CN216820186U - Carrier plate with embedded heat dissipation fluid channel - Google Patents
Carrier plate with embedded heat dissipation fluid channel Download PDFInfo
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- CN216820186U CN216820186U CN202123067259.2U CN202123067259U CN216820186U CN 216820186 U CN216820186 U CN 216820186U CN 202123067259 U CN202123067259 U CN 202123067259U CN 216820186 U CN216820186 U CN 216820186U
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Abstract
The carrier plate with the embedded heat dissipation fluid channel comprises a composite circuit structure, a heat dissipation element and an electronic element, wherein the heat dissipation element is embedded in the composite circuit structure and is provided with a bottom surface and a top surface, the fluid channel is arranged in the heat dissipation element, and the top surface is provided with a first through hole and a second through hole which are communicated with the fluid channel; the electronic element is embedded in the composite circuit structure and contacts with the bottom surface of the heat dissipation element; the composite line structure is also provided with a first through hole, a second through hole and a through hole, wherein the first through hole and the second through hole are communicated with the heat dissipation element, so that heat dissipation fluid can flow into the first through hole of the heat dissipation element from the external space and then flow into the fluid channel, and then flow out from the second through hole through the fluid channel space, waste heat generated by the electronic element is actively discharged, and the heat dissipation efficiency is improved.
Description
Technical Field
A carrier plate, and more particularly, to a carrier plate with embedded heat dissipation fluid channels.
Background
Referring to fig. 5 to fig. 7, the circuit carrier with embedded components has advantages of flexible carrier layout, reduced product size, shorter connecting circuit, and stable electrical connection, and is a carrier technology commonly used in electronic products with miniaturization trend in recent years. The circuit carrier board of the embedded component generally includes a circuit structure 50 and an embedded chip component, the chip component 60 is embedded in the circuit structure 50 of the carrier board and cannot conduct heat dissipation by directly contacting with the outside air, and the waste heat accumulated in the chip component affects the operation of the component and reduces the service life of the chip component, so how to dissipate heat for the chip component is a problem that must be solved by the circuit carrier board of the embedded component.
Referring to fig. 5, in a conventional technology, an embedded heat sink 70 is disposed on one side of the embedded chip component 60, and the heat sink 70 is, for example, a copper plate, and is used as a heat reservoir of the embedded chip component 60. However, the heat dissipation plate 70 is embedded in the composite circuit structure 50, and thus cannot directly dissipate heat to the outside, and the waste heat still causes over-temperature of the embedded chip component 60 when accumulated to a certain degree.
Referring to fig. 6, in another prior art, the embedded heat spreader 70 penetrates through the circuit layer junction on one side and is exposed on the surface of the composite circuit structure 50 to dissipate heat outwards. However, the heat dissipation plate 70 occupies a large volume and area of each circuit layer in the composite circuit structure 50, which affects the layout of the circuit wiring, and the heat generated by the embedded chip component 60 can only be passively conducted from one surface of the heat dissipation plate 70 contacting the embedded chip component 60 to the other surface of the heat dissipation plate, which is still not very efficient.
Referring to fig. 7, in another prior art, the material of the core layer 51 in the composite circuit structure 50 is changed, for example, a ceramic core substrate with better thermal conductivity is selected, so that the heat generated by the chip components 60 embedded in the core layer 51 can be conducted to the entire core layer 51, thereby achieving better heat dissipation efficiency. However, the core layer 51 of the ceramic material is expensive, and micro bubbles are easily generated between the core layer 51 of the ceramic material and the attached metal line, which results in unstable line quality.
In summary, the conventional device heat dissipation technology of the embedded device circuit carrier has its drawbacks, and thus, still needs to be improved.
SUMMERY OF THE UTILITY MODEL
In view of the improvement of the conventional heat dissipation technology of the embedded component circuit carrier, the present invention provides a carrier with an embedded heat dissipation fluid channel, comprising: a composite wiring structure; a heat dissipation element having a bottom surface and a top surface and embedded in the composite circuit structure, wherein the heat dissipation element has a fluid channel therein, and the top surface has a first through hole and a second through hole respectively communicated with the fluid channel; the composite circuit structure is provided with two through holes which are respectively communicated with a first through hole and an external space of the heat dissipation element, and a second through hole and the external space; and the electronic element is embedded in the composite circuit structure and is directly contacted with the bottom surface of the heat dissipation element.
In an embodiment of the present invention, the composite circuit structure includes: the core board is provided with a first surface and a second surface opposite to the first surface, and the heat dissipation element is arranged on the first surface; a plurality of build-up circuit structures respectively arranged on the first surface or the second surface of the core board, wherein at least one build-up circuit structure is arranged on the heat dissipation element and covers the heat dissipation element; at least one build-up circuit layer on the first surface of the core board is provided with the through hole to communicate with the first through hole and the second through hole of the heat dissipation element.
In an embodiment of the present invention, the heat dissipation element includes: the bottom layer is provided with the bottom surface and is arranged on the first surface of the core board; a patterned channel layer disposed on the bottom layer and including a circular wall structure and a flow channel structure, wherein the flow channel structure forms a fluid channel on an inner side of the circular wall structure; a top cover disposed on the patterned channel layer, wherein the bottom layer and the top cover seal the fluid channel in the patterned channel layer.
In an embodiment of the present invention, the composite circuit structure includes: a seed layer disposed on the first surface of the core board; a patterned metal layer disposed on the seed layer and including a circuit portion and a patterned channel portion; the patterned channel part is a patterned channel layer of the heat dissipation element, and a part of the seed layer under the patterned channel part is a bottom layer of the heat dissipation element.
In an embodiment of the present invention, the composite circuit structure includes: the heat dissipation element is embedded in the core board, and the top surface of the heat dissipation element is flush with the first surface of the core board; and the plurality of build-up circuit layers are respectively arranged on the first surface or the second surface of the core board, and at least one build-up circuit layer on the first surface of the core board is provided with the through hole so as to be communicated with the first through hole and the second through hole of the heat dissipation element.
In an embodiment of the present invention, the heat dissipation element is integrally formed.
The carrier plate of the embedded heat dissipation fluid channel is internally embedded with a heat dissipation element in a composite circuit structure, the heat dissipation element is internally provided with a fluid channel, the fluid channel is communicated with an external space through a first through hole and a second through hole on the surface of the heat dissipation element and the through hole penetrating through the composite circuit structure, heat dissipation fluid can be injected into the first through hole from the external space to enter the fluid channel and flows out from the second through hole after passing through the fluid channel, and heat energy generated by an electronic element is actively taken away from the interior of the heat dissipation element. After the waste heat generated by the electronic components embedded in the composite circuit structure is conducted to the heat dissipation component, the waste heat is further carried out by the fluid in the fluid channel, so that the temperature of the heat dissipation component and the whole electronic components is not increased. Therefore, the heat dissipation efficiency is improved without increasing the volume or position configuration of the heat dissipation element, the circuit configuration in the composite circuit structure is not influenced, the material and the thickness of the composite circuit structure are not required to be changed, and the heat can be actively transferred from the outer space of the inner footpath of the composite circuit structure by the heat dissipation fluid.
Drawings
Fig. 1 is a schematic cross-sectional view of a carrier with embedded heat dissipation fluid channels according to the present invention.
Fig. 2A to fig. 2Q are schematic cross-sectional views illustrating a manufacturing process of a carrier plate with an embedded heat dissipation fluid channel according to a first embodiment of the present invention.
Fig. 3A to fig. 3J are schematic cross-sectional views illustrating a manufacturing process of a carrier plate with an embedded heat dissipation fluid channel according to a second embodiment of the present invention.
Fig. 4 is a perspective view of a heat dissipation element in a carrier with embedded heat dissipation fluid channels according to the present invention.
Fig. 5 to 7 are schematic cross-sectional views of a circuit carrier with an embedded chip component in the prior art.
Detailed Description
Referring to fig. 1, the carrier with embedded heat dissipation fluid channel of the present invention includes a composite circuit structure 10, a heat dissipation element 20, and an electronic element 30. In one embodiment, the composite circuit structure includes a core board 11 and a plurality of build-up circuit structures, the core board includes two opposite surfaces, such as a first surface 111 and a second surface 112 opposite to the first surface 111, and the plurality of build-up circuit structures include a first build-up circuit structure 12, a second build-up circuit structure 13, a third build-up circuit structure 14, a fourth build-up circuit structure 15, and the like. Each build-up circuit structure includes a build-up dielectric layer and a build-up circuit layer, which are stacked on the first surface 111 or the second surface 112 of the core board 11. The heat dissipation element 20 is embedded in the composite circuit structure 10, and disposed on the first surface 111 or the second surface 112 of the core board 11, or embedded in the core board 10.
The heat dissipation element 20 has a bottom surface 201 and a top surface 202, and a fluid channel 200 is formed inside the heat dissipation element 20 and is distributed inside the heat dissipation element 20 as a channel space communicating front and back. The top surface 202 of the heat dissipating device 20 has a first through hole 203 and a second through hole 204, which are respectively connected to the fluid channel 200, and preferably respectively connected to the front and rear ends of the fluid channel 200, so that the heat dissipating fluid flows from the first through hole 203 into the fluid channel 200, passes through the fluid channel 200, and then flows out from the second through hole 204. The electronic component 30 is embedded in the composite circuit structure 10 and directly contacts with the bottom surface 201 of the heat dissipation component 20, so as to directly conduct heat energy to the heat dissipation component 20.
The composite circuit structure 10 has two through holes 101 respectively communicating the first through hole 203 and an external space of the heat dissipating device 20, and the second through hole 204 and the external space for flowing in and out of a heat dissipating fluid.
The following will further describe the method for manufacturing the carrier plate with embedded heat dissipation fluid channel of the present invention in detail.
In the first embodiment of the present invention, the heat dissipation element 20 is disposed on a surface of the core board 11, i.e. outside the core board 11. The following manufacturing method is described by taking the case where the heat dissipation element 20 is disposed on the first surface 111 of the core board 11.
Referring to fig. 2A, the core board 11 is prepared, and a seed layer 113 is pre-disposed on the first surface 111 and the second surface 112 of the core board 11, respectively, where the seed layer 113 is, for example, a copper foil layer, but not limited thereto.
Referring to fig. 2B, optionally, at least one through hole is formed on the core substrate 11, and a patterned photoresist layer 114 is disposed on the seed layer 113 on the first surface 111 and the second surface 112, respectively, wherein the patterned photoresist layer 114 is formed by steps of laying a photoresist, exposing, developing, and the like. The patterned photoresist layer 114 on the first surface 111 is used to form patterned lines and patterned channels on the first surface 111.
Referring to fig. 2C, electroplating is performed on the seed layer 113 on the first surface 111 and the second surface 112 of the core substrate 11 to form a patterned metal layer 115 in the gaps of the patterned photoresist layer 114, and the patterned photoresist layer 114 is removed. The patterned metal layer 115 on the first surface 11 includes a circuit portion 1151 and a patterned channel portion 1152.
Referring to fig. 2D, after the patterned metal layer 115 on the first surface 111 and the second surface 112 of the core board 11 is completed, a protection layer 116 is covered on the patterned channel portion 1152 on the first surface 111. The protective layer 116 serves to protect the patterned channel portion 1152 and the portion of the seed layer 113A exposed under and in the gap between the patterned channel portion 1152 in the next etching step.
Referring to fig. 2E, an etching step is performed on the first surface 111 and the second surface 112 of the core board 11 to remove the seed layer 113 not covered by the patterned metal layer 115 and the passivation layer 116. Since the protective layer covers 116 the patterned channel portions 1152 and the portions of the seed layer 113A thereunder, the seed layer 113A in the gaps of the patterned channel portions 1152 is not removed.
As shown in fig. 2F, the patterned channel portion 1152 is the patterned channel layer 22 of the heat spreader 20, and the remaining portion of the seed layer 113A under the patterned channel portion 1152 is the bottom layer 21 of the heat spreader 20. After the etching is completed, the protection layer 116 is removed to expose the bottom layer 21 and the patterned channel layer 22, as shown in fig. 2F.
Referring to fig. 2G, a top cover 23 is disposed on the patterned channel layer 22, and the bottom layer 21, the patterned channel layer 22 and the top cover 23 are combined to form the heat dissipation device 20. Wherein the bottom layer 21 has the bottom surface 201, and the top cover 23 has the top surface 202. The top cover 23 is bonded to the patterned channel layer 22, for example, directly bonded by ultrasonic welding, so as to close the gap portion formed in the patterned channel layer 22, and thus the heat dissipation element 20 has a closed fluid channel 200 therein, which is defined by the patterned channel layer 22 with a specific channel pattern.
Referring to fig. 2H to fig. 2J, a circuit build-up step is performed on the first surface 111 and the second surface 112 of the core board 11. As shown in fig. 2H, a first build-up dielectric layer 121 is disposed on the first surface 111 of the core board 11, and a second build-up dielectric layer 131 is disposed on the second surface 112 of the core board 11, as shown in fig. 2I, and blind vias 1210 and 1310 for inter-circuit connection are formed on the first build-up dielectric layer 121 and the second build-up dielectric layer 131. The first build-up dielectric layer 121 covers the heat dissipation device 20, such that the heat dissipation device 20 is embedded between the core board 11 and the first build-up dielectric layer 121; next, as shown in fig. 2J, a first build-up wiring layer 122 and a second build-up wiring layer 132 are disposed on the surfaces of the first build-up dielectric layer 121 and the second build-up dielectric layer 131 and in the blind vias 1210 and 1310. The step of disposing the first build-up circuit layer 122 and the second build-up circuit layer 132 is accomplished, for example, by first disposing a seed layer, disposing a patterned photoresist layer, electroplating, removing the patterned photoresist layer, and etching.
Referring to fig. 2K, a drilling process is performed on the surface of the second build-up circuit structure 13 to form an element accommodating groove 110. The drilling process is performed by, for example, mechanical drilling or laser drilling, but the utility model is not limited thereto. The device receiving cavity 110 penetrates through the second build-up dielectric layer 131 and the core board 11, so that the bottom layer 21 of the heat dissipation device 20 is exposed in the device receiving cavity 110. The surface of the bottom layer 21 originally disposed on the first surface 111 of the core board 11 is the bottom surface 201 of the heat dissipation element 20, so as to be directly contacted with the embedded electronic element 30 in the next step.
Referring to fig. 2L, the electronic component 30 is disposed in the component accommodating groove 110, and a bottom surface 301 of the electronic component 30 directly contacts with a bottom surface 201 of the heat dissipating component 20. Wherein a top surface 302 of the electronic component 30 opposite to the bottom surface 301 has at least one component contact 31.
Referring to fig. 2M, a third build-up dielectric layer 141 is disposed on the second build-up circuit layer 132, and the third dielectric layer 141 covers the second build-up dielectric layer 131 and the second build-up circuit layer 132 and fills the component accommodating groove 110 to fix and protect the electronic component 30 embedded in the component accommodating groove 110.
Referring to fig. 2N, a drilling process is performed on the surface of the third build-up dielectric layer 141, such as, but not limited to, mechanical drilling or laser drilling. To form at least one blind via 1410 in communication with the surface contact 31 on the top surface 301 of the electronic component 30 and the blind via 1410 in communication with the surface of the second build-up circuitry layer 132.
Referring to fig. 2O, a third build-up wiring layer 142 is disposed on the surface of the third build-up dielectric layer 141 and in the blind via 1410, and the third build-up wiring layer 142 is further electrically connected to the surface contact 31 on the top surface 301 of the electronic component 30 in the blind via 1410.
Referring to fig. 2M to 2O, in the step of disposing the third build-up dielectric layer 141 and the third build-up circuit layer 142 of the third build-up circuit structure 14, a further line build-up process may be optionally performed on the first build-up circuit structure 12, for example, a fourth build-up dielectric layer 151 and a fourth build-up circuit layer 152 of a fourth build-up circuit structure 15 are further disposed on the first build-up dielectric layer 121 and the second build-up circuit 122, and the utility model is not limited thereto.
Taking the third build-up circuit layer 142 and the fourth build-up circuit 152 as surface circuit layers as an example, the main process flow of the composite circuit structure 10 is completed in the step of fig. 2O.
Referring to fig. 2P, an insulating protective layer 16 is disposed on the outermost build-up circuit layer, such as the third build-up circuit structure 14 and the fourth build-up circuit structure 15, and the insulating protective layer 16 has at least one opening 160 for exposing the surface contact of the third build-up circuit layer 14 and the fourth build-up circuit layer 152.
Referring to fig. 2Q, a drilling process is performed on the insulating passivation layer 16 on the first surface 11 of the core board 11 to penetrate through the insulating passivation layer 16, the first build-up circuit structure 12, and the fourth build-up circuit structure 15 to form a through hole 101 of the composite circuit structure 10, and further penetrate through the top cover 23 of the heat dissipation device 20 to form a first through hole 203 and a second through hole 204, which are communicated with the fluid channel 200, so that the fluid channel 200 is communicated with an external space, thereby completing the carrier board with a heat dissipation fluid channel according to the first embodiment of the present invention.
In the first embodiment of the present invention, the heat dissipation device 20 is disposed outside the surface of the core board 11, and the patterned via layer 22 is formed at the same time as the patterned metal layer 115 is disposed in the step of disposing the circuit, and then the top cover 23 is connected to complete the process of the heat dissipation device 20.
In a second embodiment of the present invention, the heat dissipation element 20 is embedded in the core board 11. The following description of the manufacturing method will be made by taking the heat dissipation element 20 disposed on the first surface 111 of the core board 11 as an example.
Referring to fig. 3A, the core board 11 is prepared, and as shown in fig. 3B, metal circuit layers 117 are respectively disposed on the first surface 111 and the second surface 112 of the core board 11.
Referring to fig. 3C, a slotting process is performed to directly form the component accommodating cavity 110 in the core board 11, and the component accommodating cavity 110 penetrates through the core board 11 to form an opening on the first surface 111 and the second surface 112, respectively.
Referring to fig. 3D, an adhesive layer 17 covers the first surface 111 of the core board 11, and the adhesive layer 17 seals the opening of the component accommodating cavity 110 on the first surface 111 and is exposed in the component accommodating cavity 110.
Referring to fig. 3E, a prepared heat dissipation element 20 is placed into the element receiving slot 110 from the opening of the element receiving slot 110 on the second surface 112, a top surface 202 of the heat dissipation element 20 faces the adhesive layer 17 and is fixed on the adhesive layer 17, and a bottom surface 201 faces the opening of the second surface 112. Unlike the first embodiment, the heat dissipation device 20 is prepared in advance, for example, by a three-dimensional printing technique.
Referring to fig. 3F, the electronic component 30 is placed into the component receiving slot 110 from the opening of the component receiving slot 110 on the second surface 112, such that the bottom surface 301 of the electronic component 30 is directly contacted with the top surface 202 of the heat dissipating component 20.
Referring to fig. 3G to fig. 3H, the adhesive layer 17 is removed and a circuit build-up process is performed on the first surface 111 and the second surface 112 of the core board 11, respectively. As shown in fig. 3G, after removing the adhesive layer 17, a first build-up dielectric layer 121 is disposed on the first surface 111 of the core board 11, and a second build-up dielectric layer 131 is disposed on the second surface 112. In this embodiment, the second build-up dielectric layer 131 is first disposed on the second surface 112, and the opening of the second surface 112 is filled into the component accommodating groove 110 to fix the electronic component 30 and the heat dissipating component 20, the adhesive layer 17 is removed, and the first build-up dielectric layer 121 is then disposed on the first surface 111. As shown in fig. 3H, a first build-up line layer 122 and a second build-up line layer 132 are disposed on the first build-up dielectric layer 121 and the second build-up dielectric layer 131 to complete the first build-up line structure 12 and the second build-up line structure 13.
In this embodiment, the first build-up circuit layer 122 and the second build-up circuit layer 132 are taken as the outermost circuit layers, and a further build-up process may be performed to add more build-up circuit structures, which is not limited in the present invention.
Referring to fig. 3I, an insulating protection layer 17 is disposed on the first build-up circuit layer 122 and the second build-up circuit layer 132, and the insulating protection layer 7 has at least one blind via 170. To expose the contacts of the first build-up circuit layer 122 and the second build-up circuit layer 132.
Finally, referring to fig. 3J, a drilling process is performed on the insulating passivation layer 16 on the first surface 111 of the core board 11 to penetrate through the insulating passivation layer 16 and the first build-up circuit structure 14 to form the through hole 101 of the composite circuit structure 10, and a first through hole 203 and a second through hole 204 communicating with the fluid channel 200 are formed through the top surface of the heat dissipation element 20 to communicate the fluid channel 200 with the external space, thereby completing the carrier board with the embedded heat dissipation fluid channel according to the second embodiment.
In the present embodiment, since the heat dissipation element 20 is formed in advance, the material thereof is not limited to the metal material of the circuit layer, and other materials with good thermal conductivity, such as ceramic, can be selected.
Referring to fig. 4, in a first embodiment, the heat dissipation device 20 includes the bottom layer 21, the patterned channel layer 22 and the top cover 23. The patterned channel layer 22 includes a circular wall structure 221 and a flow channel structure 222, the flow channel structure 222 is located on an inner side of the circular wall structure 221, and the fluid channel 200 is formed on the inner side of the circular wall structure 221. The arrows shown in fig. 4 indicate the flow path of the heat sink fluid in the fluid channel 200. In the present embodiment, the flow channel is bent and distributed in the heat dissipation element 20 in an "S" shape, so that the heat dissipation fluid can flow through most of the area of the heat dissipation element 20, and efficiently take away the heat generated by the electronic element 30. Since the patterned channel layer 22 is a part of the patterned metal layer 115, the shape structure of the patterned channel layer 22 can be set by the design of the patterned metal layer 115, and is not limited to the "S" shaped curved channel shape.
In addition, in the second embodiment, the heat dissipation element 20 is pre-formed and directly embedded in the core board 11, so that the bottom layer 21, the patterned channel layer 22 and the top cover 23 can be integrally formed. Since the heat dissipation device 20 is formed by, for example, a three-dimensional printing technology, the shape and structure of the fluid channel 200 can be designed according to the requirement, and is not limited to the flow channel shape shown in fig. 4.
Although the present invention has been described with reference to the above embodiments, it should be understood that the utility model is not limited to the above embodiments, and various changes and modifications may be made by those skilled in the art without departing from the scope of the utility model.
Claims (6)
1. A carrier plate with embedded heat dissipation fluid channel, comprising:
a composite circuit structure;
the heat dissipation element is provided with a bottom surface and a top surface, is embedded in the composite circuit structure, and is internally provided with a fluid channel; the composite circuit structure is provided with two through holes which are respectively communicated with a first through hole and an external space of the radiating element, and a second through hole and the external space;
and the electronic element is embedded in the composite circuit structure and is in direct contact with the bottom surface of the heat dissipation element.
2. The carrier plate with embedded heat dissipation fluid channel of claim 1, wherein the composite wiring structure comprises:
the heat dissipation device comprises a core board, a first heat dissipation element and a second heat dissipation element, wherein the core board is provided with a first surface and a second surface opposite to the first surface;
a plurality of build-up circuit structures respectively disposed on the first surface or the second surface of the core board, wherein at least one build-up circuit structure is disposed on the heat dissipation element and covers the heat dissipation element;
at least one build-up circuit layer on the first surface of the core board is provided with the two through holes so as to communicate the first through hole and the second through hole of the heat dissipation element.
3. The carrier plate with embedded heat dissipation fluid channel of claim 2, wherein the heat dissipation element comprises:
the bottom layer is provided with the bottom surface and is arranged on the first surface of the core board;
the patterned channel layer is arranged on the bottom layer and comprises a circular wall structure and a flow channel structure, and the flow channel structure forms fluid channels which are communicated with each other on one inner side of the circular wall structure;
and the top cover is arranged on the patterned channel layer, and the bottom layer and the top cover seal the fluid channel in the patterned channel layer.
4. The carrier plate with embedded heat dissipation fluid channel of claim 3, wherein the composite wiring structure comprises:
a seed layer disposed on the first surface of the core board;
a patterned metal layer disposed on the seed layer and including a circuit portion and a patterned channel portion; the patterned channel part is a patterned channel layer of the heat dissipation element, and a part of the seed layer under the patterned channel part is a bottom layer of the heat dissipation element.
5. The carrier plate with embedded heat dissipation fluid channel of claim 1, wherein the composite wiring structure comprises:
the heat dissipation element is embedded in the core board, and the top surface of the heat dissipation element is flush with the first surface of the core board;
and the plurality of build-up circuit layers are respectively arranged on the first surface or the second surface of the core board, and at least one build-up circuit layer on the first surface of the core board is provided with the two through holes so as to be communicated with the first through hole and the second through hole of the heat dissipation element.
6. The carrier plate with embedded heat dissipation fluid channel of claim 5, wherein the heat dissipation element is integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202123067259.2U CN216820186U (en) | 2021-12-08 | 2021-12-08 | Carrier plate with embedded heat dissipation fluid channel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202123067259.2U CN216820186U (en) | 2021-12-08 | 2021-12-08 | Carrier plate with embedded heat dissipation fluid channel |
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| CN216820186U true CN216820186U (en) | 2022-06-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116782506A (en) * | 2023-08-24 | 2023-09-19 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
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2021
- 2021-12-08 CN CN202123067259.2U patent/CN216820186U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116782506A (en) * | 2023-08-24 | 2023-09-19 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
| CN116782506B (en) * | 2023-08-24 | 2023-11-24 | 荣耀终端有限公司 | Circuit board assembly, processing method thereof, circuit board stacking structure and electronic equipment |
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