CN113923848A - Circuit board and method for manufacturing the same - Google Patents
Circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- CN113923848A CN113923848A CN202010664042.0A CN202010664042A CN113923848A CN 113923848 A CN113923848 A CN 113923848A CN 202010664042 A CN202010664042 A CN 202010664042A CN 113923848 A CN113923848 A CN 113923848A
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- Prior art keywords
- substrate
- heat dissipation
- accommodating space
- dissipation block
- layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A method of manufacturing a circuit board, comprising the steps of: providing a circuit substrate, including a first substrate and at least a second substrate stacked on the same side of the first substrate, the circuit substrate includes a first surface and a second surface arranged oppositely, the first surface is the surface of the first substrate far away from the second substrate, the second surface is the surface of the second substrate far away from the first substrate located outside, the second surface is provided with at least a containing space, the containing space does not penetrate through the first surface. At least one heat dissipation block is provided, which comprises a third surface and a fourth surface opposite to the third surface. And fixing the radiating block in the accommodating space, so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at intervals with the bottom of the accommodating space. Removing the part of the first substrate corresponding to the heat dissipation block to expose the third surface out of the circuit substrate, and disposing an electronic element on the third surface. In addition, the invention also provides a circuit board.
Description
Technical Field
The invention relates to a circuit board and a manufacturing method thereof.
Background
With the development of the trend of high integration, miniaturization and miniaturization of electronic products, the density of electronic components on a circuit board is higher and higher, and the power consumption is higher and higher, which puts higher and higher requirements on the heat dissipation of the circuit board.
In the prior art, a metal radiating block is usually embedded at a position needing radiating, then a groove is formed in the metal radiating block, and finally an electronic component needing radiating is arranged in the groove to realize heat conduction, but the groove is inconvenient to process and the radiating effect is difficult to control.
Disclosure of Invention
Accordingly, there is a need for a method of manufacturing a circuit board that avoids notching the metal heat slug.
In addition, it is necessary to provide a circuit board.
A method of manufacturing a circuit board, comprising the steps of: providing a circuit substrate, the circuit substrate includes a first substrate and an at least second substrate that the stack was located the same one side of first substrate, the circuit substrate includes relative a first surface and a second surface that sets up, the first surface is the first substrate is kept away from the surface of second substrate, the second surface is for being located one in the outside the second substrate is kept away from the surface of first substrate, the second surface is equipped with at least an accommodation space, the accommodation space does not run through the first surface.
Providing at least one heat dissipation block, wherein the heat dissipation block comprises a third surface and a fourth surface opposite to the third surface.
And fixing the radiating block in the accommodating space, so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at intervals with the bottom of the accommodating space.
And removing the part of the first substrate corresponding to the heat dissipation block to expose the third surface out of the circuit substrate, and arranging an electronic element on the third surface to obtain the circuit board.
Further, the preparing of the circuit substrate specifically includes: providing one the first substrate, the first substrate comprises a first substrate layer and two first copper foil layers arranged on two opposite surfaces of the first substrate layer, the first substrate is provided with at least one blind groove, and the blind groove penetrates through one of the first copper foil layers and part of the first substrate layer.
Providing at least one second substrate, wherein each second substrate comprises a second substrate layer and second copper foil layers arranged on two opposite surfaces of the second substrate layer, each second substrate is provided with at least one notch, and the notch penetrates through the second substrate layer and each second copper foil layer.
And overlapping all the second substrates on the same side of the first substrate, so that the open grooves correspond to the blind grooves to form the accommodating space.
Further, the step of "stacking all the second substrates before the first substrate" further includes: and arranging an adhesive layer between the first substrate and the second substrate and between the second substrate and the second substrate, wherein the adhesive layer is provided with through holes at positions corresponding to the blind grooves and the open grooves.
Furthermore, the bonding layer is provided with a through hole which is communicated with the open groove and the blind groove, and the width of the through hole is larger than the width of the through hole or the width of the open groove along the thickness direction of the circuit board.
Further, fixing the heat dissipation block in the accommodating space includes the steps of: and fixing the third surface of the heat dissipation block on a temporary carrier plate. Fixing the third surface of the circuit substrate on the temporary carrier plate, and accommodating the heat dissipation block in the accommodating space, wherein the heat dissipation block further comprises a plurality of side surfaces connected with the first surface and the second surface, and a first gap is formed between the side surfaces and the side wall of the accommodating space. Pressing the circuit substrate to enable the bonding layer to be filled in the first gap; and peeling off the temporary carrier plate.
Further, with the radiating block still includes after being fixed in the accommodation space: etching the first copper foil layer of the first substrate far away from the heat dissipation block to obtain a first circuit layer; and etching a second copper foil layer of the second substrate close to the first surface to obtain a second circuit layer.
Further, before the heat dissipation block is fixed in the accommodating space, a peelable adhesive layer is disposed on the second surface, the peelable adhesive layer is spaced from the bottom of the accommodating space, and after the step of removing the portion of the first substrate corresponding to the heat dissipation block, the method further includes: and stripping the strippable glue layer and exposing the second surface to the circuit substrate.
Further, the material of the heat dissipation block is selected from at least one of copper, iron, nickel, silver, gold, aluminum nitride alloy and copper molybdenum alloy.
A circuit board comprises a circuit substrate, at least one heat dissipation block and at least one electronic element, wherein the heat dissipation block is embedded in the circuit substrate, and the electronic element is arranged on the heat dissipation block. The circuit substrate comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is the surface of the first substrate far away from the second substrate, the second surface is the surface of the second substrate far away from the first substrate, the second surface is provided with at least one accommodating space, and the accommodating space does not penetrate through the first surface. The radiating block comprises a third surface and a fourth surface opposite to the third surface, the height of the radiating block is smaller than the depth of the accommodating space, and the width of the radiating block is smaller than the width of the accommodating space. The heat dissipation block is contained in the containing space, the second surface is flush with the fourth surface, the third surface is exposed out of the containing space, and the electronic element is arranged on the third surface.
According to the circuit board, the containing space is formed, the radiating block is filled into the containing space and penetrates through the bottom of the containing space to expose the radiating block, so that the radiating block is prevented from being directly grooved on the radiating block, the processing cost is reduced, meanwhile, the damage to the heat conducting surface of the radiating block can be reduced to the greatest extent, and the radiating effect is improved.
Drawings
Fig. 1 is a schematic view of a first substrate according to an embodiment of the invention.
FIG. 2 is a schematic diagram of a second substrate and an adhesive layer according to an embodiment of the invention
Fig. 3 is a schematic view of a heat dissipation block provided by the present invention.
Fig. 4 is a schematic view of the first substrate shown in fig. 1, the substrate and the adhesive layer shown in fig. 2, and the heat dissipation block shown in fig. 3 before being fixed.
Fig. 5 is a schematic view of the first substrate shown in fig. 1, the substrate and the adhesive layer shown in fig. 2, and the heat dissipation block shown in fig. 3 being fixed together.
Fig. 6 is a schematic view of fig. 5 after etching the first copper foil layer and the second copper foil layer.
Fig. 7 is a schematic diagram of a circuit board according to an embodiment of the present invention.
Description of the main elements
The accommodating space 40 of the first substrate 10
First copper foil layer 12 second gap 42
Second line 222 side 63
Slotted 23 strippable layer 611
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 7, the present invention provides a method for manufacturing a circuit board 100, including the steps of:
s1, referring to fig. 4, providing a circuit board 30, where the circuit board 30 includes a first substrate 10 and at least one second substrate 20 stacked on the same side of the first substrate 10, the circuit board 30 includes a first surface 31 and a second surface 32 that are oppositely disposed, the first surface 31 is a surface of the first substrate 10 away from the second substrate 20, the second surface 32 is a surface of the second substrate 20 located outside away from the first substrate 10, the second surface 32 is provided with at least one accommodating space 40, and the accommodating space 40 does not penetrate through the first surface 31;
in the present embodiment, in step S1, the providing the circuit substrate 30 includes the steps of:
s10, referring to fig. 1, providing the first substrate 10, where the first substrate 10 includes a first substrate layer 11 and two first copper foil layers 12 disposed on two opposite sides of the first substrate layer 11, the first substrate 10 is provided with at least one blind slot 13, and the blind slot 13 penetrates through one first copper foil layer 12 and a part of the first substrate layer 11.
S11, referring to fig. 2, providing at least one second substrate 20, where the second substrate 20 includes a second substrate layer 21 and two second copper foil layers 22 disposed on two opposite sides of the second substrate layer 21, each second substrate has at least one slot 23, the slot 23 penetrates through the second substrate layer 21 and the second copper foil layers 22, and a cross-sectional width L2 of the slot 23 in a thickness direction of the second substrate 20 is the same as a cross-sectional width L1 of the blind via 13 in the thickness direction of the first substrate 10.
S12 referring to fig. 4, all the second substrates 20 are stacked on the same side of the first substrate 10, so that the open slots 23 correspond to the blind slots 13 to form the accommodating space 40, thereby obtaining the circuit substrate 30.
In this embodiment, before step S12, the second copper foil layer 22 on the side of the second substrate 20 away from the second surface 32 and located outside the circuit substrate 30 is etched to form an inner layer circuit (not shown), and the second copper foil layer 22 on each of the second substrates 20 and located inside the circuit substrate 30 is etched to form an inner layer circuit (not shown).
In this embodiment, in step S12, before the step of stacking the second substrate 20 on the first substrate 10, an adhesive layer 50 is disposed between the first substrate 10 and the second substrate 20, and between the second substrate 20 and the second substrate 20, and the adhesive layer 50 is disposed with a through hole 51 at a position corresponding to the blind groove 13 and/or the open groove 23.
In this embodiment, the adhesive layer 50 is a prepreg, and the main material of the adhesive layer 50 may be at least one of an epoxy adhesive, a polyurethane adhesive, and an acrylic adhesive.
S2 referring to fig. 3, a heat slug 60 is provided, the heat slug 60 includes a third surface 61 and a fourth surface 62 opposite to the third surface 61, the height H of the heat slug 60 is smaller than the depth D of the accommodating space 40, and the width L3 of the heat slug 60 is smaller than the width L4 of the accommodating space 40.
In this embodiment, the material of the heat dissipation block 60 is a simple metal, such as a good thermal conductor of copper, iron, nickel, silver, gold, or the like, or the material of the heat dissipation block 60 is a metal alloy, such as an aluminum nitride alloy, a copper-molybdenum alloy, or the like.
S3 referring to fig. 4 and 5, the heat slug 60 is fixed in the accommodating space 40 such that the second surface 32 is flush with the fourth surface 62, and the third surface 61 faces the bottom of the accommodating space 40 and is spaced from the bottom of the accommodating space 40.
In this embodiment, in step S3, the step of fixing the heat dissipation block 60 in the accommodating space 40 includes the steps of:
s31, fixing the fourth surface 62 of the heat sink 60 on a temporary carrier (not shown), and disposing a peelable adhesive layer 611 on the third surface 61;
s32, temporarily fixing the second surface 32 of the circuit substrate 30 on the temporary carrier board, and accommodating the heat sink 60 in the accommodating space 40, wherein the heat sink 60 further includes a plurality of side surfaces 63 connecting the third surface 61 and the fourth surface 62, and a first gap 41 is formed between the side surfaces 63 and the side walls of the accommodating space 40.
S33, heating and pressing the circuit substrate 30 to make the adhesive layer 50 become a fluid (not shown) which flows into the first gap 41, and cooling and solidifying the fluid in the first gap 41 to peel off the carrier plate.
In the embodiment, the cross-sectional width L5 of the through hole 51 in the thickness direction of the adhesive layer 50 is slightly larger than the cross-sectional width L1 of the slot 23 in the thickness direction of the second substrate 20 or slightly larger than the cross-sectional width L2 of the blind slot 13 in the thickness direction of the first substrate 10, so as to ensure that the adhesive layer 50 does not excessively or contaminate the fourth surface 62 in the subsequent thermal extrusion process.
In this embodiment, in step S3, after the heat dissipation block 60 is fixed in the accommodating space 40, the method further includes the steps of:
s34 referring to fig. 6, the first copper foil layer 12 of the first substrate 10 away from the heat slug 60 is etched to obtain the first circuit 121 and the second copper foil layer 22 of the second substrate 20 close to the third surface 61 is etched to obtain the second circuit 222. By etching the first copper foil layer 12 away from the heat sink 60 and the second copper foil layer 22 close to the third surface 61 after the circuit substrate 30 is heated and extruded, the alignment accuracy during heating and extrusion can be improved, and the yield of the circuit board 100 can be improved.
S4, please refer to fig. 7, uncovering, removing a portion of the first substrate 10 corresponding to the heat slug 60, so that the third surface 61 is exposed out of the circuit substrate 30; and disposing an electronic component 70 on the third surface 61 to obtain the circuit board 100.
In the present embodiment, the heat generated by the electronic component 70 is conducted to the heat dissipation block 60 through the third surface 61, and the heat dissipation block 60 as a good heat conductor can quickly conduct and dissipate the heat to other positions of the circuit board 100 or a space except the circuit board 100.
In this embodiment, in step S4, the uncovering specifically includes:
s41, removing the first copper foil layer 12 and a portion of the first substrate layer 11 corresponding to the heat spreader 60 to form an opening 34, wherein the peelable glue layer 611 is exposed out of the opening 34.
In this embodiment, the first copper foil layer 12 and a portion of the first substrate layer 11 corresponding to the heat dissipation block 60 are removed by a laser or a molding machine.
In this embodiment, a second gap 42 exists between the peelable glue layer 611 and the bottom of the accommodating space 40, and the second gap 42 is used to prevent the third surface 61 of the heat slug 60 from being damaged when the portion of the first substrate 10 corresponding to the heat slug 60 is removed.
In the present embodiment, a width L6 of the opening 34 in the cross section of the circuit board 100 in the thickness direction is smaller than a width L4 of the second gap 42 (i.e., a width L4 of the accommodating space 40), so that a step 35 is formed between the opening 34 and the second gap 42.
S42, the peelable glue layer 611 is peeled off to expose the third surface on the first substrate 10.
In this embodiment, by disposing a peelable adhesive layer 611 before the heating and pressing, and peeling off the peelable adhesive layer 611 before disposing the electronic component 70, the problem of the decrease in the heat transfer efficiency between the electronic component 70 and the heat dissipation block 60 caused by the fluid adhering to the third surface 61 can be avoided.
Referring to fig. 7, the present invention further provides a circuit board 100, where the circuit board 100 includes a circuit substrate 30, at least one heat dissipation block 60 and at least one electronic component 70, the heat dissipation block 60 is embedded in the circuit substrate 30, and the electronic component 70 is disposed on the heat dissipation block 60;
the circuit substrate 30 includes a first substrate 10 and at least one second substrate 20 stacked on the same side of the first substrate 10, the circuit substrate 30 includes a first surface 31 and a second surface 32 that are oppositely disposed, the first surface 31 is a surface of the first substrate 10 away from the second substrate 20, the second surface 32 is a surface of the second substrate 20 located outside away from the first substrate 10, the second surface 32 is provided with at least one accommodating space 40, and the accommodating space 40 does not penetrate through the first surface 31;
the heat slug 60 comprises a third surface 61 and a fourth surface 62 opposite to the third surface 61, the height H of the heat slug 60 is smaller than the depth D of the accommodating space 40, the width L3 of the heat slug 60 is smaller than the width L4 of the accommodating space 40;
the heat dissipation block 60 is accommodated in the accommodating space 40, the second surface 32 is flush with the fourth surface 62, the third surface 61 is exposed out of the accommodating space 40, and the electronic element 70 is disposed on the third surface 61.
The circuit board manufacturing method provided by the invention adopts the process of firstly slotting, then filling the radiating block into the slotting and finally penetrating the bottom of the slotting to expose the radiating block, so that the slotting on the radiating block can be avoided directly, the processing cost is reduced, meanwhile, the damage to the heat-conducting surface of the radiating block can be reduced to the greatest extent, and the radiating effect is favorably improved.
In addition, it is obvious to those skilled in the art that other various corresponding changes and modifications can be made according to the technical idea of the present invention, and all such changes and modifications should fall within the protective scope of the present invention.
Claims (9)
1. A method of manufacturing a circuit board, comprising the steps of:
providing a circuit substrate, wherein the circuit substrate comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is the surface of the first substrate far away from the second substrate, the second surface is the surface of the second substrate far away from the first substrate, the second surface is provided with at least one accommodating space, and the accommodating space does not penetrate through the first surface;
providing at least one heat dissipation block, wherein the heat dissipation block comprises a third surface and a fourth surface opposite to the third surface;
fixing the heat dissipation block in the accommodating space, so that the second surface is flush with the fourth surface, and the third surface faces the bottom of the accommodating space and is arranged at an interval with the bottom of the accommodating space;
removing a part of the first substrate corresponding to the heat dissipation block to expose the third surface out of the circuit substrate; and
and arranging an electronic element on the third surface to obtain the circuit board.
2. The method of manufacturing a circuit board according to claim 1, wherein the preparing the circuit substrate specifically includes:
providing the first substrate, wherein the first substrate comprises a first substrate layer and two first copper foil layers arranged on two opposite surfaces of the first substrate layer, the first substrate is provided with at least one blind groove, and the blind groove penetrates through one first copper foil layer and part of the first substrate layer;
providing at least one second substrate, wherein each second substrate comprises a second substrate layer and second copper foil layers arranged on two opposite surfaces of the second substrate layer, each second substrate is provided with at least one notch, and the notch penetrates through the second substrate layer and each second copper foil layer;
and overlapping all the second substrates on the same side of the first substrate, so that the open grooves correspond to the blind grooves to form the accommodating space.
3. The method for manufacturing a circuit board according to claim 2, wherein the step of "stacking all the second substrates before the first substrate" further comprises:
and arranging an adhesive layer between the first substrate and the second substrate and between the second substrate and the second substrate, wherein the adhesive layer is provided with through holes at positions corresponding to the blind grooves and the open grooves.
4. The method for manufacturing a circuit board according to claim 3, wherein the adhesive layer is provided with a through hole which communicates the open groove and the blind groove, and a width of the through hole is larger than a width of the through hole or a width of the open groove in a thickness direction of the circuit board.
5. The method for manufacturing a circuit board according to claim 3, wherein the step of fixing the heat slug in the accommodating space comprises the steps of:
fixing the third surface of the heat dissipation block on a temporary carrier plate;
fixing the third surface of the circuit substrate on the temporary carrier plate, and accommodating the heat dissipation block in the accommodating space, wherein the heat dissipation block further comprises a plurality of side surfaces connecting the first surface and the second surface, and a first gap is formed between the side surfaces and the side wall of the accommodating space;
pressing the circuit substrate to enable the bonding layer to be filled in the first gap; and
and stripping the temporary carrier plate.
6. The method for manufacturing a circuit board according to claim 3, wherein fixing the heat dissipation block in the accommodating space further comprises:
etching the first copper foil layer of the first substrate far away from the heat dissipation block to obtain a first circuit layer; and
and etching a second copper foil layer of the second substrate close to the first surface to obtain a second circuit layer.
7. The method for manufacturing a circuit board according to claim 1, wherein a peelable adhesive layer is disposed on the second surface before the heat slug is fixed in the accommodating space, the peelable adhesive layer being spaced from a bottom of the accommodating space,
after the step of removing the portion of the first substrate corresponding to the heat dissipation block, the method further includes: and stripping the strippable glue layer and exposing the second surface to the circuit substrate.
8. The method for manufacturing a circuit board according to claim 1, wherein a material of the heat dissipation block is at least one selected from the group consisting of copper, iron, nickel, silver, gold, aluminum nitride alloy, and copper molybdenum alloy.
9. A circuit board is characterized by comprising a circuit substrate, at least one heat dissipation block and at least one electronic element, wherein the heat dissipation block is embedded in the circuit substrate, and the electronic element is arranged on the heat dissipation block;
the circuit substrate comprises a first substrate and at least one second substrate stacked on the same side of the first substrate, the circuit substrate comprises a first surface and a second surface which are oppositely arranged, the first surface is the surface of the first substrate far away from the second substrate, the second surface is the surface of the second substrate far away from the first substrate and positioned on the outer side, the second surface is provided with at least one accommodating space, and the accommodating space does not penetrate through the first surface;
the heat dissipation block comprises a third surface and a fourth surface opposite to the third surface, the heat dissipation block is contained in the containing space, the second surface is flush with the fourth surface, the third surface is exposed out of the containing space, and the electronic element is arranged on the third surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010664042.0A CN113923848B (en) | 2020-07-10 | 2020-07-10 | Circuit board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010664042.0A CN113923848B (en) | 2020-07-10 | 2020-07-10 | Circuit board and manufacturing method thereof |
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| CN113923848A true CN113923848A (en) | 2022-01-11 |
| CN113923848B CN113923848B (en) | 2023-07-21 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| CN101467249A (en) * | 2006-06-08 | 2009-06-24 | 宇芯（毛里求斯）控股有限公司 | Method of making thermally enhanced substrate-based array package |
| CN107787112A (en) * | 2016-08-25 | 2018-03-09 | 三星电机株式会社 | Printed circuit board (PCB) with electronic component, its manufacture method and electronic component modular |
| CN108417544A (en) * | 2018-04-13 | 2018-08-17 | 业成科技（成都）有限公司 | Heat dissipation element, using the production method of its electronic device and electronic device |
| CN109729679A (en) * | 2017-10-31 | 2019-05-07 | 发那科株式会社 | Control device |
-
2020
- 2020-07-10 CN CN202010664042.0A patent/CN113923848B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5124884A (en) * | 1989-11-09 | 1992-06-23 | Ibiden Co., Ltd. | Electronic part mounting board and method of manufacturing the same |
| CN101467249A (en) * | 2006-06-08 | 2009-06-24 | 宇芯（毛里求斯）控股有限公司 | Method of making thermally enhanced substrate-based array package |
| CN107787112A (en) * | 2016-08-25 | 2018-03-09 | 三星电机株式会社 | Printed circuit board (PCB) with electronic component, its manufacture method and electronic component modular |
| CN109729679A (en) * | 2017-10-31 | 2019-05-07 | 发那科株式会社 | Control device |
| CN108417544A (en) * | 2018-04-13 | 2018-08-17 | 业成科技（成都）有限公司 | Heat dissipation element, using the production method of its electronic device and electronic device |
Also Published As
| Publication number | Publication date |
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| CN113923848B (en) | 2023-07-21 |
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