CN217007396U - Tin-copper alloy detector - Google Patents
Tin-copper alloy detector Download PDFInfo
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- CN217007396U CN217007396U CN202122660070.8U CN202122660070U CN217007396U CN 217007396 U CN217007396 U CN 217007396U CN 202122660070 U CN202122660070 U CN 202122660070U CN 217007396 U CN217007396 U CN 217007396U
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- insulating substrate
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- copper alloy
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Abstract
A tin-copper alloy detector is used for measuring the electrical characteristics of a semiconductor element and comprises a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is reserved between every two adjacent spheres, and each sphere is used for a contact point which is in contact with a measurement target. The utility model adopts the structure that the ball body is simply embedded into the surface of the insulating substrate, and the structure is simple; the sphere is used as a contact point with the measurement target, so that the risk that the measurement target is damaged does not exist, the position relation between the sphere and the measurement target can be maintained at high precision, and accurate positioning is realized.
Description
Technical Field
The utility model relates to an electrical characteristic measuring device of a semiconductor element, in particular to a tin-copper alloy detector.
Background
Probes used for measuring electrical characteristics of semiconductor devices (wafers and chips) are generally tips of a plurality of needle-like contactors (probes) to be pressed against a surface of an object to be measured (semiconductor device).
The probe having the above-described structure is required to press the tip of the probe against a measurement target and to contact the measurement target when measuring the electrical characteristics of the semiconductor element, and since the probe itself has a certain curvature, there is a risk that the contact position between the probe and the measurement target is displaced, and particularly when the surface of the measurement target has a curved surface, a large positional deviation is likely to occur, and such a positional deviation becomes an error factor when measuring the electrical characteristics of the measurement target, and therefore, it is required to maintain, for example, a sufficiently high supporting accuracy of the probe, but for this reason, there is a problem that the probe structure becomes complicated. Further, since the tip of the probe is pressed against the measurement target, there is a risk that the measurement target may be damaged by the tip.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a sn-cu alloy probe, which has a simple structure and can reliably prevent the displacement between the device under test and the probe in contact therewith, and prevent the device under test from being scratched.
The utility model is realized in such a way that the technical scheme adopted by the tin-copper alloy detector is as follows: a tin-copper alloy detector is used for an electrical characteristic measuring device of a semiconductor element and comprises a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is reserved between every two adjacent spheres, and each sphere is used for a contact point which is in contact with a measuring target.
Further, the ball is made of a solder ball having a low-resistance conductive material as a core and a surface coated with solder, the ball is embedded in a groove formed on the surface of the insulating substrate, and the ball is soldered to a conductive layer previously provided on the insulating substrate by a reflow process.
Further, the low-resistance conductive material is a tin-copper alloy.
Further, the insulating substrate is a printed circuit board having a conductive layer of a predetermined wiring pattern;
specifically, the insulating substrate is preferably a flexible printed circuit board.
Compared with the prior art, the tin-copper alloy detector provided by the utility model has the beneficial effects that the tin-copper alloy detector is used for the electrical characteristic measuring device of a semiconductor element, and comprises a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is formed between every two adjacent spheres, and the spheres are used for contact points which are contacted with a measuring target. The utility model adopts the structure that the ball body is simply embedded into the surface of the insulating substrate, and the structure is simple; the sphere is used as a contact point with the measurement target, so that the risk that the measurement target is damaged does not exist, the position relation between the sphere and the measurement target can be maintained at high precision, and accurate positioning is realized.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a top view of a schematic structure of a main portion of a tin-copper alloy probe according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional structural diagram of a tin-copper alloy detector shown in fig. 1 according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a ball embedded insulating substrate of a sn-cu alloy detector according to an embodiment of the present invention.
Fig. 4 is a schematic horizontal plane usage diagram of a tin-copper alloy detector according to an embodiment of the present invention.
Fig. 5 is a schematic view illustrating a curved surface of a sn-cu alloy detector according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and do not limit the utility model.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; it is to be understood that, if the terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on those shown in the drawings, they are only used for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore, the terms describing the positional relationships in the drawings are only used for illustrative purposes and are not to be construed as limitations of the present patent, and the specific meanings of the terms can be understood by those skilled in the art according to specific situations.
The technical solution of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.
The utility model provides a tin-copper alloy detector, which is used for an electrical characteristic measuring device of a semiconductor element and comprises a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is formed between every two adjacent spheres, and each sphere is used for a contact point which is in contact with a measuring target.
The tin-copper alloy detector comprises a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is reserved between every two adjacent spheres, and each sphere is used for a contact point which is in contact with a measurement target. The utility model adopts the structure that the ball body is simply embedded into the surface of the insulating substrate, and the structure is simple; the sphere is used as a contact point with the measurement target, so that the risk that the measurement target is damaged does not exist, the position relation between the sphere and the measurement target can be maintained at high precision, and accurate positioning is realized.
As an embodiment of the present invention, the ball is made of a solder ball having a low-resistance conductive material as a core and a surface coated with solder, the ball is embedded in a groove formed on a surface of the insulating substrate, and the ball is soldered to a conductive layer previously provided on the insulating substrate by a reflow soldering process.
In one embodiment of the present invention, the low-resistance conductive material is a tin-copper alloy.
In one embodiment of the present invention, the insulating substrate is a printed circuit board having a conductive layer with a predetermined wiring pattern.
Specifically, the insulating substrate is preferably a flexible printed circuit board.
Referring to fig. 1 to 5, a preferred embodiment of the present invention:
fig. 1 is a plan view showing a front end portion of a schematic structure of a main portion of a probe of the present embodiment, and fig. 2 is a schematic view of an X-X cross-sectional configuration of fig. 1, for example, the probe is configured by embedding approximately half of a plurality of balls 2 having a diameter of 0.3mm as contacts on a surface of a flexible printed circuit board 1 having a thickness of 350 μm, each ball 2 is made of a low-resistance conductive material, the surface thereof is coated with solder having a tin-copper alloy core, and adjacent balls 2 have a predetermined interval therebetween. The balls 2 are arranged side by side in a straight line at the end of the flexible printed circuit board 1.
In the present embodiment, the six balls 2 have a pair of contacts 2a, 2a for supplying current, a pair of contacts 2b, 2b for detecting a first potential, and a pair of contacts 2c, 2c for detecting a second potential; the current source contacts 2a and 2a are provided at a distance of, for example, 15mm, and the first potential detecting contacts 2b and 2b are each 1mm from the current source contacts 2a and 2a, and the second potential detecting contacts 2c and 2c are arranged symmetrically to each other at a distance of 4mm from the inside of the current source contacts 2a and 2 a; each of the balls 2 is connected to the ends of six wires 3 forming a predetermined wiring pattern printed on the flexible printed circuit board 1, the wires 3 (wiring patterns) are connected to each other, and the probe is connected to a measuring device through the wires 3 for use.
The manner in which the respective balls 2 are embedded in the flexible printed circuit board 1 is as follows: as shown in the cross-sectional structure of fig. 2, first, a hole 4 having a diameter of 0.25mm is formed in an insulating layer 1a having a thickness of about 0.2mm covering the surface of the flexible printed circuit board 1 to expose the lead 3; then, the ball 2 is fitted into the hole 4 so that the ball 2 is placed on the lead 3, and then the ball 2 is removed from the surface of the flexible printed circuit board 1, so that the solder coated on the surface of the ball 2 is heated by heating the ball 2 and the portion of the flexible printed circuit board 1 where the ball 2 is placed, and the ball 2 is soldered to the lead 3 by a reflow soldering process.
By such a reflow process, a plurality of balls 2 are embedded and formed as contacts on the surface of the flexible printed circuit board 1. After that, the plate-shaped support member 8 is attached to the back side of the flexible printed circuit board 1 as needed, for example, when the rigidity of the portion of the flexible printed circuit board 1 in which the plurality of spherical bodies 2 as the contacts are embedded is needed, the support member 8 may be a plastic plate or the like.
As shown in fig. 3, a conductor portion 3a connected to the conductor line 3 is provided around the peripheral wall of the hole 4 of the insulating layer 1a and the hole 4 of the insulating layer 1 a. It is also useful to perform soldering between the insulating layer 1a, the ball 1 In the hole 4 and the conductor portion 3a In the assembly, and In this case, it is preferable to use a solder having excellent conductivity and high mechanical strength, such as an Ag — Pb-In alloy, and of course, it is also possible to fill the hole 4 with a powder of an Ag — Pb-In alloy or the like and reflow-solder the ball 2.
By embedding the spherical body 2 in the flexible printed circuit board 1 and soldering the spherical body 2 to the flexible printed circuit board 1 in this manner, the joint area between the spherical body 2 and the conductor portion 3a via the solder layer is increased. Therefore, it is possible to reliably prevent the spherical body 2 from being peeled off from the flexible printed circuit board 1 and easily realize a probe having excellent mechanical strength.
If, as shown in fig. 4, the surface of the measurement target 10 is flat, for example, the measurement target 10 is a printed circuit board using a predetermined jig 7, the tips of a plurality of balls 2 embedded in the surface of a flexible printed circuit board 1 as shown in fig. 1 are precisely positioned on the surface of the measurement target 10 at predetermined intervals, so that the electrical characteristics of the measurement target 10 can be accurately checked through the plurality of balls 2.
As shown in fig. 5, when the surface of the measurement target 10 is a curved surface, as described above, an elastic member is used as the support member 8, and a printed circuit is provided by the elastic member; when the flexible printed circuit board 1 is pressed against the measurement target 10, the flexible printed circuit board 1 is deformed according to the surface shape of the measurement target 10, and tips of the plurality of balls 2 embedded in the surface form a contact of the flexible printed circuit board 1 to abut against the surface of the measurement target 10; at this time, since each ball 2 is embedded in the surface of the flexible printed circuit board 1 and fixed at a predetermined position, the distance between the contact positions with the measurement target 10 is not deviated as in the conventional probe head; thus, it is possible to accurately determine the position of the measurement point and simultaneously accurately measure the electrical characteristics of the measurement target 10.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (4)
1. The tin-copper alloy detector is characterized by comprising a plurality of spheres and an insulating substrate, wherein one part of each sphere protrudes out of the surface of the insulating substrate, the other part of each sphere is embedded in the insulating substrate, a certain interval is reserved between every two adjacent spheres, and each sphere is used for a contact point which is in contact with a measurement target.
2. A tin-copper alloy probe according to claim 1, wherein said ball is a solder ball having a core of a low resistance conductive material and a surface coated with solder, said ball is embedded in a groove formed on a surface of said insulating substrate, and said ball is soldered to a conductive layer previously provided on said insulating substrate by a reflow soldering process.
3. A tin-copper alloy probe according to claim 2, wherein the low resistance conductive material is a tin-copper alloy.
4. A tin-copper alloy probe according to claim 3, wherein said insulating substrate is a printed circuit board having a conductive layer with a predetermined pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122660070.8U CN217007396U (en) | 2021-11-03 | 2021-11-03 | Tin-copper alloy detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122660070.8U CN217007396U (en) | 2021-11-03 | 2021-11-03 | Tin-copper alloy detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217007396U true CN217007396U (en) | 2022-07-19 |
Family
ID=82379696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122660070.8U Active CN217007396U (en) | 2021-11-03 | 2021-11-03 | Tin-copper alloy detector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217007396U (en) |
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2021
- 2021-11-03 CN CN202122660070.8U patent/CN217007396U/en active Active
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