CN117835559A - Single-sided four-layer heat dissipation substrate and manufacturing method thereof - Google Patents
Single-sided four-layer heat dissipation substrate and manufacturing method thereof Download PDFInfo
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- CN117835559A CN117835559A CN202311863917.XA CN202311863917A CN117835559A CN 117835559 A CN117835559 A CN 117835559A CN 202311863917 A CN202311863917 A CN 202311863917A CN 117835559 A CN117835559 A CN 117835559A
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- 239000000758 substrate Substances 0.000 title claims abstract description 284
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 190
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 152
- 229910052802 copper Inorganic materials 0.000 claims abstract description 150
- 239000010949 copper Substances 0.000 claims abstract description 150
- 238000000034 method Methods 0.000 claims abstract description 38
- 230000008021 deposition Effects 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000005553 drilling Methods 0.000 claims abstract description 5
- 230000005611 electricity Effects 0.000 claims abstract description 3
- 239000010410 layer Substances 0.000 claims description 94
- 238000001816 cooling Methods 0.000 claims description 32
- 230000009969 flowable effect Effects 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000012792 core layer Substances 0.000 claims description 10
- 239000000110 cooling liquid Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 239000002335 surface treatment layer Substances 0.000 claims description 8
- 238000001514 detection method Methods 0.000 claims description 6
- 238000004381 surface treatment Methods 0.000 claims description 6
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 12
- 238000003475 lamination Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 8
- 239000003292 glue Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000012809 cooling fluid Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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Abstract
The invention discloses a single-sided four-layer heat dissipation substrate and a manufacturing method thereof, and relates to the technical field of packaging substrates. The method comprises the following steps: obtaining an FR4 double-sided copper-clad substrate; manufacturing an inner layer circuit on the surface of the FR4 double-sided copper-clad substrate; pressing the FR4 double-sided copper-clad substrate, the first prepreg, the first copper plate, the second prepreg and the second copper plate to form a first substrate; drilling, copper deposition and plate electricity are carried out on the first substrate; manufacturing an outer layer circuit on the surface of the first substrate; slotting the first substrate to form an accommodating groove; placing a third prepreg and a first copper substrate on the lower surface of the first substrate, and pressing the first substrate, the third prepreg and the first copper substrate to form a heat dissipation substrate; windowing the upper surface of a heat dissipation substrate to form a first window; and a heat dissipation block is arranged on the upper surface of the heat dissipation boss. According to the method provided by the embodiment of the invention, the heat radiation capability of the heat radiation substrate can be obviously improved, and the heat radiation efficiency of the heat radiation substrate is greatly improved.
Description
Technical Field
The invention relates to the technical field of packaging substrates, in particular to a single-sided four-layer heat dissipation substrate and a manufacturing method thereof.
Background
At present, with the development of electronic industry, electronic products with high power and high current are widely used, and the requirements on the packaging substrate serving as the electronic component carrier plate are higher and higher, wherein the important point is the requirement on the heat dissipation effect of the electronic component carrier plate. Because the power and the current of the electronic product are larger, higher heat is generated, and if the heat dissipation problem cannot be properly solved, the performance of the product is greatly affected. At present, a copper block is generally embedded in an FR4 packaging substrate to dissipate heat, and the method has a certain heat dissipation effect, but as the circuit design in the packaging substrate is more and more dense and the electronic elements are more and more, the generated heat is more and more, and the heat dissipation efficiency of the method cannot meet the requirements.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention provides the single-sided four-layer heat dissipation substrate and the manufacturing method thereof, which can improve the heat dissipation capacity of the packaging substrate and meet the requirements of high-power and high-current electronic products.
On one hand, the manufacturing method of the single-sided four-layer heat dissipation substrate according to the embodiment of the invention comprises the following steps:
obtaining an FR4 double-sided copper-clad substrate; the FR4 double-sided copper-clad substrate comprises a core layer, a first copper layer and a second copper layer, wherein the first copper layer is arranged on the upper surface of the core layer, and the second copper layer is arranged on the lower surface of the core layer;
manufacturing an inner layer circuit on the surface of the FR4 double-sided copper-clad substrate;
sequentially placing a first prepreg and a first copper plate on the upper surface of the FR4 double-sided copper-clad substrate, sequentially placing a second prepreg and a second copper plate on the lower surface of the FR4 double-sided copper-clad substrate, and pressing to form a first substrate;
drilling the first substrate to form a first through hole penetrating the first substrate, and carrying out copper deposition and plate electricity on the first substrate;
manufacturing an outer layer circuit on the surface of the first substrate; the outer layer circuit is communicated with the inner layer circuit through the first through hole;
slotting the first substrate, and forming an accommodating groove in a preset heat dissipation area; the accommodating groove penetrates through the first substrate to the lower surface of the first copper plate from bottom to top;
placing a third prepreg on the lower surface of the first substrate; the third prepreg is provided with an avoidance window corresponding to the accommodating groove;
acquiring a first copper substrate, and forming a heat dissipation boss matched with the accommodating groove on the upper surface of the first copper substrate;
placing the first copper substrate on the lower surface of the third prepreg, and enabling the heat dissipation boss to penetrate through the avoidance window and be placed in the accommodating groove;
pressing the first substrate, the third prepreg and the first copper substrate to form a heat dissipation substrate;
windowing the upper surface of the heat dissipation substrate to form a first window so as to expose the upper surface of the heat dissipation boss;
a heat dissipation block is arranged on the upper surface of the heat dissipation boss; the outer layer circuit and the inner layer circuit are communicated with the heat dissipation boss or the heat dissipation block.
According to some embodiments of the invention, the method further comprises the steps of:
manufacturing a plurality of first heat dissipation copper columns which are distributed at intervals at the bottom of the first copper substrate; a first cooling channel is formed among the plurality of first heat dissipation copper columns;
obtaining a second copper substrate, and manufacturing a plurality of second heat dissipation copper columns corresponding to the plurality of first heat dissipation copper columns on the upper surface of the second copper substrate; a second cooling channel is formed among the second heat dissipation copper columns, and the first cooling channel is communicated with the second cooling channel to form a circulating cooling channel;
a second through hole and a third through hole are formed in the second copper substrate; the second through hole is used as a cooling liquid inlet of the circulating cooling channel, and the third through hole is used as a cooling liquid outlet of the circulating cooling channel;
and arranging the second copper substrate at the bottom of the first copper substrate.
According to some embodiments of the invention, the method further comprises the steps of:
and carrying out surface treatment on the second copper substrate to form a first surface treatment layer.
According to some embodiments of the invention, the placing a third prepreg on the lower surface of the first substrate specifically includes:
obtaining the third prepreg;
windowing the third prepreg to form an avoidance window corresponding to the accommodating groove; the unilateral size of the avoidance window is 0.07mm-1.00mm larger than that of the heat dissipation boss.
According to some embodiments of the present invention, the obtaining a first copper substrate, and forming a heat dissipation boss adapted to the accommodating groove on an upper surface of the first copper substrate, specifically includes:
acquiring the first copper substrate;
attaching a photosensitive dry film on the surface of the first copper substrate, exposing and developing the photosensitive dry film, and covering the area corresponding to the heat dissipation boss;
etching the upper surface of the first copper substrate to form the heat dissipation boss;
and removing the photosensitive dry film, and carrying out browning treatment on the first copper substrate.
According to some embodiments of the invention, the windowing is performed on the upper surface of the heat dissipation substrate to form a first window so as to expose the upper surface of the heat dissipation boss, and the method specifically includes:
a laser positioning hole is formed in the heat dissipation substrate;
and aligning according to the laser positioning holes, and windowing the upper surface of the heat dissipation substrate corresponding to the position of the heat dissipation boss in a laser windowing mode to form a first window so as to expose the upper surface of the heat dissipation boss.
According to some embodiments of the invention, the third cured sheet comprises a flowable PP sheet and a non-flowable PP sheet; the placing of the third prepreg on the lower surface of the first substrate specifically includes:
placing the non-flowable PP sheet on a lower surface of the first substrate;
and placing the flowable PP sheet on the lower surface of the non-flowable PP sheet.
According to some embodiments of the invention, the method further comprises the steps of:
performing AOI detection on the radiating substrate;
manufacturing a solder mask layer on the surface of the heat dissipation substrate, and windowing the solder mask layer to form a bonding pad;
forming character information on the surface of the solder mask layer by screen printing of thermosetting ink;
CNC machining and forming are conducted on the radiating substrate.
According to some embodiments of the invention, the method further comprises the steps of:
carrying out surface treatment on the bonding pad to form a second surface treatment layer;
and performing a withstand voltage test on the heat dissipation substrate.
On the other hand, the single-sided four-layer heat dissipation substrate according to the embodiment of the invention is manufactured by the manufacturing method of the single-sided four-layer heat dissipation substrate.
According to the single-sided four-layer heat dissipation substrate and the manufacturing method thereof, the single-sided four-layer heat dissipation substrate has at least the following beneficial effects: the heat dissipation substrate is formed by laminating the first copper substrate and the FR4 double-sided copper-clad substrate, and the heat dissipation capability of the heat dissipation substrate can be remarkably improved because the heat dissipation capability of the first copper substrate is much stronger than that of the FR4 double-sided copper-clad substrate; meanwhile, the first copper substrate is provided with a heat dissipation boss, the heat dissipation boss is embedded into the FR4 double-sided copper-clad substrate and is communicated with a circuit in the FR4 double-sided copper-clad substrate, and therefore the heat dissipation effect is further improved. In addition, the accommodating groove is capped through the first copper plate, so that glue overflow to the surface of the first substrate in the lamination process can be avoided. Finally, the heat dissipation block is arranged on the upper surface of the heat dissipation boss, so that the heat dissipation effect is further improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a flow chart of steps of a method for manufacturing a single-sided four-layer heat dissipation substrate according to an embodiment of the invention;
FIG. 2 is a schematic diagram of an FR4 double-sided copper-clad substrate according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a first substrate according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of the structure after drilling, copper deposition and plating the first substrate;
fig. 5 is a schematic structural view of the first substrate after grooving to form the accommodating groove;
FIG. 6 is a schematic structural diagram of a first substrate according to an embodiment of the present invention;
FIG. 7 is a schematic view of a first copper substrate according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a heat dissipating substrate according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of the heat dissipating substrate after the upper surface of the heat dissipating substrate is windowed;
fig. 10 is a schematic structural view of a heat dissipating block disposed on an upper surface of a heat dissipating boss;
FIG. 11 is a schematic diagram of a structure of a first copper pillar fabricated on the bottom of a first copper substrate;
FIG. 12 is a schematic diagram of a second copper substrate according to an embodiment of the present invention;
FIG. 13 is a schematic view of the structure after disposing a second copper substrate on the bottom of the first copper substrate;
FIG. 14 is a schematic view showing the structure of a circulating cooling channel according to an embodiment of the present invention;
reference numerals:
the FR4 double-sided copper-clad substrate 100, the core layer 110, the first copper layer 120, the second copper layer 130, the first prepreg 200, the first copper plate 300, the second prepreg 400, the second copper plate 500, the first through hole 600, the copper foil 700, the accommodating groove 800, the third prepreg 900, the avoiding window 910, the first copper substrate 1000, the heat dissipation boss 1001, the first window 1002, the heat dissipation block 1100, the first heat dissipation copper pillar 1200, the first cooling channel 1210, the second copper substrate 1300, the second heat dissipation copper pillar 1310, the second cooling channel 1320, the second through hole 1330, the third through hole 1340, and the circulation cooling channel 1400.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. The step numbers in the following embodiments are set for convenience of illustration only, and the order between the steps is not limited in any way, and the execution order of the steps in the embodiments may be adaptively adjusted according to the understanding of those skilled in the art.
In the description of the present invention, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present invention and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," "third," and "fourth" and the like in the description and in the claims and drawings are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
At present, with the development of electronic industry, electronic products with high power and high current are widely used, and the requirements on the packaging substrate serving as the electronic component carrier plate are higher and higher, wherein the important point is the requirement on the heat dissipation effect of the electronic component carrier plate. Because the power and the current of the electronic product are larger, higher heat is generated, and if the heat dissipation problem cannot be properly solved, the performance of the product is greatly affected. At present, a copper block is generally embedded in an FR4 packaging substrate to dissipate heat, and the method has a certain heat dissipation effect, but as the circuit design in the packaging substrate is more and more dense and the electronic elements are more and more, the generated heat is more and more, and the heat dissipation efficiency of the method cannot meet the requirements.
Therefore, the embodiment of the invention provides a single-sided four-layer heat dissipation substrate and a manufacturing method thereof, wherein the heat dissipation substrate is formed by laminating a first copper substrate and an FR4 double-sided copper-clad substrate, and the heat dissipation capacity of the first copper substrate is much stronger than that of the FR4 double-sided copper-clad substrate, so that the heat dissipation capacity of the heat dissipation substrate can be remarkably improved; meanwhile, the first copper substrate is provided with a heat dissipation boss, the heat dissipation boss is embedded into the FR4 double-sided copper-clad substrate and is communicated with a circuit in the FR4 double-sided copper-clad substrate, and therefore the heat dissipation effect is further improved. In addition, the accommodating groove is capped through the first copper plate, so that glue overflow to the surface of the first substrate in the lamination process can be avoided. Finally, the heat dissipation block is arranged on the upper surface of the heat dissipation boss, so that the heat dissipation effect is further improved.
The following describes a single-sided four-layer heat dissipation substrate and a manufacturing method thereof in detail with reference to the accompanying drawings.
On the one hand, as shown in fig. 1, the manufacturing method of the single-sided four-layer heat dissipation substrate according to the embodiment of the invention comprises the following steps:
step S100: obtaining an FR4 double-sided copper-clad substrate 100; the FR4 double-sided copper-clad substrate 100 includes a core layer 110, a first copper layer 120 and a second copper layer 130, wherein the first copper layer 120 is disposed on the upper surface of the core layer 110, and the second copper layer 120 is disposed on the lower surface of the core layer 110.
Specifically, as shown in fig. 2, firstly, the required double-sided copper-clad substrate 100 is prepared according to the design size, and then, the FR4 double-sided copper-clad substrate 100 is baked to remove the moisture of the FR4 double-sided copper-clad substrate 100.
Step S200: an inner layer wiring is formed on the surface of the FR4 double-sided copper-clad substrate 100.
Specifically, an inner layer wiring pattern is formed by attaching a photosensitive dry film to the upper and lower surfaces of the FR4 double-sided copper-clad substrate 100, then exposing and developing the photosensitive dry film, then etching the inner layer wiring pattern to form an inner layer wiring pattern, and removing the photosensitive dry film. After the inner layer circuit is manufactured, AOI detection (Automated Optical Inspection, automatic optical detection) is performed on the FR4 double-sided copper-clad substrate, so that no problem exists in the inner layer circuit.
Step S300: a first prepreg 200 and a first copper plate 300 are sequentially placed on the upper surface of the FR4 double-sided copper-clad substrate 100, a second prepreg 400 and a second copper plate 500 are sequentially placed on the lower surface of the FR4 double-sided copper-clad substrate 100, and the first substrate is formed by lamination, as shown in fig. 3.
Specifically, before the lamination, the first copper plate 300, the first prepreg 200, the FR4 double-sided copper-clad substrate 100, the second prepreg 400, and the second copper plate 500 are riveted in the order from top to bottom, and then the first substrate is formed by high-temperature and high-pressure lamination.
Step S400: the first substrate is drilled, a first through hole 600 is formed through the first substrate, and copper deposition and plating are performed on the first substrate.
Specifically, as shown in fig. 4, the first substrate is drilled by mechanical drilling or the like to form a first through hole 600; then, copper deposition and electroplating are performed on the whole plate, so that a thin copper foil layer is formed on the side wall of the first through hole 600 and the surface of the first substrate, the first through hole 600 can conduct the upper layer circuit and the lower layer circuit, and a foundation is provided for manufacturing an outer layer circuit on the surface of the first substrate later.
Step S500: manufacturing an outer layer circuit on the surface of the first substrate; the outer layer wiring is conducted with the inner layer wiring through the first via hole 600.
Specifically, the outer layer circuit pattern may be formed by attaching a photosensitive dry film to the upper and lower surfaces of the first substrate, then exposing and developing the photosensitive dry film, then etching the outer layer circuit according to the outer layer circuit pattern, and removing the photosensitive dry film. And the outer layer circuit and the inner layer circuit are conducted through the first through hole, so that a first substrate with four layers of circuits is formed. After the outer layer circuit is manufactured, AOI detection can be performed on the first substrate, so that the circuit of each layer of the first substrate is ensured to have no problem.
Step S600: slotting the first substrate, and forming an accommodating groove 800 in a preset heat dissipation area; the receiving groove 800 penetrates the first substrate to the lower surface of the first copper plate 300 from the bottom up.
Specifically, as shown in fig. 5, a receiving groove 800 is formed in a heat dissipation area preset in the first substrate by adopting a laser grooving manner; wherein the receiving groove 800 does not completely penetrate the first substrate but penetrates the lower surface of the first copper plate 300 from bottom to top. The accommodating recess 800 is used for accommodating the heat radiation boss 1001 of the first copper substrate 1000 later.
Step S700: placing a third prepreg 900 on the lower surface of the first substrate; the third prepreg 900 is provided with a dodging window 910 corresponding to the receiving groove 800.
Specifically, as shown in fig. 6, the step S700 specifically includes the following two steps:
(1) Obtaining a third prepreg 900;
(2) Windowing the third prepreg 900 to form an avoidance window 910 corresponding to the accommodating groove 800; the unilateral dimension of the relief window 910 is 0.07mm-1.00mm larger than the unilateral dimension of the heat dissipating boss 1001.
Specifically, the size of the escape window 910 may be the same as that of the receiving groove 800, and each is 0.07mm to 1.00mm larger than the single-side size of the heat radiation boss 1001 in order to facilitate the heat radiation boss 1001 to pass through the escape window 910 and enter the inside of the receiving groove 800. Meanwhile, the sizes of the avoiding window 910 and the accommodating groove 800 are not too much larger than the heat dissipation boss 1001, so that gaps between the accommodating groove 800 and the heat dissipation boss 1001 cannot be filled with glue during subsequent lamination.
Step S800: the first copper substrate 1000 is obtained, and a heat radiation boss 1001 adapted to the accommodation groove 800 is formed on the upper surface of the first copper substrate 1000.
Specifically, as shown in fig. 7, the step S700 specifically includes the following four steps:
(1) Acquiring a first copper substrate 1000;
(2) Attaching a photosensitive dry film on the surface of the first copper substrate 1000, exposing and developing the photosensitive dry film, and covering the area corresponding to the heat radiation boss 1001;
(3) Etching the upper surface of the first copper substrate 1000 to form a heat radiation boss 1001;
(4) The photosensitive dry film is removed, and the first copper substrate 1000 is subjected to a browning process.
The thickness of the heat radiation boss 1001 is equal to the sum of the thicknesses of the accommodating groove 800 and the avoiding window 910, so that the heat radiation boss can just pass through the avoiding window 910 and be placed inside the accommodating groove 800. Meanwhile, the first copper substrate 1000 is subjected to browning treatment, so that the surface roughness of the first copper substrate 1000 is improved, the binding force between the subsequent first copper substrate 1000 and the first substrate is further improved, and the stability of subsequent lamination is ensured.
Step S900: the first copper substrate 1000 is placed on the lower surface of the third prepreg 900 such that the heat radiation boss 1001 is placed inside the receiving groove 800 through the escape window 910 as shown in fig. 8.
Step S1000: the first substrate, the third prepreg 900, and the first copper substrate 1000 are laminated to form a heat dissipation substrate, as shown in fig. 8.
Specifically, when the heat dissipating bosses 1001 are provided in plurality, since the heights of the heat dissipating bosses 1001 at different positions in the same plate may be different when the heat dissipating bosses 1001 are etched to the first copper substrate 1000, if the conventional lamination method is adopted, the heat dissipating bosses 1001 with different heights may cause glue overflow in the lamination process. In order to avoid this, the accommodating groove 800 provided in the present application does not completely penetrate the first substrate, but penetrates the lower surface of the first copper plate 300 from bottom to top, and the accommodating groove 800 is capped by using the first copper plate 300, so that glue overflows to the surface of the first substrate in the lamination process can be avoided, and thus, the height difference of the heat dissipation boss 1001 can be avoided, the fault tolerance rate in the process of etching the heat dissipation boss 1001 is high, the process control is relatively easy, and the production efficiency is directly improved.
Step S1100: the first copper plate 300 is windowed to form a first window 1002 to expose the upper surface of the heat radiation boss 1001, as shown in fig. 9.
The step S1100 specifically includes the following two steps:
(1) A laser positioning hole is formed in the heat dissipation substrate;
(2) And aligning according to the laser positioning holes, and then windowing the position of the upper surface of the heat dissipation substrate corresponding to the heat dissipation boss 1001 in a laser windowing mode to form a first window 1002 so as to expose the upper surface of the heat dissipation boss 1001.
The laser positioning holes are used for positioning, so that the accuracy of laser windowing can be improved, and the first window 1002 is formed in a laser windowing mode, so that the upper surface of the heat dissipation boss 1001 is exposed, and the heat dissipation block 1100 is conveniently arranged on the upper surface of the heat dissipation boss 1001.
Step S1200: a heat dissipation block 1100 is provided on the upper surface of the heat dissipation boss 1001; the outer layer line and the inner layer line are conducted with the heat radiation boss 1001 or the heat radiation block 1100.
Specifically, as shown in fig. 10, by arranging the heat dissipation block 1100 on the upper surface of the heat dissipation boss 1001 and making the heat dissipation block 1100 flush with the upper surface of the heat dissipation substrate, the conduction between the outer layer circuit and the heat dissipation block 1100 is realized, and the inner layer circuit is conducted with the heat dissipation boss 1001, so that the heat dissipation is performed inside the heat dissipation substrate together by matching the heat dissipation block 1100 with the heat dissipation boss 1001, and the heat dissipation efficiency is improved.
According to the manufacturing method of the single-sided four-layer heat dissipation substrate, the heat dissipation substrate is formed by laminating the first copper substrate 1000 and the FR4 double-sided copper-clad substrate 100, and the heat dissipation capacity of the first copper substrate 1000 is much stronger than that of the FR4 double-sided copper-clad substrate 100, so that the heat dissipation capacity of the heat dissipation substrate can be remarkably improved; meanwhile, the first copper substrate 1000 is provided with a heat dissipating boss 1001, and the heat dissipating boss 1001 is embedded into the FR4 double-sided copper-clad substrate 100 to be conducted with a circuit inside the FR4 double-sided copper-clad substrate 100, thereby further improving the heat dissipating effect. In addition, the accommodating groove 800 is capped by the first copper plate 300, so that glue overflow to the surface of the first substrate in the lamination process can be avoided, and therefore, the height difference of the heat dissipation boss 1001 is not needed to be considered, the fault tolerance rate in the process of etching the heat dissipation boss 1001 is high, the process control is relatively easy, and the production efficiency is directly improved. Finally, the heat dissipation block 1100 is disposed on the upper surface of the heat dissipation boss 1001, thereby further improving the heat dissipation effect.
Further, as shown in fig. 11 to 14, the method for manufacturing a single-sided four-layer heat dissipation substrate according to the embodiment of the invention further includes the following steps:
a plurality of first heat dissipation copper pillars 1200 are formed at intervals on the bottom of the first copper substrate 1000; a first cooling channel 1210 is formed between the plurality of first heat dissipation copper pillars 1200;
acquiring a second copper substrate 1300, and manufacturing a plurality of second heat dissipation copper pillars 1310 corresponding to the plurality of first heat dissipation copper pillars 1200 on the upper surface of the second copper substrate 1300; a second cooling channel 1320 is formed among the second heat dissipation copper pillars 1310, and the first cooling channel 1210 is communicated with the second cooling channel 1320 to form a circulating cooling channel 1400;
a second through hole 1330 and a third through hole 1340 are formed in the second copper substrate 1300; the second through hole 1330 serves as a cooling fluid inlet of the circulation cooling channel 1400, and the third through hole 1340 serves as a cooling fluid outlet of the circulation cooling channel 1400;
at the bottom of the first copper substrate 1000, a second copper substrate 1300 is provided.
Specifically, as shown in fig. 11, first, a plurality of first heat dissipation copper pillars 1200 are formed on the bottom of a first copper substrate 1000 by electroplating; then, as shown in fig. 12, a second copper substrate 1300 is obtained, and a plurality of second heat dissipation copper pillars 1310 are fabricated on the upper surface of the second copper substrate 1300 by etching or electroplating, where the second heat dissipation copper pillars 1310 are in one-to-one correspondence with the first heat dissipation copper pillars 1200. The second copper substrate 1300 is disposed at the bottom of the first copper substrate 100 as a cover plate of the heat dissipation substrate. As shown in fig. 14, the first cooling channel 1210 communicates with the second cooling channel 1320 to form a circulation cooling channel 1400, and the circulation cooling channel has a cooling liquid inlet (i.e., a second through hole 1330) and a cooling liquid outlet (i.e., a third through hole 1340). When the heat dissipation substrate needs to be efficiently and rapidly dissipated, the cooling liquid inlet and the cooling liquid outlet are communicated with the hydraulic pump, and the cooling liquid is introduced into the circulating cooling channel 1400 by the hydraulic pump, so that heat in the heat dissipation substrate is efficiently dissipated, and the heat dissipation efficiency is greatly improved.
Further, the manufacturing method of the single-sided four-layer heat dissipation substrate in the embodiment of the invention further comprises the following steps:
the second copper substrate 1300 is subjected to a surface treatment to form a first surface treatment layer.
The second copper substrate 1300 is surface-treated with an antioxidant material such as nickel-palladium-gold, tin plating, or silver plating to form an antioxidant first surface treatment layer, thereby protecting the second copper substrate 1300 from oxidation.
Further, in some embodiments of the present invention, third cured sheet 900 includes a flowable PP sheet and a non-flowable PP sheet; step S700 described above: the third prepreg 900 is placed on the lower surface of the first substrate, which specifically includes the following two steps:
(1) Placing a non-flowable PP sheet on the lower surface of the first substrate;
(2) And placing the flowability PP sheet on the lower surface of the non-flowability PP sheet.
Through adopting the combination of non-flowability PP piece and flowability PP piece when the pressfitting, can avoid simply adopting flowability PP piece can appear the problem of gummosis when the pressfitting effectively, can also solve simultaneously and simply adopting non-flowability PP piece can appear filling inadequately when the pressfitting and lead to the problem of white spot.
Further, the manufacturing method of the single-sided four-layer heat dissipation substrate according to the embodiment of the invention further comprises the following four steps:
(1) Carrying out AOI detection on the radiating substrate;
(2) Manufacturing a solder mask layer on the surface of the heat dissipation substrate, and windowing the solder mask layer to form a bonding pad;
(3) Forming character information on the surface of the solder mask layer by screen printing of thermosetting ink;
(4) CNC machining and forming are carried out on the heat dissipation substrate.
Specifically, by performing AOI inspection on the heat dissipating substrate, it is ensured that the wiring of the final heat dissipating substrate is free from problems. Then, a solder mask layer is manufactured on the surface of the heat dissipation substrate, and alignment, exposure and development are carried out on the solder mask layer to expose the required bonding pads. And then, according to design requirements, character information is formed on the surface of the solder mask layer in a mode of screen printing thermosetting ink, so that reference information is provided for subsequent processing. And finally, carrying out CNC processing and forming on the heat dissipation substrate according to the designed appearance requirement.
Further, the manufacturing method of the single-sided four-layer heat dissipation substrate according to the embodiment of the invention further comprises the following two steps:
(1) Performing surface treatment on the welding disc to form a second surface treatment layer;
(2) And performing pressure resistance test on the heat dissipation substrate.
Specifically, the surface of the welding disk is treated, nickel plating and gold plating are carried out on the surface of the welding disk, and a second surface treatment layer is formed, so that the welding disk is protected. Meanwhile, the heat dissipation substrate is subjected to pressure resistance test, so that the quality of the heat dissipation substrate can be ensured to meet the requirements.
On the other hand, as shown in fig. 10 or fig. 13, the embodiment of the invention further provides a single-sided four-layer heat dissipation substrate, which is manufactured by the manufacturing method of the single-sided four-layer heat dissipation substrate.
According to the single-sided four-layer heat dissipation substrate provided by the embodiment of the invention, the heat dissipation substrate is formed by laminating the first copper substrate 1000 and the FR4 double-sided copper-clad substrate 100, and the heat dissipation capability of the first copper substrate 1000 is much stronger than that of the FR4 double-sided copper-clad substrate 100, so that the heat dissipation capability of the heat dissipation substrate can be remarkably improved; meanwhile, the first copper substrate 1000 is provided with a heat dissipating boss 1001, and the heat dissipating boss 1001 is embedded into the FR4 double-sided copper-clad substrate 100 to be conducted with a circuit inside the FR4 double-sided copper-clad substrate 100, thereby further improving the heat dissipating effect. In addition, the accommodating groove 800 is capped by the first copper plate 300, so that glue overflow to the surface of the first substrate in the lamination process can be avoided, the height difference of the heat dissipation boss 1001 is not needed to be considered, the fault tolerance rate is high when the heat dissipation boss 1001 is etched, the process control is relatively easy, and the production efficiency is directly improved; further, the heat dissipation block 1100 is heat-dissipated at the upper surface of the heat dissipation boss 1001, further improving the heat dissipation effect. Finally, the second copper substrate 1300 is further disposed on the substrate of the heat dissipation substrate as a cooling cover plate, and a cooling circulation system is formed inside the heat dissipation substrate, so that the heat dissipation efficiency of the heat dissipation substrate is greatly improved.
It should be noted that, the content in the above method embodiment is applicable to the system embodiment, and the functions specifically implemented by the system embodiment are the same as those of the above method embodiment, and the beneficial effects achieved by the method embodiment are the same as those achieved by the above method embodiment.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention.
Claims (10)
1. The manufacturing method of the single-sided four-layer heat dissipation substrate is characterized by comprising the following steps of:
obtaining an FR4 double-sided copper-clad substrate; the FR4 double-sided copper-clad substrate comprises a core layer, a first copper layer and a second copper layer, wherein the first copper layer is arranged on the upper surface of the core layer, and the second copper layer is arranged on the lower surface of the core layer;
manufacturing an inner layer circuit on the surface of the FR4 double-sided copper-clad substrate;
sequentially placing a first prepreg and a first copper plate on the upper surface of the FR4 double-sided copper-clad substrate, sequentially placing a second prepreg and a second copper plate on the lower surface of the FR4 double-sided copper-clad substrate, and pressing to form a first substrate;
drilling the first substrate to form a first through hole penetrating the first substrate, and carrying out copper deposition and plate electricity on the first substrate;
manufacturing an outer layer circuit on the surface of the first substrate; the outer layer circuit is communicated with the inner layer circuit through the first through hole;
slotting the first substrate, and forming an accommodating groove in a preset heat dissipation area; the accommodating groove penetrates through the first substrate to the lower surface of the first copper plate from bottom to top;
placing a third prepreg on the lower surface of the first substrate; the third prepreg is provided with an avoidance window corresponding to the accommodating groove;
acquiring a first copper substrate, and forming a heat dissipation boss matched with the accommodating groove on the upper surface of the first copper substrate;
placing the first copper substrate on the lower surface of the third prepreg, and enabling the heat dissipation boss to penetrate through the avoidance window and be placed in the accommodating groove;
pressing the first substrate, the third prepreg and the first copper substrate to form a heat dissipation substrate;
windowing the upper surface of the heat dissipation substrate to form a first window so as to expose the upper surface of the heat dissipation boss;
a heat dissipation block is arranged on the upper surface of the heat dissipation boss; the outer layer circuit and the inner layer circuit are communicated with the heat dissipation boss or the heat dissipation block.
2. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 1, further comprising the steps of:
manufacturing a plurality of first heat dissipation copper columns which are distributed at intervals at the bottom of the first copper substrate; a first cooling channel is formed among the plurality of first heat dissipation copper columns;
obtaining a second copper substrate, and manufacturing a plurality of second heat dissipation copper columns corresponding to the plurality of first heat dissipation copper columns on the upper surface of the second copper substrate; a second cooling channel is formed among the second heat dissipation copper columns, and the first cooling channel is communicated with the second cooling channel to form a circulating cooling channel;
a second through hole and a third through hole are formed in the second copper substrate; the second through hole is used as a cooling liquid inlet of the circulating cooling channel, and the third through hole is used as a cooling liquid outlet of the circulating cooling channel;
and arranging the second copper substrate at the bottom of the first copper substrate.
3. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 2, further comprising the steps of:
and carrying out surface treatment on the second copper substrate to form a first surface treatment layer.
4. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 1, wherein the placing a third prepreg on the lower surface of the first substrate specifically comprises:
obtaining the third prepreg;
windowing the third prepreg to form an avoidance window corresponding to the accommodating groove; the unilateral size of the avoidance window is 0.07mm-1.00mm larger than that of the heat dissipation boss.
5. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 1, wherein the step of obtaining a first copper substrate and forming a heat dissipation boss adapted to the accommodating groove on an upper surface of the first copper substrate specifically comprises:
acquiring the first copper substrate;
attaching a photosensitive dry film on the surface of the first copper substrate, exposing and developing the photosensitive dry film, and covering the area corresponding to the heat dissipation boss;
etching the upper surface of the first copper substrate to form the heat dissipation boss;
and removing the photosensitive dry film, and carrying out browning treatment on the first copper substrate.
6. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 1, wherein the windowing is performed on the upper surface of the heat dissipation substrate to form a first window so as to expose the upper surface of the heat dissipation boss, specifically comprising:
a laser positioning hole is formed in the heat dissipation substrate;
and aligning according to the laser positioning holes, and windowing the upper surface of the heat dissipation substrate corresponding to the position of the heat dissipation boss in a laser windowing mode to form a first window so as to expose the upper surface of the heat dissipation boss.
7. The method of manufacturing a single-sided four-layer heat sink substrate according to claim 1, wherein the third cured sheet comprises a flowable PP sheet and a non-flowable PP sheet; the placing of the third prepreg on the lower surface of the first substrate specifically includes:
placing the non-flowable PP sheet on a lower surface of the first substrate;
and placing the flowable PP sheet on the lower surface of the non-flowable PP sheet.
8. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 1, further comprising the steps of:
performing AOI detection on the radiating substrate;
manufacturing a solder mask layer on the surface of the heat dissipation substrate, and windowing the solder mask layer to form a bonding pad;
forming character information on the surface of the solder mask layer by screen printing of thermosetting ink;
CNC machining and forming are conducted on the radiating substrate.
9. The method for manufacturing a single-sided four-layer heat dissipation substrate according to claim 8, further comprising the steps of:
carrying out surface treatment on the bonding pad to form a second surface treatment layer;
and performing a withstand voltage test on the heat dissipation substrate.
10. A single-sided four-layer heat-dissipating substrate fabricated by the method of fabricating a single-sided four-layer heat-dissipating substrate as set forth in any one of claims 1-9.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132476A (en) * | 2019-12-30 | 2020-05-08 | 乐健科技（珠海）有限公司 | Preparation method of double-sided circuit radiating substrate |
| CN216600189U (en) * | 2021-11-10 | 2022-05-24 | 珠海和进兆丰电子科技有限公司 | Multilayer circuit board structure with heat dissipation copper base plate |
| US20230092164A1 (en) * | 2021-09-17 | 2023-03-23 | Zhuhai Access Semiconductor Co., Ltd | Package substrate based on molding process and manufacturing method thereof |
| CN116095971A (en) * | 2023-01-10 | 2023-05-09 | 珠海市深联电路有限公司 | Processing method of heat dissipation boss on laminated circuit board |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132476A (en) * | 2019-12-30 | 2020-05-08 | 乐健科技（珠海）有限公司 | Preparation method of double-sided circuit radiating substrate |
| US20230092164A1 (en) * | 2021-09-17 | 2023-03-23 | Zhuhai Access Semiconductor Co., Ltd | Package substrate based on molding process and manufacturing method thereof |
| CN216600189U (en) * | 2021-11-10 | 2022-05-24 | 珠海和进兆丰电子科技有限公司 | Multilayer circuit board structure with heat dissipation copper base plate |
| CN116095971A (en) * | 2023-01-10 | 2023-05-09 | 珠海市深联电路有限公司 | Processing method of heat dissipation boss on laminated circuit board |
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