CN204539680U - Adhesive-spill-preventing frame and electronic installation thereof - Google Patents
Adhesive-spill-preventing frame and electronic installation thereof Download PDFInfo
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- CN204539680U CN204539680U CN201520247931.1U CN201520247931U CN204539680U CN 204539680 U CN204539680 U CN 204539680U CN 201520247931 U CN201520247931 U CN 201520247931U CN 204539680 U CN204539680 U CN 204539680U
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- wall
- spill
- adhesive
- preventing frame
- sealing groove
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Abstract
The utility model discloses adhesive-spill-preventing frame and electronic installation thereof, the utility model provides a kind of adhesive-spill-preventing frame, comprise: bearing wall, the madial wall of described bearing wall is provided with for increasing adhesion between chip packing-body and reduce glue overflow the first sealing groove.The utility model additionally provides a kind of electronic equipment, comprises described adhesive-spill-preventing frame, and the chip packing-body for matching with described adhesive-spill-preventing frame.The utility model adhesive-spill-preventing frame and electronic installation thereof can by the settings of the first sealing groove, and retaining more glue increases adhesion between chip packing-body and adhesive-spill-preventing frame with this, meanwhile, can also reduce the spilling of glue.
Description
Technical field
The utility model relates to fingerprint sensor technology field, particularly relates to adhesive-spill-preventing frame and electronic installation thereof.
Background technology
Under prior art for some chip packing-bodies when assembling with frame, especially as fingerprint sensor one series products, in order to ensure that fingerprint sensor can have larger information gathering face, general is all fingerprint sensing is directly vertically put into frame from the upper port of frame and bonds with the madial wall glue of frame, this kind of operating type, in actual production, owing to unnecessary glue after bonding effectively can not be adsorbed or drainage, often make glue overflow frame outside, and then cause the bad order of product; In addition due in sealing process, lack necessary storage glue space, thus can not effectively dam certain glue, to increase the adhesion between chip packing-body and frame.
Utility model content
The purpose of this utility model one is that providing a kind of can increase adhesion and the adhesive-spill-preventing frame of minimizing glue spilling.
The purpose of this utility model two is that providing a kind of can increase adhesion and the electronic installation of minimizing glue spilling.
For reaching this object, the utility model by the following technical solutions:
A kind of adhesive-spill-preventing frame, comprising:
Bearing wall, the madial wall of described bearing wall is provided with for increasing adhesion between chip packing-body and reduce glue overflow the first sealing groove.
Wherein, also comprise: be arranged on bottom described bearing wall for adsorbing the prolongation wall overflowing glue.
Wherein, described bearing wall comprises straight wall and is connected and intilted skew wall with described Zhi Bi lower end.
Wherein, described prolongation wall is connected with the lower end of described skew wall, and described prolongation wall and described straight wall be arranged in parallel.
Wherein, the L-shaped setting of cross section of described first sealing groove, and a sidewall of described first sealing groove and described straight wall be arranged in parallel.
Wherein, described first sealing groove is arranged at the madial wall of described skew wall.
Wherein, described chip packing-body is the fingerprint sensor being installed on adhesive-spill-preventing frame.
A kind of electronic installation, comprises the adhesive-spill-preventing frame described in above-mentioned any one, and the chip packing-body for matching with described adhesive-spill-preventing frame.
Wherein, the lateral wall of described chip packing-body is provided with the second sealing groove.
Wherein, described second sealing groove is arranged at the top of described first sealing groove, and the sidewall of described second sealing groove be arranged in parallel with the sidewall of the first corresponding sealing groove.
The beneficial effects of the utility model: the utility model provides a kind of adhesive-spill-preventing frame, comprising: bearing wall, the madial wall of described bearing wall is provided with for increasing adhesion between chip packing-body and reduce glue overflow the first sealing groove.The utility model additionally provides a kind of electronic equipment, comprises described adhesive-spill-preventing frame, and the chip packing-body for matching with described adhesive-spill-preventing frame.The utility model adhesive-spill-preventing frame and electronic installation thereof by the setting of the first sealing groove, can retain more glue to increase the adhesion between chip packing-body and adhesive-spill-preventing frame, meanwhile, can also reduce the spilling of glue.
Accompanying drawing explanation
Fig. 1 is a kind of exploded view of the electronic installation not with prolongation wall.
Fig. 2 is a kind of front view of the electronic installation not with prolongation wall.
Fig. 3 is the cutaway view in AA cross section in Fig. 2.
Fig. 4 is the partial enlarged drawing at B place in Fig. 3.
Fig. 5 is a kind of exploded view of the electronic installation with prolongation wall.
Fig. 6 is a kind of front view of the electronic installation with prolongation wall.
Fig. 7 is the cutaway view in CC cross section in Fig. 6.
Fig. 8 is the partial enlarged drawing at D place in Fig. 7.
In figure:
1. adhesive-spill-preventing frame, 10. bearing wall, 101. straight walls, 102. skew walls, 1021. first sealing grooves, 11. extend wall;
2. chip packing-body, 21. second sealing grooves.
Embodiment
The technical solution of the utility model is further illustrated by embodiment below in conjunction with accompanying drawing.
Embodiment 1
As shown in Figures 1 to 4, a kind of adhesive-spill-preventing frame, comprise bearing wall 10, the madial wall of bearing wall 10 is provided with for increasing adhesion between chip packing-body 2 and reduce glue overflow the first sealing groove 1021, the setting of the first sealing groove 1021, can effectively dam glue, increases the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, meanwhile, the effect of the spilling reducing glue can also be played.
Preferably, bearing wall 10 comprises straight wall 101 and is connected and intilted skew wall 102 with straight wall 101 lower end, and the madial wall of skew wall 102 offers the first sealing groove 1021, preferably, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, and the L-shaped setting of cross section of the first sealing groove 1021, and a sidewall of the first sealing groove 1021 and straight wall 101 be arranged in parallel.This structural design, can convenient glue along the madial wall of bearing wall 10 from the top down in flow process, effectively glue is dammed in the first sealing groove 1021, and then effectively can increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, effectively can slow down the speed that glue flows downward along skew wall 102, reduce glue and overflow.
Preferred further, the chip packing-body 2 in the utility model, for being installed on the fingerprint sensor of adhesive-spill-preventing frame 1, also can be other similar electronic device.
A kind of electronic installation, comprise adhesive-spill-preventing frame 1 described above, and the chip packing-body 2 for matching with adhesive-spill-preventing frame 1, preferably, the lateral wall of chip packing-body 2 is provided with the second sealing groove 21, second sealing groove is arranged at the top of the first sealing groove 1021, and the sidewall of the second sealing groove 21 be arranged in parallel with the sidewall of the first corresponding sealing groove 1021, preferred further, the madial wall of adhesive-spill-preventing frame 1 and the lateral wall matched in clearance of chip packing-body 2, first sealing groove 1021 and the second sealing groove 21 form square shape and hold glue space, and the diagonally opposing corner that the gap between the lateral wall of the madial wall of adhesive-spill-preventing frame 1 and chip packing-body 2 holds glue space from square shape passes.This structural design, fills when glue can be made to flow from the top down and holds glue space, and then increases chip packing-body 2 and the adhesion of adhesive-spill-preventing frame 1, decreases the speed of the glue flowed out in calm glue space simultaneously, and then can effectively reduce excessive glue.
Embodiment 2
As shown in Fig. 5 to Fig. 8, a kind of adhesive-spill-preventing frame, comprise bearing wall 10, the madial wall of bearing wall 10 be provided with for increasing adhesion between chip packing-body 2 and reduce the first sealing groove 1021 that glue overflows, also comprising being arranged on bottom described bearing wall 10 and overflow the prolongation wall 11 of glue for adsorbing.Extend the setting of wall 11, effectively the glue of spilling can be adsorbed onto on the madial wall of prolongation wall, thus play the effect effectively preventing glue from overflowing.
Preferably, bearing wall 10 comprises straight wall 101 and is connected and intilted skew wall 102 with straight wall 101 lower end, extend wall 11 to be connected with the lower end of described skew wall 102, and described prolongation wall 11 be arranged in parallel with described straight wall 101, preferably, the L-shaped setting of cross section of the first sealing groove 1021, and a sidewall of described first sealing groove 1021 and described straight wall 101 be arranged in parallel, first sealing groove 1021 is arranged at the middle part of the madial wall of skew wall 102, this structural design, can convenient glue along the madial wall of bearing wall 10 from the top down in flow process, effectively glue is dammed in the first sealing groove 1021, and then effectively can increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, effectively can slow down the speed that glue flows downward along skew wall 102, reduce glue to overflow, extend the setting of wall 11, the glue of spilling effectively can be adsorbed onto on the madial wall of prolongation wall 11, and then effectively prevent glue from overflowing, avoid the outward appearance affecting adhesive-spill-preventing frame.
Preferred further, the chip packing-body 2 in the utility model, for being installed on the fingerprint sensor of adhesive-spill-preventing frame 1, also can be other similar electronic device.
A kind of electronic installation, comprise adhesive-spill-preventing frame 1 described above, and the chip packing-body 2 for matching with adhesive-spill-preventing frame 1, preferably, the lateral wall of chip packing-body 2 is provided with the second sealing groove 21, second sealing groove is arranged at the top of the first sealing groove 1021, and the sidewall of the second sealing groove 21 be arranged in parallel with the sidewall of the first corresponding sealing groove 1021, preferred further, the madial wall of adhesive-spill-preventing frame 1 and the lateral wall matched in clearance of chip packing-body 2, first sealing groove 1021 and the second sealing groove 21 form square shape and hold glue space, and the diagonally opposing corner that the gap between the lateral wall of the madial wall of adhesive-spill-preventing frame 1 and chip packing-body 2 holds glue space from square shape passes.This structural design, fill when glue can be made to flow from the top down and hold glue space, and then increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, decrease the speed of the glue flowed out in calm glue space simultaneously, and then can effectively reduce excessive glue, simultaneously, owing to extending the setting of wall 11, effectively the glue of spilling can be adsorbed onto on the madial wall of prolongation wall, and then effectively prevent glue from overflowing, affect the outward appearance of electronic installation.
Below know-why of the present utility model is described in conjunction with specific embodiments.These describe just in order to explain principle of the present utility model, and can not be interpreted as the restriction to the utility model protection range by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present utility model, and these modes all will fall within protection range of the present utility model.
Claims (10)
1. an adhesive-spill-preventing frame, is characterized in that, comprising:
Bearing wall (10), the madial wall of described bearing wall (10) is provided with for increasing adhesion between chip packing-body (2) and reduce glue overflow the first sealing groove (1021).
2. a kind of adhesive-spill-preventing frame according to claim 1, is characterized in that, also comprise: be arranged on described bearing wall (10) bottom for adsorbing the prolongation wall (11) overflowing glue.
3. a kind of adhesive-spill-preventing frame according to claim 2, it is characterized in that, described bearing wall (10) comprises straight wall (101) and is connected and intilted skew wall (102) with described straight wall (101) lower end.
4. a kind of adhesive-spill-preventing frame according to claim 3, it is characterized in that, described prolongation wall (11) is connected with the lower end of described skew wall (102), and described prolongation wall (11) and described straight wall (101) be arranged in parallel.
5. a kind of adhesive-spill-preventing frame according to claim 3, it is characterized in that, the L-shaped setting of cross section of described first sealing groove (1021), and a sidewall of described first sealing groove (1021) and described straight wall (101) be arranged in parallel.
6. a kind of adhesive-spill-preventing frame according to claim 3, is characterized in that, described first sealing groove (1021) is arranged at the madial wall of described skew wall (102).
7. a kind of adhesive-spill-preventing frame according to claim 1, is characterized in that, described chip packing-body (2) is for being installed on the fingerprint sensor of adhesive-spill-preventing frame (1).
8. an electronic installation, is characterized in that: comprise the adhesive-spill-preventing frame (1) described in claim 1 to 7 any one, and the chip packing-body (2) for matching with described adhesive-spill-preventing frame (1).
9. a kind of electronic installation according to claim 8, is characterized in that: the lateral wall of described chip packing-body (2) is provided with the second sealing groove (21).
10. a kind of electronic installation according to claim 9, it is characterized in that: described second sealing groove (21) is arranged at the top of described first sealing groove (1021), and the sidewall of described second sealing groove (21) be arranged in parallel with the sidewall of the first corresponding sealing groove (1021).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520247931.1U CN204539680U (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and electronic installation thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520247931.1U CN204539680U (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and electronic installation thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204539680U true CN204539680U (en) | 2015-08-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520247931.1U Expired - Fee Related CN204539680U (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and electronic installation thereof |
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| Country | Link |
|---|---|
| CN (1) | CN204539680U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797117A (en) * | 2015-04-22 | 2015-07-22 | 南昌欧菲生物识别技术有限公司 | Glue-overflowing-resistant frame and electronic device with same |
| CN109385833A (en) * | 2017-08-03 | 2019-02-26 | 青岛海尔滚筒洗衣机有限公司 | Deposition mounting structure and washing machine for washing machine |
| WO2020233562A1 (en) * | 2019-05-20 | 2020-11-26 | 华为技术有限公司 | Fingerprint recognition module and electronic device |
-
2015
- 2015-04-22 CN CN201520247931.1U patent/CN204539680U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104797117A (en) * | 2015-04-22 | 2015-07-22 | 南昌欧菲生物识别技术有限公司 | Glue-overflowing-resistant frame and electronic device with same |
| CN104797117B (en) * | 2015-04-22 | 2017-12-05 | 南昌欧菲生物识别技术有限公司 | Adhesive-spill-preventing frame and its electronic installation |
| CN109385833A (en) * | 2017-08-03 | 2019-02-26 | 青岛海尔滚筒洗衣机有限公司 | Deposition mounting structure and washing machine for washing machine |
| CN109385833B (en) * | 2017-08-03 | 2022-03-15 | 青岛海尔洗涤电器有限公司 | A cladding mounting structure and washing machine for washing machine |
| WO2020233562A1 (en) * | 2019-05-20 | 2020-11-26 | 华为技术有限公司 | Fingerprint recognition module and electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150805 Termination date: 20180422 |
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| CF01 | Termination of patent right due to non-payment of annual fee |