CN216773234U - Heat conduction gasket for increasing contact area - Google Patents
Heat conduction gasket for increasing contact area Download PDFInfo
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- CN216773234U CN216773234U CN202220610168.4U CN202220610168U CN216773234U CN 216773234 U CN216773234 U CN 216773234U CN 202220610168 U CN202220610168 U CN 202220610168U CN 216773234 U CN216773234 U CN 216773234U
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- heat conduction
- heat
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- substrate
- matching groove
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Abstract
The utility model discloses a heat conduction gasket for increasing the contact area, which comprises a heat conduction substrate, wherein the middle part of the heat conduction substrate is provided with a matching groove, the matching groove is a through groove in the vertical direction, and the inner wall profile of the matching groove is matched with the peripheral profile of a heating chip; the lower part of the heat conduction substrate is fixedly coated with a heat conduction assembly, the top of the heat conduction assembly enters the bottom of the matching groove in a coaxial tight-matching mode, and the contour surface of the top surface of the heat conduction assembly is in fit with and in close contact with the contour bottom surface of the heating chip. The beneficial effects are that: according to the utility model, the matching groove matched with the heating chip in shape is formed in the middle of the heat-conducting substrate, the matching groove is a through groove in the vertical direction, the heat-conducting component is fixedly attached to the bottom surface of the heat-conducting substrate, and the metal pressing sheet at the top of the heat-conducting component is coaxially and tightly matched with the matching groove, so that the contact area is increased by means of the contact mode of the top surface of the metal pressing sheet and the bottom surface of the heating chip, and the heat-conducting efficiency is favorably improved.
Description
Technical Field
The utility model relates to the field of chip heat dissipation auxiliary assemblies, in particular to a heat conduction gasket for increasing the contact area.
Background
When the heating chip is designed, the outer shape of the heating chip is mostly in a convex shape with a higher central height and a lower peripheral height, the height difference between the central height and the peripheral height is about 1-2 mm, and the heating chip is usually in a rectangular sheet shape, but when the heat conducting gasket is assembled on the existing heating chip, because the shell contacted by the heat conducting gasket pad has a fixed height, if the heat conducting gasket is adhered above the heating chip, the thickness of the heat conducting gasket can be selected only by matching with the central height or one of the peripheral heights of the heating chip, the heat conducting gasket can not be well contacted with the heating chip, the heat conducting area is limited, and the heat radiating efficiency of the heat conducting gasket is lower.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the problems and provide a heat conduction gasket for increasing the contact area, wherein a matching groove matched with the appearance of a heating chip is formed in the middle of a heat conduction substrate, the matching groove is a through groove in the vertical direction, a heat conduction assembly is attached and fixed to the bottom surface of the heat conduction substrate, a metal pressing sheet at the top of the heat conduction assembly is coaxially and tightly matched with the matching groove, and the contact area is increased by means of attaching and contacting the top surface of the metal pressing sheet with the bottom surface of the heating chip, which is described in detail below.
In order to achieve the purpose, the utility model provides the following technical scheme:
the utility model provides a heat conduction gasket for increasing the contact area, which comprises a heat conduction substrate, wherein a matching groove is formed in the middle of the heat conduction substrate, the matching groove is a through groove in the vertical direction, and the inner wall profile of the matching groove is matched with the peripheral profile of a heating chip;
the lower part of the heat conduction substrate is fixedly coated with a heat conduction assembly, the top of the heat conduction assembly enters the bottom of the matching groove in a coaxial tight-matching mode, and the contour surface of the top surface of the heat conduction assembly is in fit with and in close contact with the contour bottom surface of the heating chip.
Preferably, the heat conducting assembly comprises a protective frame and a framework, the protective frame is of a box body structure with an open top and is fixedly coated on the periphery of the bottom surface of the heat conducting substrate, the framework is vertically arranged and is fixed in the inner space of the protective frame, a metal pressing sheet is fixed in the middle of the top surface of the framework, the metal pressing sheet enters the bottom of the matching groove in a coaxial tight-fit mode, and the contour surface of the top surface of the metal pressing sheet is in fit with and in tight contact with the contour bottom surface of the heating chip.
Preferably, the framework is a grid-type metal frame, and the top end face of the framework is in contact with the bottom face of the heat-conducting substrate in a bonding mode.
Preferably, the meshes of the framework are all tightly filled with fillers of heat conduction materials.
Preferably, the filler is heat conductive silicone grease.
Preferably, the protective frame, the framework and the metal pressing sheet are all made of pure copper.
Preferably, the heat conducting substrate is made of pure copper, and the outer edge of the bottom surface of the heat conducting substrate is connected with the top end surface of the protective frame in a hot pressing mode.
By adopting the heat conduction gasket for increasing the contact area, in the design, the transmitting chip is inserted into the matching groove in a manner of matching the peripheral outline with the outline of the inner wall of the matching groove, and simultaneously, the outline surface of the top surface of the metal pressing sheet is matched and attached with the outline bottom surface of the heating chip, so that the contact area can be increased by the manner of matching and contacting the top surface of the metal pressing sheet with the bottom surface of the heating chip, the heat conduction efficiency is favorably improved, meanwhile, in the working process of the heating chip, the heat of the heating chip is conducted to the framework through the metal chip, the framework is of a grid structure, and due to the existence of each grid, the framework has enough outline area, the conducted heat can be uniformly and efficiently radiated, the heat conduction and radiation efficiency is favorably improved, and meanwhile, the grids of the framework are filled with the fillers, the filler is heat-conducting silicone grease, so that heat transferred by the metal pressing sheet is dispersed into the filler of each grid through the framework for effective heat conduction and dissipation, the heat-conducting and dissipating efficiency is further improved, and the filler is in good contact with the protective frame, so that the heat can be further conducted to the outer surface of the protective frame for heat dissipation, and the heat-conducting and dissipating effect is further improved.
Has the advantages that: 1. according to the utility model, the matching groove matched with the heating chip in shape is formed in the middle of the heat-conducting substrate, the matching groove is a through groove in the vertical direction, the heat-conducting component is fixedly attached to the bottom surface of the heat-conducting substrate, and the metal pressing sheet at the top of the heat-conducting component is coaxially and tightly matched with the matching groove, so that the contact area is increased by the way that the top surface of the metal pressing sheet is in contact with the bottom surface of the heating chip in a bonding manner, and the heat-conducting efficiency is favorably improved;
2. the heat conducting component is provided with a grid type framework, the framework can efficiently dissipate heat conducted by the metal pressing sheet through a larger outline area of the framework, and the grids of the framework are filled with fillers, so that the heat transferred by the metal pressing sheet is dispersed into the fillers of each grid through the framework to be effectively conducted and dissipated, and the heat conducting and dissipating efficiency is further improved;
3. because filler and the good contact of frame that protects, can then with the further conduction of heat to the surface of protecting the frame and disperse the heat dissipation, be favorable to promoting the heat conduction radiating effect once more.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic front cross-sectional view of the present invention;
fig. 2 is a schematic top cross-sectional view of fig. 1 of the present invention.
The reference numerals are explained below:
1. a heat conductive substrate; 101. a mating groove; 2. a heat conducting component; 201. pressing metal sheets; 202. protecting the frame; 203. a filler; 204. and (3) a framework.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Referring to fig. 1-2, the utility model provides a heat conduction gasket for increasing a contact area, which includes a heat conduction substrate 1, wherein a fitting groove 101 is formed in the middle of the heat conduction substrate 1, the fitting groove 101 is a through groove in the vertical direction, and the inner wall profile of the fitting groove 101 is adapted to the peripheral profile of a heat-generating chip. The lower part of the heat conduction substrate 1 is coated and fixed with a heat conduction assembly 2, the top of the heat conduction assembly 2 enters the bottom of the matching groove 101 in a coaxial tight-matching mode, and the contour surface of the top surface of the heat conduction assembly 2 is in fit and close contact with the contour bottom surface of the heating chip.
As a preferable scheme of the present application, the heat conducting assembly 2 includes a protective frame 202 and a framework 204, the protective frame 202 is of a box structure with an open top and is fixedly wrapped on the periphery of the bottom surface of the heat conducting substrate 1, the framework 204 vertically arranged is fixed in the inner space of the protective frame 202, a metal pressing sheet 201 is fixed in the middle of the top surface of the framework 204, the metal pressing sheet 201 enters the bottom of the matching groove 101 in a coaxial tight-fitting manner, and the contour surface of the top surface of the metal pressing sheet 201 is in fit and close contact with the contour bottom surface of the heat generating chip.
The framework 204 is a grid-type metal frame, the top end face of the framework 204 is in contact with the bottom face of the heat-conducting substrate 1 in an attaching mode, due to the arrangement, the heat-conducting substrate is convenient to have a large enough outline area, and then the conducted heat can be uniformly and efficiently dissipated, the heat-conducting and heat-dissipating efficiency is favorably improved, the filler 203 made of heat-conducting materials is tightly filled in the grids of the framework 204, due to the arrangement, the heat transferred by the metal pressing sheet 201 can be conveniently dispersed into the filler 203 of each grid through the framework 204 to be effectively conducted and dissipated, and the heat-conducting and heat-dissipating efficiency is further improved.
By adopting the structure, in the design, the emitting chip is inserted into the matching groove 101 in a manner of matching the peripheral contour with the contour of the inner wall of the matching groove 101, meanwhile, the contour surface of the top surface of the metal pressing sheet 201 is matched and attached with the contour bottom surface of the heating chip, so that the contact area can be increased by the manner of matching and contacting the top surface of the metal pressing sheet 201 with the bottom surface of the heating chip, the heat conduction efficiency is improved, meanwhile, in the working process of the heating chip, the heat of the heating chip is conducted to the framework 204 through the metal chip, the framework 204 is of a grid type structure, due to the existence of each grid, the framework has a large enough contour area, the conducted heat can be uniformly and efficiently dissipated, the heat conduction and heat dissipation efficiency is improved, meanwhile, the grids of the framework 204 are filled with the filler 203, and the filler 203 is heat conduction silicone grease, therefore, the framework 204 is used for dispersing the heat transferred by the metal pressing sheet 201 into the filler 203 of each grid for effective heat conduction and dissipation, the heat conduction and dissipation efficiency is further improved, and the filler 203 is in good contact with the protective frame 202, so that the heat can be further conducted to the outer surface of the protective frame 202 for heat dissipation, and the heat conduction and dissipation effect is further improved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (7)
1. A heat conduction gasket for increasing contact area, comprising a heat conduction substrate (1), characterized in that: the middle part of the heat-conducting substrate (1) is provided with a matching groove (101), the matching groove (101) is a through groove in the vertical direction, and the inner wall profile of the matching groove (101) is matched with the peripheral profile of the heating chip;
the lower part of the heat conduction substrate (1) is fixedly coated with a heat conduction assembly (2), the top of the heat conduction assembly (2) enters the bottom of the matching groove (101) in a coaxial tight-matching mode, and the contour surface of the top surface of the heat conduction assembly (2) is in fit with and in close contact with the contour bottom surface of the heating chip.
2. A contact area increasing thermal pad according to claim 1, wherein: the heat conduction assembly (2) comprises a protective frame (202) and a framework (204), the protective frame (202) is of a box structure with an open top and is fixedly coated on the periphery of the bottom surface of the heat conduction substrate (1), the framework (204) is vertically arranged in the inner space of the protective frame (202), a metal pressing sheet (201) is fixed in the middle of the top surface of the framework (204), the metal pressing sheet (201) enters the bottom of the matching groove (101) in a coaxial tight fit mode, and the contour surface of the top surface of the metal pressing sheet (201) is in fit with and in tight contact with the contour bottom surface of the heating chip.
3. The heat conduction gasket with an increased contact area as set forth in claim 2, wherein: the framework (204) is a grid-type metal frame, and the top end face of the framework (204) is in contact with the bottom face of the heat-conducting substrate (1) in a fitting mode.
4. A contact area increasing thermal pad according to claim 3, wherein: the meshes of the framework (204) are all tightly filled with fillers (203) of heat conduction materials.
5. The heat conduction gasket with an increased contact area as set forth in claim 4, wherein: the filler (203) is heat-conducting silicone grease.
6. The heat conduction gasket with an increased contact area as set forth in claim 5, wherein: the protective frame (202), the framework (204) and the metal pressing sheet (201) are all made of pure copper.
7. The gasket of any one of claims 2 to 6, wherein: the heat conduction substrate (1) is made of pure copper, and the outer edge of the bottom surface of the heat conduction substrate (1) is connected with the top end surface of the protective frame (202) in a hot-pressing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220610168.4U CN216773234U (en) | 2022-03-18 | 2022-03-18 | Heat conduction gasket for increasing contact area |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220610168.4U CN216773234U (en) | 2022-03-18 | 2022-03-18 | Heat conduction gasket for increasing contact area |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216773234U true CN216773234U (en) | 2022-06-17 |
Family
ID=81959816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220610168.4U Active CN216773234U (en) | 2022-03-18 | 2022-03-18 | Heat conduction gasket for increasing contact area |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216773234U (en) |
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2022
- 2022-03-18 CN CN202220610168.4U patent/CN216773234U/en active Active
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