CN216988825U

CN216988825U - Semiconductor cleaning equipment

Info

Publication number: CN216988825U
Application number: CN202123194856.1U
Authority: CN
Inventors: 闫亮; 王广永
Original assignee: Beijing Naura Microelectronics Equipment Co Ltd
Current assignee: Beijing Naura Microelectronics Equipment Co Ltd
Priority date: 2021-12-17
Filing date: 2021-12-17
Publication date: 2022-07-19
Anticipated expiration: 2031-12-17

Abstract

The utility model discloses a semiconductor cleaning device, which is used for cleaning and drying a clamping part of a manipulator, wherein the clamping part is provided with a plurality of bearing grooves for clamping a wafer, and the cleaning device comprises a cleaning mechanism and a drying mechanism; the cleaning mechanism comprises a cleaning tank for receiving cleaning liquid; the drying mechanism comprises an air inlet assembly and an air spraying device, the air spraying device is arranged above the tank body of the cleaning tank, the air inlet assembly is communicated with the air spraying device, and the air inlet assembly is used for introducing sweeping gas into the air spraying device; the air outlet end of the air injection device is provided with a flow guide channel group, the flow guide channel group is provided with a plurality of flow guide channels which are distributed at intervals along a first direction, the sweeping gas is injected to the clamping part through the flow guide channels, and the first direction is the distribution direction of the plurality of bearing grooves. The problem that the drying effect of manipulator is relatively poor can be solved to above-mentioned scheme.

Description

Semiconductor cleaning equipment

Technical Field

The utility model relates to the technical field of mechanical arm cleaning, in particular to a semiconductor cleaning device.

Background

The transshipment of wafer between a plurality of washing tanks is realized through the manipulator, in order to prevent that the manipulator from causing the cross contamination between the washing tank, the manipulator all need wash, dry the manipulator when snatching the wafer at every turn to get rid of the remaining liquid medicine of manipulator.

In the related art, the drying device comprises a gas injection assembly, and the gas injection assembly is used for injecting gas to purge the manipulator. The gas injection assembly comprises a gas pipeline and a plurality of spray heads, the plurality of spray heads are arranged at intervals along the axis direction of the gas pipeline, and the plurality of spray heads are communicated with the gas pipe. And blowing gas is introduced into the gas pipe, and the blowing gas is sprayed out from the spray head and sprayed onto the manipulator, so that the residual liquid drops of the cleaning liquid on the manipulator are dried.

However, because nozzle spun air current is radially to make the air current form fan-shaped wind surface, when the air current reachd the manipulator, the liquid drop can be blown away, causes the liquid drop to splash everywhere, and then influences the drying effect of manipulator, thereby makes the drying effect of manipulator relatively poor.

SUMMERY OF THE UTILITY MODEL

The utility model discloses semiconductor cleaning equipment, which aims to solve the problem of poor drying effect of a manipulator.

In order to solve the problems, the utility model adopts the following technical scheme:

the semiconductor cleaning equipment is used for cleaning and drying a clamping part of a manipulator, wherein the clamping part is provided with a plurality of bearing grooves for clamping wafers, and the cleaning equipment comprises a cleaning mechanism and a drying mechanism;

the cleaning mechanism comprises a cleaning tank for receiving cleaning liquid;

the drying mechanism comprises an air inlet assembly and an air injection device, the air injection device is arranged above the tank body of the cleaning tank, the air inlet assembly is communicated with the air injection device, and the air inlet assembly is used for introducing purging gas into the air injection device;

the air outlet end of the air injection device is provided with a flow guide channel group, the flow guide channel group is provided with a plurality of flow guide channels which are distributed at intervals along a first direction, the sweeping gas is injected to the clamping part through the flow guide channels, and the first direction is the distribution direction of the plurality of bearing grooves.

The technical scheme adopted by the utility model can achieve the following beneficial effects:

in the semiconductor cleaning equipment disclosed by the utility model, the gas outlet end of the gas injection device is provided with a flow guide channel group, the flow guide channel group is provided with a plurality of flow guide channels which are distributed at intervals along a first direction, and the purging gas is injected to the clamping part through the flow guide channels. In this scheme, the water conservancy diversion passageway can carry out the water conservancy diversion to gas, and gas after the water conservancy diversion passageway water conservancy diversion, the gas that erupts can maintain the column structure of certain distance, and the air current of column structure sweeps the region and concentrates, is difficult to cause the liquid drop to splash everywhere consequently to improve the drying effect of manipulator, and then make the drying effect of manipulator relatively poor.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

fig. 1 and 2 are schematic structural views of a robot in the related art;

FIG. 3 is a schematic structural diagram of an air injection device in a semiconductor cleaning apparatus according to an embodiment of the present invention;

FIG. 4 is a front view of an air injection device in the semiconductor cleaning apparatus according to the embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of another semiconductor cleaning apparatus according to an embodiment of the present invention.

Description of reference numerals:

100-drying mechanism, 110-air inlet device, 120-filtering device, 121-first filter, 122-second filter, 130-fan, 131-power module, 132-frequency conversion module, 133-control module, 134-fan body, 140-air injection device, 141-base body part, 142-injection part, 1421-air outlet end, 1422-air inlet end, 1423-upper surface, 1424-lower surface, 1425-chamfer, 1426-cavity, 143-diversion channel, 150-air supply pipeline, 160-pressure regulating valve, 170-pneumatic valve, 150-pneumatic valve, air-supply pipeline, air-supply and air-supply valve, air-supply pipeline, air-supply valve, air-supply and air-supply pipeline, air-supply and air-supply pipeline, air-supply air-supply valve, air-supply device, air-supply valve, air-supply air-supply device, air-supply valve, air-supply device, air-supply valve, air-supply device, air-supply device, air-supply device, air-drying device, air,

200-cleaning mechanism, 210-liquid supply pipe, 220-flow regulating valve, 230-control valve, 240-cleaning tank, 250-spraying portion,

300-robot, 310-grip, 311-load-bearing trough.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the disclosed embodiments are merely exemplary of the utility model, and are not intended to be exhaustive or exhaustive. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

As shown in fig. 3 to 6, the embodiment of the present invention discloses a semiconductor cleaning apparatus for cleaning and drying a clamping portion 310 of a robot 300, wherein the clamping portion 310 has a plurality of carrying grooves 311 for clamping a wafer, and when the robot 300 clamps the wafer, the wafer is clamped in the carrying grooves 311. The disclosed cleaning apparatus includes a cleaning mechanism 200 and a drying mechanism 100.

The cleaning mechanism 200 is used to clean the nip portion 310, and the drying mechanism 100 is used to dry the cleaned nip portion 310.

The cleaning mechanism 200 includes a cleaning tank 240 and a spraying part 250, the cleaning tank 240 is used for receiving a cleaning solution, the spraying part 250 can be disposed in the cleaning tank 240, and the spraying part 250 can spray the cleaning solution onto the clamping part 310. The drying mechanism 100 includes an air intake assembly and an air injection device 140, the air injection device 140 is disposed above the tank body of the cleaning tank 240, the air intake assembly is communicated with the air injection device 140, and the air intake assembly is used for introducing purge gas into the air injection device 140. The gas outlet 1421 of the gas injector 140 has a flow guiding channel group having a plurality of flow guiding channels 143 spaced along a first direction, and the purge gas is emitted to the clamping portion 310 through the flow guiding channels 143, where the first direction is a distribution direction of the plurality of carrying grooves 311.

In a specific operation, first, the cleaning liquid is sprayed onto the clamping portion 310 through the spraying portion 250, so as to clean the clamping portion 310. The sprayed cleaning solution falls into the cleaning tank 240. Then the manipulator rises to the position opposite to the air outlet end of the air injection device 140, the air inlet assembly introduces purge gas into the air injection device 140, and the purge gas passes through the flow guide channel 143 and then is injected onto the clamping part 310, so that the residual liquid drops on the clamping part 310 are dried.

Of course, in order to achieve a better cleaning effect, before the spray part 250 performs the spray cleaning, the cleaning solution may be filled into the cleaning tank 240 and overflowed, the holding part 310 may be immersed in the cleaning tank 240, and the cleaning solution in the cleaning tank 240 may be drained after the overflow is completed.

In the embodiment disclosed in the application, the water conservancy diversion passageway 143 can carry out the water conservancy diversion to the purge gas, and the purge gas is after the water conservancy diversion of water conservancy diversion passageway 143, and the gas that erupts can maintain the column structure of certain distance, and the air current of column structure sweeps the regional concentration, is difficult to cause the liquid drop to splash everywhere consequently to improve the drying effect of manipulator 300, and then make the drying effect of manipulator 300 relatively poor.

In addition, the air flow after the diversion of the diversion channel 143 sweeps the area concentratedly, so the sweep range of a single diversion channel 143 is smaller, but the quantity of the diversion channels 143 is a plurality, so that the whole sweep area of the air injection device 140 is larger, and the air injection device 140 can cover a larger sweep range.

In addition, the arrangement direction of the flow guide channels 143 is the same as the distribution direction of the bearing groove 311, so that the airflow can be easily blown into the bearing groove 311, and the drying effect of the manipulator 300 is further improved.

Alternatively, the air jet device 140 may be made of a material with high shape and cleanliness, such as polyvinylidene fluoride.

Further, the number of the flow guide channel groups may be plural, and the distance between the axes of two adjacent flow guide channels 143 in each flow guide channel group may not be greater than the distance between two adjacent bearing grooves 311, that is, the distance between the axes of two adjacent flow guide channels 143 in each flow guide channel group is less than or equal to the distance between the bearing grooves 311. The plurality of flow guide channel groups may be spaced apart along the second direction, the first direction may be perpendicular to the second direction, and the flow guide channels 143 of adjacent flow guide channel groups may be staggered.

In this scheme, each flow guide channel 143 can purge one bearing groove 311, so that the phenomenon that the bearing groove 311 cannot be purged can be avoided, and the drying effect of the manipulator 300 is improved. In addition, the number of the flow guide channel groups can be multiple, and at this time, the purging range of the air injection device 140 is further increased, so that one bearing groove 311 can be purged by the multiple flow guide channels 143, and the drying efficiency of the drying mechanism 100 is improved. In addition, the adjacent flow guide channel groups are distributed in a staggered manner, and each flow guide channel 143 in the next column corresponds to a gap between two adjacent flow guide channels 143 in the previous column, so that each bearing groove 311 can be ensured to be purged.

Specifically, there may be three flow guide channel groups, the diameter of the flow guide channel 143 in each group is 2mm, and the distance between the axes of two adjacent flow guide channels 143 may be 5 mm.

In order to make the flow guiding channel 143 have good flow guiding performance, in another alternative, the length of the flow guiding channel 143 may be not less than 5mm, so that the purge gas can purge the clamping portion 310 with columnar gas flow. The scheme can further improve the flow guide performance of the sweeping gas and avoid gas diffusion.

To further prevent splashing of the droplets around, in an alternative embodiment, the flow guide channels 143 may be arranged obliquely downwards. In this embodiment, the purge gas ejected from the gas ejecting device 140 is inclined downward, so that the gas flow direction approaches the gravity direction, so that the liquid droplets slide downward, thereby further preventing the liquid droplets from splashing. In addition, the gas of the gas injection device 140 flows obliquely downward, so that the lower part of the gas pressure between the clamping part 310 and the gas injection device 140 is high, and the upper part of the gas pressure is low, so that the gas flow between the clamping part 310 and the gas injection device 140 flows from top to bottom, thereby preventing the liquid drops from splashing upward, further preventing the liquid drops from splashing, and further improving the drying effect.

In another alternative embodiment, the injector 140 may include a base portion 141 and an injector portion 142, the injector portion 142 may have an outlet end 1421 and an inlet end 1422 opposite to each other, and the inlet end 1422 of the injector portion 142 may communicate with the air intake assembly through the base portion 141. In the injection direction of the purge gas, the injection part 142 is provided with a tapered cavity 1426, and the cavity 1426 communicates with the flow guide passage 143. The injection direction of the purge gas is from the gas inlet 1422 to the gas outlet 1421. In this embodiment, the cavity 1426 in the injection part 142 is tapered along the injection direction of the purge gas, so as to facilitate the collection of the gas and increase the injection pressure of the gas. In addition, the cavity 1426 of the injector 142 can also guide the gas, thereby further preventing the gas flow from spreading and causing the liquid droplets to splash.

Further, an upper surface 1423 and a lower surface 1424 are disposed between the air outlet end 1421 and the air inlet end 1422, and the upper surface 1423 and the lower surface 1424 are both arc-shaped surfaces. At this time, when the droplets are sputtered onto the upper surface 1423 and the lower surface 1424, they are not easily gathered on the upper surface 1423 and the lower surface 1424, thereby facilitating the droplet landing.

The lower surface 1424 is an arc surface, and when the purge air blown out from the ejection unit 142 is reflected and returned by the robot 300, the purge air can flow along the lower surface 1424, thereby having a flow guide effect on the reflected gas.

Further, a chamfer 1425 may be disposed between the end surface of the venting end 1421 and the lower surface 1424. In this embodiment, the chamfer 1425 has a flow guide effect on the sputtered droplets, and therefore the droplets can be further prevented from splashing.

In another alternative embodiment, the size of the outlet 1421 and the inlet 1422 along the first direction may be the same, the size of the outlet 1421 along the second direction may be smaller than the size of the inlet 1422 along the second direction, and the center of the outlet 1421 coincides with the center of the inlet 1422. In this embodiment, since the width of the end surface of the gas outlet 1421 is small, the spraying portion 142 is similar to a trapezoid structure, and the area of the side of the spraying portion 142 where the flow guide channel 143 is disposed is small, so that it can be avoided that the purged liquid droplets are splashed onto the spraying portion 142, which causes the liquid droplets to be splashed around, and affects the drying effect of the manipulator 300.

Meanwhile, the external shape structure of the injection part 142 is matched with the internal cavity 1426 structure, and both are tapered structures, so that the structure of the injection part 142 is more compact.

A specific structure of the air intake assembly is disclosed herein, but the air intake assembly may have other structures, and is not limited herein. Specifically, as shown in fig. 5, the air intake assembly may include an air intake device 110, a filter device 120, and a fan 130, and the air intake device 110, the filter device 120, the fan 130, and the air injection device 140 are sequentially communicated.

The fan 130 may be used to drive air in from the air intake 110 and out from the air jet 140. The filter device 120 may be used to remove particles from the air, and the filter element of the filter device 120 may collide and rub against the particles to generate heat to heat the air.

In a specific operation process, the blower 130 may form a negative pressure, so that the pressure inside the air inlet device 110 is low, external air is sucked in, the external air enters from the air inlet device 110, is filtered by the filter device 120, is transmitted to the air injection device 140, and is emitted to the clamping portion 310 through the air injection device 140, so as to purge the clamping portion 310.

In the embodiment disclosed in the present application, the filtering device 120 is used for filtering particulate matters in the air, and meanwhile, the filtering core of the filtering device 120 can collide with the filtering matters in the air and generate heat through friction, and the heat can heat the air, so that the temperature of the air sprayed by the air spraying device 140 is higher, and therefore the evaporation efficiency of the residual liquid drops on the clamping portion 310 can be increased, the drying efficiency of the drying mechanism 100 can be improved, and the process time required by the drying of the manipulator 300 can be shortened. In addition, air can be sucked by the fan 130, and the robot 300 is purged by the air, so that the cost of the air is low, and the cost of the semiconductor cleaning equipment is low.

In another alternative embodiment, the filtering device 120 may include a first filter 121 and a second filter 122, and the air inlet device 110, the first filter 121, the fan 130, the second filter 122, and the air injection device 140 may be sequentially communicated. The volume of the particulate matter filtered by the second filter 122 may be smaller than the volume of the particulate matter filtered by the first filter 121, and the filtering accuracy of the second filter 122 is higher than that of the first filter 121. This scheme adopts the two-stage filtration, and filterable effect is better, consequently makes the content of the particulate matter in the air that erupts few, has improved manipulator 300's clean effect. In addition, the two-stage filtration can generate heat, so that the temperature of air is further increased, and the drying efficiency is further improved.

The present application discloses a specific structure of the fan 130, but the fan 130 may also be other structures, and the present application is not limited herein. Specifically, the fan 130 may include a power module 131, a frequency conversion module 132, a control module 133, and a fan body 134, where the power module 131 is configured to provide electric energy for the frequency conversion module 132, the control module 133, the fan body 134, and other components of the fan 130, and the power module is an energy source of the fan 130. The control module 133 is a control part of the wind turbine 130, and a user may modify parameters and configurations in the control module 133 to control the wind turbine 130. The frequency conversion module 132 is used for adjusting the rotation speed of the fan main body 134, and further adjusting the flow rate and the temperature of the air of the drying mechanism 100 by adjusting the rotation speed of the fan main body 134.

The power module 131 may be electrically connected to the frequency conversion module 132 and the control module 133, respectively, the control module 133 may be in control connection with the frequency conversion module 132, the frequency conversion module 132 may be connected to the fan main body 134, and the frequency conversion module 132 may be configured to adjust an output frequency of the fan main body 134.

In this scheme, the user can control the frequency conversion module through revising control module 133 to make the frequency conversion module export corresponding frequency to fan main part 134, with the rotational speed of adjusting fan main part 134, thereby can adjust the flow and the temperature of gas that gas jet system 140 spun, can adjust drying efficiency.

For example, the frequency of the fan 130 may be increased to increase the rotation speed of the fan main body 134, so that the air flow rate sucked by the drying mechanism 100 is increased, the flow rate of the ejected air is larger, and the sucked air flow rate is increased, so that the content of the particulate matter is increased, the collision is increased, the heat of the air is higher, and the drying efficiency of the robot 300 is faster.

Of course, the frequency of the fan 130 may be reduced to reduce the rotation speed of the fan 130, so that the drying mechanism 100 may suck a small amount of air, and spray the air with a small amount of air, and the sucked air with a small amount of air may have a small content of particulate matter therein, resulting in a weak collision effect and a low heat of air, thereby slowing the drying efficiency of the robot 300.

Therefore, the drying efficiency of the mechanical arm 300 can be accurately controlled, the requirements of different mechanical arms 300 for drying are met, and the service efficiency of the drying mechanism 100 is improved.

The semiconductor cleaning apparatus in the above embodiment may be disposed in a clean room, and thus the gas sucked by the drying mechanism 100 may be clean air purified in the clean room.

Of course, the purge gas is not limited to the air, and may be other gas, such as high purity nitrogen, and when the purge gas is high purity nitrogen, as shown in fig. 6, the air intake assembly may include an air supply line 150, a pressure regulating valve 160, and a pneumatic valve 170, and the air supply line 150, the pressure regulating valve 160, the pneumatic valve 170, and the air injection device 140 are sequentially communicated. The gas supply line 150 is in communication with a source of high purity nitrogen. The pressure regulating valve 160 is used to regulate the pressure of the high purity nitrogen gas ejected from the gas ejection device 140. Pneumatic valve 170 is used to communicate the high purity nitrogen gas source to the sparging device 140.

In a specific operation, when the pneumatic valve 170 is opened, high purity nitrogen gas is injected onto the nip 310 by the gas injection device 140.

In order to further improve the drying efficiency of the robot 300, in another alternative embodiment, the number of the air injection devices 140 may be multiple, the multiple air injection devices 140 may be all communicated with the air intake assembly, there are two clamping portions 310, each clamping portion 310 corresponds to two air injection devices 140, the air outlet ends 1421 of the two air injection devices 140 may be disposed opposite to each other, and the clamping portion 310 may be located between the two air injection devices 140. In this scheme, every clamping part 310 corresponds two air jet device 140, and air jet device 140 can sweep the positive and negative of clamping part 310 all to increased clamping part 310's drying area, thereby improved clamping part 310's drying effect, in addition, two air jet device 140 sweep clamping part 310 simultaneously, further improved manipulator 300's drying efficiency, shortened manipulator 300's drying time.

The present application discloses a specific structure of the cleaning mechanism 200, but the cleaning mechanism 200 may have other structures, and is not limited herein. Specifically, the cleaning mechanism 200 further includes a liquid supply pipe 210, a flow regulating valve 220, a control valve 230, and a spraying part 250, the liquid supply pipe 210, the flow regulating valve 220, the control valve 230, and the spraying part 250 are sequentially communicated, the spraying part 250 may be disposed in the tank body of the cleaning tank 240, the flow regulating valve 220 may be configured to control a flow rate of the cleaning liquid introduced thereto, and the control valve 230 may be configured to control on/off of the cleaning liquid of the spraying part 250. The shower portion 250 can spray a cleaning liquid onto the nip portion 310, thereby cleaning the nip portion 310.

The liquid supply pipe 210 is communicated with a cleaning liquid tank to provide cleaning liquid for the semiconductor cleaning equipment, and the cleaning liquid can be deionized water. The flow rate control valve 220 can control the water pressure of the cleaning liquid introduced into the cleaning mechanism 200, thereby controlling the cleaning water pressure sprayed from the shower unit 250. The control valve 230 is used to control the spraying part 250 to spray the cleaning liquid. The cleaning liquid sprayed from the spray part 250 can clean the clamping part 310.

In a specific operation process, when the clamping portion 310 is cleaned, the control valve 230 may be opened, the flow rate of the cleaning liquid required is adjusted by the flow rate adjusting valve 220, and the spraying portion 250 sprays the cleaning liquid onto the clamping portion 310, so as to clean the clamping portion 310.

In this embodiment, the pressure of the cleaning liquid sprayed from the spray part 250 is adjusted to realize the cleaning performance of the cleaning mechanism 200, thereby further improving the cleaning effect of the robot 300.

In the above embodiments of the present invention, the difference between the embodiments is mainly described, and different optimization features between the embodiments can be combined to form a better embodiment as long as they are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present invention and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A semiconductor cleaning apparatus for performing cleaning and drying processing on a holding portion (310) of a robot (300), the holding portion (310) having a plurality of carrying grooves (311) for holding wafers, characterized by comprising a cleaning mechanism (200) and a drying mechanism (100);

the cleaning mechanism (200) comprises a cleaning tank (240) for receiving cleaning liquid;

the drying mechanism (100) comprises an air inlet assembly and an air injection device (140), the air injection device (140) is arranged above the tank body of the cleaning tank (240), the air inlet assembly is communicated with the air injection device (140), and the air inlet assembly is used for introducing purging gas into the air injection device (140);

the gas outlet end (1421) of the gas injection device (140) is provided with a flow guide channel group, the flow guide channel group is provided with a plurality of flow guide channels (143) distributed at intervals along a first direction, the purge gas is injected to the clamping part (310) through the flow guide channels (143), and the first direction is the distribution direction of the plurality of bearing grooves (311).

2. The semiconductor cleaning equipment according to claim 1, wherein the number of the flow guide channel groups is multiple, and the distance between the axes of two adjacent flow guide channels (143) in each flow guide channel group is not greater than the distance between two adjacent bearing grooves (311); the guide channel groups are distributed at intervals along a second direction, and the first direction is vertical to the second direction; the flow guide channels (143) of the adjacent flow guide channel groups are distributed in a staggered manner.

3. The semiconductor cleaning apparatus according to claim 1, wherein the length of the flow guide passage (143) is not less than 5mm, so that the purge gas can purge the clamping portion (310) with columnar gas flow.

4. The semiconductor cleaning apparatus according to claim 1, wherein the flow guide passage (143) is provided obliquely downward.

5. The semiconductor cleaning apparatus according to claim 1, wherein the gas injection device (140) comprises a base body portion (141) and an injection portion (142), the injection portion (142) has the gas outlet end (1421) and the gas inlet end (1422) which are oppositely arranged, and the gas inlet end (1422) of the injection portion (142) is communicated with the gas inlet component through the base body portion (141); along the injection direction of the purge gas, the injection part (142) is provided with a tapered cavity (1426), and the cavity (1426) is communicated with the flow guide channel (143).

6. The semiconductor cleaning device according to claim 5, wherein an upper surface (1423) and a lower surface (1424) are disposed between the gas outlet end (1421) and the gas inlet end (1422), and the upper surface (1423) and the lower surface (1424) are both arc-shaped surfaces.

7. The semiconductor cleaning apparatus according to claim 6, wherein the size of the gas outlet end (1421) and the size of the gas inlet end (1422) along the first direction are the same, the size of the gas outlet end (1421) along the second direction is smaller than the size of the gas inlet end (1422) along the second direction, and the center of the gas outlet end (1421) coincides with the center of the gas inlet end (1422), wherein the first direction is perpendicular to the second direction.

8. The semiconductor cleaning device according to claim 6, wherein a chamfer (1425) is provided between the end surface of the gas outlet end (1421) and the lower surface (1424).

9. The semiconductor cleaning equipment according to any one of claims 1 to 8, wherein the air inlet assembly comprises an air inlet device (110), a filtering device (120), a fan (130), and the air inlet device (110), the filtering device, the fan (130) and the air injection device (140) are communicated in sequence;

the fan (130) is used for driving air to enter from the air inlet device (110) and then to be ejected from the air ejecting device (140); the filter device (120) is used for removing the particles in the air, and a filter core of the filter device (120) can collide with the particles and generate heat through friction so as to heat the air.

10. The semiconductor cleaning equipment according to claim 9, wherein the filtering device (120) comprises a first filter (121) and a second filter (122), the air inlet device (110), the first filter (121), the fan (130), the second filter (122) and the air injection device (140) are communicated in sequence, and the filtering precision of the second filter (122) is higher than that of the first filter (121).

11. The semiconductor cleaning equipment according to claim 9, wherein the fan (130) comprises a power module (131), a frequency conversion module (132), a control module (133) and a fan body (134), the power module (131) is electrically connected with the frequency conversion module (132) and the control module (133), respectively, the control module (133) is in control connection with the frequency conversion module (132), the frequency conversion module (132) is connected with the fan body (134), and the frequency conversion module (132) is used for adjusting the output frequency of the fan body (134).

12. The semiconductor cleaning equipment according to claim 1, wherein the number of the gas injection devices (140) is plural, the plural gas injection devices (140) are communicated with the gas inlet assembly, two clamping portions (310) are provided, each clamping portion corresponds to two gas injection devices (140), the gas outlet ends (1421) of the two gas injection devices (140) are arranged in an opposite manner, and the clamping portion (310) is located between the two gas injection devices (140).

13. The semiconductor cleaning device according to claim 1, wherein the cleaning mechanism (200) further comprises a liquid supply pipe (210), a flow regulating valve (220), a control valve (230) and a spraying part (250), the liquid supply pipe (210), the flow regulating valve (220), the control valve (230) and the spraying part (250) are sequentially communicated, the spraying part (250) is arranged in the tank body of the cleaning tank (240), the flow regulating valve (220) is used for controlling the flow of the cleaning liquid, the control valve (230) is used for controlling the on-off of the cleaning liquid of the spraying part (250), and the spraying part (250) can spray the cleaning liquid onto the clamping part (310).