CN217008074U - Fingerprint identification module and electronic equipment - Google Patents
Fingerprint identification module and electronic equipment Download PDFInfo
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- CN217008074U CN217008074U CN202090000556.XU CN202090000556U CN217008074U CN 217008074 U CN217008074 U CN 217008074U CN 202090000556 U CN202090000556 U CN 202090000556U CN 217008074 U CN217008074 U CN 217008074U
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1662—Details related to the integrated keyboard
- G06F1/1671—Special purpose buttons or auxiliary keyboards, e.g. retractable mini keypads, keypads or buttons that remain accessible at closed laptop
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
- H04M1/236—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof including keys on side or rear faces
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M2250/00—Details of telephonic subscriber devices
- H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Image Input (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application provides a fingerprint identification module and an electronic equipment to improve the performance and the structural reliability of fingerprint identification module. Fingerprint identification module, including flexible circuit board, base plate, fingerprint identification chip and filling glue film, wherein: the flexible circuit board and the substrate are arranged in a stacked mode and comprise a first end and a second end which are opposite in position, at least one of the first end and the second end exceeds the substrate, and a wire outlet area is formed in one end, close to the end exceeding the substrate, of the flexible circuit board; the first surface of the substrate, which is arranged towards the flexible circuit board, comprises a first area and a second area, the first area is provided with a wire and a welding disc used for being electrically connected with the flexible circuit board, and the second area is opposite to the wire outlet area and is provided with a slot; the fingerprint identification chip is arranged on the second surface of the substrate, which is opposite to the flexible circuit board; the filling adhesive layer is filled between the flexible circuit board and the substrate and used for wrapping the bonding pad.
Description
The present application claims the priority of the chinese patent application filed on 20/5/2019 under the name of 201910417832.6 by the chinese intellectual property office, and the priority of the chinese patent application entitled "a fingerprint recognition module and an electronic device", the entire contents of which are incorporated herein by reference.
Technical Field
The application relates to the technical field of electronic equipment, in particular to a fingerprint identification module and electronic equipment.
Background
Along with the continuous promotion of the comprehensive screen design of cell-phone, the dorsal part or the week side of cell-phone are shifted to by the screen place side of cell-phone gradually in the fingerprint identification district of cell-phone, like this, just need set up the mounting groove in order to hold the fingerprint identification module at the backshell of cell-phone or center. The fingerprint identification module generally includes flexible circuit board, the base plate, fingerprint identification chip and packing glue film, wherein, flexible circuit board and the range upon range of setting of base plate, the base plate is provided with a plurality of pads that are used for being connected with the flexible circuit board electricity towards the first surface of flexible circuit board, the fingerprint identification chip sets up in the base plate flexible circuit board's of the back second surface and forms integrative packaging structure with the base plate, the packing glue film is filled between the first surface of flexible circuit board and base plate and is used for wrapping up the pad.
When setting up the fingerprint identification district in the week side of cell-phone, because the size restriction in cell-phone thickness direction often makes the flexible circuit board not surpass the base plate along first direction during the design, this first direction is the direction unanimous with the thickness direction of cell-phone when fingerprint identification module is installed in the mounting groove of center. By adopting the design, when the filling glue layer is formed, glue needs to be dispensed on the first surface of the substrate along the extending direction of the edge of the flexible circuit board, so that the glue is filled between the flexible circuit board and the substrate through the capillary action, when the dispensing amount is full, the glue can overflow to the side surface of the packaging structure formed by the substrate and the fingerprint identification chip, the whole size of the fingerprint identification module is increased, and the fingerprint identification module can interfere with the middle frame when being installed in the installation groove. For avoiding appearing above-mentioned problem, current fingerprint identification module point volume of gluing is general not enough, and the volume of gluing is not enough to lead to pad can not be sealed well all around, under the user's finger and the usage that fingerprint identification module high frequency contacted, sweat on the finger invades easily between flexible circuit board and the base plate and causes the corruption to the pad, influences the performance of fingerprint identification module.
Disclosure of Invention
The application provides a fingerprint identification module and an electronic equipment for improve the performance and the structural reliability of fingerprint identification module.
In a first aspect, the present application provides a fingerprint identification module, which includes a flexible circuit board, a substrate and a fingerprint identification chip, wherein the flexible circuit board and the substrate are stacked, and include a first end and a second end opposite to each other in position, when forming a wire outgoing area of the flexible circuit board, the wire outgoing area can be set in an area close to the first end, or in an area close to the second end, or in both the area close to the first end and the area close to the second end, and when specifically setting, one end of the flexible circuit board, at which the wire outgoing area is provided, should exceed the substrate, so as to be electrically connected with a motherboard of an electronic device; the substrate comprises a first surface and a second surface, the first surface is arranged towards the flexible circuit board, the second surface is arranged opposite to the flexible circuit board, the first surface of the substrate comprises a first area and a second area, a bonding pad and a wire are formed in the first area, the substrate can be electrically connected with the flexible circuit board through the bonding pad, the second area is opposite to a wire outlet area of the flexible circuit board, and a slot is formed in the second area; the fingerprint identification chip is arranged on the second surface of the substrate and can be electrically connected with the substrate; in order to strengthen the structural reliability of the fingerprint identification module, the fingerprint identification module further comprises a filling adhesive layer filled between the flexible circuit board and the first surface of the substrate, and when the filling adhesive layer is formed, the bonding pad is completely wrapped and sealed by glue through dispensing on the substrate.
The fingerprint identification module that this application embodiment provided sets up the fluting through the second area of avoiding walking line and pad on the base plate, can suitably increase the dispensing volume when forming the packing glue film, guarantees that the pad can be sealed well, can make abundant glue overflow to this fluting in simultaneously to can not exert an influence to the overall dimension of fingerprint identification module, can improve the performance and the structural reliability of fingerprint identification module.
When a slot is provided, the slot can have a variety of configurations. In a specific embodiment, the substrate further comprises a sidewall connected between the first surface and the second surface, and the slot may extend directly to the sidewall, which may make the slot difficult.
In another specific embodiment, the slot may be a closed slot that does not extend to the side wall of the substrate, and in this case, the cross section of the slot may be circular, semicircular, or polygonal.
When the grooved volume is set, the error existing in the dispensing process should be taken into account, and in the embodiment of the application, the error can be taken into accountThe volume of the groove is not less than 0.1mm3。
In order to ensure the strength of the substrate, in a specific embodiment, the thickness of the area of the substrate corresponding to the groove is not less than 0.1 mm.
In a specific embodiment, one side of the flexible circuit board, which is far away from the substrate, is also provided with a reinforcing plate so as to improve the strength of the flexible circuit board and further improve the structural reliability of the fingerprint identification module.
In a specific embodiment, the fingerprint identification module still includes the plastic envelope layer, and this plastic envelope layer sets up in the one side that the fingerprint identification chip deviates from the base plate for the embedding protects the fingerprint identification chip.
In this embodiment, the substrate, the fingerprint identification chip, and the plastic package layer may be an integrated package structure packaged by a grid array package technology.
In a second aspect, the present application further provides an electronic device, the electronic device includes a housing and a fingerprint identification module in any possible implementation scheme in the first aspect, and the fingerprint identification module is disposed in a mounting groove formed in the housing, so that the electronic device can realize multiple functions of screen unlocking, quick payment, file encryption and the like based on the fingerprint identification module. Use electronic equipment as the cell-phone for the example, set up when the mounting groove in the center of cell-phone casing, the width of the flexible circuit board at the fingerprint identification module is less than under the prerequisite of the width of its base plate, still can guarantee to seal the pad well to because the size precision of fingerprint identification module is higher, consequently can assemble smoothly into in the mounting groove.
In a third aspect, the present application further provides a method for manufacturing the fingerprint identification module in any of the embodiments of the first aspect, where the method includes the following steps: forming a first area provided with a trace and a pad and a second area avoiding the trace and the pad on the first surface of the substrate; arranging a fingerprint identification chip on a second surface opposite to the first surface on the substrate; arranging a slot in a second area of the first surface, forming a wire outlet area in an area, close to the first end and/or the second end, of the flexible circuit board, then overlapping the flexible circuit board on the first surface of the substrate and enabling the flexible circuit board to be electrically connected with the substrate through a pad, and enabling the wire outlet area of the flexible circuit board to be opposite to the slot in position during arrangement, wherein one end, provided with the wire outlet area, of the flexible circuit board is arranged to exceed the substrate; a filling adhesive layer is formed between the flexible circuit board and the first surface of the substrate through adhesive dispensing, and the bonding pad is wrapped and sealed by the filling adhesive layer.
The fingerprint identification module manufactured by the method can properly increase the dispensing amount when the filling glue layer is formed, ensures that the bonding pad can be well sealed, and simultaneously can enable surplus glue to overflow into the groove, so that the appearance size of the fingerprint identification module cannot be influenced, and the performance and the structural reliability of the fingerprint identification module can be improved.
In a specific embodiment, the method further comprises the step of forming a reinforcing plate on the side of the flexible circuit board, which faces away from the substrate, so as to improve the strength of the flexible circuit board, and further improve the structural reliability of the fingerprint identification module.
In a specific embodiment, the method further comprises forming a plastic packaging layer on the side of the fingerprint identification chip, which faces away from the substrate, and the plastic packaging layer can be used for embedding the fingerprint identification chip.
Drawings
FIG. 1 is a top view of a partial structure of a fingerprint identification module forming a filling adhesive layer in the prior art;
FIG. 2 is a schematic structural diagram of a fingerprint identification module forming a filling adhesive layer in the prior art;
FIG. 3 is a side view of a prior art fingerprint recognition module;
FIG. 4 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the present disclosure;
FIG. 5 is a side view of a portion of the fingerprint identification module according to an embodiment of the present disclosure when no underfill layer is formed;
FIG. 6 is a schematic view of a first surface of a substrate according to an embodiment of the present disclosure;
FIG. 7 is a top view of a portion of a fingerprint identification module according to an embodiment of the present disclosure when forming a filling adhesive layer;
FIG. 8 is a side view of a portion of the fingerprint identification module after forming a filling adhesive layer according to an embodiment of the present disclosure;
FIG. 9 is a side view of a portion of a fingerprint identification module according to another embodiment of the present application after forming a filling adhesive layer;
FIG. 10 is a schematic view of a first surface of a substrate according to another embodiment of the present application;
FIG. 11 is a schematic view of a structure of a first surface of a substrate according to yet another embodiment of the present application;
FIG. 12 is a schematic view of a structure of a first surface of a substrate according to yet another embodiment of the present application;
fig. 13 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 14 is an enlarged view of the embodiment shown in fig. 13 at a.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, the present application will be further described in detail with reference to the accompanying drawings.
At present, with the wide application of the fingerprint identification technology in the field of electronic equipment, the functions of screen unlocking, quick payment, file encryption and the like of various electronic equipment can be realized based on the technology, and the use experience of a user is greatly improved. The mobile phone is taken as an example, when the mobile phone is specifically arranged, a fingerprint identification area is usually arranged on the side of the screen of the mobile phone, and a mounting groove is formed in the position, corresponding to the fingerprint identification area, of the front cover of the mobile phone, so that the fingerprint identification module for realizing the functions is accommodated. And along with the appearance of the full screen cell-phone, the fingerprint identification district shifts to the dorsal part or the week side of cell-phone by the screen place side of cell-phone gradually, then needs set up the mounting groove at the backshell of cell-phone or center and hold the fingerprint identification module at this moment. When the fingerprint identification district set up in the week side of cell-phone, still can make the fingerprint identification module realize the function of power key simultaneously, can realize the fingerprint identification function under the prerequisite that does not increase cell-phone casing fluting quantity to can promote the outward appearance quality of cell-phone. When the scheme is adopted, referring to fig. 1, due to the size limitation in the thickness direction of the mobile phone, the flexible circuit board 01 of the fingerprint identification module usually does not exceed the substrate 02 in the direction a during the design, so as to reduce the volume of the mounting groove arranged on the middle frame as much as possible and improve the strength of the mobile phone, and thus, when the filling adhesive layer 03 is formed, glue needs to be dispensed on the edge of the flexible circuit board 01 along the direction B on the substrate 02, so that the glue is filled between the flexible circuit board 01 and the substrate 02 through the capillary action. As shown in fig. 2, if the dispensing amount is too full, the glue may overflow to the sidewall of the substrate 02 along the extending direction of the outlet end of the flexible circuit board 01, resulting in an increase in the overall size of the fingerprint identification module, and when the fingerprint identification module is mounted, there is a risk of interference with the middle frame, and when the dispensing amount is insufficient, there is a problem that the periphery of the pad 04 shown in fig. 3 cannot be sealed well, and the pad is easily corroded by the invading sweat or water vapor during use, which affects the performance of the fingerprint identification module. Based on this, this application embodiment provides a fingerprint identification module, and this fingerprint identification module can also avoid leading to the overall dimension of fingerprint identification module to change because the glue overflow under can realizing good sealed prerequisite to the pad to can improve the performance and the structural reliability of fingerprint identification module.
The fingerprint identification module that this application embodiment provided can be applied to among the electronic equipment, utilizes its fingerprint identification technique can make electronic equipment realize multiple functions such as screen unblock, swift payment and file encryption, and this electronic equipment can be for common terminals such as cell-phone or panel computer among the prior art. Referring to fig. 4 and fig. 5, the fingerprint identification module provided in the embodiment of the present application includes a chip package structure 100 and a flexible circuit board 10, and when specifically configured, the chip package structure 100 may be a structure packaged by LGA (Land Grid Array) technology, and includes a substrate 20 and a fingerprint identification chip 30, where the substrate 20 includes a first surface 21 and a second surface 22, the first surface 21 of the substrate 20 is disposed toward the flexible circuit board 10, the second surface 22 is disposed opposite to the flexible circuit board 10, and the fingerprint identification chip 30 is fixed to the second surface 22 thereof, and the specific fixing manner may be adhered by an adhesive 40. When the fingerprint recognition chip 30 is electrically connected to the substrate 20, the first pins 31 are provided on the fingerprint recognition chip 30, the second pins 23 are provided on the second surface 22 in the region that avoids the fingerprint recognition chip 30, and the first pins 31 and the second pins 23 may be connected by the metal wires 50. With continued reference to fig. 4, the chip package structure 100 further includes a molding layer 60 disposed on a side of the fingerprint identification chip 30 away from the substrate 20, where the molding layer 60 is used to cover the fingerprint identification chip 30 and the metal lines 50, and at least cover an area of the second surface 22 where the second pins 23 are disposed, so as to reduce the risk of damaging these devices.
Referring to fig. 4, 5 and 6, the flexible circuit board 10 is located at a side close to the first surface 21 of the substrate 20, the outlet region 12 of the flexible circuit board 10 is formed at a region close to the first end 11 thereof, and in order to facilitate electrical connection between the flexible circuit board 10 and a main board of an electronic device, the first end 11 of the flexible circuit board 10 should extend beyond the substrate 20; when the flexible circuit board 10 is electrically connected to the chip package structure 100, the first region 24 of the first surface 21 of the substrate 20 is provided with traces and pads 25, and correspondingly, the positions of the pads 25 on the flexible circuit board 10 corresponding to the first region 24 are also provided with connection pins, so that the flexible circuit board 10 and the chip package structure can be welded and fixed by applying tin paste on the pads 25, and meanwhile, the two can be electrically connected to form mutual communication, so that the electrical signals collected by the chip package structure 100 can be transmitted to the flexible circuit board 10, and further transmitted to a main board of an electronic device by the flexible circuit board 10 for processing.
It is understood that in other embodiments of the present application, the wire outlet region 12 may also be formed at the second end 13 of the flexible circuit board 10, where the second end 13 is the end of the flexible circuit board 10 opposite to the first end 11, as shown in fig. 9, and the second end 13 of the flexible circuit board 10 is also disposed beyond the substrate 20 to facilitate electrical connection with the motherboard of the electronic device.
Further, referring to fig. 4, a side of the flexible circuit board 10 facing away from the substrate 20 is further provided with a reinforcing plate 70. Due to the flexible characteristic of the flexible circuit board 10, the flexible circuit board is easily damaged when being stressed, and the strength of the flexible circuit board 10 can be improved by the arrangement of the reinforcing plate 70, so that the flexible circuit board 10 can reliably transmit signals between the chip packaging structure 100 and a main board of an electronic device.
Need explain, the fingerprint identification module of this application embodiment specifically can discern user's fingerprint based on current capacitanc fingerprint identification technique, at this moment, the integration has capacitanc fingerprint sensor in the fingerprint identification chip 30, when the user pressed the plastic envelope layer 60 that sets up on the fingerprint identification chip 30, inside capacitanc fingerprint sensor can form different tolerance according to user's fingerprint's valley and ridge, the poor detectable fingerprint information who obtains user through these different capacitances, the fingerprint information that detects further can transmit to electronic equipment's mainboard through flexible circuit board 10, the mainboard is through comparing the fingerprint information that detects and the fingerprint information that saves and carry out operation on next step, specific process here is no longer repeated.
In order to strengthen the structural reliability of the fingerprint identification module, reduce the risk that the tin is cracked because the base plate 20 deforms and produces stress, the fingerprint identification module further comprises a filling adhesive layer 80 filled between the flexible circuit board 10 and the first surface 21 of the base plate 20, when the filling adhesive layer 80 is formed, the requirement that the filling adhesive layer 80 can extend to the side surface of the chip packaging structure 100 can be met when the bonding pad 25 is well sealed, and the size precision of the fingerprint identification module is improved.
In specific implementation, referring to fig. 5 and fig. 6, the first surface 21 of the substrate 20 further includes a second region 26 avoiding the traces and the bonding pads 25, the second region 26 is disposed near an edge of one side of the first surface 21 and is opposite to the position of the wire-out region 12 of the flexible circuit board 10, a slot 27 is disposed in the second region 26, and the slot 27 can be used as an overflow groove for glue when the glue filling layer 80 is formed. Specifically, after the flexible circuit board 10 and the substrate 20 are soldered and fixed, as shown in fig. 7, since the width of the substrate 20 (i.e. the dimension of the substrate 20 in the direction a in fig. 7) is greater than the width of the flexible circuit board 10 (i.e. the dimension of the flexible circuit board 10 in the direction a in fig. 7), glue needs to be dispensed on the substrate 20 and dispensed on the edge of the flexible circuit board 10 along the direction B, so that the glue is filled between the flexible circuit board 10 and the substrate 20 by capillary action, at this time, in order to better seal the periphery of the pad 25, the dispensing amount can be properly increased, after the pad 25 is completely wrapped, if there is a surplus of glue, the surplus glue will overflow into the slot 27 along the extending direction of the flexible circuit board 10, as shown in fig. 8, so that the glue can be prevented from directly flowing from the first surface 21 of the substrate 20 to the side of the chip packaging structure, thereby make the packing glue film 80 who forms by the restriction between flexible circuit board 10 and base plate 20, make the size precision of fingerprint identification module obtain guaranteeing, and then the risk that fingerprint identification module and electronic equipment's casing interfere when can reducing the installation.
When the flexible circuit board 10 is also formed with the outlet regions 12 in the regions near the second ends 13 thereof, as shown in fig. 9, the first surface 21 of the substrate 20 should have two second regions 26 opposite to the respective outlet regions 12 at the two ends, and at this time, the two second regions 26 should be respectively provided with the slots 27 to accommodate the overflowing glue when forming the filling glue layer 80.
It should be noted that the margin of the glue can be controlled by the dispensing device, and since the dispensing device will have an error during dispensing, the dispensing error needs to be taken into account when setting the volume of the slot 27, in the embodiment of the present application, the volume of the slot 27 can be designed to be not less than 0.1mm3. According to experimental verification, after the glue dispensing is finished, the margin of glue after the bonding pad 25 is wrapped and sealed can be accurately controlled to be 0.1mm3Inner, therefore, when the volume of the slit 27 is not less than 0.1mm3In time, the surplus glue can be completely accommodated. In addition, in order to secure the strength of the substrate 20, the thickness H of the region of the substrate 20 corresponding to the open groove 27 may be not less than 0.1mm when designed.
In the above embodiment, the specific shape of the slot 27 is not limited, and in a specific embodiment, the base plate 20 further includes a sidewall 28 connected between the first surface 21 and the second surface 22, and the slot 27 may be extended to the sidewall 28 when designed, for example, in the embodiment shown in fig. 5 and 6, the base plate 20 has a track-shaped cross section, the second area 26 is located at one end of the track-shaped base plate 20, and the slot 27 may be extended to the arc-shaped sidewall of the base plate 20. Of course, in other embodiments of the present application, the slot 27 may be designed to be closed, that is, the slot 27 does not need to extend to the side wall of the substrate 20, and the cross section of the slot 27 may be designed to be circular as shown in fig. 10, or semicircular as shown in fig. 11, or polygonal as shown in fig. 12.
To sum up, the fingerprint identification module that this application embodiment provided sets up the fluting through the second area that avoids walking line and pad on the base plate, can suitably increase the point volume of gluing when forming the packing glue film, guarantees that the pad can be sealed well, can make abundant glue overflow to this fluting in simultaneously to can not exert an influence to the overall dimension of fingerprint identification module, can improve the performance and the structural reliability of fingerprint identification module.
In addition, an embodiment of the present application further provides a method for manufacturing the fingerprint identification module provided in the foregoing embodiment, taking the embodiment shown in fig. 4 to 8 as an example, the method may include the following steps:
the method comprises the following steps: forming a first area 24 provided with traces and pads 25 and a second area 26 avoiding the traces and pads 25 on the first surface 21 of the substrate 20;
step two: arranging the fingerprint identification chip 30 on the second surface 22 opposite to the first surface 21 on the substrate 20, and electrically connecting the first pins 31 on the fingerprint identification chip 30 with the second pins 23 on the second surface 22 through the metal wires 50;
step three: forming a plastic package layer 60 on a side of the fingerprint identification chip 30 away from the substrate 20, wherein the plastic package layer 60 can be used for covering the fingerprint identification chip 30 and the metal wire 50, and at least covering the area on the second surface 22 where the second pins 23 are arranged, so as to reduce the risk of damaging the devices;
step four: providing a trench 27 in the second region 26 of the first surface 21, wherein the trench 27 can serve as an overflow trough when the filling glue layer 80 is formed later;
step five: forming a wire outlet area 12 on the flexible circuit board 10 in an area close to the first end 11 thereof, then superposing the flexible circuit board 10 on the first surface 21 of the substrate 20, and making the first end 11 of the flexible circuit board 10 exceed the substrate 20 and making the wire outlet area 12 of the flexible circuit board 10 opposite to the notch 27;
step six: the adhesive filling layer 80 is formed between the flexible circuit board 10 and the first surface 21 of the substrate 20 by a dispensing process, and during a specific operation, dispensing is performed on the first surface 21 of the substrate 20 along the direction B at the edge of the flexible circuit board 10, so that glue fills between the flexible circuit board 10 and the substrate 20 by capillary action, and at this time, in order to better seal the periphery of the pad 25, the amount of glue dispensing can be increased appropriately, after the pads 25 are completely wrapped, if there is a margin of glue, this excess glue will overflow into the slot 27 in the direction of extension of the flexible circuit board 10, this prevents glue from flowing directly from the first surface 21 of the substrate 20 to the side of the chip package structure, therefore, the formed filling adhesive layer 80 is limited between the flexible circuit board 10 and the substrate 20, the dimensional accuracy of the fingerprint identification module is ensured, and the risk of interference between the fingerprint identification module and the shell of the electronic equipment during installation can be reduced;
step seven: form stiffening plate 70 at the one side that flexible circuit board 10 deviates from base plate 20 to improve flexible circuit board 10's intensity, further can improve the structural reliability of fingerprint identification module.
It should be understood that, in the above specific steps, the outlet region of the flexible circuit board is formed in the area near the first end of the flexible circuit board as an example, in other implementation manners, the outlet region may also be formed near the second end of the flexible circuit board, and at this time, the structure of the second surface of the substrate needs to be changed accordingly, and details are not described here.
The fingerprint identification module manufactured by the method can ensure that the bonding pad can be well sealed, and meanwhile, redundant glue can overflow into the groove, so that the appearance size of the fingerprint identification module cannot be influenced, and the performance and the structural reliability of the fingerprint identification module can be improved.
As shown in fig. 13, an embodiment of the present application further provides an electronic device 200, where the electronic device 200 may be a mobile phone or a tablet computer and other common terminals in the prior art, and include a housing 210 and the fingerprint identification module of any of the above embodiments, when specifically setting up, a mounting groove 220 is formed in the housing 210, and the fingerprint identification module is disposed in the mounting groove 220, so that the electronic device 200 can realize multiple functions such as screen unlocking, fast payment and file encryption based on the fingerprint identification module. Taking the electronic device 200 as an example of a mobile phone, referring to fig. 14 together, when the mounting groove 220 is disposed in the middle frame of the mobile phone housing, the fingerprint identification module can also implement the function of a power key, specifically, a metal spring 230 is further disposed on one side of the stiffener 70 departing from the flexible circuit board 10 to connect the circuit board 240 with the main board of the mobile phone, and thus, the fingerprint identification module can implement different functions in different application scenarios. For example, when a user needs to unlock the screen, the fingerprint identification module acquires fingerprint information of the user by touching the fingerprint identification module with a finger, and then transmits the fingerprint information to a main board of the mobile phone through the flexible circuit board 10, and the main board compares the fingerprint information with the stored fingerprint information and unlocks the screen when the comparison result is consistent; when the user needs to turn on/off the mobile phone, the user can press the fingerprint identification module by a finger, so that the metal elastic sheet 230 contacts the circuit board 240 and triggers the key switch on the circuit board 240, then the circuit board 240 transmits an on/off signal to a mainboard of the mobile phone, and the mainboard controls the mobile phone to turn on or turn off the mobile phone according to the received on/off signal.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a fingerprint identification module, its characterized in that includes flexible circuit board, base plate, fingerprint identification chip and packing glue film, wherein:
the flexible circuit board and the substrate are arranged in a stacked mode and comprise a first end and a second end which are opposite in position, at least one of the first end and the second end exceeds the substrate, and a wire outlet area is formed in one end, close to the end exceeding the substrate, of the flexible circuit board;
the first surface of the substrate, which is arranged towards the flexible circuit board, comprises a first area and a second area, the first area is provided with a wire and a welding disc used for being electrically connected with the flexible circuit board, and the second area is opposite to the wire outlet area and is provided with a slot;
the fingerprint identification chip is arranged on a second surface of the substrate, which is back to the flexible circuit board;
the filling adhesive layer is filled between the flexible circuit board and the substrate and used for wrapping the welding disc.
2. The fingerprint identification module of claim 1, wherein the base plate further comprises a sidewall connected between the first surface and the second surface, the slot extending to the sidewall.
3. The fingerprint identification module of claim 1, wherein the cross-section of the groove is circular, semicircular, or polygonal.
4. The fingerprint identification module of claim 1 wherein the volume of the slot is not less than 0.1mm3。
5. The fingerprint identification module of claim 1, wherein a thickness of a region of the substrate corresponding to the slot is not less than 0.1 mm.
6. The fingerprint identification module of claim 1, further comprising a stiffener disposed on a side of the flexible circuit board facing away from the substrate.
7. The fingerprint identification module of any one of claims 1 to 6, further comprising a molding layer disposed on a side of the fingerprint identification chip facing away from the substrate, the molding layer being configured to embed the fingerprint identification chip.
8. The fingerprint identification module of claim 7, wherein the substrate, the fingerprint identification chip, and the molding layer are packaged in a grid array as a single package.
9. An electronic device, comprising a housing and the fingerprint recognition module according to any one of claims 1 to 8, wherein the housing defines a mounting slot, and the fingerprint recognition module is disposed in the mounting slot.
10. The electronic device of claim 9, wherein the electronic device is a mobile phone, and the mounting slot is disposed on a middle frame of the housing.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019104178326 | 2019-05-20 | ||
| CN201910417832.6A CN110320972B (en) | 2019-05-20 | 2019-05-20 | Fingerprint identification module and electronic equipment |
| PCT/CN2020/091019 WO2020233562A1 (en) | 2019-05-20 | 2020-05-19 | Fingerprint recognition module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217008074U true CN217008074U (en) | 2022-07-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910417832.6A Active CN110320972B (en) | 2019-05-20 | 2019-05-20 | Fingerprint identification module and electronic equipment |
| CN202090000556.XU Active CN217008074U (en) | 2019-05-20 | 2020-05-19 | Fingerprint identification module and electronic equipment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910417832.6A Active CN110320972B (en) | 2019-05-20 | 2019-05-20 | Fingerprint identification module and electronic equipment |
Country Status (3)
| Country | Link |
|---|---|
| CN (2) | CN110320972B (en) |
| DE (1) | DE202020005712U1 (en) |
| WO (1) | WO2020233562A1 (en) |
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|---|---|---|---|---|
| CN110320972B (en) * | 2019-05-20 | 2022-05-06 | 荣耀终端有限公司 | Fingerprint identification module and electronic equipment |
| CN113015324B (en) * | 2019-12-19 | 2023-05-09 | 华为技术有限公司 | Circuit board assembly, electronic device and method for processing circuit board assembly |
| CN112257602B (en) * | 2020-06-12 | 2024-04-26 | 深圳市汇顶科技股份有限公司 | Ultrasonic sensor, fingerprint identification module and electronic equipment |
| CN112186013B (en) * | 2020-09-25 | 2023-04-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN112560628B (en) * | 2020-12-07 | 2024-04-12 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
| CN112817481B (en) * | 2021-01-28 | 2024-03-22 | 京东方科技集团股份有限公司 | Touch display panel and touch display device |
| CN113065390A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Narrow strip-shaped fingerprint chip, side-edge type fingerprint chip module and electronic equipment |
| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
| CN113038698B (en) * | 2021-03-08 | 2022-09-09 | 京东方科技集团股份有限公司 | Flexible circuit board, display panel, preparation method and display device |
| CN113556639B (en) * | 2021-06-29 | 2023-07-28 | 荣成歌尔微电子有限公司 | SIP module and TWS earphone |
| CN113543517A (en) * | 2021-06-30 | 2021-10-22 | 青岛歌尔智能传感器有限公司 | Connection method of SIP module and FPC and electronic product |
| CN114241533B (en) * | 2021-12-22 | 2023-05-16 | 赣州深奥科技有限公司 | Waterproof fingerprint module structure |
| CN118072615A (en) * | 2022-08-02 | 2024-05-24 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel, bonding method and display device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI536528B (en) * | 2013-06-17 | 2016-06-01 | 茂丞科技股份有限公司 | Ultra-thin sensing device with flat contact surface |
| CN104932763B (en) * | 2015-04-17 | 2018-06-01 | 汕头超声显示器技术有限公司 | A kind of capacitance touch screen and its fingerprint detection method with fingerprint identification function |
| CN204539680U (en) * | 2015-04-22 | 2015-08-05 | 南昌欧菲生物识别技术有限公司 | Adhesive-spill-preventing frame and electronic installation thereof |
| CN106061113A (en) * | 2016-06-20 | 2016-10-26 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and flexible circuit board thereof |
| CN107735798B (en) * | 2017-05-05 | 2021-08-10 | 深圳市汇顶科技股份有限公司 | Fingerprint module and mobile terminal |
| CN107275239B (en) * | 2017-06-29 | 2020-03-06 | 华进半导体封装先导技术研发中心有限公司 | Fingerprint identification chip packaging method and packaging structure |
| CN109299637A (en) * | 2017-07-25 | 2019-02-01 | 南昌欧菲生物识别技术有限公司 | Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group |
| CN109117728A (en) * | 2018-07-11 | 2019-01-01 | 维沃移动通信有限公司 | A kind of fingerprint recognition mould group and mobile terminal |
| CN110320972B (en) * | 2019-05-20 | 2022-05-06 | 荣耀终端有限公司 | Fingerprint identification module and electronic equipment |
-
2019
- 2019-05-20 CN CN201910417832.6A patent/CN110320972B/en active Active
-
2020
- 2020-05-19 CN CN202090000556.XU patent/CN217008074U/en active Active
- 2020-05-19 DE DE202020005712.6U patent/DE202020005712U1/en active Active
- 2020-05-19 WO PCT/CN2020/091019 patent/WO2020233562A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN110320972B (en) | 2022-05-06 |
| WO2020233562A1 (en) | 2020-11-26 |
| CN110320972A (en) | 2019-10-11 |
| DE202020005712U1 (en) | 2022-02-24 |
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