CN115312426A - Wafer cleaning device and cleaning method thereof - Google Patents
Wafer cleaning device and cleaning method thereof Download PDFInfo
- Publication number
- CN115312426A CN115312426A CN202210900170.XA CN202210900170A CN115312426A CN 115312426 A CN115312426 A CN 115312426A CN 202210900170 A CN202210900170 A CN 202210900170A CN 115312426 A CN115312426 A CN 115312426A
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- wafer
- cleaning
- mounting plate
- connecting pipe
- air
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- 238000004140 cleaning Methods 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 title claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 58
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 238000002347 injection Methods 0.000 claims abstract description 26
- 239000007924 injection Substances 0.000 claims abstract description 26
- 235000012431 wafers Nutrition 0.000 claims description 76
- 238000005406 washing Methods 0.000 claims description 17
- 239000007789 gas Substances 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 2
- 239000003344 environmental pollutant Substances 0.000 abstract description 20
- 231100000719 pollutant Toxicity 0.000 abstract description 20
- 239000000243 solution Substances 0.000 abstract description 2
- 230000005587 bubbling Effects 0.000 abstract 1
- 239000003814 drug Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 2
- 238000012864 cross contamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- -1 and vortex mechanism Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning device and a cleaning method thereof.A cleaning tank is provided, and cleaning liquid forms a first flow direction from a water inlet to a water outlet; providing a clamping mechanism, wherein the clamping mechanism is provided with a plurality of clamping parts, and the plurality of clamping parts are used for fixing the wafer; providing a vortex mechanism, wherein the vortex mechanism is arranged in the cleaning tank and is used for driving the cleaning solution to flow to form a second flow direction; providing air injection mechanisms which are respectively arranged at two sides of each wafer and are used for respectively bubbling air bubbles to the front surface and the back surface of each wafer so as to enable the cleaning liquid to respectively form a third flow direction and a fourth flow direction; when the wafer is cleaned, the wafer is fixed by the clamping mechanism, cleaning liquid continuously flows in through the water inlet and flows out of the water outlet, and the vortex mechanism and the air injection mechanism are both started. According to the invention, the pollutant removal capacity is enhanced by adding the gas blown out by the gas charging device in the cleaning tank, and the turbine is added at the tank bottom to accelerate the water flow speed to remove pollutants and rapidly settle, so that secondary pollution caused by pollutant re-adhesion is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer cleaning device and a cleaning method thereof.
Background
The wet cleaning is an important process in the manufacturing process of the integrated circuit, and the wet cleaning mode mainly comprises groove type cleaning and single wafer type cleaning; the tank type cleaning mode has the characteristics of high efficiency, rapidness, liquid medicine saving and the like, and is widely applied to the integrated circuit manufacturing process; however, in the current tank type cleaning, because the number of wafers in one-time operation is large, the liquid medicine in the tank flows slowly, some pollutants adsorbed on the surfaces of the wafers are difficult to remove, even the removed pollutants float in the liquid medicine and are easily adhered to the wafers, so that cross contamination is formed, and the wafer cleaning efficiency is greatly influenced.
In order to solve the above problems, a novel wafer cleaning apparatus and a cleaning method thereof are needed.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a wafer cleaning apparatus and a cleaning method thereof, for solving the problems in the prior art that the tank cleaning is difficult to remove some contaminants adsorbed on the surface of a wafer due to the large number of wafers in one-time operation and the slow flow of the liquid medicine in the tank, and even the removed contaminants float in the liquid medicine and easily adhere to the wafer, thereby causing cross contamination and greatly affecting the wafer cleaning efficiency.
To achieve the above and other related objects, the present invention provides a wafer cleaning apparatus and a cleaning apparatus thereof, comprising:
the washing device comprises a washing tank, a water inlet is formed in one end of the washing tank, a water outlet is formed in the other end of the washing tank, and washing liquid forms a first flow direction from the water inlet to the water outlet;
the clamping mechanism is provided with a plurality of clamping parts, and the plurality of clamping parts are used for fixing the wafer;
the eddy mechanism is arranged in the cleaning tank and used for driving the cleaning liquid to flow to form a second flow direction;
the air injection mechanisms are respectively arranged on two sides of each wafer and are used for respectively blowing bubbles to the front surface and the back surface of each wafer so that the cleaning liquid respectively forms a third flow direction and a fourth flow direction;
when the wafer is cleaned, the wafer is fixed by the clamping mechanism, the cleaning liquid continuously flows in through the water inlet and flows out of the water outlet, and the vortex mechanism and the air injection mechanism are both started.
Preferably, the vortex mechanism comprises fan blades and a drive motor.
Preferably, the vortex mechanism is arranged on the inner surface of the bottom end of the cleaning tank, and the vortex mechanism is positioned below the wafer.
Preferably, the wafer is perpendicular to the bottom surface of the cleaning tank.
Preferably, the front surface and the back surface of the wafer are respectively perpendicular to the airflow direction of the air injection mechanism.
Preferably, the front surface and the back surface of the wafer are respectively arranged in an inclined manner with respect to the air flow direction of the air injection mechanism.
Preferably, the gas ejected by the gas ejecting mechanism is nitrogen.
Preferably, the air injection mechanism comprises a first air pump, a first connecting pipe, a first control valve and a first mounting plate, an output end of the first air pump is communicated with one end of the first connecting pipe, the size of the first mounting plate is matched with that of the wafer, the first mounting plate is fixedly connected to the outer surface of one side of the cleaning tank, a first air cavity is formed between the first mounting plate and the cleaning tank, the other end of the first connecting pipe is communicated with the first air cavity, the cleaning tank is provided with a plurality of first vent holes communicated with the first air cavity, and the first connecting pipe is provided with the first control valve; the air injection mechanism further comprises a second air pump, a second connecting pipe, a second control valve and a second mounting plate, the output end of the second air pump is communicated with one end of the second connecting pipe, the size of the second mounting plate is matched with that of the wafer, the second mounting plate is fixedly connected to the outer surface of the other side of the cleaning tank, a second air cavity is formed between the mounting plate and the cleaning tank, a plurality of second vent holes communicated with the second air cavity are formed in the cleaning tank, the other end of the second connecting pipe is communicated with the second air cavity, and the second control valve is arranged on the second connecting pipe.
Preferably, the air injection mechanism comprises a first air pump, a first connecting pipe, a first control valve and a first mounting plate, an output end of the first air pump is communicated with one end of the first connecting pipe, the size of the first mounting plate is matched with that of the wafer, the first mounting plate is fixedly connected to the inner surface of one side of the cleaning tank, a first air cavity is formed in the first mounting plate, the other end of the first connecting pipe is communicated with the first air cavity, a plurality of first air holes communicated with the interior of the cleaning tank are formed in the first mounting plate, and the first connecting pipe is provided with the first control valve; the air injection mechanism further comprises a second air pump, a second connecting pipe, a second control valve and a second mounting plate, the output end of the second air pump is communicated with one end of the second connecting pipe, the size of the second mounting plate is matched with that of the wafer, the second mounting plate is fixedly connected to the inner surface of the other side of the cleaning tank, a second air cavity is formed in the mounting plate, a plurality of second vent holes communicated with the interior of the cleaning tank are formed in the mounting plate, the other end of the second connecting pipe is communicated with the second air cavity, and the second control valve is arranged on the second connecting pipe.
A cleaning method, wherein any of the above-described wafer cleaning apparatuses is used for the cleaning method.
As described above, the wafer cleaning apparatus and the cleaning method thereof according to the present invention have the following advantageous effects:
according to the invention, the pollutant removal capacity is enhanced by adding the gas blown out by the gas charging device in the cleaning tank, and the turbine is added at the tank bottom to accelerate the water flow speed to remove pollutants and rapidly settle, so that secondary pollution caused by pollutant re-adhesion is avoided.
Drawings
FIG. 1 is a first flow diagram of a cleaning tank according to the present invention;
FIG. 2 is a schematic diagram of a second to third flow directions of a cleaning tank according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second to third flow directions of the cleaning tank according to another embodiment of the present invention.
Detailed Description
The embodiments of the present invention are described below with reference to specific embodiments, and other advantages and effects of the present invention will be easily understood by those skilled in the art from the disclosure of the present specification. The invention is capable of other and different embodiments and of being practiced or of being carried out in various ways, and its several details are capable of modification in various respects, all without departing from the spirit and scope of the present invention.
The invention provides a wafer 03 cleaning device and a cleaning device thereof, comprising:
the cleaning device comprises a cleaning tank 01, wherein one end of the cleaning tank 01 is provided with one or more water inlets 011, the other end of the cleaning tank 01 is provided with one or more water outlets 012, and cleaning liquid forms a first flow direction 013 from the water inlets 011 to the water outlets to form a structure shown in fig. 1;
specifically, water inlet 011 is used for external inlet tube, and delivery port 012 is used for discharging the washing liquid and by the pollutant under washing, when wasing wafer 03, open water inlet 011 and delivery port 012, the washing liquid between water inlet 011 and delivery port 012 flows and forms first class to 013, the bottom at washing tank 01 should be seted up to delivery port 012 under the normal conditions, water inlet 011 highly should be higher than delivery port 012, then the first class 013 of formation can wash the pollutant to the bottom of washing tank 01, the rethread delivery port 012 discharges.
The wafer clamping device comprises a clamping mechanism 02, wherein the clamping mechanism 02 is provided with a plurality of clamping parts which are used for fixing a wafer 03; the gripping mechanism 02 is typically a movable robot arm and a gripping portion provided on the robot arm.
The vortex mechanism is arranged in the cleaning tank 01 and is used for driving the cleaning liquid to flow to form a second flow direction 072 from top to bottom so as to further drive the cleaning liquid to flow, so that the cleaning effect is enhanced, pollutants can be driven to the bottom of the cleaning tank 01, and secondary pollution caused by adhesion of the pollutants is avoided;
in an embodiment of the present invention, the eddy current mechanism includes fan blades 071 and drive motor 07.
In the embodiment of the invention, the eddy current mechanism is arranged on the inner surface of the bottom end of the cleaning tank 01, and the eddy current mechanism is positioned below the wafer 03.
The air injection mechanisms are respectively arranged at two sides of each wafer 03 and are used for respectively blowing bubbles to the front surface and the back surface of each wafer 03 so that the cleaning liquid respectively forms a third flow direction and a fourth flow direction, and through the blowing of the air, on one hand, the flowing of the cleaning liquid is accelerated, the cleaning effect on pollutants on the wafers 03 is improved, and the pollutants on the wafers 03 can be further removed by utilizing the impact force generated by the broken bubbles;
in the embodiment of the present invention, the wafer 03 is disposed perpendicular to the bottom surface of the cleaning tank 01, so as to reduce the impact of the cleaning liquid in the first flow direction 013 of the wafer 03 on the wafer 03.
In the embodiment of the invention, the front surface and the back surface of the wafer 03 are respectively and vertically arranged with the airflow direction of the air injection mechanism, when the cleaning liquid and the bubbles impact the front surface and the back surface of the wafer 03, the two surfaces of the wafer 03 are stressed and counteracted, meanwhile, the cleaning liquid in the third flow direction 055 and the fourth flow direction 065 further flows downwards, and the cleaning liquid in the first flow direction and the second flow direction is matched, so that the secondary pollution caused by the back adhesion of pollutants is further avoided.
In the embodiment of the present invention, the front surface and the back surface of the wafer 03 are respectively disposed in an inclined manner with respect to the airflow direction of the air injection mechanism, and the third flow direction 055 and the fourth flow direction 065 can be in the same clockwise direction or different clockwise directions (counterclockwise/clockwise) by adjusting the angle of the airflow, so as to further drive the flow of the cleaning solution.
In the embodiment of the invention, the gas sprayed by the gas spraying mechanism is nitrogen.
In an embodiment of the present invention, please refer to fig. 2, the air injection mechanism includes a first air pump 05, a first connection pipe 051, a first control valve 053 and a first control valve 052, an output end of the first air pump 05 is communicated with one end of the first connection pipe 051, a size of the first control valve 052 is adapted to a size of the wafer 03, the first control valve 052 is fixedly connected to an outer surface of one side of the cleaning tank 01, a first air cavity is formed between the first control valve 052 and the cleaning tank 01, another end of the first connection pipe 051 is communicated with the first air cavity, a plurality of first vent holes communicated with the first air cavity are arranged on the cleaning tank 01, and the first connection pipe 051 is provided with the first control valve 053; the air injection mechanism further comprises a second air pump 06, a second connecting pipe 061, a second control valve 063 and a second mounting plate 062, the output end of the second air pump 06 is communicated with one end of the second connecting pipe 061, the size of the second mounting plate 062 is matched with that of the wafer 03, the second mounting plate 062 is fixedly connected to the outer surface of the other side of the cleaning tank 01, a second air cavity is formed between the mounting plate and the cleaning tank 01, a plurality of second vent holes communicated with the second air cavity are formed in the cleaning tank 01, the other end of the second connecting pipe 061 is communicated with the second air cavity, and the second control valve 063 is arranged on the second connecting pipe 061.
In an embodiment of the present invention, please refer to fig. 3, the air injection mechanism includes a first air pump 05, a first connection pipe 051, a first control valve 053 and a first control valve 052, an output end of the first air pump 05 is communicated with one end of the first connection pipe 051, the size of the first control valve 052 is adapted to the size of the wafer 03, the first control valve 052 is fixedly connected to an inner surface of one side of the cleaning tank 01, a first air cavity is formed in the first control valve 052, the other end of the first connection pipe 051 is communicated with the first air cavity, a plurality of first vent holes communicated with the interior of the cleaning tank 01 are arranged on the first control valve 052, and the first connection pipe 051 is provided with the first control valve 053; the air injection mechanism further comprises a second air pump 06, a second connecting pipe 061, a second control valve 063 and a second mounting plate 062, the output end of the second air pump 06 is communicated with one end of the second connecting pipe 061, the size of the second mounting plate 062 is matched with that of the wafer 03, the second mounting plate 062 is fixedly connected to the inner surface of the other side of the cleaning tank 01, a second air cavity is formed in the mounting plate, a plurality of second vent holes communicated with the interior of the cleaning tank 01 are formed in the mounting plate, the other end of the second connecting pipe 061 is communicated with the second air cavity, and a second control valve 063 is arranged on the second connecting pipe 061.
Wherein, when wasing wafer 03, wafer 03 is fixed by the mechanism of centre gripping, and the washing liquid lasts to flow in through water inlet 011, flows out by going out water, and vortex mechanism, air injection mechanism all start, that is to say, through the cooperation of the washing liquid of first to four flow directions, accelerate the velocity of water flow and get rid of the pollutant and subside fast, avoid the pollutant to glue back and lead to secondary pollution.
A cleaning method using any of the above wafer cleaning apparatuses.
It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the components related to the present invention are only shown in the drawings rather than drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of the components in actual implementation may be changed freely, and the layout of the components may be more complicated.
In conclusion, the invention enhances the pollutant removal capability by adding the gas blown out by the gas charging device in the cleaning tank, and the turbine is added at the tank bottom to accelerate the water flow speed to remove the pollutants and rapidly settle, thereby avoiding secondary pollution caused by pollutant re-adhesion. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and scope of the present invention as defined in the appended claims.
Claims (10)
1. An apparatus for cleaning a wafer, comprising:
the washing device comprises a washing tank, a water inlet is formed in one end of the washing tank, a water outlet is formed in the other end of the washing tank, and washing liquid forms a first flow direction from the water inlet to the water outlet;
the clamping mechanism is provided with a plurality of clamping parts, and the plurality of clamping parts are used for fixing the wafer;
the eddy mechanism is arranged in the cleaning tank and used for driving the cleaning liquid to flow to form a second flow direction;
the air injection mechanisms are respectively arranged on two sides of each wafer and are used for respectively blowing bubbles to the front surface and the back surface of each wafer so that the cleaning liquid respectively forms a third flow direction and a fourth flow direction;
when the wafer is cleaned, the wafer is fixed by the clamping mechanism, the cleaning liquid continuously flows in through the water inlet and flows out of the water outlet, and the vortex mechanism and the air injection mechanism are both started.
2. The apparatus for cleaning wafer as claimed in claim 1, wherein: the vortex mechanism comprises fan blades and a driving motor.
3. The apparatus for cleaning wafer as claimed in claim 2, wherein: the vortex mechanism is arranged on the inner surface of the bottom end of the cleaning tank, and the vortex mechanism is located below the wafer.
4. The apparatus for cleaning wafer as claimed in claim 1, wherein: the wafer is perpendicular to the bottom surface of the cleaning tank.
5. The apparatus for cleaning wafer as claimed in claim 1, wherein: the front surface and the back surface of the wafer are respectively and vertically arranged with the airflow direction of the air injection mechanism.
6. The apparatus for cleaning wafer as claimed in claim 1, wherein: the front surface and the back surface of the wafer are respectively arranged in an inclined way with the airflow direction of the air injection mechanism.
7. The apparatus for cleaning wafer as claimed in claim 1, wherein: the gas sprayed out by the gas spraying mechanism is nitrogen.
8. A cleaning apparatus for wafers as claimed in claim 1, wherein: the air injection mechanism comprises a first air pump, a first connecting pipe, a first control valve and a first mounting plate, the output end of the first air pump is communicated with one end of the first connecting pipe, the size of the first mounting plate is matched with that of the wafer, the first mounting plate is fixedly connected to the outer surface of one side of the cleaning tank, a first air cavity is formed between the first mounting plate and the cleaning tank, the other end of the first connecting pipe is communicated with the first air cavity, the cleaning tank is provided with a plurality of first air holes communicated with the first air cavity, and the first connecting pipe is provided with the first control valve; the air injection mechanism further comprises a second air pump, a second connecting pipe, a second control valve and a second mounting plate, the output end of the second air pump is communicated with one end of the second connecting pipe, the size of the second mounting plate is matched with that of the wafer, the second mounting plate is fixedly connected to the outer surface of the other side of the cleaning tank, a second air cavity is formed between the mounting plate and the cleaning tank, a plurality of second vent holes communicated with the second air cavity are formed in the cleaning tank, the other end of the second connecting pipe is communicated with the second air cavity, and the second control valve is arranged on the second connecting pipe.
9. The apparatus for cleaning wafer as claimed in claim 1, wherein: the air injection mechanism comprises a first air pump, a first connecting pipe, a first control valve and a first mounting plate, wherein the output end of the first air pump is communicated with one end of the first connecting pipe, the size of the first mounting plate is matched with that of the wafer, the first mounting plate is fixedly connected to the inner surface of one side of the cleaning tank, a first air cavity is formed in the first mounting plate, the other end of the first connecting pipe is communicated with the first air cavity, a plurality of first air holes communicated with the interior of the cleaning tank are formed in the first mounting plate, and the first connecting pipe is provided with the first control valve; the air injection mechanism further comprises a second air pump, a second connecting pipe, a second control valve and a second mounting plate, the output end of the second air pump is communicated with one end of the second connecting pipe, the size of the second mounting plate is matched with that of the wafer, the second mounting plate is fixedly connected to the inner surface of the other side of the cleaning tank, a second air cavity is formed in the mounting plate, a plurality of second vent holes communicated with the interior of the cleaning tank are formed in the mounting plate, the other end of the second connecting pipe is communicated with the second air cavity, and the second control valve is arranged on the second connecting pipe.
10. A cleaning method of a wafer cleaning apparatus according to any one of claims 1 to 9, wherein: the wafer cleaning device is used for the cleaning method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210900170.XA CN115312426A (en) | 2022-07-28 | 2022-07-28 | Wafer cleaning device and cleaning method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210900170.XA CN115312426A (en) | 2022-07-28 | 2022-07-28 | Wafer cleaning device and cleaning method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115312426A true CN115312426A (en) | 2022-11-08 |
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ID=83859683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210900170.XA Pending CN115312426A (en) | 2022-07-28 | 2022-07-28 | Wafer cleaning device and cleaning method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN115312426A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117443839A (en) * | 2023-12-21 | 2024-01-26 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201800A (en) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | Flow modulated wafer cleaning method and its apparatus |
| JPH104076A (en) * | 1996-06-15 | 1998-01-06 | Sony Corp | Single wafer cleaning system |
| KR19980034228A (en) * | 1996-11-06 | 1998-08-05 | 문정환 | Wafer cleaning equipment |
| KR20000010825U (en) * | 1998-11-26 | 2000-06-26 | 윤종용 | Wafer cleaning equipment |
| KR20010017387A (en) * | 1999-08-11 | 2001-03-05 | 윤종용 | Apparatus for cleaning wafer |
| KR20180111152A (en) * | 2017-03-31 | 2018-10-11 | (주)씨앤지테크 | Vortex type wet scrubber |
| CN110571165A (en) * | 2018-06-05 | 2019-12-13 | 中芯国际集成电路制造(上海)有限公司 | cleaning device, cleaning method, semiconductor processing machine table and wafer processing method |
| CN114392978A (en) * | 2022-03-24 | 2022-04-26 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning machine for wafer processing |
-
2022
- 2022-07-28 CN CN202210900170.XA patent/CN115312426A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07201800A (en) * | 1993-12-28 | 1995-08-04 | Hitachi Ltd | Flow modulated wafer cleaning method and its apparatus |
| JPH104076A (en) * | 1996-06-15 | 1998-01-06 | Sony Corp | Single wafer cleaning system |
| KR19980034228A (en) * | 1996-11-06 | 1998-08-05 | 문정환 | Wafer cleaning equipment |
| KR20000010825U (en) * | 1998-11-26 | 2000-06-26 | 윤종용 | Wafer cleaning equipment |
| KR20010017387A (en) * | 1999-08-11 | 2001-03-05 | 윤종용 | Apparatus for cleaning wafer |
| KR20180111152A (en) * | 2017-03-31 | 2018-10-11 | (주)씨앤지테크 | Vortex type wet scrubber |
| CN110571165A (en) * | 2018-06-05 | 2019-12-13 | 中芯国际集成电路制造(上海)有限公司 | cleaning device, cleaning method, semiconductor processing machine table and wafer processing method |
| CN114392978A (en) * | 2022-03-24 | 2022-04-26 | 智程半导体设备科技(昆山)有限公司 | Megasonic cleaning machine for wafer processing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117443839A (en) * | 2023-12-21 | 2024-01-26 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
| CN117443839B (en) * | 2023-12-21 | 2024-03-19 | 湖南隆深氢能科技有限公司 | Bipolar plate cleaning equipment |
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