temperature even, further improve radiating fin's radiating efficiency.

Drawings

Fig. 1 is an exploded schematic view of a heat sink with multiple radiating pipes according to the present invention.

Fig. 2 is a schematic view of the heat sink with multiple radiating pipes shown in fig. 1.

Detailed Description

Specific examples of the present invention will be described in further detail below. It should be understood that the description herein of embodiments of the invention is not intended to limit the scope of the invention.

Please refer to fig. 1 to 2, which are schematic structural views of a heat sink with multi-surface heat dissipation tubes according to the present invention. A heat sink with multi-sided radiating pipe includes a heat dissipating module 10, a heat conducting module 20 disposed at the bottom of the heat dissipating module 10, and a test socket 40 disposed below the heat conducting module 20, and a chip 41 disposed at the upper end of the test socket 40. It is understood that the heat sink with multi-sided heat pipes further includes other functional components and specific structures, such as electrical connection components, mounting structures, etc., which are well known to those skilled in the art, and therefore, will not be described in detail herein.

The heat dissipation assembly 10 includes a heat dissipation fin set 11, at least one heat dissipation cavity 12 penetrating through the heat dissipation fin set 11, and a heat dissipation element 13 disposed on one side of the heat dissipation fin set 11. The heat dissipation fin set 11 includes a heat dissipation support supporting piece 111 disposed at the upper end of the heat pipe base, and at least two heat dissipation fins 112 sequentially stacked on the heat dissipation support supporting piece 111 along the penetrating direction of the heat dissipation cavity 12. The heat dissipation bearing support 111 is installed on the upper end surface of the heat conducting assembly 20, so that the heat dissipation fin set 11 and the heat conducting assembly 20 are installed more firmly and are in close contact to facilitate heat conduction. The heat dissipation fins 112 are formed by stamping any one of red copper sheets, copper plates, copper alloy plates or aluminum plates. In the present example, the heat dissipating module 10 mainly employs the stacked heat dissipating fins 112, and it is conceivable that the heat dissipating member 13 may be mounted on the upper end of a plurality of cylindrical heat dissipating fins instead of the plurality of cylindrical heat dissipating fins.

The heat dissipation element 13 is connected with the heat dissipation fin group 11 through a limit welding structure 30. The limiting welding structure 30 comprises a fixing carrier plate 31 arranged on one side of the radiating fin group 11, two strip-shaped inner embedded grooves 32 arranged on one side, close to the fixing carrier plate 31, of the radiating fin group 11, two positioning convex parts 33 arranged on the fixing carrier plate 31 and correspondingly embedded in the strip-shaped inner embedded grooves 32, and the positioning convex parts 33 are welded and fixed with the strip-shaped inner embedded grooves 32. The fixing carrier plate 31 is used for fixing the heat dissipation element 13 on one side of the heat dissipation fin set 11. The strip-shaped embedded groove 32 is in welding contact with the positioning convex part 33, so that the tiny deformation generated when the radiating fin group 11 and the heat conducting component 20 are installed is compensated, and the stability and the reliability of the radiator are improved.

The fixing carrier plate 31 is provided with a relief hole 331, and the heat dissipation element 13 is disposed on a side of the fixing carrier plate 31 away from the heat dissipation fin set 11. The heat dissipation element 13 is a heat dissipation fan, and the heat dissipation fan performs heat dissipation and blowing on the heat dissipation fin group 11 through the abdicating hole 331. Forced cold air blown by the heat dissipation element 13 forms a baffling in the heat dissipation fin group 11, and a directional airflow channel is formed between the heat dissipation fin group 11 and the heat dissipation cavity 12 through the installation cavity, so that air can flow into a cold region from a hot region according to the directional airflow channel, heat guided out by the heat pipe flows rapidly, and a rapid heat dissipation effect is achieved.

The heat conducting assembly 20 includes a heat pipe base 21 disposed at the bottom of the heat dissipating fin set 11, at least two mounting cavities 22 sequentially penetrating through the heat pipe base 21 and the heat dissipating fin set 11, and at least one heat conducting structure 23 fixed in the heat pipe base 21 and respectively and correspondingly penetrating through the mounting cavities 22. The heat conducting structure 23 includes at least one inner heat pipe 231 inserted into the mounting cavity 22 located in the middle of the heat dissipating fin set 11, and at least three outer heat pipes 232 inserted into the mounting cavity 22 located in the circumferential direction of the inner heat pipe 231. The heat pipe base 21 fixes the outer heat pipe 232 and the inner heat pipe 231 in the installation cavity 22 of the heat pipe base 21, the whole heat pipe base 21 is processed precisely and smoothly, and the bottom surface of the heat pipe base 21 is in direct contact with the chip 41 to conduct heat. The inner heat pipe 231 and the outer heat pipe 232 are embedded in the mounting cavity 22, and the structure is reliable, and the connection is compact and stable. The length of the inner heat pipe 231 is greater than that of the outer heat pipe 232, and one end of the inner heat pipe 231 is arranged on the bottom surface of the heat pipe base 21 and is closest to the heat of the chip 41, so that heat conduction is efficiently and quickly realized. The heat pipe base 21 contacts the upper end surface of the chip 41, and conducts heat to one end of the heat dissipation fin set 11 rapidly through the inner heat pipe 231 in the middle and the outer heat pipe 232 at the periphery, respectively. In addition, the outer heat pipe 232 connects the heat pipe base 21 and the heat dissipating fin set 11, and also plays a role in connecting and supporting the whole device.

The inner heat pipe 231 and the outer heat pipe 232 are both filled with liquid heat-conducting medium. The liquid heat-conducting medium is used, the heat-conducting speed is high, the power of the heat-radiating element 13 is high, the temperature of the whole set of heat pipe radiator is uniform from bottom to top, and the heat-radiating efficiency of the heat-radiating fins 112 is improved. The liquid heat-conducting medium belongs to the conventional arrangement in the technical field, and is not described in detail.

The above description is only for the preferred embodiment of the present invention and should not be construed as limiting the scope of the present invention, and any modification, equivalent replacement or improvement within the spirit of the present invention is encompassed by the claims of the present invention.

Claims

1. A radiator with multi-surface radiating pipes is characterized in that: the radiator with multiaspect cooling tube includes a radiator unit, and a setting is in the heat-conducting component of radiator unit bottom, radiator unit includes a radiating fin group, and at least one runs through radiating cavity in the radiating fin group, and a setting is in the radiating element of radiating fin group one side, heat-conducting component includes that a setting is in the heat pipe base of radiating fin group bottom, at least two run through the installation cavity of heat pipe base and radiating fin group in proper order, and at least one is fixed just correspond respectively and wear to establish in the heat pipe base heat conduction structure in the installation cavity.

2. The radiator with the multi-sided radiating tube as set forth in claim 1, wherein: the radiating fin group comprises a radiating bearing support piece arranged at the upper end of the heat pipe base and at least two radiating fins which are sequentially stacked on the radiating bearing support piece along the penetrating direction of the radiating cavity.

3. The radiator with the multi-sided radiating tube as set forth in claim 1, wherein: the radiating element is connected with the radiating fin group through a limiting welding structure.

4. The radiator with the faceted heat pipe as claimed in claim 3, wherein: the limiting welding structure comprises a fixing support plate arranged on one side of the radiating fin group, two strip-shaped embedded grooves arranged at intervals and close to one side of the fixing support plate are arranged on the radiating fin group, two positioning convex parts correspondingly embedded into the strip-shaped embedded grooves are arranged on the fixing support plate, and the positioning convex parts and the strip-shaped embedded grooves are welded and fixed.

5. The radiator with the multi-sided radiating tubes as recited in claim 4 wherein: the fixing carrier plate is provided with a yielding hole, and the radiating element is arranged on one side of the fixing carrier plate, which is far away from the radiating fin group.

6. The radiator with the multi-sided radiating tube as set forth in claim 1, wherein: the heat conduction structure comprises at least one inner heat pipe arranged in the mounting cavity in the middle of the radiating fin group in a penetrating mode and at least three outer heat pipes arranged in the mounting cavity in the circumferential direction of the inner heat pipe in a penetrating mode.

7. The radiator with the faceted heat pipe as claimed in claim 6, wherein: the length of the inner heat pipe is greater than that of the outer heat pipe.

8. The radiator with the faceted heat pipe as claimed in claim 6, wherein: and liquid heat-conducting media are filled in the inner heat pipe and the outer heat pipe.

9. The radiator with the multi-sided radiating tube as set forth in claim 1, wherein: the radiator of the multi-surface radiating pipe also comprises a test socket arranged below the heat pipe base and a chip arranged at the upper end of the test socket, and the upper end of the chip is directly contacted with the inner heat pipe.