WO2020233562A1 - Fingerprint recognition module and electronic device - Google Patents

Fingerprint recognition module and electronic device Download PDF

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Publication number
WO2020233562A1
WO2020233562A1 PCT/CN2020/091019 CN2020091019W WO2020233562A1 WO 2020233562 A1 WO2020233562 A1 WO 2020233562A1 CN 2020091019 W CN2020091019 W CN 2020091019W WO 2020233562 A1 WO2020233562 A1 WO 2020233562A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
circuit board
flexible circuit
fingerprint identification
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/091019
Other languages
French (fr)
Chinese (zh)
Inventor
王道虎
李彤彤
周琛
徐偲伟
王勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202090000556.XU priority Critical patent/CN217008074U/en
Publication of WO2020233562A1 publication Critical patent/WO2020233562A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1662—Details related to the integrated keyboard
    • G06F1/1671—Special purpose buttons or auxiliary keyboards, e.g. retractable mini keypads, keypads or buttons that remain accessible at closed laptop
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H04M1/236—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof including keys on side or rear faces
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M2250/00—Details of telephonic subscriber devices
    • H04M2250/12—Details of telephonic subscriber devices including a sensor for measuring a physical value, e.g. temperature or motion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • This application relates to the technical field of electronic equipment, and in particular to a fingerprint recognition module and an electronic device.
  • the fingerprint recognition module usually includes a flexible circuit board, a substrate, a fingerprint recognition chip, and a filling layer.
  • the flexible circuit board and the substrate are stacked, and the first surface of the substrate facing the flexible circuit board is provided with a plurality of devices for connecting to the flexible circuit board. Connected pads, the fingerprint recognition chip is arranged on the second surface of the substrate facing away from the flexible circuit board and forms an integrated packaging structure with the substrate, and the filler layer is filled between the flexible circuit board and the first surface of the substrate and used to wrap the pads .
  • the flexible circuit board is often designed so that the flexible circuit board does not exceed the substrate in the first direction.
  • the first direction is the installation of the fingerprint recognition module.
  • the direction coincides with the thickness direction of the mobile phone.
  • the glue When it is full, the glue may overflow to the side of the package structure composed of the substrate and the fingerprint identification chip, resulting in an increase in the overall size of the fingerprint identification module, which will interfere with the middle frame when installed in the mounting slot.
  • the existing fingerprint recognition module has generally insufficient dispensing volume, and the insufficient dispensing volume will cause the pads to be sealed around the pads.
  • the sweat from the fingers Under the circumstances, the sweat from the fingers easily penetrates between the flexible circuit board and the substrate and corrodes the pads, affecting the performance of the fingerprint recognition module.
  • This application provides a fingerprint recognition module and an electronic device to improve the performance and structural reliability of the fingerprint recognition module.
  • the present application provides a fingerprint recognition module.
  • the fingerprint recognition module includes a flexible circuit board, a substrate, and a fingerprint recognition chip, wherein the flexible circuit board and the substrate are stacked, including a first end and a At the second end, when forming the outlet area of the flexible circuit board, the outlet area can be set in the area near the first end, or in the area near the second end, or in the area near the first end and near the second end.
  • the terminal area is provided with a lead-out area, and in specific settings, the end of the flexible circuit board with the lead-out area should extend beyond the substrate to facilitate electrical connection with the motherboard of the electronic device;
  • the substrate includes a first surface facing the flexible circuit board and The second surface is arranged opposite to the flexible circuit board.
  • the first surface of the substrate includes a first area and a second area.
  • the first area is formed with pads and traces.
  • the substrate can be electrically connected to the flexible circuit board through the pads.
  • the second area is opposite to the outlet area of the flexible circuit board, and a slot is arranged in the second area;
  • the fingerprint identification chip is arranged on the second surface of the substrate and can be electrically connected to the substrate; in order to enhance the structural reliability of the fingerprint identification module
  • the fingerprint recognition module further includes a glue filling layer filled between the flexible circuit board and the first surface of the substrate. When the glue filling layer is formed, glue is dispensed on the substrate so that the glue can completely wrap and seal the pad.
  • the second area of the substrate avoiding the traces and the pads is provided with a slot, so that the amount of glue can be appropriately increased when the filling layer is formed to ensure that the pads can be It is well sealed, and at the same time, excess glue can overflow into the slot, so that it will not affect the outline size of the fingerprint identification module, and can improve the performance and structural reliability of the fingerprint identification module.
  • the slot can have a variety of structural forms.
  • the substrate further includes a side wall connected between the first surface and the second surface, and the groove can directly extend to the side wall, so that the process difficulty in making the groove can be achieved.
  • the slot can also be designed as a closed slot that does not extend to the side wall of the substrate.
  • the cross section of the slot can be round, semi-circular or polygonal. shape.
  • the volume of the slot can be made not less than 0.1 mm 3 .
  • the thickness of the area corresponding to the groove on the substrate is not less than 0.1 mm.
  • a reinforcing plate is further provided on the side of the flexible circuit board away from the substrate to improve the strength of the flexible circuit board and further improve the structural reliability of the fingerprint identification module.
  • the fingerprint identification module further includes a plastic encapsulation layer disposed on the side of the fingerprint identification chip away from the substrate for embedding and protecting the fingerprint identification chip.
  • the substrate, the fingerprint identification chip and the plastic packaging layer may be an integrated packaging structure packaged by the grid array packaging technology.
  • the present application also provides an electronic device, the electronic device includes a housing and the fingerprint identification module in any possible implementation of the first aspect, the fingerprint identification module is provided on the housing
  • the electronic device can realize various functions such as screen unlocking, fast payment and file encryption based on the fingerprint recognition module.
  • the electronic device when the mounting slot is set in the middle frame of the mobile phone housing, the pad can still be sealed well under the premise that the width of the flexible circuit board of the fingerprint recognition module is smaller than the width of the substrate. And because of the high dimensional accuracy of the fingerprint recognition module, it can be smoothly assembled into the installation slot.
  • the present application also provides a method for manufacturing the fingerprint identification module in any one of the embodiments of the first aspect.
  • the method may include the following steps: forming a first surface of a substrate with traces and The first area of the pad and the second area avoiding the trace and the pad; the fingerprint identification chip is arranged on the second surface of the substrate opposite to the first surface; the second area of the first surface is provided with a slot, A lead-out area is formed on the flexible circuit board near the first end and/or the second end, and then the flexible circuit board is stacked on the first surface of the substrate and electrically connected to the substrate through pads, and during installation, Make the outlet area of the flexible circuit board opposite to the slot position.
  • the end of the flexible circuit board with the outlet area should be set beyond the substrate; a filling layer is formed between the flexible circuit board and the first surface of the substrate by dispensing
  • the adhesive layer wraps and seals the pad.
  • the fingerprint recognition module produced by the above method can appropriately increase the amount of glue when forming the filling layer to ensure that the pad can be well sealed, and at the same time, the excess glue can overflow into the slot, so that it will not It has an impact on the external dimensions of the fingerprint identification module, which can improve the performance and structural reliability of the fingerprint identification module.
  • the method further includes forming a reinforcing plate on the side of the flexible circuit board away from the substrate to increase the strength of the flexible circuit board and further improve the structural reliability of the fingerprint identification module.
  • the method further includes forming a plastic encapsulation layer on the side of the fingerprint identification chip away from the substrate, and the plastic encapsulation layer can be used to embed the fingerprint identification chip.
  • FIG. 1 is a top view of a partial structure of a fingerprint recognition module in the prior art when a filling layer is formed;
  • FIG. 2 is a schematic diagram of the structure of a fingerprint recognition module in the prior art when a filling layer is formed
  • Figure 3 is a partial structural side view of a fingerprint recognition module in the prior art
  • FIG. 4 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the application.
  • FIG. 5 is a partial structural side view of the fingerprint recognition module according to the embodiment of the application when the filling layer is not formed;
  • FIG. 6 is a schematic diagram of the structure of the first surface of the substrate according to an embodiment of the application.
  • FIG. 7 is a top view of a partial structure of the fingerprint recognition module in the embodiment of the application when forming a filling layer;
  • FIG. 8 is a partial structural side view of the fingerprint recognition module of an embodiment of the application after forming a filling layer
  • FIG. 9 is a partial structural side view of a fingerprint recognition module of another embodiment of the application after forming a filling layer
  • FIG. 10 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application.
  • FIG. 11 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application.
  • FIG. 12 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application.
  • FIG. 13 is a schematic structural diagram of an electronic device according to an embodiment of the application.
  • Fig. 14 is an enlarged view of A in the embodiment shown in Fig. 13.
  • the fingerprint recognition area is usually set on the side of the screen of the mobile phone, and an installation slot is opened on the front cover of the mobile phone at a position corresponding to the fingerprint recognition area to accommodate the fingerprint recognition module used to realize the above functions. group.
  • the fingerprint recognition area gradually shifts from the side where the screen of the mobile phone is located to the back or peripheral side of the mobile phone. At this time, it is necessary to open an installation slot in the back shell or middle frame of the mobile phone to accommodate the fingerprint recognition module.
  • the fingerprint recognition module can also realize the function of the power button at the same time, that is, the fingerprint recognition function can be realized without increasing the number of slots in the phone casing, thereby improving the mobile phone’s performance. Appearance quality.
  • the flexible circuit board 01 of the fingerprint recognition module is often designed to not exceed the substrate 02 in the A direction to minimize the opening in the middle.
  • the volume of the mounting groove on the frame increases the strength of the mobile phone.
  • the filling layer 03 when the filling layer 03 is formed, it is necessary to dispense glue on the edge of the flexible circuit board 01 along the B direction on the substrate 02, so that the glue is filled to be flexible by capillary action Between the circuit board 01 and the substrate 02. As shown in Figure 2, if the dispensing volume is too full, the glue may overflow to the side wall of the substrate 02 along the extension direction of the flexible circuit board 01, resulting in an increase in the overall size of the fingerprint recognition module. There will be a risk of interference with the middle frame, and the insufficient amount of glue will cause the problem that the pad 04 shown in Figure 3 cannot be properly sealed around the pad 04. The pad is easily corroded by sweat or water vapor during use. Affect the performance of the fingerprint recognition module.
  • the embodiments of the present application provide a fingerprint recognition module, which can avoid the appearance of the fingerprint recognition module due to the overflow of glue on the premise that it can achieve a good seal on the pad. Changes, which can improve the performance and structural reliability of the fingerprint recognition module.
  • the fingerprint identification module provided by the embodiments of the present application can be applied to electronic equipment. Using its fingerprint identification technology, the electronic equipment can realize various functions such as screen unlocking, quick payment, and file encryption.
  • the electronic equipment can be an existing technology. Common terminals such as mobile phones or tablets.
  • the fingerprint identification module provided by the embodiment of the present application includes a stacked chip packaging structure 100 and a flexible circuit board 10.
  • the chip packaging structure 100 may adopt LGA (Land Grid Array) , Grid array packaging) technology package structure, including a substrate 20 and a fingerprint recognition chip 30, wherein the substrate 20 includes a first surface 21 and a second surface 22, the first surface 21 of the substrate 20 is disposed facing the flexible circuit board 10, The two surfaces 22 are arranged opposite to the flexible circuit board 10, and the fingerprint identification chip 30 is fixed on the second surface 22 thereof.
  • the specific fixing method may be adhesive 40 bonding.
  • the chip packaging structure 100 further includes a plastic encapsulation layer 60 disposed on the side of the fingerprint identification chip 30 away from the substrate 20.
  • the plastic encapsulation layer 60 can be used to cover the fingerprint identification chip 30 and the metal wire 50, and at least The area where the second pin 23 is provided on the second surface 22 is covered to reduce the risk of damage to these devices.
  • the flexible circuit board 10 is located on the side close to the first surface 21 of the substrate 20, and the outlet area 12 of the flexible circuit board 10 is formed in the area close to the first end 11 thereof, and To facilitate electrical connection between the flexible circuit board 10 and the main board of the electronic device, the first end 11 of the flexible circuit board 10 should extend beyond the substrate 20; when the flexible circuit board 10 is electrically connected to the chip packaging structure 100, the first surface of the substrate 20
  • the first area 24 of 21 is provided with traces and pads 25.
  • the position of the pad 25 on the flexible circuit board 10 corresponding to the first area 24 is also provided with connecting pins.
  • the outlet area 12 can also be formed at the second end 13 on the flexible circuit board 10 at the same time, and the second end 13 is located on the flexible circuit board 10 opposite to the first end 11. As shown in FIG. 9, at this time, the second end 13 of the flexible circuit board 10 is also arranged beyond the base plate 20 to facilitate electrical connection with the main board of the electronic device.
  • a reinforcing plate 70 is further provided on the side of the flexible circuit board 10 facing away from the substrate 20. Due to the soft characteristics of the flexible circuit board 10, it is prone to damage when subjected to force. The strength of the flexible circuit board 10 can be improved by providing the reinforcing plate 70, so that the flexible circuit board 10 can be reliably integrated in the chip packaging structure 100 and electronic equipment Transfer signals between the motherboards.
  • the fingerprint identification module of the embodiment of the present application can specifically identify the user's fingerprint based on the existing capacitive fingerprint identification technology.
  • the fingerprint identification chip 30 is integrated with a capacitive fingerprint sensor.
  • the internal capacitive fingerprint sensor will form different capacitance differences according to the valleys and ridges of the user’s fingerprint.
  • the user’s fingerprint information can be detected through these different capacitance differences.
  • the obtained fingerprint information can be further transmitted to the main board of the electronic device via the flexible circuit board 10, and the main board performs the next operation by comparing the detected fingerprint information with the stored fingerprint information. The specific process is not repeated here.
  • the fingerprint recognition module also includes a filler filled between the flexible circuit board 10 and the first surface 21 of the substrate 20
  • the layer 80 when forming the glue filling layer 80, should meet the requirements of forming a good seal on the pad 25, while preventing the glue filling layer 80 from extending to the side of the chip packaging structure 100, so as to improve the dimensional accuracy of the fingerprint recognition module .
  • the first surface 21 of the substrate 20 also includes a second area 26 that avoids the traces and the pads 25, and the second area 26 is close to one side edge of the first surface 21
  • the slot 27 is arranged in the second area 26 opposite to the outlet area 12 of the flexible circuit board 10.
  • the slot 27 can be used as an overflow slot for glue.
  • the rubber filling layer 80 is limited between the flexible circuit board 10 and the substrate 20, so that the dimensional accuracy of the fingerprint recognition module can be ensured, and the risk of interference between the fingerprint recognition module and the housing of the electronic device during installation can be reduced.
  • the first surface 21 of the substrate 20 should have two outlet areas 12 located at opposite ends.
  • the second area 26 should be respectively provided with slots 27 to accommodate the overflowing glue when the glue filling layer 80 is formed.
  • the excess amount of glue can be controlled by the dispensing equipment. Since the dispensing equipment will have errors during dispensing, it is necessary to take the amount of dispensing error into consideration when setting the volume of the slot 27.
  • the volume of the slot 27 can be designed to be not less than 0.1 mm 3 . According to experimental verification, after the glue dispensing is completed, the excess amount of glue after wrapping and sealing the pad 25 can be accurately controlled within 0.1mm 3. Therefore, when the volume of the slot 27 is not less than 0.1mm 3 , the excess glue can be completely contained glue.
  • the thickness H of the area on the substrate 20 corresponding to the groove 27 may not be less than 0.1 mm during design.
  • the specific shape of the slot 27 is not limited.
  • the substrate 20 further includes a side wall 28 connected between the first surface 21 and the second surface 22, which can be opened during design.
  • the groove 27 extends to the side wall 28.
  • the cross-sectional shape of the substrate 20 is a racetrack shape, and the second area 26 is located at one end of the racetrack-shaped substrate 20, and the groove 27 It can extend to the arc-shaped sidewall of the substrate 20.
  • the slot 27 can also be designed to be closed, that is, the slot 27 does not need to extend to the side wall of the substrate 20.
  • the cross section of the slot 27 can be designed as shown in FIG. The circle as shown in FIG. 11, or the semicircle as shown in FIG. 11, or the polygon as shown in FIG. 12, and other shapes.
  • the fingerprint recognition module provided by the embodiments of the present application provides a slot on the substrate in the second area avoiding the traces and the pads, so that the amount of glue can be appropriately increased when the filling layer is formed to ensure welding
  • the disc can be well sealed, and at the same time, excess glue can overflow into the slot, so that the external dimension of the fingerprint identification module will not be affected, and the performance and structural reliability of the fingerprint identification module can be improved.
  • the embodiment of the present application also provides a method for manufacturing the fingerprint identification module provided in the above embodiment. Taking the embodiment shown in FIG. 4 to FIG. 8 as an example, the method may include the following steps:
  • Step 1 On the first surface 21 of the substrate 20, a first area 24 provided with traces and pads 25 and a second area 26 avoiding the traces and pads 25 are formed;
  • Step 2 Place the fingerprint identification chip 30 on the second surface 22 of the substrate 20 opposite to the first surface 21, and connect the first pin 31 on the fingerprint identification chip 30 and the second surface 22 through the metal wire 50 The second pin 23 is electrically connected;
  • Step 3 Form a plastic encapsulation layer 60 on the side of the fingerprint identification chip 30 away from the substrate 20.
  • the plastic encapsulation layer 60 can be used to cover the fingerprint identification chip 30 and the metal wire 50, and at least cover the second surface 22 with a second tube The area of the pin 23 to reduce the risk of damage to these devices;
  • Step 4 Provide a slot 27 in the second area 26 of the first surface 21, and the slot 27 can serve as an overflow slot when the rubber filling layer 80 is subsequently formed;
  • Step 5 Form the outlet area 12 on the flexible circuit board 10 near the first end 11 of the flexible circuit board 10, and then stack the flexible circuit board 10 on the first surface 21 of the substrate 20, and make the first end 11 of the flexible circuit board 10 Exceed the substrate 20 and make the outlet area 12 of the flexible circuit board 10 opposite to the above-mentioned slot 27;
  • Step 6 A glue filling layer 80 is formed between the flexible circuit board 10 and the first surface 21 of the substrate 20 through a glue dispensing process.
  • a glue dispensing process On the first surface 21 of the substrate 20 along the B direction on the flexible circuit board 10 Dispense glue on the edge so that the glue is filled between the flexible circuit board 10 and the substrate 20 by capillary action.
  • the amount of glue can be appropriately increased.
  • the formed rubber filling layer 80 is confined between the flexible circuit board 10 and the substrate 20, so that the dimensional accuracy of the fingerprint recognition module can be ensured, thereby reducing the footprint of the fingerprint recognition module and electronic equipment during installation. Risk of personal interference;
  • Step 7 A reinforcing plate 70 is formed on the side of the flexible circuit board 10 away from the substrate 20 to improve the strength of the flexible circuit board 10 and further improve the structural reliability of the fingerprint identification module.
  • the outlet area of the flexible circuit board is formed in the area close to the first end of the flexible circuit board as an example.
  • the flexible circuit board may also be located close to the second end of the flexible circuit board.
  • the fingerprint recognition module made by the above method can ensure that the pad can be well sealed, and at the same time, the excess glue can overflow into the slot, so that it will not affect the external size of the fingerprint recognition module and can improve the fingerprint Identify the performance and structural reliability of the module.
  • an embodiment of the present application also provides an electronic device 200.
  • the electronic device 200 may be a common terminal such as a mobile phone or a tablet computer in the prior art, and includes a housing 210 and the fingerprint of any of the foregoing embodiments.
  • the identification module when specifically set, is provided with an installation slot 220 on the housing 210, and the fingerprint identification module is set in the installation slot 220, so that the electronic device 200 can realize screen unlocking, quick payment and file encryption based on the fingerprint identification module A variety of functions.
  • the fingerprint recognition module can also realize the function of the power button.
  • the side of the board 70 away from the flexible circuit board 10 is also provided with a metal spring 230 and a circuit board 240, which is electrically connected to the main board of the mobile phone, so that the fingerprint recognition module can achieve different functions in different application scenarios .
  • the fingerprint identification module can obtain the user's fingerprint information by touching the fingerprint identification module with the finger, and then transmit the fingerprint information to the main board of the mobile phone through the flexible circuit board 10, and the main board passes the fingerprint The information is compared with the stored fingerprint information, and the screen is unlocked when the comparison result is consistent; when the user needs to turn on/off, the fingerprint recognition module can be pressed by the finger to make the metal spring 230 contact the circuit board 240 and trigger the circuit board Then the circuit board 240 transmits the on/off signal to the main board of the mobile phone, and the main board controls the startup or shutdown according to the received on/off signal.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Image Input (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Provided are a fingerprint recognition module and an electronic device, for improving the performance and structural reliability of a fingerprint recognition module. The fingerprint recognition module comprises a flexible circuit board, a substrate, a fingerprint recognition chip and a filling adhesive layer, wherein the flexible circuit board is arranged in a stacked manner with the substrate, and comprises a first end and a second end in opposite positions, at least one end of the first end and the second end is beyond the substrate, and a wire outlet area is formed, close to the end beyond the substrate, in the flexible circuit board; a first surface, arranged facing the flexible circuit board, of the substrate comprises a first area and a second area, the first area is provided with a wire and a pad used for electrically connecting to the flexible circuit board, and the second area is in a position opposite the wire outlet area and is provided with an open groove; the fingerprint recognition chip is arranged on a second surface, facing away from the flexible circuit board, of the substrate; and the filling adhesive layer is filled between the flexible circuit board and the substrate and is used for wrapping the pad.

Description

一种指纹识别模组及一种电子设备A fingerprint recognition module and an electronic device

本申请要求在2019年5月20日提交中国国家知识产权局、申请号为201910417832.6的中国专利申请的优先权，发明名称为“一种指纹识别模组及一种电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。This application requires the priority of a Chinese patent application filed with the State Intellectual Property Office of China with application number 201910417832.6, and a Chinese patent application with the title of “a fingerprint recognition module and an electronic device” on May 20, 2019 Priority, the entire content of which is incorporated in this application by reference.

技术领域Technical field

本申请涉及电子设备技术领域，尤其涉及到一种指纹识别模组及一种电子设备。This application relates to the technical field of electronic equipment, and in particular to a fingerprint recognition module and an electronic device.

背景技术Background technique

随着手机全面屏设计的持续推进，手机的指纹识别区逐渐由手机的屏幕所在侧转移到手机的背侧或者周侧，这样，就需要在手机的后壳或者中框设置安装槽以容纳指纹识别模组。指纹识别模组通常包括柔性电路板、基板、指纹识别芯片以及填充胶层，其中，柔性电路板与基板层叠设置，基板朝向柔性电路板的第一表面设置有多个用于与柔性电路板电连接的焊盘，指纹识别芯片设置于基板背向柔性电路板的第二表面并与基板形成为一体封装结构，填充胶层填充于柔性电路板与基板的第一表面之间并用于包裹焊盘。With the continuous advancement of the full screen design of mobile phones, the fingerprint recognition area of the mobile phone is gradually transferred from the side where the screen of the mobile phone is located to the back or peripheral side of the mobile phone. In this way, it is necessary to set a mounting slot in the back shell or middle frame of the mobile phone to accommodate fingerprints. Identification module. The fingerprint recognition module usually includes a flexible circuit board, a substrate, a fingerprint recognition chip, and a filling layer. The flexible circuit board and the substrate are stacked, and the first surface of the substrate facing the flexible circuit board is provided with a plurality of devices for connecting to the flexible circuit board. Connected pads, the fingerprint recognition chip is arranged on the second surface of the substrate facing away from the flexible circuit board and forms an integrated packaging structure with the substrate, and the filler layer is filled between the flexible circuit board and the first surface of the substrate and used to wrap the pads .

当将指纹识别区设置于手机的周侧时，由于在手机厚度方向的尺寸限制，在设计时往往使柔性电路板沿第一方向不超出基板，该第一方向即为指纹识别模组安装于中框的安装槽内时与手机的厚度方向一致的方向。采用这种设计，在形成填充胶层时，需要在基板的第一表面上沿柔性电路板边缘的延伸方向点胶，使胶水通过毛细作用填充至柔性电路板与基板之间，当点胶量较饱满时，胶水就可能会溢流至基板与指纹识别芯片组成的封装结构的侧面，导致指纹识别模组的整体尺寸增大，在安装至安装槽内时就会与中框产生干涉。为避免出现上述问题，现有的指纹识别模组点胶量普遍不足，而点胶量不足又会导致焊盘四周不能良好地密封，在用户的手指与指纹识别模组高频率接触的使用状况下，手指上的汗液容易侵入柔性电路板与基板之间并对焊盘造成腐蚀，影响指纹识别模组的性能。When the fingerprint recognition area is arranged on the peripheral side of the mobile phone, due to the size limitation in the thickness direction of the mobile phone, the flexible circuit board is often designed so that the flexible circuit board does not exceed the substrate in the first direction. The first direction is the installation of the fingerprint recognition module. When inside the installation groove of the middle frame, the direction coincides with the thickness direction of the mobile phone. With this design, when forming the filling layer, it is necessary to dispense glue on the first surface of the substrate along the extension direction of the edge of the flexible circuit board, so that the glue is filled between the flexible circuit board and the substrate by capillary action. When it is full, the glue may overflow to the side of the package structure composed of the substrate and the fingerprint identification chip, resulting in an increase in the overall size of the fingerprint identification module, which will interfere with the middle frame when installed in the mounting slot. In order to avoid the above-mentioned problems, the existing fingerprint recognition module has generally insufficient dispensing volume, and the insufficient dispensing volume will cause the pads to be sealed around the pads. In the use situation where the user’s fingers are in high-frequency contact with the fingerprint recognition module Under the circumstances, the sweat from the fingers easily penetrates between the flexible circuit board and the substrate and corrodes the pads, affecting the performance of the fingerprint recognition module.

发明内容Summary of the invention

本申请提供了一种指纹识别模组及一种电子设备，用以提高指纹识别模组的性能以及结构可靠性。This application provides a fingerprint recognition module and an electronic device to improve the performance and structural reliability of the fingerprint recognition module.

第一方面，本申请提供了一种指纹识别模组，该指纹识别模组包括柔性电路板、基板和指纹识别芯片，其中，柔性电路板与基板层叠设置，包括位置相对的第一端和第二端，在形成柔性电路板的出线区时，既可以在靠近第一端的区域设置出线区，或者在靠近第二端的区域设置出线区，也可以在靠近第一端的区域以及靠近第二端的区域同时设置出线区，并且在具体设置时，柔性电路板上设置有出线区的一端应超出基板，以便于与电子设备的主板进行电连接；基板包括朝向柔性电路板设置的第一表面以及背向柔性电路板设置的第二表面，基板的第一表面包括第一区域和第二区域，第一区域形成有焊盘以及走线，通过焊盘可将基板与柔性电路板电连接，第二区域与柔性电路板的出线区位置相对，并且该第二区域内设置有开槽；指纹识别芯片设置于基板的第二表面并且能够与基板电连接；为了增强指纹识别模组的结构可靠性，指纹识别模组还包括填充于柔性电路板与基板的第一表面之间的填充胶层，在形成该填充胶层时，通过在基板上点胶，使胶水将焊盘完全包裹密封。In the first aspect, the present application provides a fingerprint recognition module. The fingerprint recognition module includes a flexible circuit board, a substrate, and a fingerprint recognition chip, wherein the flexible circuit board and the substrate are stacked, including a first end and a At the second end, when forming the outlet area of the flexible circuit board, the outlet area can be set in the area near the first end, or in the area near the second end, or in the area near the first end and near the second end. At the same time, the terminal area is provided with a lead-out area, and in specific settings, the end of the flexible circuit board with the lead-out area should extend beyond the substrate to facilitate electrical connection with the motherboard of the electronic device; the substrate includes a first surface facing the flexible circuit board and The second surface is arranged opposite to the flexible circuit board. The first surface of the substrate includes a first area and a second area. The first area is formed with pads and traces. The substrate can be electrically connected to the flexible circuit board through the pads. The second area is opposite to the outlet area of the flexible circuit board, and a slot is arranged in the second area; the fingerprint identification chip is arranged on the second surface of the substrate and can be electrically connected to the substrate; in order to enhance the structural reliability of the fingerprint identification module The fingerprint recognition module further includes a glue filling layer filled between the flexible circuit board and the first surface of the substrate. When the glue filling layer is formed, glue is dispensed on the substrate so that the glue can completely wrap and seal the pad.

本申请实施例提供的指纹识别模组，通过在基板上避开走线与焊盘的第二区域设置开槽，在形成填充胶层时可适当地增大点胶量，保证焊盘能够被良好地密封，同时可以使富余的胶水溢流至该开槽内，从而不会对指纹识别模组的外形尺寸产生影响，可以提高指纹识别模组的性能以及结构可靠性。In the fingerprint recognition module provided by the embodiments of the present application, the second area of the substrate avoiding the traces and the pads is provided with a slot, so that the amount of glue can be appropriately increased when the filling layer is formed to ensure that the pads can be It is well sealed, and at the same time, excess glue can overflow into the slot, so that it will not affect the outline size of the fingerprint identification module, and can improve the performance and structural reliability of the fingerprint identification module.

在设置开槽时，开槽可以具有多种结构形式。在一个具体的实施方案中，基板还包括连接于第一表面与第二表面之间的侧壁，开槽可直接延伸至该侧壁，这样可以制作开槽时的工艺难度。When the slot is set, the slot can have a variety of structural forms. In a specific embodiment, the substrate further includes a side wall connected between the first surface and the second surface, and the groove can directly extend to the side wall, so that the process difficulty in making the groove can be achieved.

在另一个具体的实施方案中，还可以将开槽设计为未延伸至基板的侧壁的封闭式开槽，此时，开槽的横截面可以为圆形、半圆形或者多边形等多种形状。In another specific embodiment, the slot can also be designed as a closed slot that does not extend to the side wall of the substrate. At this time, the cross section of the slot can be round, semi-circular or polygonal. shape.

在设置开槽的体积时，应当将点胶时存在的误差量考虑进去，在本申请实施例中，可使开槽的体积不小于0.1mm 3。 When setting the volume of the slot, the amount of error in dispensing should be taken into account. In the embodiment of the present application, the volume of the slot can be made not less than 0.1 mm 3 .

为了保证基板的强度，在一个具体的实施方案中，基板上对应开槽的区域的厚度不小于0.1mm。In order to ensure the strength of the substrate, in a specific embodiment, the thickness of the area corresponding to the groove on the substrate is not less than 0.1 mm.

在一个具体的实施方案中，柔性电路板背离基板的一侧还设置有补强板，以提高柔性电路板的强度，进一步可以提高指纹识别模组的结构可靠性。In a specific embodiment, a reinforcing plate is further provided on the side of the flexible circuit board away from the substrate to improve the strength of the flexible circuit board and further improve the structural reliability of the fingerprint identification module.

在一个具体的实施方案中，指纹识别模组还包括塑封层，该塑封层设置于指纹识别芯片背离基板的一侧，用于包埋并保护指纹识别芯片。In a specific embodiment, the fingerprint identification module further includes a plastic encapsulation layer disposed on the side of the fingerprint identification chip away from the substrate for embedding and protecting the fingerprint identification chip.

在本申请实施例中，基板、指纹识别芯片与塑封层可以为通过格栅阵列封装技术封装的一体封装结构。In the embodiment of the present application, the substrate, the fingerprint identification chip and the plastic packaging layer may be an integrated packaging structure packaged by the grid array packaging technology.

第二方面，本申请还提供了一种电子设备，所述电子设备包括壳体以及上述第一方面中任意可能的实施方案中的指纹识别模组，指纹识别模组设置于壳体上所开设的安装槽内，使得电子设备能够基于指纹识别模组实现屏幕解锁、快捷支付以及文件加密等多种功能。以电子设备为手机为例，当安装槽设置于手机壳体的中框时，在指纹识别模组的柔性电路板的宽度小于其基板的宽度的前提下，仍可以保证将焊盘良好密封，并且由于指纹识别模组的尺寸精度较高，因此可以顺利地装配进安装槽内。In a second aspect, the present application also provides an electronic device, the electronic device includes a housing and the fingerprint identification module in any possible implementation of the first aspect, the fingerprint identification module is provided on the housing In the installation slot, the electronic device can realize various functions such as screen unlocking, fast payment and file encryption based on the fingerprint recognition module. Taking the electronic device as a mobile phone as an example, when the mounting slot is set in the middle frame of the mobile phone housing, the pad can still be sealed well under the premise that the width of the flexible circuit board of the fingerprint recognition module is smaller than the width of the substrate. And because of the high dimensional accuracy of the fingerprint recognition module, it can be smoothly assembled into the installation slot.

第三方面，本申请还提供了一种用于制作上述第一方面任一实施方案中的指纹识别模组的方法，该方法可包括以下步骤：在基板的第一表面形成设置有走线和焊盘的第一区域以及避开走线和焊盘的第二区域；将指纹识别芯片设置于基板上与第一表面位置相对的第二表面；在第一表面的第二区域设置开槽，在柔性电路板上靠近其第一端和/或第二端的区域形成出线区，然后将柔性电路板叠置于基板的第一表面并使其通过焊盘与基板电连接，并且在设置时，使柔性电路板的出线区与开槽位置相对，柔性电路板上设置有出线区的一端应超出基板设置；通过点胶在柔性电路板与基板的第一表面之间形成填充胶层，时填充胶层将焊盘包裹密封。In the third aspect, the present application also provides a method for manufacturing the fingerprint identification module in any one of the embodiments of the first aspect. The method may include the following steps: forming a first surface of a substrate with traces and The first area of the pad and the second area avoiding the trace and the pad; the fingerprint identification chip is arranged on the second surface of the substrate opposite to the first surface; the second area of the first surface is provided with a slot, A lead-out area is formed on the flexible circuit board near the first end and/or the second end, and then the flexible circuit board is stacked on the first surface of the substrate and electrically connected to the substrate through pads, and during installation, Make the outlet area of the flexible circuit board opposite to the slot position. The end of the flexible circuit board with the outlet area should be set beyond the substrate; a filling layer is formed between the flexible circuit board and the first surface of the substrate by dispensing The adhesive layer wraps and seals the pad.

采用上述方法制作的指纹识别模组，在形成填充胶层时可适当地增大点胶量，保证焊盘能够被良好地密封，同时可以使富余的胶水溢流至开槽内，从而不会对指纹识别模组的外形尺寸产生影响，可以提高指纹识别模组的性能以及结构可靠性。The fingerprint recognition module produced by the above method can appropriately increase the amount of glue when forming the filling layer to ensure that the pad can be well sealed, and at the same time, the excess glue can overflow into the slot, so that it will not It has an impact on the external dimensions of the fingerprint identification module, which can improve the performance and structural reliability of the fingerprint identification module.

在一个具体的实施方案中，该方法还包括在柔性电路板背离基板的一侧形成补强板，以提高柔性电路板的强度，进一步可以提高指纹识别模组的结构可靠性。In a specific embodiment, the method further includes forming a reinforcing plate on the side of the flexible circuit board away from the substrate to increase the strength of the flexible circuit board and further improve the structural reliability of the fingerprint identification module.

在一个具体的实施方案中，该方法还包括在指纹识别芯片背离基板的一侧形成塑封层，该塑封层可用于包埋指纹识别芯片。In a specific embodiment, the method further includes forming a plastic encapsulation layer on the side of the fingerprint identification chip away from the substrate, and the plastic encapsulation layer can be used to embed the fingerprint identification chip.

附图说明Description of the drawings

图1为现有技术中指纹识别模组形成填充胶层时的局部结构俯视图；FIG. 1 is a top view of a partial structure of a fingerprint recognition module in the prior art when a filling layer is formed;

图2为现有技术中指纹识别模组形成填充胶层时的结构示意图；FIG. 2 is a schematic diagram of the structure of a fingerprint recognition module in the prior art when a filling layer is formed;

图3为现有技术中指纹识别模组的局部结构侧视图；Figure 3 is a partial structural side view of a fingerprint recognition module in the prior art;

图4为本申请实施例指纹识别模组的结构示意图；4 is a schematic structural diagram of a fingerprint identification module according to an embodiment of the application;

图5为本申请实施例指纹识别模组未形成填充胶层时的局部结构侧视图；FIG. 5 is a partial structural side view of the fingerprint recognition module according to the embodiment of the application when the filling layer is not formed;

图6为本申请一实施例基板的第一表面的结构示意图；6 is a schematic diagram of the structure of the first surface of the substrate according to an embodiment of the application;

图7为本申请实施例指纹识别模组形成填充胶层时的局部结构俯视图；FIG. 7 is a top view of a partial structure of the fingerprint recognition module in the embodiment of the application when forming a filling layer;

图8为本申请一实施例指纹识别模组形成填充胶层后的局部结构侧视图；8 is a partial structural side view of the fingerprint recognition module of an embodiment of the application after forming a filling layer;

图9为本申请另一实施例指纹识别模组形成填充胶层后的局部结构侧视图；FIG. 9 is a partial structural side view of a fingerprint recognition module of another embodiment of the application after forming a filling layer;

图10为本申请另一实施例基板的第一表面的结构示意图；10 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application;

图11为本申请又一实施例基板的第一表面的结构示意图；11 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application;

图12为本申请又一实施例基板的第一表面的结构示意图；12 is a schematic diagram of the structure of the first surface of the substrate according to another embodiment of the application;

图13为本申请实施例电子设备的结构示意图；FIG. 13 is a schematic structural diagram of an electronic device according to an embodiment of the application;

图14为图13所示实施例中A处的放大图。Fig. 14 is an enlarged view of A in the embodiment shown in Fig. 13.

具体实施方式Detailed ways

为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

目前，随着指纹识别技术在电子设备领域的广泛应用，使得多种电子设备可基于该技术实现屏幕解锁、快捷支付以及文件加密等功能，极大地提升了用户使用体验。以手机为例，在具体设置时，通常在手机的屏幕所在侧设置指纹识别区，并在手机前盖上对应该指纹识别区的位置开设安装槽，以容纳用于实现上述功能的指纹识别模组。而随着全面屏手机的出现，指纹识别区逐渐由手机的屏幕所在侧转移到手机的背侧或者周侧，这时则需要在手机的后壳或者中框开设安装槽来容纳指纹识别模组。当指纹识别区设置于手机的周侧时，还可使指纹识别模组同时实现电源键的功能，即可以在不增加手机壳体开槽数量的前提下实现指纹识别功能，从而可以提升手机的外观品质。采用这种方案时，参考图1所示，由于手机厚度方向的尺寸限制，在设计时往往使指纹识别模组的柔性电路板01在A方向上不超出基板02，以尽量减小开设于中框上的安装槽的体积，提高手机的强度，这样，在形成填充胶层03时，就需要在基板02上沿B方向在柔性电路板01的边缘点胶，使胶水通过毛细作用填充至柔性电路板01与基板02之间。如图2所示，如果点胶量过于饱满，胶水就可能会沿柔性电路板01的出线端的延伸方向溢流至基板02的侧壁，导致指纹识别模组的整体尺寸增大，在安装时就会出现与中框干涉的风险，而点胶量不足又会出现图3中所示的焊盘04四周不能良好地密封的问题，在使用过程中焊盘容易被侵入的汗液或者水汽腐蚀，影响指纹识别模组的性能。基于此，本申请实施例提供了一种指纹识别模组，该指纹识别模组在能够对焊盘实现良好密封的前提下，还可以避免由于胶水溢流而导致指纹识别模组的外形尺寸发生变化，从而可以提高指纹识别模组的性能以及结构可靠性。At present, with the widespread application of fingerprint recognition technology in the field of electronic devices, various electronic devices can realize functions such as screen unlocking, quick payment, and file encryption based on this technology, greatly improving user experience. Taking a mobile phone as an example, in the specific setting, the fingerprint recognition area is usually set on the side of the screen of the mobile phone, and an installation slot is opened on the front cover of the mobile phone at a position corresponding to the fingerprint recognition area to accommodate the fingerprint recognition module used to realize the above functions. group. With the emergence of full-screen mobile phones, the fingerprint recognition area gradually shifts from the side where the screen of the mobile phone is located to the back or peripheral side of the mobile phone. At this time, it is necessary to open an installation slot in the back shell or middle frame of the mobile phone to accommodate the fingerprint recognition module. . When the fingerprint recognition area is set on the peripheral side of the mobile phone, the fingerprint recognition module can also realize the function of the power button at the same time, that is, the fingerprint recognition function can be realized without increasing the number of slots in the phone casing, thereby improving the mobile phone’s performance. Appearance quality. When using this solution, referring to Figure 1, due to the size limitation in the thickness direction of the mobile phone, the flexible circuit board 01 of the fingerprint recognition module is often designed to not exceed the substrate 02 in the A direction to minimize the opening in the middle. The volume of the mounting groove on the frame increases the strength of the mobile phone. In this way, when the filling layer 03 is formed, it is necessary to dispense glue on the edge of the flexible circuit board 01 along the B direction on the substrate 02, so that the glue is filled to be flexible by capillary action Between the circuit board 01 and the substrate 02. As shown in Figure 2, if the dispensing volume is too full, the glue may overflow to the side wall of the substrate 02 along the extension direction of the flexible circuit board 01, resulting in an increase in the overall size of the fingerprint recognition module. There will be a risk of interference with the middle frame, and the insufficient amount of glue will cause the problem that the pad 04 shown in Figure 3 cannot be properly sealed around the pad 04. The pad is easily corroded by sweat or water vapor during use. Affect the performance of the fingerprint recognition module. Based on this, the embodiments of the present application provide a fingerprint recognition module, which can avoid the appearance of the fingerprint recognition module due to the overflow of glue on the premise that it can achieve a good seal on the pad. Changes, which can improve the performance and structural reliability of the fingerprint recognition module.

本申请实施例提供的指纹识别模组可应用于电子设备中，利用其指纹识别技术可以使电子设备实现屏幕解锁、快捷支付以及文件加密等多种功能，该电子设备可以为现有技术中的手机或者平板电脑等常见终端。首先参考图4和图5所示，本申请实施例提供的指纹识别模组包括层叠设置的芯片封装结构100以及柔性电路板10，具体设置时，芯片封装结构100可以为采用LGA(Land Grid Array，栅格阵列封装)技术封装的结构，包括基板20和指纹识别 芯片30，其中，基板20包括第一表面21和第二表面22，基板20的第一表面21朝向柔性电路板10设置，第二表面22背向柔性电路板10设置，指纹识别芯片30即固定于其第二表面22，具体固定方式可以采用粘胶40粘接。在将指纹识别芯片30与基板20电连接时，指纹识别芯片30上设置有第一管脚31，第二表面22上避开指纹识别芯片30的区域设置有第二管脚23，利用金属线50将第一管脚31与第二管脚23之间进行连接即可。请继续参考图4所示，芯片封装结构100还包括设置于指纹识别芯片30背离基板20的一侧的塑封层60，该塑封层60可用于包覆指纹识别芯片30和金属线50，以及至少包覆第二表面22上设置有第二管脚23的区域，以减小这些器件被损坏的风险。The fingerprint identification module provided by the embodiments of the present application can be applied to electronic equipment. Using its fingerprint identification technology, the electronic equipment can realize various functions such as screen unlocking, quick payment, and file encryption. The electronic equipment can be an existing technology. Common terminals such as mobile phones or tablets. First, referring to FIGS. 4 and 5, the fingerprint identification module provided by the embodiment of the present application includes a stacked chip packaging structure 100 and a flexible circuit board 10. When specifically set up, the chip packaging structure 100 may adopt LGA (Land Grid Array) , Grid array packaging) technology package structure, including a substrate 20 and a fingerprint recognition chip 30, wherein the substrate 20 includes a first surface 21 and a second surface 22, the first surface 21 of the substrate 20 is disposed facing the flexible circuit board 10, The two surfaces 22 are arranged opposite to the flexible circuit board 10, and the fingerprint identification chip 30 is fixed on the second surface 22 thereof. The specific fixing method may be adhesive 40 bonding. When the fingerprint identification chip 30 is electrically connected to the substrate 20, the fingerprint identification chip 30 is provided with a first pin 31, and the second surface 22 is provided with a second pin 23 in the area avoiding the fingerprint identification chip 30, using a metal wire 50 connect the first pin 31 and the second pin 23. Please continue to refer to FIG. 4, the chip packaging structure 100 further includes a plastic encapsulation layer 60 disposed on the side of the fingerprint identification chip 30 away from the substrate 20. The plastic encapsulation layer 60 can be used to cover the fingerprint identification chip 30 and the metal wire 50, and at least The area where the second pin 23 is provided on the second surface 22 is covered to reduce the risk of damage to these devices.

参考图4、图5和图6所示，柔性电路板10位于靠近基板20的第一表面21的一侧，柔性电路板10的出线区12形成于靠近其第一端11的区域，并且为了便于将柔性电路板10与电子设备的主板进行电连接，柔性电路板10的第一端11应超出基板20；在将柔性电路板10与芯片封装结构100电连接时，基板20的第一表面21的第一区域24设置有走线以及焊盘25，相应地，柔性电路板10上对应第一区域24的焊盘25的位置也设置有连接管脚，这样，通过在焊盘25上点涂锡膏即可将柔性电路板10与芯片封装结构焊接固定，同时还可使两者之间形成电连接，使得两者之间能够相互通信，从而使芯片封装结构100所采集到的电信号能够传输给柔性电路板10，并进一步由柔性电路板10传输至电子设备的主板进行处理。4, 5 and 6, the flexible circuit board 10 is located on the side close to the first surface 21 of the substrate 20, and the outlet area 12 of the flexible circuit board 10 is formed in the area close to the first end 11 thereof, and To facilitate electrical connection between the flexible circuit board 10 and the main board of the electronic device, the first end 11 of the flexible circuit board 10 should extend beyond the substrate 20; when the flexible circuit board 10 is electrically connected to the chip packaging structure 100, the first surface of the substrate 20 The first area 24 of 21 is provided with traces and pads 25. Correspondingly, the position of the pad 25 on the flexible circuit board 10 corresponding to the first area 24 is also provided with connecting pins. In this way, by clicking on the pad 25 Applying solder paste can weld and fix the flexible circuit board 10 and the chip packaging structure, and at the same time, form an electrical connection between the two, so that the two can communicate with each other, so that the electrical signals collected by the chip packaging structure 100 It can be transmitted to the flexible circuit board 10, and further transmitted from the flexible circuit board 10 to the main board of the electronic device for processing.

可以理解的，在本申请的其它实施例中，还可在柔性电路板10上的第二端13同时形成出线区12，该第二端13为柔性电路板10上与第一端11位置相对的一端，参考图9所示，此时，柔性电路板10的第二端13同样超出基板20设置，以便于与电子设备的主板进行电连接。It is understandable that, in other embodiments of the present application, the outlet area 12 can also be formed at the second end 13 on the flexible circuit board 10 at the same time, and the second end 13 is located on the flexible circuit board 10 opposite to the first end 11. As shown in FIG. 9, at this time, the second end 13 of the flexible circuit board 10 is also arranged beyond the base plate 20 to facilitate electrical connection with the main board of the electronic device.

进一步，参考图4所示，柔性电路板10背离基板20的一侧还设置有补强板70。由于柔性电路板10的柔软特性，导致其在受力时容易发生损坏，通过设置补强板70可提高柔性电路板10的强度，使柔性电路板10能够可靠地在芯片封装结构100与电子设备的主板之间传递信号。Furthermore, referring to FIG. 4, a reinforcing plate 70 is further provided on the side of the flexible circuit board 10 facing away from the substrate 20. Due to the soft characteristics of the flexible circuit board 10, it is prone to damage when subjected to force. The strength of the flexible circuit board 10 can be improved by providing the reinforcing plate 70, so that the flexible circuit board 10 can be reliably integrated in the chip packaging structure 100 and electronic equipment Transfer signals between the motherboards.

需要说明的是，本申请实施例的指纹识别模组具体可以基于现有的电容式指纹识别技术来识别用户的指纹，此时，指纹识别芯片30内集成有电容式指纹传感器，当用户按压设置于指纹识别芯片30上的塑封层60时，内部的电容式指纹传感器会根据用户指纹的谷和脊而形成不同的电容差，通过这些不同的电容差即可检测得到用户的指纹信息，所检测到的指纹信息进一步可经过柔性电路板10传输至电子设备的主板，主板通过将检测到的指纹信息与所保存的指纹信息进行比对来进行下一步的操作，具体过程此处不再赘述。It should be noted that the fingerprint identification module of the embodiment of the present application can specifically identify the user's fingerprint based on the existing capacitive fingerprint identification technology. At this time, the fingerprint identification chip 30 is integrated with a capacitive fingerprint sensor. When the user presses the setting In the case of the plastic encapsulation layer 60 on the fingerprint identification chip 30, the internal capacitive fingerprint sensor will form different capacitance differences according to the valleys and ridges of the user’s fingerprint. The user’s fingerprint information can be detected through these different capacitance differences. The obtained fingerprint information can be further transmitted to the main board of the electronic device via the flexible circuit board 10, and the main board performs the next operation by comparing the detected fingerprint information with the stored fingerprint information. The specific process is not repeated here.

为了增强指纹识别模组的结构可靠性，降低由于基板20变形产生应力而导致锡裂的风险，指纹识别模组还包括填充于柔性电路板10与基板20的第一表面21之间的填充胶层80，在形成该填充胶层80时，应满足能够对焊盘25形成良好密封的同时，还能避免填充胶层80延伸至芯片封装结构100的侧面，以提高指纹识别模组的尺寸精度。In order to enhance the structural reliability of the fingerprint recognition module and reduce the risk of tin cracking due to the deformation of the substrate 20, the fingerprint recognition module also includes a filler filled between the flexible circuit board 10 and the first surface 21 of the substrate 20 The layer 80, when forming the glue filling layer 80, should meet the requirements of forming a good seal on the pad 25, while preventing the glue filling layer 80 from extending to the side of the chip packaging structure 100, so as to improve the dimensional accuracy of the fingerprint recognition module .

具体实施时，参考图5和图6所示，基板20的第一表面21还包括避开走线以及焊盘25的第二区域26，该第二区域26靠近第一表面21的一侧边缘设置并且与柔性电路板10的出线区12位置相对，在第二区域26内设置有开槽27，在形成填充胶层80时，该开槽27即可作为胶水的溢流槽使用。具体而言，在将柔性电路板10与基板20焊接固定后，结合图7所示，由于基板20的宽度(即图7中基板20在A方向的尺寸)大于柔性电路板10的宽度(即图7中柔性电路板10在A方向的尺寸)，因此需要将胶水点在基板20上，并沿B方向在柔性电路板10的边缘进行点胶，这样，胶水就会通过毛细作用填充至柔性电路板10与基板20 之间，此时，为了更好地将焊盘25四周密封，可适当地增大点胶量，在将焊盘25完全包裹之后，如果胶水存在富余，该部分富余的胶水会沿柔性电路板10的延伸方向溢流至开槽27内，如图8中所示，这样就可以避免胶水直接由基板20的第一表面21流至芯片封装结构的侧面，从而使形成的填充胶层80被限制在柔性电路板10与基板20之间，使指纹识别模组的尺寸精度得以保证，进而可以减小安装时指纹识别模组与电子设备的壳体干涉的风险。In specific implementation, referring to FIG. 5 and FIG. 6, the first surface 21 of the substrate 20 also includes a second area 26 that avoids the traces and the pads 25, and the second area 26 is close to one side edge of the first surface 21 The slot 27 is arranged in the second area 26 opposite to the outlet area 12 of the flexible circuit board 10. When the glue filling layer 80 is formed, the slot 27 can be used as an overflow slot for glue. Specifically, after the flexible circuit board 10 and the substrate 20 are welded and fixed, as shown in FIG. 7, the width of the substrate 20 (that is, the size of the substrate 20 in the A direction in FIG. 7) is greater than the width of the flexible circuit board 10 (that is, The size of the flexible circuit board 10 in the A direction in FIG. 7), so it is necessary to dot glue on the substrate 20 and dispense glue on the edge of the flexible circuit board 10 along the B direction. In this way, the glue will be filled to the flexibility by capillary action. Between the circuit board 10 and the substrate 20, at this time, in order to better seal the periphery of the pad 25, the amount of glue can be appropriately increased. After the pad 25 is completely wrapped, if there is excess glue, this part of the excess The glue will overflow into the slot 27 along the extension direction of the flexible circuit board 10, as shown in FIG. 8, so that the glue can be prevented from flowing directly from the first surface 21 of the substrate 20 to the side surface of the chip packaging structure, thereby forming The rubber filling layer 80 is limited between the flexible circuit board 10 and the substrate 20, so that the dimensional accuracy of the fingerprint recognition module can be ensured, and the risk of interference between the fingerprint recognition module and the housing of the electronic device during installation can be reduced.

当柔性电路板10上靠近其第二端13的区域也形成有出线区12时，结合图9所示，基板20的第一表面21应具有与位于两端的出线区12分别位置相对的两个第二区域26，此时，该两个第二区域26应分别设置开槽27，以在形成填充胶层80时容纳溢流的胶水。When the flexible circuit board 10 is also formed with an outlet area 12 in the area near the second end 13 thereof, as shown in FIG. 9, the first surface 21 of the substrate 20 should have two outlet areas 12 located at opposite ends. The second area 26. At this time, the two second areas 26 should be respectively provided with slots 27 to accommodate the overflowing glue when the glue filling layer 80 is formed.

需要说明的是，胶水的富余量可通过点胶设备进行控制，由于点胶设备在点胶时会存在误差，因此在设置开槽27的体积时需要将点胶的误差量考虑进去，在本申请实施例中，可以将开槽27的体积设计为不小于0.1mm 3。根据实验验证，点胶完成后，将焊盘25包裹密封之后的胶水富余量可精确控制在0.1mm 3内，因此，当开槽27的体积不小于0.1mm 3时，就可以完全容纳富余的胶水。此外，为了保证基板20的强度，在设计时可使基板20上对应开槽27的区域的厚度H不小于0.1mm。 It should be noted that the excess amount of glue can be controlled by the dispensing equipment. Since the dispensing equipment will have errors during dispensing, it is necessary to take the amount of dispensing error into consideration when setting the volume of the slot 27. In the application embodiment, the volume of the slot 27 can be designed to be not less than 0.1 mm 3 . According to experimental verification, after the glue dispensing is completed, the excess amount of glue after wrapping and sealing the pad 25 can be accurately controlled within 0.1mm 3. Therefore, when the volume of the slot 27 is not less than 0.1mm 3 , the excess glue can be completely contained glue. In addition, in order to ensure the strength of the substrate 20, the thickness H of the area on the substrate 20 corresponding to the groove 27 may not be less than 0.1 mm during design.

上述实施例中，开槽27的具体形状不限，在一个具体的实施方案中，基板20还包括连接于第一表面21与第二表面22之间的侧壁28，在设计时可将开槽27延伸至该侧壁28，例如，在图5和图6所示的实施例中，基板20的横截面形状为跑道形，第二区域26位于跑道形基板20的其中一端，开槽27可延伸至基板20的弧形侧壁。当然，在本申请的其它实施例中，也可以将开槽27设计为封闭式的，即开槽27无需延伸至基板20的侧壁，此时开槽27的横截面可以设计为如图10中所示的圆形，或者如图11中所示的半圆形，亦或者如图12中所示的多边形等多种形状。In the above embodiment, the specific shape of the slot 27 is not limited. In a specific embodiment, the substrate 20 further includes a side wall 28 connected between the first surface 21 and the second surface 22, which can be opened during design. The groove 27 extends to the side wall 28. For example, in the embodiment shown in FIGS. 5 and 6, the cross-sectional shape of the substrate 20 is a racetrack shape, and the second area 26 is located at one end of the racetrack-shaped substrate 20, and the groove 27 It can extend to the arc-shaped sidewall of the substrate 20. Of course, in other embodiments of the present application, the slot 27 can also be designed to be closed, that is, the slot 27 does not need to extend to the side wall of the substrate 20. At this time, the cross section of the slot 27 can be designed as shown in FIG. The circle as shown in FIG. 11, or the semicircle as shown in FIG. 11, or the polygon as shown in FIG. 12, and other shapes.

综上，本申请实施例提供的指纹识别模组，通过在基板上避开走线与焊盘的第二区域设置开槽，在形成填充胶层时可适当地增大点胶量，保证焊盘能够被良好地密封，同时可以使富余的胶水溢流至该开槽内，从而不会对指纹识别模组的外形尺寸产生影响，可以提高指纹识别模组的性能以及结构可靠性。In summary, the fingerprint recognition module provided by the embodiments of the present application provides a slot on the substrate in the second area avoiding the traces and the pads, so that the amount of glue can be appropriately increased when the filling layer is formed to ensure welding The disc can be well sealed, and at the same time, excess glue can overflow into the slot, so that the external dimension of the fingerprint identification module will not be affected, and the performance and structural reliability of the fingerprint identification module can be improved.

此外，本申请实施例还提供了一种用于制作上述实施例所提供的指纹识别模组的方法，以图4至图8所示的实施例为例，该方法可包括以下步骤：In addition, the embodiment of the present application also provides a method for manufacturing the fingerprint identification module provided in the above embodiment. Taking the embodiment shown in FIG. 4 to FIG. 8 as an example, the method may include the following steps:

步骤一：在基板20的第一表面21形成设置有走线和焊盘25的第一区域24以及避开走线和焊盘25的第二区域26；Step 1: On the first surface 21 of the substrate 20, a first area 24 provided with traces and pads 25 and a second area 26 avoiding the traces and pads 25 are formed;

步骤二：将指纹识别芯片30设置于基板20上与第一表面21位置相对的第二表面22，并通过金属线50将指纹识别芯片30上的第一管脚31与第二表面22上的第二管脚23电连接；Step 2: Place the fingerprint identification chip 30 on the second surface 22 of the substrate 20 opposite to the first surface 21, and connect the first pin 31 on the fingerprint identification chip 30 and the second surface 22 through the metal wire 50 The second pin 23 is electrically connected;

步骤三：在指纹识别芯片30背离基板20的一侧形成塑封层60，该塑封层60可用于包覆指纹识别芯片30和金属线50，以及至少包覆第二表面22上设置有第二管脚23的区域，以减少这些器件被损坏的风险；Step 3: Form a plastic encapsulation layer 60 on the side of the fingerprint identification chip 30 away from the substrate 20. The plastic encapsulation layer 60 can be used to cover the fingerprint identification chip 30 and the metal wire 50, and at least cover the second surface 22 with a second tube The area of the pin 23 to reduce the risk of damage to these devices;

步骤四：在第一表面21的第二区域26设置开槽27，该开槽27在后续形成填充胶层80时可充当溢流槽；Step 4: Provide a slot 27 in the second area 26 of the first surface 21, and the slot 27 can serve as an overflow slot when the rubber filling layer 80 is subsequently formed;

步骤五：在柔性电路板10上靠近其第一端11的区域形成出线区12，然后将柔性电路板10叠置于基板20的第一表面21，并使柔性电路板10的第一端11超出基板20以及使柔性电路板10的出线区12与上述开槽27位置相对；Step 5: Form the outlet area 12 on the flexible circuit board 10 near the first end 11 of the flexible circuit board 10, and then stack the flexible circuit board 10 on the first surface 21 of the substrate 20, and make the first end 11 of the flexible circuit board 10 Exceed the substrate 20 and make the outlet area 12 of the flexible circuit board 10 opposite to the above-mentioned slot 27;

步骤六：通过点胶工艺在柔性电路板10与基板20的第一表面21之间形成填充胶层80，具体操作时，在基板20的第一表面21上沿B方向在柔性电路板10的边缘进行点胶，使胶 水通过毛细作用填充至柔性电路板10与基板20之间，此时，为了更好地将焊盘25四周密封，可适当地增大点胶量，在将焊盘25完全包裹之后，如果胶水存在富余，该部分富余的胶水会沿柔性电路板10的延伸方向溢流至开槽27内，这样就可以避免胶水直接由基板20的第一表面21流至芯片封装结构的侧面，从而使形成的填充胶层80被限制在柔性电路板10与基板20之间，使指纹识别模组的尺寸精度得以保证，进而可以减小安装时指纹识别模组与电子设备的壳体干涉的风险；Step 6: A glue filling layer 80 is formed between the flexible circuit board 10 and the first surface 21 of the substrate 20 through a glue dispensing process. During the specific operation, on the first surface 21 of the substrate 20 along the B direction on the flexible circuit board 10 Dispense glue on the edge so that the glue is filled between the flexible circuit board 10 and the substrate 20 by capillary action. At this time, in order to better seal the periphery of the pad 25, the amount of glue can be appropriately increased. After being completely wrapped, if there is surplus glue, this part of the surplus glue will overflow into the slot 27 along the extension direction of the flexible circuit board 10, so as to prevent the glue from directly flowing from the first surface 21 of the substrate 20 to the chip packaging structure Therefore, the formed rubber filling layer 80 is confined between the flexible circuit board 10 and the substrate 20, so that the dimensional accuracy of the fingerprint recognition module can be ensured, thereby reducing the footprint of the fingerprint recognition module and electronic equipment during installation. Risk of personal interference;

步骤七：在柔性电路板10背离基板20的一侧形成补强板70，以提高柔性电路板10的强度，进一步可以提高指纹识别模组的结构可靠性。Step 7: A reinforcing plate 70 is formed on the side of the flexible circuit board 10 away from the substrate 20 to improve the strength of the flexible circuit board 10 and further improve the structural reliability of the fingerprint identification module.

应当理解的是，在上述具体步骤是以柔性电路板的出线区形成在靠近其第一端的区域为例进行的说明，在其它实现方式中，还可以在靠近柔性电路板的第二端也形成出线区，这时基板的第二表面的结构也需做相应变化，此处不再赘述。It should be understood that, in the above specific steps, the outlet area of the flexible circuit board is formed in the area close to the first end of the flexible circuit board as an example. In other implementations, the flexible circuit board may also be located close to the second end of the flexible circuit board. When the lead-out area is formed, the structure of the second surface of the substrate also needs to be changed accordingly, which will not be repeated here.

采用上述方法制作的指纹识别模组，可保证焊盘能够被良好地密封，同时可以使富余的胶水溢流至开槽内，从而不会对指纹识别模组的外形尺寸产生影响，可以提高指纹识别模组的性能以及结构可靠性。The fingerprint recognition module made by the above method can ensure that the pad can be well sealed, and at the same time, the excess glue can overflow into the slot, so that it will not affect the external size of the fingerprint recognition module and can improve the fingerprint Identify the performance and structural reliability of the module.

如图13所示，本申请实施例还提供了一种电子设备200，该电子设备200可以为现有技术中的手机或者平板电脑等常见终端，包括壳体210以及上述任一实施例的指纹识别模组，具体设置时，壳体210上开设有安装槽220，指纹识别模组设置于该安装槽220内，使电子设备200能够基于指纹识别模组实现屏幕解锁、快捷支付以及文件加密等多种功能。以电子设备200为手机为例，一并参考图14所示，当安装槽220设置于手机壳体的中框时，指纹识别模组还可实现电源键的功能，具体来讲，在补强板70背离柔性电路板10的一侧还设置有金属弹片230以电路板240，电路板240与手机的主板电连接，这样，在不同的应用场景下，指纹识别模组就可以实现不同的功能。例如，当用户需要解锁屏幕时，通过使手指触摸指纹识别模组，使指纹识别模组获取用户的指纹信息，然后将该指纹信息通过柔性电路板10传输至手机的主板，主板通过将该指纹信息与所保存的指纹信息进行比对，并在比对结果一致时解锁屏幕；当用户需要开/关机时，可使手指按压指纹识别模组，使金属弹片230接触电路板240并触发电路板240上的按键开关，然后电路板240将开/关信号传输至手机的主板，主板根据接收到的开/关信号来控制开机或者关机。As shown in FIG. 13, an embodiment of the present application also provides an electronic device 200. The electronic device 200 may be a common terminal such as a mobile phone or a tablet computer in the prior art, and includes a housing 210 and the fingerprint of any of the foregoing embodiments. The identification module, when specifically set, is provided with an installation slot 220 on the housing 210, and the fingerprint identification module is set in the installation slot 220, so that the electronic device 200 can realize screen unlocking, quick payment and file encryption based on the fingerprint identification module A variety of functions. Taking the electronic device 200 as a mobile phone as an example, as shown in FIG. 14 together, when the installation slot 220 is provided in the middle frame of the mobile phone housing, the fingerprint recognition module can also realize the function of the power button. Specifically, in the reinforcement The side of the board 70 away from the flexible circuit board 10 is also provided with a metal spring 230 and a circuit board 240, which is electrically connected to the main board of the mobile phone, so that the fingerprint recognition module can achieve different functions in different application scenarios . For example, when the user needs to unlock the screen, the fingerprint identification module can obtain the user's fingerprint information by touching the fingerprint identification module with the finger, and then transmit the fingerprint information to the main board of the mobile phone through the flexible circuit board 10, and the main board passes the fingerprint The information is compared with the stored fingerprint information, and the screen is unlocked when the comparison result is consistent; when the user needs to turn on/off, the fingerprint recognition module can be pressed by the finger to make the metal spring 230 contact the circuit board 240 and trigger the circuit board Then the circuit board 240 transmits the on/off signal to the main board of the mobile phone, and the main board controls the startup or shutdown according to the received on/off signal.

以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this application, and they should all cover Within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims (10)

一种指纹识别模组，其特征在于，包括柔性电路板、基板、指纹识别芯片以及填充胶层，其中：A fingerprint recognition module is characterized by comprising a flexible circuit board, a substrate, a fingerprint recognition chip and a filling layer, wherein: 所述柔性电路板与所述基板层叠设置且包括位置相对的第一端和第二端，所述第一端和所述第二端中的至少一端超出所述基板，所述柔性电路板上靠近超出所述基板的一端形成有出线区；The flexible circuit board is stacked on the substrate and includes a first end and a second end opposite to each other. At least one of the first end and the second end extends beyond the substrate, and the flexible circuit board An exit area is formed near the end beyond the substrate; 所述基板朝向所述柔性电路板设置的第一表面包括第一区域和第二区域，所述第一区域设置有走线以及用于与所述柔性电路板电连接的焊盘，所述第二区域与所述出线区位置相对且设置有开槽；The first surface of the substrate facing the flexible circuit board includes a first area and a second area. The first area is provided with traces and pads for electrical connection with the flexible circuit board. The second area is opposite to the outlet area and is provided with a slot; 所述指纹识别芯片设置于所述基板背向所述柔性电路板的第二表面；The fingerprint identification chip is arranged on a second surface of the substrate facing away from the flexible circuit board; 所述填充胶层所述填充于所述柔性电路板与所述基板之间，用于包裹所述焊盘。The filling glue layer is filled between the flexible circuit board and the substrate for wrapping the pad. 如权利要求1所述的指纹识别模组，其特征在于，所述基板还包括连接于所述第一表面和所述第二表面之间的侧壁，所述开槽延伸至所述侧壁。The fingerprint identification module of claim 1, wherein the substrate further comprises a side wall connected between the first surface and the second surface, and the slot extends to the side wall . 如权利要求1所述的指纹识别模组，其特征在于，所述凹槽的横截面为圆形、半圆形或者多边形。The fingerprint identification module of claim 1, wherein the cross section of the groove is circular, semicircular or polygonal. 如权利要求1所述的指纹识别模组，其特征在于，所述开槽的体积不小于0.1mm 3。 The fingerprint identification module of claim 1, wherein the volume of the slot is not less than 0.1 mm 3 . 如权利要求1所述的指纹识别模组，其特征在于，所述基板上对应所述开槽的区域的厚度不小于0.1mm。3. The fingerprint identification module of claim 1, wherein the thickness of the area on the substrate corresponding to the slot is not less than 0.1 mm. 如权利要求1所述的指纹识别模组，其特征在于，还包括设置于所述柔性电路板背离所述基板的一侧的补强板。5. The fingerprint identification module of claim 1, further comprising a reinforcing plate disposed on a side of the flexible circuit board away from the substrate. 如权利要求1～6任一项所述的指纹识别模组，其特征在于，还包括设置于所述指纹识别芯片背离所述基板的一侧的塑封层，所述塑封层用于包埋所述指纹识别芯片。The fingerprint identification module according to any one of claims 1 to 6, further comprising a plastic encapsulation layer disposed on the side of the fingerprint identification chip away from the substrate, and the plastic encapsulation layer is used to embed The fingerprint identification chip. 如权利要求7所述的指纹识别模组，其特征在于，所述基板、所述指纹识别芯片以及所述塑封层采用栅格阵列封装为一体封装结构。8. The fingerprint identification module of claim 7, wherein the substrate, the fingerprint identification chip, and the plastic encapsulation layer adopt a grid array package as an integral package structure. 一种电子设备，其特征在于，包括壳体以及如权利要求1～8任一项所述的指纹识别模组，所述壳体开设有安装槽，所述指纹识别模组设置于所述安装槽内。An electronic device, comprising a housing and the fingerprint identification module according to any one of claims 1 to 8, wherein the housing is provided with a mounting slot, and the fingerprint identification module is arranged in the mounting In the slot. 如权利要求9所述的电子设备，其特征在于，所述电子设备为手机，所述安装槽开设于所述壳体的中框上。9. The electronic device of claim 9, wherein the electronic device is a mobile phone, and the mounting slot is opened on the middle frame of the housing.
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