CN104797117A - Glue-overflowing-resistant frame and electronic device with same - Google Patents
Glue-overflowing-resistant frame and electronic device with same Download PDFInfo
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- CN104797117A CN104797117A CN201510194137.XA CN201510194137A CN104797117A CN 104797117 A CN104797117 A CN 104797117A CN 201510194137 A CN201510194137 A CN 201510194137A CN 104797117 A CN104797117 A CN 104797117A
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Abstract
The invention discloses a glue-overflowing-resistant frame and an electronic device with the same. The glue-overflowing-resistant frame comprises a bearing wall, wherein a first glue sealing groove is formed in an inner side wall of the bearing wall; and by the first glue sealing groove, a force for combining the glue-overflowing-resistant frame and a chip package body is increased, and overflowed glue is reduced. The electronic device comprises the glue-overflowing-resistant frame and the chip package body which is matched with the glue-overflowing-resistant frame. By the glue-overflowing-resistant frame and the electronic device with the same, a large amount of glue can be retained through the first glue sealing groove, the force for combining the glue-overflowing-resistant frame and the chip package body is increased, and the overflowed glue can be reduced.
Description
Technical field
The present invention relates to fingerprint sensor technology field, particularly relate to adhesive-spill-preventing frame and electronic installation thereof.
Background technology
Under prior art for some chip packing-bodies when assembling with frame, especially as fingerprint sensor one series products, in order to ensure that fingerprint sensor can have larger information gathering face, general is all fingerprint sensing is directly vertically put into frame from the upper port of frame and bonds with the madial wall glue of frame, this kind of operating type, in actual production, owing to unnecessary glue after bonding effectively can not be adsorbed or drainage, often make glue overflow frame outside, and then cause the bad order of product; In addition due in sealing process, lack necessary storage glue space, thus can not effectively dam certain glue, to increase the adhesion between chip packing-body and frame.
Summary of the invention
Object one of the present invention is that providing a kind of can increase adhesion and the adhesive-spill-preventing frame of minimizing glue spilling.
Object two of the present invention is that providing a kind of can increase adhesion and the electronic installation of minimizing glue spilling.
For reaching this object, the present invention by the following technical solutions:
A kind of adhesive-spill-preventing frame, comprising:
Bearing wall, the madial wall of described bearing wall is provided with for increasing adhesion between chip packing-body and reduce glue overflow the first sealing groove.
Wherein, also comprise: be arranged on bottom described bearing wall for adsorbing the prolongation wall overflowing glue.
Wherein, described bearing wall comprises straight wall and is connected and intilted skew wall with described Zhi Bi lower end.
Wherein, described prolongation wall is connected with the lower end of described skew wall, and described prolongation wall and described straight wall be arranged in parallel.
Wherein, the L-shaped setting of cross section of described first sealing groove, and a sidewall of described first sealing groove and described straight wall be arranged in parallel.
Wherein, described first sealing groove is arranged at the madial wall of described skew wall.
Wherein, described chip packing-body is the fingerprint sensor being installed on adhesive-spill-preventing frame.
A kind of electronic installation, comprises the adhesive-spill-preventing frame described in above-mentioned any one, and the chip packing-body for matching with described adhesive-spill-preventing frame.
Wherein, the lateral wall of described chip packing-body is provided with the second sealing groove.
Wherein, described second sealing groove is arranged at the top of described first sealing groove, and the sidewall of described second sealing groove be arranged in parallel with the sidewall of the first corresponding sealing groove.
Beneficial effect of the present invention: the invention provides a kind of adhesive-spill-preventing frame, comprising: bearing wall, the madial wall of described bearing wall is provided with for increasing adhesion between chip packing-body and reduce glue overflow the first sealing groove.Present invention also offers a kind of electronic equipment, comprise described adhesive-spill-preventing frame, and the chip packing-body for matching with described adhesive-spill-preventing frame.Adhesive-spill-preventing frame of the present invention and electronic installation thereof by the setting of the first sealing groove, can retain more glue to increase the adhesion between chip packing-body and adhesive-spill-preventing frame, meanwhile, can also reduce the spilling of glue.
Accompanying drawing explanation
Fig. 1 is a kind of exploded view of the electronic installation not with prolongation wall.
Fig. 2 is a kind of front view of the electronic installation not with prolongation wall.
Fig. 3 is the cutaway view in AA cross section in Fig. 2.
Fig. 4 is the partial enlarged drawing at B place in Fig. 3.
Fig. 5 is a kind of exploded view of the electronic installation with prolongation wall.
Fig. 6 is a kind of front view of the electronic installation with prolongation wall.
Fig. 7 is the cutaway view in CC cross section in Fig. 6.
Fig. 8 is the partial enlarged drawing at D place in Fig. 7.
In figure:
1. adhesive-spill-preventing frame, 10. bearing wall, 101. straight walls, 102. skew walls, 1021. first sealing grooves, 11. extend wall;
2. chip packing-body, 21. second sealing grooves.
Embodiment
Technical scheme of the present invention is further illustrated by embodiment below in conjunction with accompanying drawing.
Embodiment 1
As shown in Figures 1 to 4, a kind of adhesive-spill-preventing frame, comprise bearing wall 10, the madial wall of bearing wall 10 is provided with for increasing adhesion between chip packing-body 2 and reduce glue overflow the first sealing groove 1021, the setting of the first sealing groove 1021, can effectively dam glue, increases the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, meanwhile, the effect of the spilling reducing glue can also be played.
Preferably, bearing wall 10 comprises straight wall 101 and is connected and intilted skew wall 102 with straight wall 101 lower end, and the madial wall of skew wall 102 offers the first sealing groove 1021, preferably, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, and the L-shaped setting of cross section of the first sealing groove 1021, and a sidewall of the first sealing groove 1021 and straight wall 101 be arranged in parallel.This structural design, can convenient glue along the madial wall of bearing wall 10 from the top down in flow process, effectively glue is dammed in the first sealing groove 1021, and then effectively can increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, effectively can slow down the speed that glue flows downward along skew wall 102, reduce glue and overflow.
Preferred further, the chip packing-body 2 in the present invention, for being installed on the fingerprint sensor of adhesive-spill-preventing frame 1, also can be other similar electronic device.
A kind of electronic installation, comprise adhesive-spill-preventing frame 1 described above, and the chip packing-body 2 for matching with adhesive-spill-preventing frame 1, preferably, the lateral wall of chip packing-body 2 is provided with the second sealing groove 21, second sealing groove is arranged at the top of the first sealing groove 1021, and the sidewall of the second sealing groove 21 be arranged in parallel with the sidewall of the first corresponding sealing groove 1021, preferred further, the madial wall of adhesive-spill-preventing frame 1 and the lateral wall matched in clearance of chip packing-body 2, first sealing groove 1021 and the second sealing groove 21 form square shape and hold glue space, and the diagonally opposing corner that the gap between the lateral wall of the madial wall of adhesive-spill-preventing frame 1 and chip packing-body 2 holds glue space from square shape passes.This structural design, fills when glue can be made to flow from the top down and holds glue space, and then increases chip packing-body 2 and the adhesion of adhesive-spill-preventing frame 1, decreases the speed of the glue flowed out in calm glue space simultaneously, and then can effectively reduce excessive glue.
Embodiment 2
As shown in Fig. 5 to Fig. 8, a kind of adhesive-spill-preventing frame, comprise bearing wall 10, the madial wall of bearing wall 10 be provided with for increasing adhesion between chip packing-body 2 and reduce the first sealing groove 1021 that glue overflows, also comprising being arranged on bottom described bearing wall 10 and overflow the prolongation wall 11 of glue for adsorbing.Extend the setting of wall 11, effectively the glue of spilling can be adsorbed onto on the madial wall of prolongation wall, thus play the effect effectively preventing glue from overflowing.
Preferably, bearing wall 10 comprises straight wall 101 and is connected and intilted skew wall 102 with straight wall 101 lower end, extend wall 11 to be connected with the lower end of described skew wall 102, and described prolongation wall 11 be arranged in parallel with described straight wall 101, preferably, the L-shaped setting of cross section of the first sealing groove 1021, and a sidewall of described first sealing groove 1021 and described straight wall 101 be arranged in parallel, first sealing groove 1021 is arranged at the middle part of the madial wall of skew wall 102, this structural design, can convenient glue along the madial wall of bearing wall 10 from the top down in flow process, effectively glue is dammed in the first sealing groove 1021, and then effectively can increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, first sealing groove 1021 is arranged at the middle part of skew wall madial wall, effectively can slow down the speed that glue flows downward along skew wall 102, reduce glue to overflow, extend the setting of wall 11, the glue of spilling effectively can be adsorbed onto on the madial wall of prolongation wall 11, and then effectively prevent glue from overflowing, avoid the outward appearance affecting adhesive-spill-preventing frame.
Preferred further, the chip packing-body 2 in the present invention, for being installed on the fingerprint sensor of adhesive-spill-preventing frame 1, also can be other similar electronic device.
A kind of electronic installation, comprise adhesive-spill-preventing frame 1 described above, and the chip packing-body 2 for matching with adhesive-spill-preventing frame 1, preferably, the lateral wall of chip packing-body 2 is provided with the second sealing groove 21, second sealing groove is arranged at the top of the first sealing groove 1021, and the sidewall of the second sealing groove 21 be arranged in parallel with the sidewall of the first corresponding sealing groove 1021, preferred further, the madial wall of adhesive-spill-preventing frame 1 and the lateral wall matched in clearance of chip packing-body 2, first sealing groove 1021 and the second sealing groove 21 form square shape and hold glue space, and the diagonally opposing corner that the gap between the lateral wall of the madial wall of adhesive-spill-preventing frame 1 and chip packing-body 2 holds glue space from square shape passes.This structural design, fill when glue can be made to flow from the top down and hold glue space, and then increase the adhesion of chip packing-body 2 and adhesive-spill-preventing frame 1, decrease the speed of the glue flowed out in calm glue space simultaneously, and then can effectively reduce excessive glue, simultaneously, owing to extending the setting of wall 11, effectively the glue of spilling can be adsorbed onto on the madial wall of prolongation wall, and then effectively prevent glue from overflowing, affect the outward appearance of electronic installation.
Below know-why of the present invention is described in conjunction with specific embodiments.These describe just in order to explain principle of the present invention, and can not be interpreted as limiting the scope of the invention by any way.Based on explanation herein, those skilled in the art does not need to pay performing creative labour can associate other embodiment of the present invention, and these modes all will fall within protection scope of the present invention.
Claims (10)
1. an adhesive-spill-preventing frame, is characterized in that, comprising:
Bearing wall (10), the madial wall of described bearing wall (10) is provided with for increasing adhesion between chip packing-body (2) and reduce glue overflow the first sealing groove (1021).
2. a kind of adhesive-spill-preventing frame according to claim 1, is characterized in that, also comprise: be arranged on described bearing wall (10) bottom for adsorbing the prolongation wall (11) overflowing glue.
3. a kind of adhesive-spill-preventing frame according to claim 2, it is characterized in that, described bearing wall (10) comprises straight wall (101) and is connected and intilted skew wall (102) with described straight wall (101) lower end.
4. a kind of adhesive-spill-preventing frame according to claim 3, it is characterized in that, described prolongation wall (11) is connected with the lower end of described skew wall (102), and described prolongation wall (11) and described straight wall (101) be arranged in parallel.
5. a kind of adhesive-spill-preventing frame according to claim 3, it is characterized in that, the L-shaped setting of cross section of described first sealing groove (1021), and a sidewall of described first sealing groove (1021) and described straight wall (101) be arranged in parallel.
6. a kind of adhesive-spill-preventing frame according to claim 3, is characterized in that, described first sealing groove (1021) is arranged at the madial wall of described skew wall (102).
7. a kind of adhesive-spill-preventing frame according to claim 1, is characterized in that, described chip packing-body (2) is for being installed on the fingerprint sensor of adhesive-spill-preventing frame (1).
8. an electronic installation, is characterized in that: comprise the adhesive-spill-preventing frame (1) described in claim 1 to 7 any one, and the chip packing-body (2) for matching with described adhesive-spill-preventing frame (1).
9. a kind of electronic installation according to claim 8, is characterized in that: the lateral wall of described chip packing-body (2) is provided with the second sealing groove (21).
10. a kind of electronic installation according to claim 9, it is characterized in that: described second sealing groove (21) is arranged at the top of described first sealing groove (1021), and the sidewall of described second sealing groove (21) be arranged in parallel with the sidewall of the first corresponding sealing groove (1021).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510194137.XA CN104797117B (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and its electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510194137.XA CN104797117B (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and its electronic installation |
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| Publication Number | Publication Date |
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| CN104797117A true CN104797117A (en) | 2015-07-22 |
| CN104797117B CN104797117B (en) | 2017-12-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510194137.XA Active CN104797117B (en) | 2015-04-22 | 2015-04-22 | Adhesive-spill-preventing frame and its electronic installation |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105187583A (en) * | 2015-08-31 | 2015-12-23 | 广东欧珀移动通信有限公司 | Terminal front cover assembly and terminal |
| CN107509306A (en) * | 2017-09-11 | 2017-12-22 | 珠海格力节能环保制冷技术研究中心有限公司 | Limit adhesive dispenser, circuit board assembly and brshless DC motor |
| CN108644743A (en) * | 2018-05-31 | 2018-10-12 | 深圳实现创新科技有限公司 | A kind of daylight lamp circuit plate encapsulating structure |
| CN109385833A (en) * | 2017-08-03 | 2019-02-26 | 青岛海尔滚筒洗衣机有限公司 | Deposition mounting structure and washing machine for washing machine |
| CN116234192A (en) * | 2021-12-03 | 2023-06-06 | Oppo广东移动通信有限公司 | Electronic device, housing assembly, protective assembly, decoration and assembly method |
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| CN203748139U (en) * | 2013-12-30 | 2014-07-30 | 惠州比亚迪电子有限公司 | Electronic product |
| CN204539680U (en) * | 2015-04-22 | 2015-08-05 | 南昌欧菲生物识别技术有限公司 | Adhesive-spill-preventing frame and electronic installation thereof |
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2015
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Patent Citations (4)
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| US20060202222A1 (en) * | 2005-03-14 | 2006-09-14 | Wen-Jeng Lan | Package structure of organic electroluminescent devices |
| CN202251341U (en) * | 2011-09-22 | 2012-05-30 | 深圳市鑫灏源电子科技实业有限公司 | Casing of mobile phone and casing hot-melting nut capable of preventing glue from overflowing |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105187583A (en) * | 2015-08-31 | 2015-12-23 | 广东欧珀移动通信有限公司 | Terminal front cover assembly and terminal |
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| CN109385833A (en) * | 2017-08-03 | 2019-02-26 | 青岛海尔滚筒洗衣机有限公司 | Deposition mounting structure and washing machine for washing machine |
| CN109385833B (en) * | 2017-08-03 | 2022-03-15 | 青岛海尔洗涤电器有限公司 | A cladding mounting structure and washing machine for washing machine |
| CN107509306A (en) * | 2017-09-11 | 2017-12-22 | 珠海格力节能环保制冷技术研究中心有限公司 | Limit adhesive dispenser, circuit board assembly and brshless DC motor |
| CN108644743A (en) * | 2018-05-31 | 2018-10-12 | 深圳实现创新科技有限公司 | A kind of daylight lamp circuit plate encapsulating structure |
| CN116234192A (en) * | 2021-12-03 | 2023-06-06 | Oppo广东移动通信有限公司 | Electronic device, housing assembly, protective assembly, decoration and assembly method |
| CN116234192B (en) * | 2021-12-03 | 2024-01-05 | Oppo广东移动通信有限公司 | Electronic device, housing assembly, protective assembly, decoration and assembly method |
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| Publication number | Publication date |
|---|---|
| CN104797117B (en) | 2017-12-05 |
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Address after: 330013 Jiangxi province Nanchang high tech Zone Tianxiang Road Co-patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Co-patentee after: OFilm Tech Co.,Ltd. Co-patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013 Jiangxi province Nanchang high tech Zone Tianxiang Road Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Co-patentee before: Shenzhen OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right |
Effective date of registration: 20180927 Address after: 330013 room 1408, red Gucheng tower, 545 Exhibition Road, Nanchang, Jiangxi. Patentee after: Nanchang Virtual Reality Research Institute Co.,Ltd. Address before: 330013 Jiangxi province Nanchang high tech Zone Tianxiang Road Co-patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Co-patentee before: OFilm Tech Co.,Ltd. Co-patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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| TR01 | Transfer of patent right |