CN113923848B - Circuit board and manufacturing method thereof - Google Patents
Circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN113923848B CN113923848B CN202010664042.0A CN202010664042A CN113923848B CN 113923848 B CN113923848 B CN 113923848B CN 202010664042 A CN202010664042 A CN 202010664042A CN 113923848 B CN113923848 B CN 113923848B
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- China
- Prior art keywords
- substrate
- accommodating space
- circuit board
- heat dissipation
- circuit
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Abstract
A method of manufacturing a circuit board, comprising the steps of: providing a circuit substrate, which comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, wherein the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is a surface of the first substrate far away from the second substrate, the second surface is a surface of the second substrate located on the outer side far away from the first substrate, at least one accommodating space is formed in the second surface, and the accommodating space does not penetrate through the first surface. At least one heat dissipation block is provided, and comprises a third surface and a fourth surface opposite to the third surface. The heat dissipation block is fixed in the accommodating space, so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at intervals with the bottom of the accommodating space. And removing a part of the first substrate corresponding to the heat dissipation block to expose the third surface to the circuit substrate, and arranging an electronic element on the third surface. In addition, the invention also provides a circuit board.
Description
Technical Field
The invention relates to a circuit board and a manufacturing method thereof.
Background
With the development of high integration, miniaturization and microminiaturization trend of electronic products, the density of electronic components on a circuit board is also higher and higher, and the power consumption is also higher and higher, which puts higher and higher demands on heat dissipation of the circuit board.
In the prior art, a metal heat dissipation block is generally buried in a position needing heat dissipation, then a groove is formed in the metal heat dissipation block, and finally an electronic component needing heat dissipation is arranged in the groove to realize heat conduction, however, the groove is inconvenient to process and the heat dissipation effect is difficult to control.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a method of manufacturing a circuit board that avoids the need for grooving the metal heat sink.
In addition, it is also necessary to provide a circuit board.
A method of manufacturing a circuit board, comprising the steps of: the method comprises the steps of providing a circuit substrate, wherein the circuit substrate comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is a surface of the first substrate far away from the second substrate, the second surface is a surface of the second substrate located on the outer side far away from the first substrate, at least one accommodating space is formed in the second surface, and the accommodating space does not penetrate through the first surface.
At least one heat sink is provided, and the heat sink comprises a third surface and a fourth surface opposite to the third surface.
The heat dissipation block is fixed in the accommodating space, so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at intervals with the bottom of the accommodating space.
And removing a part of the first substrate corresponding to the heat dissipation block, exposing the third surface to the circuit substrate, and arranging an electronic element on the third surface to obtain the circuit board.
Further, the preparation of the circuit substrate specifically includes: the method comprises the steps of providing a first substrate, wherein the first substrate comprises a first base material layer and two first copper foil layers arranged on two opposite surfaces of the first base material layer, the first substrate is provided with at least one blind groove, and the blind groove penetrates through one first copper foil layer and part of the first base material layer.
Providing at least one second substrate, wherein each second substrate comprises a second base material layer and second copper foil layers arranged on two opposite surfaces of the second base material layer, each second substrate is provided with at least one slot, and the slots penetrate through the second base material layer and each second copper foil layer.
And stacking all the second substrates on the same side of the first substrate, so that the grooves correspond to the blind grooves to form the accommodating space.
Further, the step of stacking all the second substrates before the first substrate further includes: an adhesive layer is arranged between the first substrate and the second substrate and between the second substrate and the second substrate, and through holes are arranged on the adhesive layer at positions corresponding to the blind grooves and the grooves.
Further, the adhesive layer is provided with a through hole, the through hole is communicated with the open slot and the blind slot, and the width of the through hole is larger than the width of the through hole or the width of the open slot along the thickness direction of the circuit board.
Further, the fixing the heat dissipation block in the accommodating space specifically includes the steps of: and fixing the third surface of the heat dissipation block on a temporary carrier plate. The third surface of the circuit substrate is fixed on the temporary carrier plate, the heat dissipation block is accommodated in the accommodating space, the heat dissipation block further comprises a plurality of side surfaces connected with the first surface and the second surface, and a first gap exists between the side surfaces and the side walls of the accommodating space. Pressing the circuit substrate so that the bonding layer is filled in the first gap; and stripping the temporary carrier plate.
Further, after the heat dissipation block is fixed in the accommodating space, the method further comprises: etching the first copper foil layer of the first substrate far away from the radiating block to obtain a first circuit layer; and etching the second copper foil layer of the second substrate close to the first surface to obtain a second circuit layer.
Further, before the heat dissipating block is fixed in the accommodating space, a peelable adhesive layer is disposed on the second surface, and the peelable adhesive layer is disposed at a distance from the bottom of the accommodating space, and after the step of removing the portion of the first substrate corresponding to the heat dissipating block, the method further includes: the peelable adhesive layer is peeled off and the second surface is exposed to the circuit substrate.
Further, the material of the heat dissipation block is at least one selected from copper, iron, nickel, silver, gold, aluminum nitride alloy and copper molybdenum alloy.
The circuit board comprises a circuit substrate, at least one heat dissipation block and at least one electronic element, wherein the heat dissipation block is embedded into the circuit substrate, and the electronic element is arranged on the heat dissipation block. The circuit substrate comprises a first substrate and at least one second substrate which is overlapped on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is the surface of the first substrate away from the second substrate, the second surface is the surface of the second substrate located on the outer side away from the first substrate, at least one accommodating space is formed in the second surface, and the accommodating space does not penetrate through the first surface. The heat dissipation block comprises a third surface and a fourth surface opposite to the third surface, the height of the heat dissipation block is smaller than the depth of the accommodating space, and the width of the heat dissipation block is smaller than the width of the accommodating space. The heat dissipation block is accommodated in the accommodating space, the second surface is flush with the fourth surface, the third surface is exposed out of the accommodating space, and the electronic element is arranged on the third surface.
According to the manufacturing method of the circuit board, the accommodating space is formed, the radiating block is filled into the accommodating space, and finally the radiating block is exposed through the bottom of the accommodating space, so that the situation that the radiating block is directly grooved is avoided, the processing cost is reduced, meanwhile, the damage to the heat conducting surface of the radiating block can be reduced to the greatest extent, and the radiating effect is improved.
Drawings
Fig. 1 is a schematic diagram of a first substrate according to an embodiment of the present invention.
FIG. 2 is a schematic diagram of a second substrate and an adhesive layer according to an embodiment of the invention
Fig. 3 is a schematic diagram of a heat dissipating block according to the present invention.
Fig. 4 is a schematic view of the first substrate shown in fig. 1, the substrate shown in fig. 2, the adhesive layer, and the heat sink shown in fig. 3 before fixing.
Fig. 5 is a schematic view of the first substrate shown in fig. 1, the substrate shown in fig. 2, the adhesive layer, and the heat sink shown in fig. 3 after being fixed.
FIG. 6 is a schematic diagram of FIG. 5 after etching the first copper foil layer and the second copper foil layer.
Fig. 7 is a schematic diagram of a circuit board according to an embodiment of the present invention.
Description of the main reference signs
Step 35 of circuit board 100
The first substrate 10 is accommodated in the space 40
First gap 41 of first substrate layer 11
Second gap 42 of first copper foil layer 12
First circuit 121 adhesive layer 50
Blind groove 13 through hole 51
The second substrate 20 is provided with a heat sink 60
Third surface 61 of second substrate layer 21
Fourth surface 62 of second copper foil layer 22
Second line 222 side 63
Slotting 23 strippable glue layer 611
Electronic component 70 of circuit board 30
First surface 31 width L1, L2, L3, L4, L5, L6
Second surface 32 height H
Depth D of opening 34
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1-7, the present invention provides a method for manufacturing a circuit board 100, which includes the steps of:
referring to fig. 4, a circuit substrate 30 is provided, the circuit substrate 30 includes a first substrate 10 and at least one second substrate 20 stacked on the same side of the first substrate 10, the circuit substrate 30 includes a first surface 31 and a second surface 32 disposed opposite to each other, the first surface 31 is a surface of the first substrate 10 away from the second substrate 20, the second surface 32 is a surface of the second substrate 20 located at an outer side away from the first substrate 10, the second surface 32 is provided with at least one accommodating space 40, and the accommodating space 40 does not penetrate through the first surface 31;
in the present embodiment, in step S1, providing the circuit substrate 30 includes the steps of:
referring to fig. 1, a first substrate 10 is provided, wherein the first substrate 10 includes a first base material layer 11 and two first copper foil layers 12 disposed on opposite sides of the first base material layer 11, the first substrate 10 is provided with at least one blind groove 13, and the blind groove 13 penetrates through one of the first copper foil layers 12 and a portion of the first base material layer 11.
Referring to fig. 2, at least one second substrate 20 is provided, the second substrate 20 includes a second base material layer 21 and two second copper foil layers 22 disposed on opposite sides of the second base material layer 21, each second substrate is provided with at least one slot 23, the slot 23 penetrates through the second base material layer 21 and the second copper foil layers 22, and a cross-sectional width L2 of the slot 23 in a thickness direction of the second substrate 20 is the same as a cross-sectional width L1 of the blind slot 13 in a thickness direction of the first substrate 10.
Referring to fig. 4, all the second substrates 20 are stacked on the same side of the first substrate 10, so that the slots 23 correspond to the blind slots 13 to form the accommodating space 40, and the circuit substrate 30 is obtained.
In this embodiment, before step S12, the second copper foil layer 22 on the side of the second substrate 20 located outside the circuit substrate 30 away from the second surface 32 is etched to form an inner circuit (not shown), and the second copper foil layer 22 of each of the second substrates 20 located inside the circuit substrate 30 is etched to form an inner circuit (not shown).
In this embodiment, in step S12, before stacking the second substrate 20 on the first substrate 10, an adhesive layer 50 is further disposed between the first substrate 10 and the second substrate 20 and between the second substrate 20 and the second substrate 20, and the adhesive layer 50 is provided with a through hole 51 at a position corresponding to the blind slot 13 and/or the slot 23.
In this embodiment, the adhesive layer 50 is a prepreg, and the main material of the adhesive layer 50 may be at least one of an epoxy adhesive material, a polyurethane adhesive material, and an acrylic adhesive material.
Referring to fig. 3, a heat dissipating block 60 is provided, the heat dissipating block 60 includes a third surface 61 and a fourth surface 62 opposite to the third surface 61, the height H of the heat dissipating block 60 is smaller than the depth D of the accommodating space 40, and the width L3 of the heat dissipating block 60 is smaller than the width L4 of the accommodating space 40.
In this embodiment, the material of the heat dissipating block 60 is a metal simple substance, such as copper, iron, nickel, silver, gold, or other heat good conductor, or the material of the heat dissipating block 60 is a metal alloy, such as aluminum nitride alloy, copper-molybdenum alloy, or other metal alloy.
Referring to fig. 4 and 5, the heat dissipating block 60 is fixed in the accommodating space 40 such that the second surface 32 is flush with the fourth surface 62, and the third surface 61 faces the bottom of the accommodating space 40 and is spaced apart from the bottom of the accommodating space 40.
In this embodiment, in step S3, the fixing the heat dissipating block 60 in the accommodating space 40 specifically includes the steps of:
s31, fixing the fourth surface 62 of the heat dissipating block 60 on a temporary carrier (not shown), and disposing a peelable adhesive layer 611 on the third surface 61;
and S32, temporarily fixing the second surface 32 of the circuit substrate 30 on the temporary carrier, and accommodating the heat dissipation block 60 in the accommodating space 40, wherein the heat dissipation block 60 further comprises a plurality of side surfaces 63 connecting the third surface 61 and the fourth surface 62, and a first gap 41 is formed between the side surfaces 63 and the side walls of the accommodating space 40.
S33, heating and pressing the circuit substrate 30 to change the adhesive layer 50 into a fluid (not shown) which flows into the first gap 41, and cooling and solidifying the fluid in the first gap 41 and peeling the carrier.
In this embodiment, the cross-sectional width L5 of the through hole 51 in the thickness direction of the adhesive layer 50 is slightly greater than the cross-sectional width L1 of the slot 23 in the thickness direction of the second substrate 20 or slightly greater than the cross-sectional width L2 of the blind slot 13 in the thickness direction of the first substrate 10, so as to ensure that the adhesive layer 50 is not excessively heated or contaminated on the fourth surface 62 in the subsequent heated extrusion process.
In this embodiment, in step S3, after the heat dissipating block 60 is fixed in the accommodating space 40, the method further includes the steps of:
referring to fig. 6, the first copper foil layer 12 of the first substrate 10 far from the heat sink 60 is etched to obtain a first circuit 121 and the second copper foil layer 22 of the second substrate 20 near the third surface 61 is etched to obtain a second circuit 222. By etching the first copper foil layer 12 far from the heat sink 60 and the second copper foil layer 22 near the third surface 61 after the circuit substrate 30 is heated and pressed, the alignment accuracy during the heating and pressing process can be improved, and the yield of the circuit board 100 can be improved.
Referring to fig. 7, the cover is opened, and the portion of the first substrate 10 corresponding to the heat dissipating block 60 is removed, so that the third surface 61 is exposed out of the circuit substrate 30; and disposing an electronic component 70 on the third surface 61 to obtain the circuit board 100.
In this embodiment, the heat generated by the electronic component 70 is conducted to the heat dissipating block 60 through the third surface 61, and the heat dissipating block 60 can quickly conduct and dissipate the heat to other locations of the circuit board 100 or to a space other than the circuit board 100 as a good conductor of heat.
In this embodiment, in step S4, the cover opening specifically includes:
s41, removing the first copper foil layer 12 and a part of the first substrate layer 11 corresponding to the heat dissipation block 60 to form an opening 34, wherein the peelable adhesive layer 611 is exposed from the opening 34.
In this embodiment, the first copper foil layer 12 and a portion of the first base material layer 11 corresponding to the heat sink 60 are removed by a laser or a molding machine.
In this embodiment, a second gap 42 is between the peelable adhesive layer 611 and the bottom of the accommodating space 40, where the second gap 42 is used to prevent the third surface 61 of the heat dissipating block 60 from being damaged when the portion of the first substrate 10 corresponding to the heat dissipating block 60 is removed.
In the present embodiment, a width L6 of the cross section of the opening 34 in the thickness direction of the circuit board 100 is smaller than a width L4 of the second gap 42 (i.e., a width L4 of the accommodating space 40), such that a step portion 35 is formed between the opening 34 and the second gap 42.
And S42, stripping the strippable glue layer 611 so that the third surface is exposed out of the first substrate 10.
In this embodiment, by disposing a peelable adhesive layer 611 before the heating and pressing, and peeling the peelable adhesive layer 611 before the electronic component 70 is disposed, the problem of the heat conduction efficiency between the electronic component 70 and the heat dissipation block 60 being reduced due to the adhesion of the fluid on the third surface 61 can be avoided.
Referring to fig. 7, the present invention further provides a circuit board 100, the circuit board 100 includes a circuit substrate 30, at least one heat dissipating block 60 and at least one electronic component 70, the heat dissipating block 60 is embedded in the circuit substrate 30, and the electronic component 70 is disposed on the heat dissipating block 60;
the circuit substrate 30 includes a first substrate 10 and at least one second substrate 20 stacked on the same side of the first substrate 10, the circuit substrate 30 includes a first surface 31 and a second surface 32 disposed opposite to each other, the first surface 31 is a surface of the first substrate 10 away from the second substrate 20, the second surface 32 is a surface of the second substrate 20 located at an outer side away from the first substrate 10, the second surface 32 is provided with at least one accommodating space 40, and the accommodating space 40 does not penetrate through the first surface 31;
the heat dissipating block 60 includes a third surface 61 and a fourth surface 62 opposite to the third surface 61, the height H of the heat dissipating block 60 is smaller than the depth D of the accommodating space 40, and the width L3 of the heat dissipating block 60 is smaller than the width L4 of the accommodating space 40;
the heat dissipating block 60 is accommodated in the accommodating space 40, the second surface 32 is flush with the fourth surface 62, the third surface 61 is exposed out of the accommodating space 40, and the electronic component 70 is disposed on the third surface 61.
The manufacturing method of the circuit board provided by the invention adopts the processes of slotting firstly, filling the radiating block into the slotting and finally penetrating the bottom of the slotting to enable the radiating block to be exposed, so that the process of directly slotting on the radiating block can be avoided, the processing cost is reduced, meanwhile, the damage to the heat conducting surface of the radiating block can be reduced to the greatest extent, and the radiating effect is improved.
In addition, various other corresponding changes and modifications will be apparent to those skilled in the art from the technical idea of the present invention, and all such changes and modifications are intended to be included in the scope of the present invention.
Claims (7)
1. A method of manufacturing a circuit board, comprising the steps of:
providing a circuit substrate, wherein the circuit substrate comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is a surface of the first substrate far away from the second substrate, the second surface is a surface of the second substrate located on the outer side far away from the first substrate, at least one accommodating space is formed in the second surface, and the accommodating space does not penetrate through the first surface;
providing at least one heat dissipation block, wherein the heat dissipation block comprises a third surface and a fourth surface opposite to the third surface, a peelable adhesive layer is arranged on the third surface, and the peelable adhesive layer is arranged at intervals with the bottom of the accommodating space;
fixing the heat dissipation block in the accommodating space so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at intervals with the bottom of the accommodating space;
removing the part of the first substrate corresponding to the heat dissipation block and the strippable glue layer, so that the third surface is exposed out of the circuit substrate; and
and arranging an electronic element on the third surface to obtain the circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein preparing the circuit board specifically comprises:
providing a first substrate, wherein the first substrate comprises a first base material layer and two first copper foil layers arranged on two opposite surfaces of the first base material layer, the first substrate is provided with at least one blind groove, and the blind groove penetrates through one first copper foil layer and part of the first base material layer;
providing at least one second substrate, wherein each second substrate comprises a second base material layer and second copper foil layers arranged on two opposite surfaces of the second base material layer, each second substrate is provided with at least one slot, and the slots penetrate through the second base material layer and each second copper foil layer;
and stacking all the second substrates on the same side of the first substrate, so that the grooves correspond to the blind grooves to form the accommodating space.
3. The method of manufacturing a circuit board according to claim 2, wherein the step of stacking all the second substrates before the first substrate further comprises:
an adhesive layer is arranged between the first substrate and the second substrate and between the second substrate and the second substrate, and through holes are arranged on the adhesive layer at positions corresponding to the blind grooves and the grooves.
4. The method of manufacturing a circuit board as defined in claim 3, wherein said adhesive layer is provided with a through hole, said through hole communicating said groove and said blind groove, and a width of said through hole is larger than a width of said blind groove or a width of said groove in a thickness direction of said circuit board.
5. The method for manufacturing a circuit board according to claim 3, wherein fixing the heat dissipation block in the accommodating space comprises the steps of:
fixing the third surface of the heat dissipation block on a temporary carrier plate;
fixing the third surface of the circuit substrate on the temporary carrier plate, and accommodating the heat dissipation block in the accommodating space, wherein the heat dissipation block further comprises a plurality of side surfaces connected with the first surface and the second surface, and a first gap exists between the side surfaces and the side walls of the accommodating space;
pressing the circuit substrate so that the bonding layer is filled in the first gap; and
and stripping the temporary carrier plate.
6. The method of manufacturing a circuit board according to claim 3, wherein after the heat dissipation block is fixed in the accommodating space, further comprising:
etching the first copper foil layer of the first substrate far away from the radiating block to obtain a first circuit layer; and
and etching the second copper foil layer of the second substrate close to the first surface to obtain a second circuit layer.
7. The method of manufacturing a circuit board according to claim 1, wherein the material of the heat dissipating block is at least one selected from the group consisting of copper, iron, nickel, silver, gold, aluminum nitride alloy, and copper molybdenum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010664042.0A CN113923848B (en) | 2020-07-10 | 2020-07-10 | Circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010664042.0A CN113923848B (en) | 2020-07-10 | 2020-07-10 | Circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN113923848A CN113923848A (en) | 2022-01-11 |
| CN113923848B true CN113923848B (en) | 2023-07-21 |
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| CN202010664042.0A Active CN113923848B (en) | 2020-07-10 | 2020-07-10 | Circuit board and manufacturing method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467249A (en) * | 2006-06-08 | 2009-06-24 | 宇芯（毛里求斯）控股有限公司 | Method of making thermally enhanced substrate-based array package |
| CN108417544A (en) * | 2018-04-13 | 2018-08-17 | 业成科技（成都）有限公司 | Heat dissipation element, using the production method of its electronic device and electronic device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2813682B2 (en) * | 1989-11-09 | 1998-10-22 | イビデン株式会社 | Substrate for mounting electronic components |
| KR102565119B1 (en) * | 2016-08-25 | 2023-08-08 | 삼성전기주식회사 | Electronic component embedded substrate and manufacturing method threrof |
| JP6637013B2 (en) * | 2017-10-31 | 2020-01-29 | ファナック株式会社 | Control device |
-
2020
- 2020-07-10 CN CN202010664042.0A patent/CN113923848B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467249A (en) * | 2006-06-08 | 2009-06-24 | 宇芯（毛里求斯）控股有限公司 | Method of making thermally enhanced substrate-based array package |
| CN108417544A (en) * | 2018-04-13 | 2018-08-17 | 业成科技（成都）有限公司 | Heat dissipation element, using the production method of its electronic device and electronic device |
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| CN113923848A (en) | 2022-01-11 |
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